CN104934408A - Inductor having metal filler structure - Google Patents
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- CN104934408A CN104934408A CN201410106306.5A CN201410106306A CN104934408A CN 104934408 A CN104934408 A CN 104934408A CN 201410106306 A CN201410106306 A CN 201410106306A CN 104934408 A CN104934408 A CN 104934408A
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- 239000002184 metal Substances 0.000 title claims abstract description 368
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 368
- 239000000945 filler Substances 0.000 title abstract 4
- 238000009826 distribution Methods 0.000 claims abstract description 61
- 239000000463 material Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 23
- 150000002739 metals Chemical class 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- 229910052802 copper Inorganic materials 0.000 description 17
- 239000010949 copper Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 9
- 235000012239 silicon dioxide Nutrition 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 7
- 230000003071 parasitic effect Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 241001124569 Lycaenidae Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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Abstract
The invention provides an inductor having a metal filler structure. The metal filler structure at least includes: a plurality of metal blocks with the same height as a pin baseline and a plurality of metal wires in radial distribution; one ends of the metal wires are connected with the pin baseline to realize grounding, and the other ends are gathered in an area with no metal distribution and do not intersect; and the metal blocks and the metal wires do not contact. By optimizing the shape, the size and an interval of the metal blocks formed in an area of the inductor where metals are sparsely distributed, an eddy current effect of the metal blocks can be reduced, thereby effectively improving a quality factor of the inductor; and the metal wires in radial distribution are formed in other metal layers except a top layer, one ends of the metal wires are connected to the ground, achieving a function of a shielding layer, effectively reducing the eddy current effect of the metal filler structure, and greatly improving the quality factor of the inductor.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, particularly relate to a kind of inductor with metal charge structure.
Background technology
At present, integrated circuit (IC)-components comprises more metal layers, the metal in each layer metal level, and according to the different application of device, according to different density distribution in insulating material silicon dioxide layer, metal material is generally copper.But because the hardness of silicon dioxide ratio metallic copper is large, and when cmp (CMP) is carried out to the silicon dioxide layer inserting metallic copper, need to apply certain pressure, under the effect of the pressure, the region that metal copper layer distribution is more sparse, will have thinner thickness than the closeer region of metal copper layer distribution.Have the silicon dioxide material layer of the metallic copper of different densities distribution, the effect schematic diagram after cmp as shown in Figure 1a.In fig 1 a, metallic copper 11 is embedded in silicon dioxide layer 10, left side to distribute sparse region for metallic copper 11, right side is the densely distributed region of metallic copper 11, because comparatively dense is compared in right side metallic copper 11 distribution, more metallic copper 11 makes the hardness on right side little compared to left side, this just makes under the effect of the pressure, right side is extruded more serious, the thickness in the densely distributed region of metallic copper 11, right side is thin compared to the left side metallic copper 11 sparse region that distributes, and in the preparation process of device, the silicon dioxide layer 10 inserting metallic copper 11 is needed to keep certain target thickness, this remains within certain scope with regard to the density needing metallic copper 11 and distribute, and be difficult to accomplish this point in existing technique.The phenomenon that thickness is different is there is after the silicon oxide layer inserting metallic copper 11 carries out cmp, general meeting forms unsettled metal charge structure (floating dummy metal) automatically in the region that Metal Distribution is more sparse, certain density is reached to make the metal in this region, as shown in Figure 1 b, Fig. 1 b is the structural representation automatically forming unsettled metal charge structure in prior art in the region that Metal Distribution is sparse.Here unsettled metal charge structure, the unsettled metal charge structure that refers to does not connect current potential, is not that is connected with original functional circuit; Here the metal charge structure automatically formed produces automatically when designing, and size is certain.Metal charge structure unsettled in Fig. 1 b is metal derby 12 one by one, is filled in the sparse space of holding wire 13, and the material of described metal derby 12 is general identical with the material of holding wire 13, and whole technical process is monitored by the density inspection window 14 of setting.
