CN104676545A - Heat absorbing device, heat radiating device and LED (light-emitting diode) mining lamp radiating system - Google Patents
Heat absorbing device, heat radiating device and LED (light-emitting diode) mining lamp radiating system Download PDFInfo
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- CN104676545A CN104676545A CN201510093466.5A CN201510093466A CN104676545A CN 104676545 A CN104676545 A CN 104676545A CN 201510093466 A CN201510093466 A CN 201510093466A CN 104676545 A CN104676545 A CN 104676545A
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- radiator
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- 238000005065 mining Methods 0.000 title abstract 2
- 239000007788 liquid Substances 0.000 claims abstract description 98
- 239000003507 refrigerant Substances 0.000 claims description 38
- 238000001816 cooling Methods 0.000 claims description 13
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000004020 luminiscence type Methods 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000011796 hollow space material Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229920000914 Metallic fiber Polymers 0.000 claims description 3
- 229910021529 ammonia Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 abstract description 20
- 230000008020 evaporation Effects 0.000 abstract description 20
- 230000000694 effects Effects 0.000 abstract description 19
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract 1
- 230000005484 gravity Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 230000005499 meniscus Effects 0.000 description 12
- 239000000126 substance Substances 0.000 description 12
- 238000012546 transfer Methods 0.000 description 7
- 238000009835 boiling Methods 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 230000003416 augmentation Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/40—Lighting for industrial, commercial, recreational or military use
- F21W2131/402—Lighting for industrial, commercial, recreational or military use for working places
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a heat absorbing device which is used for absorbing heat radiated by a heating body. The heating body is close to, attached to or embedded into one side of the heat absorbing device, a plurality of micro protrusions are arranged on the other side of the heat absorbing device to form a micro protrusion group, capillary micro grooves are formed among the micro protrusions to form a capillary micro groove group, the micro protrusion group and the capillary micro groove group are immersed in liquid work medium, and the capillary micro groove group can form capillary force to absorb the liquid work medium beside the capillary micro grooves into the micro grooves to form a phase-change heat-exchange thin liquid film area. The heat absorbing device is further provided with a liquid storage tank which is arranged on the periphery, edge or outer edge of the surface, provided with the micro protrusions, of heating device. The problems that the micro liquid film evaporation condition is lost and the heat absorbing effect is reduced due to the fact that the heat absorbing device inclines caused by external environmental fluctuation or other reasons are solved. The invention further relates to a heat radiating device and an LED (light-emitting diode) mining lamp radiating system.
Description
Technical field
The invention belongs to technical field of heat dissipation, be specially a kind of heat sink, heat abstractor and LED bay light cooling system.
Background technology
LED (light-emitting diode, Light-Emitting Diode) is considered to the new light sources of 21 century most worthy, it has the advantages such as low-work voltage, reaction time short, energy-efficient, working stability, life-span long, pollution-free, high brightness, just be widely used in fields such as urban look, lighting of home, automobile tail light, LED-backlit plates, LED illumination replaces traditional lighting and becomes the major way of mankind's illumination, will be trend of the times.
The manufacture of current great power LED is towards high-performance, integrated and miniaturization, and the power density of its chip can reach hundreds of W/cm
2.The electro-optical efficiency of great power LED is about 20%, and the electric energy of about 80% is converted to heat and distributes, and therefore the heat flow density at its chip place is high.And the junction temperature rising of LED can cause luminous efficiency decline, the lost of life, luminescent spectrum to produce drift, serious also can burn chip, so heat radiation needs one of key problems-solving in high-power LED illumination.
The existing various LED in market often adopts Natural Heat Convection, fan forced heat radiation or heat pipe method to make cooler.Wherein, hot pipe technique is the heat transfer element that one that George Ge Luofo (George Grover) of U.S. Los Alamos (Los Alamos) National Laboratory in 1963 invents is called " heat pipe ", it takes full advantage of the Rapid Thermal hereditary property of heat-conduction principle and refrigeration filling, through heat pipe, the heat of thermal objects is delivered to rapidly outside thermal source, its capacity of heat transmission exceed any oneself know the capacity of heat transmission of metal.
