CN104900565A - Cavity jointing apparatus for semiconductor deposition device - Google Patents

Abstract

A semiconductor deposition equipment chamber docking device, which mainly solves the difficulty in docking split or modular chambers existing in existing semiconductor thin film deposition equipment, and the inconvenient precision adjustment, resulting in reduced equipment stability, which in turn affects equipment productivity and product quality. rate problem. It includes a guiding structure, a sliding structure, a detachable clamping support plate structure, a clamping structure, a fixing structure, a lifting adjustment structure and a supporting and guiding structure. The device uses the supporting and guiding structure as the main structure of the whole device, and a fixing structure is designed under the supporting and guiding structure, and the fixing structure is used to fix the whole docking device on the main frame of the equipment to realize the docking operation. The invention uses a simple and convenient structure to complete fixing, supporting, sliding transport, jacking, and clamping operations, and realizes docking operations and precision adjustments. While satisfying the function of use, it can save a part of human resources and avoid labor injuries and other hazards in the process of personnel operation.

Description

A cavity docking device for semiconductor deposition equipment

technical field

The invention relates to a cavity docking device applied to semiconductor film deposition equipment. A simple docking device is used to realize online docking of split or modular reaction chambers and film transfer chambers through simple fixing, supporting, sliding handling, jacking, and clamping structures. The invention belongs to the technical field of semiconductor thin film deposition application and manufacture.

Background technique

In order to expand the production capacity of semiconductor thin film deposition equipment, it is often necessary to mount multiple reaction chambers or film transfer chambers on a large transport module. In some split-type or modular chamber structures, it may be necessary to disassemble and install the reaction chamber or the transfer chamber no matter during the assembly process or equipment maintenance. In a site without lifting equipment or a position that cannot be reached by lifting equipment, there are great difficulties in the docking and installation of the cavity. Even if the chamber can be placed in its desired position by manual handling, it is very difficult to adjust the precision of the docking of the chamber. The precision of cavity docking directly determines the precision and reliability of film transfer, as well as the stability of equipment during film deposition. These will affect the performance of the equipment to a large extent, and then affect the yield and production capacity of the product.

In the existing semiconductor thin film deposition equipment, there are many split or modular chamber structures, and operations such as separation, disassembly, or docking installation are often required during assembly or maintenance. In production lines without lifting equipment, Or when docking is required at a position that cannot be reached by lifting equipment, it can only rely on manual handling, lifting, and docking. Such docking accuracy cannot be guaranteed, which will affect the accuracy and reliability of film transfer, and the equipment in the film deposition process. in the stability. These will affect the performance of the equipment to a large extent, and then affect the yield and production capacity of the product. Moreover, more human resources will be used for manual handling, lifting, and docking operations, which undoubtedly increases the maintenance cost of the equipment. There will be certain labor injuries and certain potential safety hazards during manual lifting operations for a long time. Considering the humanized design, these need to be avoided.

Contents of the invention

The purpose of the present invention is to solve the above problems, and mainly solve the difficulty in docking of split or modular chambers existing in existing semiconductor thin film deposition equipment, and the inconvenient adjustment of precision, which reduces the stability of the equipment, thereby affecting the production capacity of the equipment and product yield. The problem.

In order to achieve the above object, the present invention adopts the following technical solution: a semiconductor deposition equipment cavity docking device, including a guiding structure, a sliding structure, a detachable clamping support plate structure, a clamping structure, a fixing structure, a lifting adjustment structure and Support guide structure. The device uses the supporting and guiding structure as the main structure of the whole device, and a fixing structure is designed under the supporting and guiding structure, and the fixing structure is used to fix the entire docking device on the main frame of the equipment to realize the docking operation.

One or two guiding structures are arranged on the above-mentioned supporting and guiding structures, which serve as guiding and supporting functions during the sliding transport of the cavity, and the guiding structures have concave or convex structures.

A sliding structure is installed on the above-mentioned guiding structure, and the sliding structure is matched with the concave or convex structure of the guiding structure, and is slidably fitted.

The above-mentioned supporting and guiding structure is designed with a lifting adjustment structure, which can realize operations such as lifting, lowering and adjusting the cavity.

The above-mentioned supporting and guiding structure is also designed with a detachable clamping support plate structure, and a clamping structure is installed on the clamping support plate structure. The clamping structure is used to clamp and fix the cavity during the cavity docking process to prevent its position Deviation occurs. The above detachable clamping support plate structure can be designed as a detachable structure in order to avoid the cavity sliding path during the cavity sliding process. If the cavity sliding path does not coincide with the direction of the required clamping force, it can be It is made into a non-detachable structure with the supporting guide structure.

