CN104603927B - Substrate-placing platform and possess its substrate board treatment - Google Patents

Abstract

Substrate-placing platform (10) including: the mounting surface (13) of mounting substrate (S)；It is arranged at mounting surface (13), for the adsorption tank (15) of sorbing substrate (S)；With at least some of multiple small concavo-convex (16) arranged randomly in mounting surface (13).

Description

Substrate mounting table and substrate processing apparatus having the same

technical field

The present invention relates to a substrate mounting table on which a substrate is placed, and a substrate processing apparatus including the same.

Background technique

In recent years, for example, when forming a circuit pattern on a semiconductor substrate, a glass substrate for a liquid crystal display, or the like, photolithography is generally used. In the case of forming a circuit pattern on a substrate by photolithography, a photoresist is coated on the substrate to form a photoresist film, and after exposure to the photoresist film, a development process is performed so that a predetermined The process of the circuit pattern.

For example, in the case of substrate processing such as photoresist coating and development, the substrate is placed on a rotatable substrate stage called a spin chuck stage in a vacuum suction state. . When the photoresist is applied and the substrate is rotated, the substrate is triboelectrically charged. In addition, when the substrate is peeled off from the spin chuck mounting table after substrate processing, the substrate is peeled and charged. Then, the charge charged on the substrate becomes a cause of electrostatic destruction of elements formed on the surface of the substrate (for example, thin film transistors, etc.), which poses a problem.

Countermeasures against electrostatic breakdown are disclosed in Patent Document 1 and Patent Document 2, for example. Patent Document 1 discloses a structure in which a substrate charged during the process of forming a coating film is eliminated using ions generated by an ion generator. In addition, in this configuration, the transport of ions generated by the ion generator to the substrate utilizes the airflow formed by the blower mechanism.

Patent Document 2 discloses a structure in which an alumina film in an amorphous state is formed by anodizing after forming a predetermined embossed shape on a substrate mounting surface of a substrate mounting table. In this configuration, the alumina film in the amorphous state is dense and firm, and therefore functions as a film for preventing peeling and electrification. In addition, by forming an embossed shape accompanying the formation of an alumina coating on the mounting surface, it is possible to prevent peeling electrification and obtain a favorable temperature distribution.

prior art literature

patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2002-231617

Patent Document 2: Japanese Patent Laid-Open No. 2008-306213

Contents of the invention

The technical problem that the invention wants to solve

Although the structure of Patent Document 1 is effective as a countermeasure against electrostatic breakdown, it has been found that there are cases where the countermeasure against electrostatic breakdown is insufficient in this configuration as well, according to studies by the applicant.

In addition, in the structure of Patent Document 2, it is necessary to perform anodizing treatment (formation of an aluminum oxide film) and embossing on the mounting surface of the substrate mounting table, and the structure of the substrate mounting table is complicated and the cost required for manufacture becomes high.

In addition, in recent years, portable terminals such as smart phones have increased the size of screens (over 4 inches) and miniaturization (over 300 DPI), and the problem of electrostatic breakdown has become more serious compared with the prior art. The reason for this is considered to be that the gate lines become longer due to the enlargement of the screen, and are easily affected by electric charges due to electrostatic discharge due to the antenna effect. In addition, as another reason, it is considered that many sites where electrostatic breakdown occurs are in the transistor section, so the number of transistor sections increases with the increase in resolution, and the probability of electrostatic breakdown increases.

In view of the above problems, an object of the present invention is to provide a substrate mounting table having a simple structure which can suppress the electrification of the substrate accompanying peeling. In addition, another object of the present invention is to provide a substrate processing apparatus that includes the substrate mounting table as described above and that can appropriately take countermeasures against electrostatic discharge.

Technical Solutions for Solving Technical Issues

In order to achieve the above object, the substrate mounting table of the present invention includes: a mounting surface on which the substrate is mounted; an adsorption groove provided on the mounting surface for absorbing the substrate; A plurality of minute unevenness (first structure).

According to this configuration, a plurality of minute irregularities are randomly provided on the mounting surface of the substrate mounting table. Therefore, the contact area between the substrate placed on the mounting surface and the substrate mounting table is reduced. As a result, when the substrate mounted on the mounting surface is peeled off from the mounting surface, it is possible to keep the amount of electricity charged to the substrate low. In addition, the substrate mounting table of this structure does not need to form an alumina coating on the mounting surface, and can have a simple structure and can be manufactured at low cost.

The substrate stage of the above-mentioned first configuration may be provided in a rotatable configuration (second configuration). This structure can be applied to a coating apparatus etc., for example.