Present heat pipe is widely used in radiator manufacturing, the stem stem of such as, on market emerging high-power LED phase-change radiator just adopts gravity assisted heat pipe technology, can see published Chinese patent, if number of patent application is 200810217336.8, denomination of invention is " a kind of vacuum liquid heat radiating device for LED lamp ", number of patent application is 201010216542.4, denomination of invention is " gravity type flat heat pipe radiator for cooling LED ", number of patent application is 201010256523.4, denomination of invention is " a kind of heat-pipe radiator and make the high-power LED lamp of radiating element with it ", number of patent application is 201010543821.1, denomination of invention is " a kind of high-efficient single direction heat transfer heat pipe for microelectronics heat radiation of improvement " and number of patent application is 201210006408.0, denomination of invention is content disclosed in patent documents such as " the modified gravity force heat pipe radiators for great power LED ".
Traditional gravity heat pipe primarily of shell, end cap and working medium three part composition.In gravity assisted heat pipe, the Temperature of Working of evaporation is higher, density is lower, has the trend to gravity motion in the other direction.And the vapour volume in condensation process diminishes, density uprises, and has the trend to gravity direction motion.Therefore, gas rises to condensation segment and is condensed into liquid, and liquid heat-conducting medium is back to evaporator section by Action of Gravity Field, and complete thermal cycle, heat is dispersed in external environment condition by fin.
Because traditional gravity heat pipe is also limited to the cooling capacity of LED chip, be difficult to realize from the timely heat-obtaining of high-power LED lamp wicking surface and externally heat radiation, its temperature is reduced in ideal range.Therefore there is again a kind of heat dissipating method adopting the high strength micro-scale composite phase-change enhanced heat exchange of liquid working substance nucleate boiling, be specifically 201010152539.0 see number of patent application, denomination of invention is " a kind of cavity-type light-emitting diode lamp ", during its work, liquid working substance in the fine conduit of open type, flow along microflute under the effect of capillary gradients, in microflute, form the high strength micro-scale composite phase-change enhanced heat exchange process of the thin liquid film evaporation of expansion meniscus surface area and the thick liquid film nucleate boiling of intrinsic meniscus surface area simultaneously, liquid working substance is become caloric value that steam takes away LED chip.But there is fluctuation due to external environment or other reasons in this heat dissipating method, cause the inclination of heat control system, can cause the problem of the forfeiture of micro-liquid film evaporation condition, this can cause interior junction temperature superelevation, even can cause dead lamp fast time serious.
Summary of the invention
The technical problem to be solved in the present invention is: provide a kind of heat sink, and it can avoid the heat sink adopting micro-liquid film evaporation, because of external environment fluctuation or other reasons, causes heat sink to tilt, the problem that the micro-liquid film evaporation condition caused is lost.
While providing above-mentioned heat sink, the present invention also provides a kind of heat abstractor comprising this heat sink.A kind of LED bay light cooling system comprising this heat abstractor is also provided.
In order to solve the problems of the technologies described above, the invention provides a kind of heat sink, for absorbing the heat that heater sends, wherein, the one side that described heater is close, be close to or be embedded in described heat sink, the another side of described heat sink is provided with multiple microprotrusion, forms dimpling group, be provided with capillary slot road between microprotrusion, and form capillary slot group; Described dimpling group and capillary slot group are immersed in liquid refrigerant, and capillary slot group forms capillary force, to be drawn in micro-channel by the liquid refrigerant on limit, capillary slot road, and in micro-channel, forms the thin liquid film region of phase-change heat-exchange; Described heat sink is also provided with reservoir, and what described reservoir was arranged on described heat sink has the periphery in microprotrusion face, edge or outer rim.
Optionally, described reservoir is provided with multiple, and is symmetrically distributed in edge or the outer rim of described heat sink.
Optionally, described reservoir is the ring-type communicated, and is arranged on the periphery of described heat sink.
Optionally, described heat sink also comprises liquid-sucking core, and described liquid-sucking core is arranged in described microprotrusion.
Optionally, described liquid-sucking core is made of porous materials.
Optionally, described liquid-sucking core is sintered by metal dust, metallic fiber or ceramic powders and forms.
Optionally, described liquid-sucking core is disposed on separately in described single microprotrusion.
Optionally, described liquid-sucking core is arranged in described multiple microprotrusion with being interconnected at least partly.
Optionally, described interconnective liquid-sucking core is network structure.