The present invention places the docking device on the main body frame of the equipment and fixes it on the main body frame through the fixing structure as the fulcrum of the whole docking device and the docking process during the docking and installation operation of the cavity. After the fixation is completed, place the cavities to be docked on the sliding structure on the guiding structure. After the cavity is slid to the required installation position, use the lifting adjustment structure to carry out the jacking operation, so as to adjust the overall height and level of the docking cavity. After the lifting adjustment is completed, the detachable clamping support plate structure is installed, and the clamping structure on it is adjusted to fully restrain the cavity. Then the fixing structure of the cavity itself is locked. When the operation is complete, remove the entire docking unit.

During the disassembly operation, it is also necessary to fix the docking device on the overall frame of the equipment, and then make the sliding structure located at the lower end of the cavity to be disassembled. After completion, lift the lifting adjustment structure to the lower surface of the cavity to be disassembled. After the completion, the cavity itself is fixed and released, so that the cavity relies on the lifting adjustment structure as a support, and then the lifting adjustment structure drives the cavity to move down slowly, so that the cavity falls on the sliding structure below. After the cavity completely falls on the surface of the sliding structure, push the sliding structure to push the cavity components to the periphery of the equipment, and perform other operations according to actual needs.

Beneficial effects and characteristics of the present invention:

The invention uses a simple and convenient structure to complete fixing, supporting, sliding transport, jacking, and clamping operations, and realizes docking operations and precision adjustments. Through a chamber docking device applied to semiconductor thin film deposition equipment, it can save part of human resources and avoid labor injuries and other hazards during personnel operation while satisfying the use function.

Description of drawings

Fig. 1 is a structural schematic diagram of the present invention.

Figure 2 is a side view of the present invention.

Figure 3 is a top view of the present invention.

As shown in the figure: 1. Guide structure; 2. Sliding structure; 3. Detachable clamping support plate structure; 4. Clamping structure; 5. Fixed structure; 6. Lifting and adjusting structure; 7. Supporting and guiding structure.

The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

Detailed ways

Example 1

As shown in Figures 1-3, a cavity docking device for semiconductor deposition equipment includes a guide structure 1, a sliding structure 2, a detachable clamping support plate structure 3, a clamping structure 4, a fixing structure 5, and a lifting adjustment structure 6 And support guide structure 7. The device uses the supporting guide structure 7 as the main structure of the whole device, which can be realized by means of welding or bolting after machining. A fixing structure 5 is designed below the supporting and guiding structure 7, and the fixing structure 5 is used to fix the entire docking device on the main body frame of the equipment to realize the docking operation. The above-mentioned fixing structure 5 can be directly connected to the main body frame through bolts, or can be realized by screw clamping, hydraulic clamping, pneumatic clamping or other clamping methods.

One to two guide structures 1 are arranged on the above-mentioned support and guide structure 7, which serve as guide and support functions during the sliding transport of the cavity. The above-mentioned guiding structure 1 can be made into a concave or convex structure by means of profiles, sheet metal or mechanical processing, and general guide rail forms such as linear guide rails, inlaid steel guide rails, and plastic-coated guide rails can also be used.

The sliding structure 2 is installed on the above-mentioned guiding structure 1, and the sliding structure 2 is matched with the concave or convex structure of the guiding structure 1, and is slidably fitted. The sliding structure 2 adopts a general or non-universal structure, and steel balls, steel balls, needle rollers or rollers are installed at the lower end of the sliding structure 2 if a non-universal structure is used.

In order to perform sliding movement, the upper end is the sliding friction generated by the cavity pressure, and the lower end is rolling friction. Because the rolling friction is much smaller than the sliding friction, the cavity will not move or crawl during the entire sliding process. The above-mentioned sliding structure 2 can be made into a whole or a separate form of each slider according to actual needs, so as to meet the requirements of different types of cavities. The aforementioned sliding structure 2 can be manually operated for sliding movement, and can also be automatically operated by power units such as cylinder push, electric cylinder push, hydraulic push, and lead screw drive.