But, form metal charge structure in the sparse space of described metal level after, eddy current effect (eddycurrent effect) can be introduced, i.e. generation current in metal charge structure, this will increase the energy loss of inductor, thus reduce quality factor (the quality factor of inductor, Q), described quality factor is the ratio of the energy of energy and the loss stored in inductor, the quality factor of inductor is higher, then show that this inductor volume power consumption is less, efficiency is higher.Meanwhile, the formation of metal charge structure also can increase electric capacity, and then the self-resonant frequency (self-resonantfrequency, SRF) of inductor is reduced, and impacts the quality factor of inductor.Such as, in 65nm technology, automatically formed after metal charge structure, the peak value of the quality factor of inductor reduces about 18%, and its self-resonant frequency is reduced to 13.7GHz by 14.9GHz; In 90nm technology, automatically formed after metal charge structure, the peak value of the quality factor of inductor reduces about 28%, and its self-resonant frequency is reduced to 11GHz by 12.9GHz.Because quality factor is as the most important performance index of inductor, the performance of its large young pathbreaker on phase noise and circuit produces larger impact, therefore, how on the basis forming metal charge structure, the quality factor effectively improving inductor starts the focus becoming research at present.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of inductor with metal charge structure, distribute after sparse region forms metal charge structure automatically for solving in prior art in inductor metal, introduce eddy current effect, i.e. meeting generation current in metal charge structure, cause the energy loss of inductor to increase, and then cause the problem of inductor quality factor reduction.
For achieving the above object and other relevant objects, the invention provides a kind of inductor with metal charge structure, it at least comprises bottom rectangular metal layer, the top layer rectangular metal layer on described bottom rectangular metal layer, at least one deck intermediate rectangular metal level between described bottom rectangular metal layer and top layer rectangular metal layer, it is characterized in that, described bottom rectangular metal layer at least comprises the pin being positioned at its four drift angle places and the pin baseline connecting described pin; Adjacent pin is connected to surround first without the region of Metal Distribution by described pin baseline, and described first is formed with metal charge structure without in the region of Metal Distribution; Described metal charge structure at least comprises:
Several metal derbies contour with described pin baseline and the some metal line distributed radially;
Described metal wire one end is connected with pin baseline and is grounded, and the other end is gathered described first without non-intersect in the middle part of the region of Metal Distribution; Described metal derby does not contact with described metal wire.
As a kind of preferred version with the inductor of metal charge structure of the present invention, described top layer rectangular metal layer at least comprises: be positioned at the inductor metal coil in the middle part of described top layer rectangular metal layer, be positioned at the pin of described top layer rectangular metal layer four drift angle places and two middle side parts, connect the connecting line of the pin of described inductor metal coil and described two middle side parts, and connect the pin baseline of described four drift angle place pins; Region between inductor metal coil inside region, inductor metal coil and pin and pin baseline, and form several metal derbies contour with described inductor metal coil without in the region of baseline connection between pin.
As a kind of preferred version with the inductor of metal charge structure of the present invention, described intermediate rectangular metal level at least comprises the pin being positioned at its four drift angle places and the pin baseline connecting described pin; Adjacent pin is connected to surround second without the region of Metal Distribution by described pin baseline, and described second is formed with metal charge structure without in the region of Metal Distribution; Described metal charge structure at least comprises:
Several metal derbies contour with described pin baseline and the some metal line distributed radially;
Described metal wire one end is connected with pin baseline and is grounded, and the other end is gathered described second without non-intersect in the middle part of the region of Metal Distribution; Described metal derby does not contact with described metal wire.
As a kind of preferred version with the inductor of metal charge structure of the present invention, described in the metal wire projection in the horizontal plane that is formed in each layer rectangular metal layer overlapped, formed between adjacent wires and be greater than the angle that 0 degree is less than or equal to 90 degree.
As a kind of preferred version with the inductor of metal charge structure of the present invention, described metal derby is square.
As a kind of preferred version with the inductor of metal charge structure of the present invention, described metal derby is evenly distributed in described first without in the region of Metal Distribution.