Optionally, described liquid-sucking core overall structure, is arranged in all described microprotrusion.
Optionally, described liquid-sucking core periphery offers one or more through hole.
Optionally, described liquid-sucking core is arranged on the top of described microprotrusion.
Optionally, described liquid-sucking core is arranged on the outer wall of described microprotrusion.
Optionally, on the described liquid-sucking core top that is arranged on described microprotrusion and outer wall.
Optionally, the shape of described microprotrusion be zigzag, triangle, trapezoidal, arc and cylindrical in one or more combination.
Optionally, the shape of described micro-channel be zigzag, triangle, trapezoidal, arc and cylindrical in one or more combination.
Optionally, described liquid refrigerant is one or more the composition in water, acetone, methyl alcohol, ethanol, liquid freon and liquefied ammonia.
Optionally, described dimpling group and capillary slot group itself are partially immersed in liquid refrigerant.
The heat abstractor provided, comprise radiator and any one heat sink above-mentioned, form closed cavity between described radiator and described heat sink, described liquid refrigerant is arranged in this closed cavity.
Optionally, described heat abstractor also comprises end cap, and described radiator is column, and described end cap is arranged on described radiator top, and described heat sink is arranged on bottom described radiator, described end cap, forms closed cavity between radiator and described heat sink.
Optionally, described radiator and described heat sink are formed in one structure.
Optionally, described radiator is column, and described heat sink is arranged on bottom described radiator, and it is funnel-form fin that the top in described radiator is provided with longitudinal section, and the spout of funnel of described funnel-form fin is towards the middle part of heat sink.
Optionally, described radiator is the sun fancy structure comprising skeleton and fin formation.
Optionally, described skeleton and fin are hollow structure, and the hollow structure of described skeleton, fin is connected with the closed cavity formed between described radiator and heat sink.
Optionally, described radiator is the column structure of hollow, and described heat abstractor also comprises radiating core, and described radiating core is built in the hollow space of described radiator.
Optionally, the cross section of described fin be triangle, quadrangle, polygon, crescent, sickleshaped and arch-shaped in one or more combination.
Optionally, the longitudinal section of described fin is rectangle, S shape or spirality.
The LED bay light cooling system provided, for absorbing and shift the heat that LED luminescence chip sends, wherein also above-mentioned heat abstractor described in any one, described LED luminescence chip is close, the one side of being close to or being embedded in described heat sink.
Heat sink of the present invention, for absorbing the heat that heater sends, the one side that described heater is close, be close to or be embedded in described heat sink, the another side of described heat sink is provided with multiple microprotrusion, form dimpling group, be provided with capillary slot road between microprotrusion, and form capillary slot group; Described dimpling group and capillary slot group are immersed in liquid refrigerant, and capillary slot group forms capillary force, to be drawn in micro-channel by the liquid refrigerant on limit, capillary slot road, and in micro-channel, forms the thin liquid film region of phase-change heat-exchange; Described heat sink is also provided with reservoir, and what described reservoir was arranged on described heat sink has the periphery in microprotrusion face, edge or outer rim.Under normal circumstances, liquid refrigerant in capillary slot road, flow along microflute under the effect of capillary gradients, in microflute, form the high strength micro-scale composite phase-change enhanced heat exchange process of the thin liquid film evaporation of expansion meniscus surface area and the thick liquid film nucleate boiling of intrinsic meniscus surface area, liquid refrigerant is become caloric value that steam zone walks radiator simultaneously.And when fluctuating or other reasons because of external environment, when causing heat sink to tilt, due to the mobility of liquid refrigerant, be in the capillary slot road of higher position and may occur work Mass lost, or working medium amount cannot infiltrate in microflute, the forfeiture of micro-liquid film evaporation condition may be caused.At this moment, be arranged on having in the reservoir of the periphery in microprotrusion face, edge or outer rim of heat sink and store liquid refrigerant, working medium can be carried out to neighbouring capillary slot road in time to supplement, it is avoided to lose the condition of micro-liquid film evaporation condition, this portion temperature caused sharply raises, the problem that endothermic effect declines.