The above-mentioned support and guide structure 7 is designed with a lifting adjustment structure 6, and the lifting adjustment structure 6 can realize the lifting, lowering, adjustment etc. The support guide structure 7 is also designed with a detachable clamping support plate structure 3, the detachable clamping support plate structure 3 can be designed as a detachable structure, so as to avoid the cavity sliding path during the cavity sliding process, such as cavity If the sliding path of the body does not coincide with the direction of the required clamping force, it can be made into a non-detachable structure with the supporting and guiding structure 7 . The above-mentioned detachable clamping support plate structure 3 can be realized by means of threaded connection or mechanical clamping connection, but it needs to be easy to disassemble and install. The above-mentioned clamping support plate structure 3 can be processed into a plate shape or other shapes suitable for the cavity structure, so as to facilitate operation and installation. A clamping structure 4 is installed on the above-mentioned clamping support plate structure 3, and the clamping structure 4 is used to clamp and fix the cavity during the docking process of the cavity, so as to prevent its position from being deviated. The above-mentioned clamping structure 4 can realize operations such as clamping and fixing the cavity by screw clamping, pneumatic clamping, electric clamping, hydraulic clamping or other mechanical clamping methods.

The above-mentioned fixed structure 5, sliding structure 2, lifting adjustment structure 6 and clamping structure 4 should be made of materials lower than the hardness of the cavity or the frame itself, so as not to damage the cavity or the frame during operation. frame, but it still needs to have a certain strength and hardness so that it will not be damaged when it is fixed or supported during the cavity docking process.

When performing cavity docking and installation operations, the supporting guide structure 7 is placed on the main frame of the equipment, and fixed on the main frame by the fixing structure 5 as the fulcrum of the entire docking device and the docking process. After the fixing is completed, the cavities to be docked are placed on the sliding structure 2 on the guiding structure 1 . Push the sliding structure 2 and the cavity, and after sliding the cavity to the required installation position, use the lifting adjustment structure 6 to carry out the jacking operation, so as to adjust the overall height and level of the docking cavity. After the lifting adjustment is completed, the detachable clamping support plate structure 3 is installed, and the clamping structure 4 on it is adjusted so that the cavity is completely restrained. Then the fixed structure of the cavity itself is locked. When the operation is complete, remove the entire docking unit.

During the disassembly operation, it is also necessary to fix the supporting guide structure 7 on the overall frame of the equipment, and then make the sliding structure 2 be located at the lower end of the cavity to be disassembled. After completion, lift the lifting adjustment structure 6 to the lower surface of the cavity to be disassembled. After the completion, the cavity itself is fixed and released, so that the cavity relies on the lifting adjustment structure 6 as a support, and then the lifting adjustment structure 6 drives the cavity to move down slowly, so that the cavity falls on the sliding structure 2 below. After the cavity completely falls on the surface of the sliding structure 2, push the sliding structure 2 to push the cavity components to the periphery of the equipment, and perform other operations according to actual needs.

Claims (6)

1. A cavity docking device for semiconductor deposition equipment, characterized in that it includes a guiding structure, a sliding structure, a detachable clamping support plate structure, a clamping structure, a fixing structure, a lifting adjustment structure and a supporting and guiding structure, the device The support and guide structure is used as the main structure of the whole device, and a fixed structure is designed under the support and guide structure; a guide structure is set on the support and guide structure, and a sliding structure is installed on the guide structure. The concave or convex shape of the sliding structure and the guide structure The supporting and guiding structure is also designed with a lifting adjustment structure and a detachable clamping support plate structure, and a clamping structure is installed on the support plate structure. 2. The semiconductor deposition equipment cavity docking device according to claim 1, characterized in that: the structure of the detachable clamping support plate is designed as a detachable structure or a non-detachable structure. 3. The semiconductor deposition equipment cavity docking device according to claim 1, characterized in that: one to two guiding structures are arranged on the supporting guiding structure, and the guiding structures are made into concave or convex shapes by means of profile, sheet metal or mechanical processing. Type structure, or use the general guide rail structure of linear guide rail, inlaid steel guide rail, and plastic-coated guide rail. 4 . The device for docking chambers of semiconductor deposition equipment according to claim 1 , wherein the supporting and guiding structures are connected by bolts after welding or machining. 5 . The cavity docking device of semiconductor deposition equipment according to claim 1 , wherein the fixing structure is directly connected to the main frame through bolts or by means of screw clamping, hydraulic clamping, or pneumatic clamping. 6 . 6. The semiconductor deposition equipment cavity docking device according to claim 1, characterized in that: the sliding structure adopts a general or non-general structure, and if a non-general structure is used, steel balls and steel balls are installed at the lower end of the sliding structure , Needle or roller components.