As a kind of preferred version with the inductor of metal charge structure of the present invention, described metal derby is identical with the material of pin baseline in bottom rectangular metal layer with the material of metal wire.
As a kind of preferred version with the inductor of metal charge structure of the present invention, the number of described metal wire is 4 ~ 32.
As a kind of preferred version with the inductor of metal charge structure of the present invention, the number of described metal wire is 8.
As a kind of preferred version with the inductor of metal charge structure of the present invention, between described adjacent wires, angle is equal.
As a kind of preferred version with the inductor of metal charge structure of the present invention, the width of described metal wire is 3 times of the second minimum design rule, the minimum dimension that described second minimum design rule allows for technique.
As a kind of preferred version with the inductor of metal charge structure of the present invention, the density of described metal charge distribution equals the first minimum design rule, and the first described minimum design rule is the minimum value of Metal Distribution density.
As mentioned above, the inductor with metal charge structure of the present invention, there is following beneficial effect: by optimizing the shape of the metal derby formed in region that inductor metal distributes sparse, size and interval, not only meet the density requirements of Metal Distribution, and the eddy current effect of metal derby can be reduced, effectively increase the quality factor of inductor; The metal wire distributed radially is formed in other metal levels except top layer, metal wire one end ground connection, serve the effect of screen, the parasitic capacitance of inductor and dead resistance are increased, after parasitic capacitance increases, the capacitive reactance of its correspondence reduces, simultaneously because dead resistance is also increase, the impedance of total obviously increases, this just makes the electric current produced in metal charge structure obviously reduce, effectively reduce the eddy current effect of metal charge structure, greatly increase the quality factor of inductor.
Accompanying drawing explanation
Fig. 1 a is shown as the silicon dioxide material layer with the metallic copper of different densities distribution of the prior art, the effect schematic diagram after cmp.
Fig. 1 b is shown as the structural representation automatically forming unsettled metal charge structure in prior art of the prior art in the region that Metal Distribution is sparse.
Fig. 2 a is shown as the inductor with metal charge structure of the present invention in bottom rectangular metal layer first without the schematic diagram being formed uniformly metal charge structure in Metal Distribution region.
Fig. 2 b is shown as the schematic diagram that the inductor with metal charge structure of the present invention is formed uniformly metal derby further in top layer rectangular metal layer.
Fig. 2 c be shown as the inductor with metal charge structure of the present invention under multiple design rule inductor Q value with the schematic diagram of frequency change.
Element numbers explanation
10 silicon dioxide layers
11 metallic coppers
12,22 metal derbies
13 holding wires
14,24 density check window
20 pins
21 pin baselines
23 metal wires
25 inductor metal coils
26 connecting lines
Embodiment
Below by way of specific instantiation, embodiments of the present invention are described, those skilled in the art the content disclosed by this specification can understand other advantages of the present invention and effect easily.The present invention can also be implemented or be applied by embodiments different in addition, and the every details in this specification also can based on different viewpoints and application, carries out various modification or change not deviating under spirit of the present invention.
Refer to Fig. 2 a to Fig. 2 c, it should be noted that, the diagram provided in the present embodiment only illustrates basic conception of the present invention in a schematic way, though only show the assembly relevant with the present invention in graphic but not component count, shape and size when implementing according to reality is drawn, it is actual when implementing, and the kenel of each assembly, quantity and ratio can be a kind of change arbitrarily, and its assembly layout kenel also may be more complicated.
Refer to Fig. 2 a to Fig. 2 c, the invention provides a kind of inductor with metal charge structure, it at least comprises bottom rectangular metal layer, the top layer rectangular metal layer on described bottom rectangular metal layer, at least one deck intermediate rectangular metal level between described bottom rectangular metal layer and top layer rectangular metal layer, it is characterized in that, described bottom rectangular metal layer at least comprises the pin two 0 being positioned at its four drift angle places and the pin baseline 21 connecting described pin two 0; Adjacent pin 20 is connected to surround first without the region of Metal Distribution by described pin baseline 21, and described first is formed with metal charge structure without in the region of Metal Distribution; Described metal charge structure at least comprises:
Several metal derbies 22 contour with described pin baseline 21 and the some metal line 23 distributed radially;
Described metal wire 23 one end is connected with pin baseline 21 and is grounded, and the other end is gathered described first without non-intersect in the middle part of the region of Metal Distribution; Described metal derby 22 does not contact with described metal wire 23.As shown in Figure 2 a, Fig. 2 a is first without the schematic diagram being formed uniformly metal charge structure in the region of Metal Distribution in bottom rectangular metal layer.