In further technical scheme, liquid-sucking core can also be set in described microprotrusion, described liquid-sucking core can be made of porous materials, in capillary slot around microprotrusion work Mass lost or without working medium time, the liquid refrigerant stored in liquid-sucking core can carry out working medium to this capillary slot road and supplement, also it can be avoided to lose the condition of micro-liquid film evaporation condition, and this portion temperature caused sharply raises, the problem that endothermic effect declines.
Heat abstractor provided by the invention, owing to comprising above-mentioned heat sink, also has corresponding technique effect.In further technical scheme, described radiator and heat sink can adopt integrated formed structure, and such sealing effectiveness is better, avoid leaking.
In further technical scheme, described radiator can for being column, described heat sink is arranged on bottom described radiator, and it is funnel-form fin that the top in described radiator can be provided with longitudinal section, and the spout of funnel of described funnel-form fin is towards the middle part of heat sink.During work, the heat of heater makes the heat sink temperature bottom radiator raise, when reaching the phase transition temperature of working medium, the local of working medium can produce phase transformation, namely working medium transfers steam state to by liquid state, steam state working medium moves upward after the restriction being subject to column radiator inwall, arrive the top rear steering of radiator, through the many heat radiations of radiator, steam state working medium is met condensation and is formed liquid refrigerant, liquid refrigerant is that funnel-form fin moves downward under gravity along longitudinal section, the middle part of heat sink is flowed to by spout of funnel, and the general temperature in the middle part of heat sink other places all relative are higher, therefore this heat abstractor has stronger radiating effect.
In further technical scheme, described radiator can be the sun fancy structure comprising skeleton and fin formation, wherein said skeleton and fin are hollow structure, and the hollow structure of described skeleton, fin is connected with the closed cavity formed between described radiator and heat sink.During work, steam state working medium not only can flow to ground cavity in radiator, and can flow in the hollow structure of skeleton, fin.Like this when making onesize heat abstractor, this radiator can obtain larger area of dissipation, thus has better radiating effect.
LED bay light cooling system provided by the invention, owing to comprising above-mentioned heat abstractor, also has corresponding technique effect.
Accompanying drawing explanation
Fig. 1 is for representing the stereogram of the heat sink involved by present embodiment;
Fig. 2 is the sectional view of heat sink shown in Fig. 1;
Fig. 3 is the place of A shown in Fig. 1 partial enlarged drawing;
Fig. 4 is for representing the stereogram of the liquid-sucking core involved by present embodiment;
Fig. 5 is for representing the configuration diagram of the another kind of liquid-sucking core involved by present embodiment;
Fig. 6 is for representing the sectional view of the heat abstractor involved by present embodiment;
Fig. 7-Figure 10 is for representing the sectional view of the other several heat abstractor involved by present embodiment;
Figure 11 is for representing the configuration diagram of the radiator involved by present embodiment;
Figure 12 is the top view of radiator shown in Figure 11.
In figure:
1 thin liquid film region, heat sink 2 microprotrusion 3 capillary slot road 31
31a meniscus 31b expands the intrinsic meniscus surface area of meniscus thin liquid film region 31c
4 reservoir 5 radiator 51 skeleton 52 fins
6 liquid-sucking core 7 through hole 8 end cap 9 funnel-form fin
91 fin fin 10 heaters
Detailed description of the invention
Describe the present invention below in conjunction with accompanying drawing, the description of this part is only exemplary and explanatory, should not have any restriction to protection scope of the present invention.In addition, those skilled in the art, according to the description of presents, can carry out respective combination to the feature in embodiment in presents and in different embodiment.