In the substrate mounting table of the above-mentioned first or second configuration, it is preferable to employ a configuration in which fine unevenness is not provided on the outermost peripheral portion of the mounting surface (third configuration). According to this structure, leakage prevention is realized when the substrate is sucked by the suction tank.

In the substrate stage of any one of the above-mentioned first to third structures, it is preferable that the arithmetic mean roughness (arithmetic mean deviation of profile) Ra of the region provided with the above-mentioned minute unevenness is 0.6 μm or more and 1.0 μm or less (fourth structure). According to this configuration, for example, even when the substrate mounting table rotates at a high speed (for example, 1000 rpm or more), the possibility of the substrate being peeled off from the substrate mounting table can be reduced.

In the substrate mounting table of any one of the first to fourth configurations above, the minute unevenness may be provided over substantially the entire area of the mounting surface (fifth configuration). According to this configuration, the contact area between the substrate placed on the mounting surface and the substrate mounting table is minimized, and the amount of charge on the substrate due to peeling of the substrate from the mounting surface (the charge amount of the substrate) is easily suppressed.

In the substrate mounting table according to any one of the above first to fourth structures, the structure may be such that the minute unevenness is provided within a part of the mounting surface (sixth structure). In this configuration, the range of a part of the mounting surface is preferably about 1/3 to 1/2 of the entire area of the mounting surface. By configuring as described above, it is possible to reduce the possibility of the substrate being peeled off from the substrate mounting table when the substrate mounting table is rotating at a high speed.

In the substrate mounting table of the sixth configuration, the above-mentioned part of the range may include a plurality of concentric annular regions with intervals therebetween (seventh configuration).

In the substrate mounting table of any one of the first to seventh configurations, a configuration (eighth configuration) may be adopted in which the substrate mounting table further includes a lateral displacement preventing portion for preventing lateral displacement of the substrate. According to this configuration, it is possible to reduce the possibility of the substrate being peeled off from the substrate mounting table when the substrate mounting table is rotating at a high speed.

Among the substrate mounting tables of the first to eighth configurations described above, a configuration in which the fine unevenness is formed by blast processing (ninth configuration) is preferable. According to this configuration, it is easy to randomly obtain a plurality of irregularities on the mounting surface.

In addition, in order to achieve the above object, the present invention adopts a structure (tenth structure) including the substrate mounting table in any one of the first to ninth structures. The substrate processing apparatus of this configuration can appropriately take countermeasures against electrostatic discharge, and therefore, elements (such as thin film transistors, etc.) formed on the substrate surface during substrate processing are less likely to be destroyed by static electricity. Moreover, a coating apparatus, a developing apparatus, etc. can be mentioned as a substrate processing apparatus.

The substrate processing apparatus of the tenth configuration may further include a rotation unit for rotating the substrate stage and a decompression unit for decompressing the adsorption tank (eleventh configuration).

Invention effect

According to the present invention, it is possible to provide a substrate mounting table having a simple structure which can suppress the electrification of the substrate accompanying peeling. In addition, another object of the present invention is to provide a substrate processing apparatus that includes the substrate mounting table as described above and that can appropriately take countermeasures against electrostatic discharge.

Description of drawings

FIG. 1 is a schematic diagram showing the configuration of a substrate processing apparatus (coating apparatus) according to a first embodiment of the present invention.

2 is a schematic plan view of the substrate mounting table (spin chuck mounting table) according to the first embodiment of the present invention seen from above.

3A is a schematic cross-sectional view for explaining the relationship between the spin chuck mounting table and the substrate, and is a view showing a state before the substrate is mounted on the spin chuck mounting table.

3B is a schematic cross-sectional view for explaining the relationship between the spin chuck mounting table and the substrate, and is a view showing a state in which the substrate is mounted on the spin chuck mounting table.

4 is a perspective view schematically showing a substrate mounting table (spin chuck mounting table) according to the first embodiment of the present invention.

5 is a schematic view for explaining the effect obtained by the substrate mounting table (spin chuck mounting table) according to the first embodiment of the present invention.

6 is a graph showing effects obtained by the substrate mounting table (spin chuck mounting table) according to the first embodiment of the present invention.

7 is another graph showing effects obtained by the substrate mounting table (spin chuck mounting table) according to the first embodiment of the present invention.

8 is a schematic plan view of a substrate mounting table (spin chuck mounting table) according to a second embodiment of the present invention viewed from above.