Concrete, after forming described metal charge structure, the density of Metal Distribution should be more than or equal to the first minimum design rule, and the first minimum design rule described here is the minimum value of Metal Distribution density.The density of described Metal Distribution is area × 100% that (density checks that the area+density of window internal pin baseline checks that the area+density of metal derby in window checks the area of metal wire in window)/density checks window, the present embodiment Midst density checks that the area of window 24 is 150 μm × 150 μm, for marking the one piece of predetermined area come in fig. 2 a.The density that described first minimum design rule refers to Metal Distribution should be more than or equal to a certain value, to meet density requirements, be unlikely to because zones of different Metal Distribution density difference is very large, cause above-mentioned Fig. 1 a said after cmp, the region that density is large is extruded more serious.Preferably, in the present embodiment, the density of described Metal Distribution equals the first minimum design rule.
Concrete, described metal derby 22 does not contact with described metal wire 23; The width of described metal wire 23 should be 1 ~ 3 times of the second minimum design rule, preferably, in the present embodiment, the width of described metal wire is 3 times of the second minimum design rule, the minimum dimension that described second minimum design rule allows for technique, if when the size of metal wire is less than a certain value, just cannot make.The number of described metal wire 23 is 4 ~ 32, and preferably, in the present embodiment, the number of described metal wire 23 is 8.
Described first without forming the metal wire 23 distributed radially in the region of Metal Distribution, metal wire 23 one end is grounded by being connected with pin baseline 21, this just serves the effect of screen, the parasitic capacitance of inductor and dead resistance are increased, after parasitic capacitance increases, the capacitive reactance of its correspondence reduces, simultaneously because dead resistance is also increase, the impedance of total obviously increases, this just makes the electric current produced in metal charge structure obviously reduce, effectively reduce the eddy current effect of metal charge structure, greatly increase the quality factor of inductor.
Concrete, described metal derby 22 is square-shaped metal block, and it is evenly distributed in described first without the region of Metal Distribution; The height of described metal derby 22 equals the height of pin baseline 21, and the length of side of described metal derby 22 equals the second minimum design rule.
A metal derby is divided into N
2individual little metal derby, wherein N is natural number, and before and after segmentation, the energy loss formula that eddy current effect produces in metal derby is respectively:
P
diss=（dB/dt）
2×π×h×R
0 4/8ρ （1）
P
diss=（dB/dt）
2×π×h×R
0 4/(8ρ×N
2) （2）
Formula (1) represents the energy loss (P due to eddy current effect generation in a metal derby
diss, power dissipation), R0 represents 1/2nd of this metal derby length of side; Formula (2) represents that this metal derby is divided into N
2individual little metal derby, this N
2the gross energy loss that individual little square-shaped metal block produces due to eddy current effect, R
0represent 1/2nd of this metal derby length of side.Contrast equation (1) and formula (2) can be found out, the quantity that metal derby is split into little metal derby is more, then the energy loss produced is less.That is, after formation metal derby, because density checks that the area of window 24 presets, and the area of pin baseline 21 is also definite value, therefore when under the prerequisite that metal wire 23 area formed is certain, density one timing of Metal Distribution, the density of metal derby 22 is also definite value, so, now density checks that the quantity of metal derby 22 in window 24 is more, then the energy loss produced is less.Therefore in the present embodiment, the length of side of metal derby 22 equals the second minimum design rule.