< heat sink >
Refer to Fig. 1 and Fig. 2.Fig. 1 is for representing the stereogram of the heat sink involved by present embodiment, and Fig. 2 is the sectional view of heat sink shown in Fig. 1.In the present embodiment, the one side of heat sink 1 can be provided with multiple microprotrusion 2, and multiple microprotrusion 2 forms dimpling group, forms capillary slot road 3 between microprotrusion 2, and multiple capillary slot road 3 forms capillary slot group; Dimpling group and capillary slot group are immersed in liquid refrigerant, and capillary slot group forms capillary force, to be drawn in micro-channel by the liquid refrigerant on limit, capillary slot road 3, and in micro-channel, forms the thin liquid film region 31 of phase-change heat-exchange.During work, heat sink utilizes micro-liquid film evaporation augmentation of heat transfer mechanism in thin liquid film region 31, the heat utilizing Working fluid phase changing potential to produce with heater, the steam state working medium that carry potential is dispelled the heat and is condensed into liquid refrigerant on radiator 5, relies on gravity reflux to come back in micro-channel.In the present embodiment, heat sink 1 can adopt the material of high thermal conductivity to make, and as the metal material such as copper, aluminium, multiple microprotrusion 2 can be distributed in a face of heat sink 1 by uniform intervals, and the another side of heat sink 1 is close to heater.Certainly as required, also by the one side of heater near heat sink 1, or heater 10 can be embedded in (as shown in Figure 10) in the one side of heat sink 1, as long as be convenient to carry out heat trnasfer between heater and heat sink.Refer to Fig. 3, the concrete principle of micro-liquid film evaporation augmentation of heat transfer mechanism in described thin liquid film region 31 is: in micro-channel, by capillary force, the liquid working substance on conduit limit is drawn into micro-channel, simultaneously due to the effect of surface tension of liquid, liquid working substance does not flood micro-channel, but meniscus 31a is formed in micro-channel, make the very thin thickness of liquid film in conduit, heat transfer resistance is very little, near meniscus 31a and channel sidewalls contact point, form the little expansion meniscus thin liquid film region 31b to micron dimension of thickness of liquid film simultaneously, when heater heat imports in micro-channel, liquid working substance flows along microflute under the effect of capillary gradients, in microflute, form the high strength micro-scale composite phase-change enhanced heat exchange process of the thin liquid film evaporation of expansion meniscus surface area and the thick liquid film nucleate boiling of intrinsic meniscus surface area 31c simultaneously, make liquid working substance become steam and take away the heat of heater.Experiment shows, this micro-scale composite phase-change enhanced heat exchange process belongs to the extraordinary phenomenon of the heat and mass under micro-space scale, it takes full advantage of the interfacial effect of micro-scale and dimensional effect to the extraordinary strengthening mechanism of flow and heat transfer, and its theoretical maximum heat-obtaining heat flow density can up to 100W/m
2, more taller than the highest heating heat flow density of current electronic device go out two orders of magnitude, be a kind of high performance cooling heat dissipation mode.
Refer to Fig. 1 and Fig. 2 again, in the present embodiment, heat sink 1 can also be provided with reservoir 4, and this reservoir 4 is arranged on the periphery having microprotrusion face of heat sink.Reservoir 4 can be annular, is centered around the periphery having microprotrusion face of heat sink 1.Certainly, also reservoir 4 can be arranged on the edge or the outer rim that there are microprotrusion face of heat sink 1 as required, such as 4 ~ 100 reservoirs 4 be set symmetrically in the have edge in microprotrusion face or the outer rim of heat sink 1.The concrete structure of this reservoir 4 can be square groove, arc groove or triangular groove.Dispel the heat on radiator 5 due to steam state working medium and be condensed into liquid refrigerant, then gravity reflux is relied on to come back in micro-channel, and micro-channel is, by capillary force, the liquid working substance on conduit limit is drawn into micro-channel, liquid working substance can not flood micro-channel, and this just requires the amount of the liquid refrigerant added in the reasonable scope.If the liquid refrigerant amount filled is excessive, this micro-liquid film evaporation effect is not just present in, and the operation principle of heat sink can become pool boiling.And when liquid refrigerant amount in the reasonable scope time, if tilt due to heat sink 1 or blow by external wind and wave, just there will be heat sink and work Mass lost appears in the direct contact portion of heater, or working medium amount cannot infiltrate micro-channel, this portion temperature will be caused sharply to raise, endothermic effect is declined, even occurs burn-off phenomenon.Now, the working medium be stored in reservoir 4 can add in neighbouring micro-channel in time, prevents micro-channel working medium amount from drying up, and causes micro-liquid film evaporation condition in part thin liquid film region 31 to be lost.