Interval between metal derby 22 should value arbitrarily in the region between the 3rd minimum design rule to spacer maximum value.Because density checks that the area of window 24 presets, and the area of pin baseline 21 is also definite value, therefore when under the prerequisite that metal wire 23 area formed is certain, the density of Metal Distribution is less, the area of metal derby 22 is also less, and the interval namely between metal derby 22 is larger, therefore, the maximum at described metal derby 22 interval is: when the density of Metal Distribution equals the first minimum design rule, the interval had between metal derby 22; Minimum interval between the metal derby 22 that described 3rd minimum design rule allows for technique.
Concrete, find after deliberation, when the density of Metal Distribution is being more than or equal to the first minimum design rule, and the length of side of metal derby 22 is when equaling the second minimum design rule, interval between metal derby is larger, the eddy current effect that then metal derby 22 produces can be less, more effectively can raise the quality factor of inductor.Therefore, after the length of side of metal derby 22 equals the second minimum design rule, the interval between metal derby to be increased, as long as finally make Metal Distribution density be not less than the first minimum design rule from the 3rd minimum design rule as much as possible.
Concrete, described metal derby 22 is identical with the material of pin baseline 21 in bottom rectangular metal layer with the material of metal wire 23.
Fig. 2 b is inductor metal coil inside region in top layer rectangular metal layer, region between inductor metal coil and pin and pin baseline, and without the schematic diagram being formed uniformly metal derby in the region of baseline connection further between pin, as shown in Figure 2 b, described top layer rectangular metal layer at least comprises: be positioned at the inductor metal coil 25 in the middle part of described top layer rectangular metal layer, be positioned at the pin two 0 of described top layer rectangular metal layer four drift angle places and two middle side parts, connect the connecting line 26 of the pin two 0 of described inductor metal coil 25 and described two middle side parts, and connect the pin baseline 21 of described four drift angle place pin twos 0, region between inductor metal coil 25 inside region, inductor metal coil 25 and pin two 0 and pin baseline 21, and form several metal derbies 22 contour with described inductor metal coil 25 without in the region of baseline connection between pin two 0.Because inductor metal coil 25 is positioned at top layer rectangular metal layer, therefore the difference to some extent in the metal charge structure and bottom rectangular metal layer of top layer formation, only form metal derby 22, do not form metal wire 23.
Concrete, described metal derby 22 is square-shaped metal block, and it is evenly distributed in the region between inductor metal coil 25 inside region, inductor metal coil 25 and pin two 0 and pin baseline 21, and without in the region of baseline connection between pin two 0.After forming metal derby 22 in described top layer rectangular metal layer, the density of Metal Distribution should be more than or equal to first minimum design rule of this layer, and preferably, the density of Metal Distribution equals first minimum design rule of this layer.
Concrete, in described top layer rectangular metal layer, the length of side of metal derby 22 equals second minimum design rule of this layer;
Concrete, interval in described top layer rectangular metal layer between metal derby 22, in the 3rd minimum design rule any value to the interval of spacer maximum value of this layer, described this layer of spacer maximum value is: when the density of Metal Distribution equals first minimum design rule of this layer, the interval had between metal derby.Obviously, preferably, in the present embodiment, the density of this layer of Metal Distribution equals first minimum design rule of this layer, and the length of side of metal derby 22 equals second minimum design rule of this layer, the spacer maximum value being spaced apart this layer now between metal derby 22.
In addition, described intermediate rectangular metal level at least comprises the pin being positioned at its four drift angle places and the pin baseline connecting described pin; Adjacent pin is connected to surround second without the region of Metal Distribution by described pin baseline, and described second is formed with metal charge structure without in the region of Metal Distribution; Described metal charge structure at least comprises:
Several metal derbies contour with described pin baseline and the some metal line distributed radially;
Described metal wire one end is connected with pin baseline and is grounded, and the other end is gathered described second without non-intersect in the middle part of the region of Metal Distribution; Described metal derby does not contact with described metal wire.
Concrete, after other each layer metal level described forms described metal charge structure, the density of Metal Distribution is more than or equal to first minimum design rule of this layer.
Concrete, described metal derby does not contact with described metal wire; The width of described metal wire should be 1 ~ 3 times of the second minimum design rule into this layer, preferably, in the present embodiment, and the width of described metal wire is 3 times of the second minimum design rule; The number of described metal wire is 4 ~ 32, and preferably, in the present embodiment, the number of described metal wire 23 is 8.
Concrete, described in the metal wire projection in the horizontal plane that is formed in each layer rectangular metal layer overlapped, formed between adjacent wires and be greater than the angle that 0 degree is less than or equal to 90 degree.
Concrete, described metal derby 22 is square-shaped metal block, and it is evenly distributed in described second without the region of Metal Distribution.In other each layer metal levels described, the length of side of metal derby equals second minimum design rule of this layer; Interval in other each layer metal level described between metal derby, in the 3rd minimum design rule any value to the interval of spacer maximum value of this layer, the spacer maximum value of this layer described is: when the density of Metal Distribution equals first minimum design rule of this layer, the interval had between metal derby.Obviously, preferably, in the present embodiment, the density of this layer of Metal Distribution equals first minimum design rule of this layer, and the length of side of metal derby equals second minimum design rule of this layer, the spacer maximum value being spaced apart this layer now between metal derby.
Concrete, described metal derby is identical with the material of pin baseline in this layer of metal level with the material of metal wire.
Fig. 2 c be under multiple design rule inductor Q value with the schematic diagram of frequency change, as shown in Figure 2 c, curve representated by square be inductor metal distribute sparse region automatically form metal derby time, the Q value of inductor is with the change of frequency; Curve representated by triangle be inductor metal distribute sparse region form metal charge structure of the present invention time, the Q value of inductor is with the change of frequency.From Fig. 2 c, when frequency is 15GHz, the Q values of two kinds of designs all reach maximum, and distribute after sparse region forms metal derby automatically in inductor metal, the maximum of its quality factor q is 20; And distributing after sparse region forms metal charge structure of the present invention in inductor metal, the maximum of its quality factor q then reaches 29.Can draw thus, after adding described metal charge structure, effectively can improve the quality factor of inductor.
In sum, the invention provides a kind of inductor with metal charge structure, by optimizing the shape of the metal derby formed in region that inductor metal distributes sparse, size and interval, not only meet the density requirements of Metal Distribution, and the eddy current effect of metal derby can be reduced, effectively increase the quality factor of inductor; The metal wire distributed radially is formed in other metal levels except top layer, metal wire one end ground connection, serve the effect of screen, the parasitic capacitance of inductor and dead resistance are increased, after parasitic capacitance increases, the capacitive reactance of its correspondence reduces, simultaneously because dead resistance is also increase, the impedance of total obviously increases, this just makes the electric current produced in metal charge structure obviously reduce, effectively reduce the eddy current effect of metal charge structure, greatly increase the quality factor of inductor.So the present invention effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.
Claims (12)
1. one kind has the inductor of metal charge structure, it is characterized in that, at least comprise: bottom rectangular metal layer, the top layer rectangular metal layer on described bottom rectangular metal layer, at least one deck intermediate rectangular metal level between described bottom rectangular metal layer and top layer rectangular metal layer, it is characterized in that, described bottom rectangular metal layer at least comprises the pin being positioned at its four drift angle places and the pin baseline connecting described pin; Adjacent pin is connected to surround first without the region of Metal Distribution by described pin baseline, and described first is formed with metal charge structure without in the region of Metal Distribution; Described metal charge structure at least comprises:
Several metal derbies contour with described pin baseline and the some metal line distributed radially;
Described metal wire one end is connected with pin baseline and is grounded, and the other end is gathered described first without non-intersect in the middle part of the region of Metal Distribution; Described metal derby does not contact with described metal wire.
2. the inductor with metal charge structure according to claim 1, it is characterized in that, described top layer rectangular metal layer at least comprises: be positioned at the inductor metal coil in the middle part of described top layer rectangular metal layer, be positioned at the pin of described top layer rectangular metal layer four drift angle places and two middle side parts, connect the connecting line of the pin of described inductor metal coil and described two middle side parts, and connect the pin baseline of described four drift angle place pins; Region between inductor metal coil inside region, inductor metal coil and pin and pin baseline, and form several metal derbies contour with described inductor metal coil without in the region of baseline connection between pin.