Refer to Fig. 4 and Fig. 5, in the present embodiment, heat sink 1 can also be provided with liquid-sucking core 6, and described liquid-sucking core 6 is arranged in described microprotrusion 2.Like this, tilt when heat sink 1 or blow by external wind to wave, occur that work Mass lost appears in heat sink and the direct contact portion of heater, or when working medium amount cannot infiltrate micro-channel, the working medium be stored in liquid-sucking core 6 also can add in the micro-channel around the microprotrusion 2 under it in time, prevent micro-channel working medium amount from drying up, and cause micro-liquid film evaporation condition in part thin liquid film region 31 to be lost.Preferably, described liquid-sucking core 6 is made of porous materials, and forms as sintered by metal dust, metallic fiber or ceramic powders.Certainly, other porous materials also can be had to make.Fully can absorb like this, store a certain amount of liquid working substance wherein.Concrete, described liquid-sucking core 6 can adopt the mode of separating separately, is arranged in single described microprotrusion 2.Such as, described liquid-sucking core 6 can be set in all microprotrusion 2, also can only arrange in part microprotrusion 2.Certainly, described liquid-sucking core 6 also can adopt part to be interconnected ground mode to be arranged in described multiple microprotrusion 2, as liquid-sucking core 6 is arranged to interconnective in network structure.Preferably, described liquid-sucking core 6, according to the topological shape of microprotrusion 2, is arranged to a monoblock, is placed on described microprotrusion 2 (as shown in Figure 4).Be convenient to like this manufacture and install, reliability is also higher.Further, liquid-sucking core 6 periphery of described monoblock offers one or more through hole 7.As offered 2 ~ 20 through holes 7 (as shown in Figure 5) in the periphery symmetry of liquid-sucking core 6.Like this, when the steam state working medium in thin liquid film region 31 moves upward the resistance being subject to liquid-sucking core 6, can be moved upward by the through hole 7 of liquid-sucking core 6 periphery, certainly, when liquid refrigerant moves downward, also can flow to downwards thin liquid film region 31 by through hole 7.Preferably, described liquid-sucking core 6 can be arranged on described microprotrusion 2 top on or/and described liquid-sucking core 6 is arranged on the outer wall of described microprotrusion 2.As long as be convenient to install and place.
In the present embodiment, the shape of described microprotrusion 2 can be set to zigzag, triangle, trapezoidal, arc and cylindrical in one or more combination.Certainly, also the shape of described micro-channel can be set to zigzag, triangle, trapezoidal, arc and cylindrical in one or more combination.Such as, the shape of described microprotrusion 2 is arranged to cylindrical, and such relative equivalent diameter is comparatively large, difficulty of processing is less.
In the present embodiment, described liquid refrigerant can be the working medium for liquid state under normal temperature and pressure, as water, acetone, methyl alcohol and ethanol; Also can be the working medium for gaseous state under normal temperature and pressure, as freon R11, R22, R-134a, liquefied ammonia etc. can be the composition of aforementioned two or more liquid refrigerant certainly.Adopt and environment and heat sink material compatible as long as be understandable that: there is temperature control ability, namely can (as about 50 DEG C evaporations) liquid refrigerant that larger heat flow density absorbs heat can be realized can fill working medium as native system under relatively low operating temperature.In addition, described dimpling group and capillary slot group itself can be partially immersed in liquid refrigerant.So that form thin liquid film region 31, construct micro-liquid film evaporation condition.Therefore, to the scope that the filling weight demand fulfillment one of the liquid refrigerant added is relatively reasonable.
< heat abstractor >
Refer to shown in Fig. 6 to Figure 10, this heat abstractor, comprise radiator 5 and above-mentioned heat sink 1, form closed cavity between described radiator 5 and described heat sink 1, described liquid refrigerant is arranged in this closed cavity.Like this, after heat sink 1 is heated, cavity built with the liquid working substance with the latent heat of vaporization become steam through micro-liquid film evaporation, the steam state working medium that carry potential is dispelled the heat and is condensed into liquid refrigerant on radiator 5, rely on gravity reflux to come back in the micro-channel of heat sink 1, form the circulation of once dispelling the heat.Owing to having above-mentioned heat sink 1, also can produce corresponding technique effect, not repeat them here.