3. the inductor with metal charge structure according to claim 1, is characterized in that, described intermediate rectangular metal level at least comprises the pin being positioned at its four drift angle places and the pin baseline connecting described pin; Adjacent pin is connected to surround second without the region of Metal Distribution by described pin baseline, and described second is formed with metal charge structure without in the region of Metal Distribution; Described metal charge structure at least comprises:
Several metal derbies contour with described pin baseline and the some metal line distributed radially;
Described metal wire one end is connected with pin baseline and is grounded, and the other end is gathered described second without non-intersect in the middle part of the region of Metal Distribution; Described metal derby does not contact with described metal wire.
4. the inductor with metal charge structure according to claim 1 or 3, it is characterized in that: described in the metal wire projection in the horizontal plane that is formed in each layer rectangular metal layer overlapped, formed between adjacent wires and be greater than the angle that 0 degree is less than or equal to 90 degree.
5. the inductor with metal charge structure according to claim 1, is characterized in that: described metal derby is square.
6. the inductor with metal charge structure according to claim 1, is characterized in that: described metal derby is evenly distributed in described first without in the region of Metal Distribution.
7. the inductor with metal charge structure according to claim 1, is characterized in that: described metal derby is identical with the material of pin baseline in bottom rectangular metal layer with the material of metal wire.
8. the inductor with metal charge structure according to claim 1, is characterized in that: the number of described metal wire is 4 ~ 32.
9. the inductor with metal charge structure according to claim 8, is characterized in that: the number of described metal wire is 8.
10. the inductor with metal charge structure described in claim 8 or 9, is characterized in that: between described adjacent wires, angle is equal.
11. inductors with metal charge structure according to claim 1, is characterized in that: the width of described metal wire is 3 times of the second minimum design rule, the minimum dimension that described second minimum design rule allows for technique.
12. inductors with metal charge structure according to claim 1, is characterized in that: the density of described metal charge distribution equals the first minimum design rule, and the first described minimum design rule is the minimum value of Metal Distribution density.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022241999A1 (en) * | 2021-05-19 | 2022-11-24 | 长鑫存储技术有限公司 | Semiconductor structure |
| US12261109B2 (en) | 2021-05-19 | 2025-03-25 | Changxin Memory Technologies, Inc. | Semiconductor structure |
| US12341094B2 (en) | 2021-05-19 | 2025-06-24 | Changxin Memory Technologies, Inc. | Semiconductor structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20060163692A1 (en) * | 2003-07-23 | 2006-07-27 | Detecheverry Celine J | Inductive and capacitvie elements for semiconductor techinologies with minimum pattern density requirements |
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| US20060163692A1 (en) * | 2003-07-23 | 2006-07-27 | Detecheverry Celine J | Inductive and capacitvie elements for semiconductor techinologies with minimum pattern density requirements |
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| CN102299134A (en) * | 2011-07-22 | 2011-12-28 | 华东师范大学 | On-chip integrated inductor internally inserted with dummy metal arrays |
| CN102412230A (en) * | 2011-11-28 | 2012-04-11 | 上海华虹Nec电子有限公司 | Inductive ground shielding structure for radio frequency process |
| CN102738127A (en) * | 2012-06-29 | 2012-10-17 | 杭州电子科技大学 | Novel fractal PGS (Program Generation System) structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2022241999A1 (en) * | 2021-05-19 | 2022-11-24 | 长鑫存储技术有限公司 | Semiconductor structure |
| US12261109B2 (en) | 2021-05-19 | 2025-03-25 | Changxin Memory Technologies, Inc. | Semiconductor structure |
| US12341094B2 (en) | 2021-05-19 | 2025-06-24 | Changxin Memory Technologies, Inc. | Semiconductor structure |
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| CN104934408B (en) | 2017-11-24 |
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