In the present embodiment, described heat abstractor can also comprise end cap 8, described radiator 5 can be set to column, described end cap 8 is arranged on described radiator 5 top, described heat sink 1 is arranged on bottom described radiator 5, described end cap 8, between radiator 5 and described heat sink 1, form closed cavity, be more convenient for like this manufacturing and installing.Preferably, described radiator 5 can adopt integrated formed structure with described heat sink 1, and direct entirety manufactures together.Like this, its better tightness.Further, it is funnel-form fin 9 that the top in described radiator 5 is provided with longitudinal section, and the spout of funnel of described funnel-form fin 9 is towards the middle part of heat sink 1.Like this, after steam state working medium is dispelled the heat and is condensed into liquid refrigerant on radiator 5, spout of funnel through funnel-form fin 9 directly flows to the middle part of heat sink 1, and the middle part of heat sink 1 is general all closer to heater, temperature is relatively higher, the evaporation of liquid refrigerant is also faster, is so just more conducive to flowing and the circulation of working medium.Certainly in order to improve radiating effect further, some fin fins 91 can also be set on described funnel-form fin 9.
Refer to Figure 11 and Figure 12, in the present embodiment, described radiator 5 can adopt the sun fancy structure comprising skeleton 51 and fin 52 formation.Preferably described skeleton 51 and fin 52 can adopt hollow structure, and the hollow structure of described skeleton 51, fin 52 is connected with the closed cavity formed between described radiator 5 and heat sink 1.Such steam state working medium not only can flow to the hollow space of heat sink 1, in the skeleton 51 that also can flow into, the hollow structure of fin 52, to improve radiating surface, is therefore more conducive to distributing of steam state working medium heat, improves radiating efficiency.Preferably, the cross section of described fin 52 can be set to triangle, quadrangle, polygon, crescent, sickleshaped and arch-shaped in one or more combination.Meanwhile, the longitudinal section of described fin 52 is rectangle, S shape or spirality.To increase area of dissipation, improve radiating efficiency.
In the present embodiment, described radiator 5 can be the column structure of hollow, can also be provided with radiating core, improve radiating effect further at the hollow space of described radiator 5.
<LED bulkhead lamp capable cooling system >
On the basis providing above-mentioned heat abstractor, the embodiment of the present invention additionally provides a kind of LED bay light cooling system.The heat that this LED bay light cooling system sends for absorbing and shift LED luminescence chip, can comprise any one heat abstractor above-mentioned, and described LED luminescence chip is close, the one side of being close to or being embedded in described heat sink 1.Owing to having above-mentioned heat abstractor, also can produce corresponding technique effect, not repeat them here.
Certainly, in order to realize carrying out filling of liquid refrigerant to described LED bay light cooling system, system in fact can also comprise vacuumize quantitatively fill with liquid refrigerant fill mouth, and system is being carried out after liquid refrigerant filled, again system is sealed, guarantee system sealing and do not leak.Owing to carrying out the technical scheme that liquid working substance fills and vacuumizes to system, on the books in the prior art, as number of patent application is: the disclosed patent document such as CN201110253364.7, CN201310231790.X, also repeats no more at this.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (10)
1. a heat sink, for absorbing the heat that heater sends, it is characterized in that: described heater is close, the one side of being close to or being embedded in described heat sink, the another side of described heat sink is provided with multiple microprotrusion, form dimpling group, be provided with capillary slot road between microprotrusion, and form capillary slot group;
Described dimpling group and capillary slot group are immersed in liquid refrigerant, and in capillary slot road, form the thin liquid film region of phase-change heat-exchange;
Described heat sink is also provided with reservoir, and what described reservoir was arranged on described heat sink has the periphery in microprotrusion face, edge or outer rim.
2. heat sink according to claim 1, is characterized in that, described reservoir is provided with multiple, and is symmetrically distributed in edge or the outer rim of described heat sink.
3. heat sink according to claim 2, is characterized in that, described reservoir is the ring-type communicated, and is arranged on the periphery of described heat sink.
4. heat sink according to claim 1, is characterized in that, described heat sink also comprises liquid-sucking core, and described liquid-sucking core is arranged in described microprotrusion.
5. heat sink according to claim 4, is characterized in that, described liquid-sucking core is made of porous materials.
6. heat sink according to claim 5, is characterized in that, described liquid-sucking core is sintered by metal dust, metallic fiber or ceramic powders and forms.
7. heat sink according to claim 4, is characterized in that, described liquid-sucking core is disposed on separately in described single microprotrusion; Described liquid-sucking core is arranged in described multiple microprotrusion with being interconnected at least partly; Described interconnective liquid-sucking core is network structure; Described liquid-sucking core overall structure, is arranged in all described microprotrusion; Described liquid-sucking core periphery offers one or more through hole; Described liquid-sucking core is arranged on the top of described microprotrusion; Or described liquid-sucking core is arranged on the outer wall of described microprotrusion; Or on the described liquid-sucking core top that is arranged on described microprotrusion and outer wall; The shape of described microprotrusion be zigzag, triangle, trapezoidal, arc and cylindrical in one or more combination; The shape of described micro-channel be zigzag, triangle, trapezoidal, arc and cylindrical in one or more combination; Described liquid refrigerant is one or more the composition in water, acetone, methyl alcohol, ethanol, liquid freon and liquefied ammonia; Described dimpling group and capillary slot group itself are partially immersed in liquid refrigerant.
8. a heat abstractor, comprises radiator, it is characterized in that, also comprises the heat sink according to any one of claim 1 to 7, forms closed cavity between described radiator and described heat sink, and described liquid refrigerant is arranged in this closed cavity.
9. heat abstractor according to claim 8, is characterized in that, also comprises end cap, described radiator is column, described end cap is arranged on described radiator top, and described heat sink is arranged on bottom described radiator, described end cap, forms closed cavity between radiator and described heat sink; Described radiator and described heat sink are formed in one structure; Described radiator is column, and described heat sink is arranged on bottom described radiator, and it is funnel-form fin that the top in described radiator is provided with longitudinal section, and the spout of funnel of described funnel-form fin is towards the middle part of heat sink; Described radiator is the sun fancy structure comprising skeleton and fin formation; Described skeleton and fin are hollow structure, and the hollow structure of described skeleton, fin is connected with the closed cavity formed between described radiator and heat sink; Described radiator is the column structure of hollow, and described heat abstractor also comprises radiating core, and described radiating core is built in the hollow space of described radiator; The cross section of described fin be triangle, quadrangle, polygon, crescent, sickleshaped and arch-shaped in one or more combination; The longitudinal section of described fin is rectangle, S shape or spirality.
10. a LED bay light cooling system, for absorbing and shift the heat that LED luminescence chip sends, is characterized in that, also comprises the heat abstractor described in claim 8 or 9, and described LED luminescence chip is close, the one side of being close to or being embedded in described heat sink.
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| CN105221941A (en) * | 2015-10-28 | 2016-01-06 | 福建中科芯源光电科技有限公司 | Tool strengthening multi-layer leads the LED bay light of heat-sinking capability |
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| CN109882810A (en) * | 2017-12-06 | 2019-06-14 | 中国科学院工程热物理研究所 | Radiator unit for full angle LED spotlight |
| CN109882810B (en) * | 2017-12-06 | 2024-03-19 | 中国科学院工程热物理研究所 | Radiator device of full-angle LED projection lamp |
| CN108332174A (en) * | 2018-02-07 | 2018-07-27 | 武汉大学 | A kind of cooling system and method applied to high-power LED (light emitting diode) lighting equipment light-emitting surface |
| CN109307252A (en) * | 2018-09-10 | 2019-02-05 | 长春希达电子技术有限公司 | A kind of phase-transition liquid and the Heat transmission module comprising the phase-transition liquid |
| CN110381700A (en) * | 2019-06-25 | 2019-10-25 | 南京理工大学 | A kind of chamber and vapor chamber integral type phase-change cooling device and system by spraying |
| CN110351981B (en) * | 2019-06-25 | 2021-03-26 | 南京理工大学 | A high heat flux density spray cooling device and system |
| CN110381701A (en) * | 2019-06-25 | 2019-10-25 | 南京理工大学 | A kind of spray cooling device that vapor chamber is combined with composite microstructure |
| CN110351981A (en) * | 2019-06-25 | 2019-10-18 | 南京理工大学 | A kind of high heat flux density spray cooling device and system |
| CN114153092A (en) * | 2021-12-09 | 2022-03-08 | 武汉华星光电技术有限公司 | Backlight module and display device |
| CN114153092B (en) * | 2021-12-09 | 2024-02-09 | 武汉华星光电技术有限公司 | Backlight module and display device |
| CN115307225A (en) * | 2022-08-03 | 2022-11-08 | 珠海格力节能环保制冷技术研究中心有限公司 | Heat transfer mechanism, electric appliance box, outdoor unit and air conditioning system |
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