9 is a schematic plan view of a substrate mounting table (spin chuck mounting table) according to a third embodiment of the present invention viewed from above.

detailed description

Hereinafter, embodiments of the substrate mounting table and the substrate processing apparatus of the present invention will be described in detail with reference to the drawings. Here, a case where the substrate processing apparatus is an application apparatus for applying a solution to a substrate will be described as an example. Here, the substrate processing device is not limited to a coating device, and for example, a developing device for developing may be used. In addition, the embodiment shown here is only an illustration, and the structure of embodiment can be changed suitably within the range of the technical idea of this invention.

<First Embodiment>

First, the schematic structure of the substrate processing apparatus (coating apparatus) of 1st Embodiment to which the substrate mounting table of this invention is applied is demonstrated. FIG. 1 is a schematic diagram showing the configuration of a substrate processing apparatus (coating apparatus 1 ) according to a first embodiment of the present invention. The coating apparatus 1 shown in FIG. 1 is used for coating a photoresist (formation of a resist film) to a semiconductor substrate, a glass substrate for a liquid crystal display, etc., for example. In addition, in FIG. 1, for easy understanding, the board|substrate S which is not the element which comprises the coating apparatus 1 is shown collectively.

As shown in FIG. 1 , the coating device 1 includes a cup body 2 with an upper opening. The lower portion of the cup body 2 is provided with a discharge port 2a. A spin chuck mounting table 10 for sucking and rotating the substrate S is arranged in the cup body 2 . The spin chuck mounting table 10 is connected to the motor 5 via the rotating shaft 4, whereby the spin chuck mounting table 10 is rotatable. Moreover, above the spin chuck mounting table 10, the nozzle 6 for dripping the photoresist to the board|substrate S adsorbed by this mounting table 10 is arrange|positioned. Furthermore, the coating apparatus 1 includes a rotating cup body 3a (rotating body) and a rotating chamber 3b (lid body) in order to perform uniform film formation, and a nearly sealed state can be formed by combining the two. In addition, the rotating cup body 3 a and the rotating chamber 3 b are provided so as to be rotatable at the same speed as the rotating chuck mounting table 10 .

In addition, the spin chuck mounting table 10 is an example of the board|substrate mounting table of this invention. In addition, the electric motor 5 is an example of the rotating part of this invention. The material of the spin chuck mounting table 10 is not particularly limited, but resins such as PPS (polyphenylene sulfide) resin, polyimide resin, and fluorine-based resin are preferable. By constituting the spin chuck mounting table 10 with resin, the possibility of damage to the glass substrate etc. mounted on this mounting table can be reduced.

2 is a schematic plan view of the substrate mounting table (spin chuck mounting table 10 ) according to the first embodiment of the present invention viewed from above. As can be understood from FIGS. 1 and 2 , the spin chuck mounting table 10 includes a disc-shaped mounting portion 11 for mounting the substrate S and a cylindrical support portion 12 for fitting the rotating shaft 4 . , as a whole is substantially T-shaped when viewed from the side (cross-sectional view). The spin chuck mounting table 10 provided in a substantially T-shape in side view is connected to the rotary shaft 4 so that the mounting surface 13 (upper surface) on which the substrate S is mounted is horizontal. This is to prevent the thickness of the resist film formed on the substrate S from being uneven.

In addition, a through hole 14 penetrating in the vertical direction (considering the representation in FIG. 1 ) is formed in the central portion of the spin chuck mounting table 10 . In addition, the through-hole 14 provided in a substantially circular shape in plan view has a diameter on the lower side larger than that on the upper side so that it can be fitted and fixed to the rotating shaft 4 .

As shown in FIG. 2 , a suction groove 15 (an example of the suction groove of the present invention) for vacuum-suctioning the substrate S is formed on the mounting surface 13 . The suction groove 15 (the width of which is, for example, about 1 mm) is provided so that the substrate S does not peel off from the mounting surface 13 due to high-speed rotation. The adsorption groove 15 includes: a plurality of annular grooves 15 a concentrically formed around the through hole 14 ; Each annular groove 15a intersects with the cross-shaped groove 15b at four places. In addition, in a state where the substrate S is placed on the placing surface 13 , the through hole 14 and the suction groove 15 are provided so as to communicate with each other.

As shown in FIG. 1 , a through hole is formed inside the rotating shaft 4 so that the decompression unit 8 can depressurize the adsorption tank 15 . The decompression part 8 is an example of the decompression part of this invention, and a vacuum pump can be mentioned as a specific example. In addition, it is preferable to have a structure in which piping is formed between the vacuum pump and the through hole 7 , and an on-off valve capable of opening and closing the communication between the vacuum pump and the through hole 7 is provided.

Next, steps of forming a resist film on the substrate S using the coating apparatus 1 configured as above will be briefly described with reference to FIGS. 3A and 3B in addition to FIGS. 1 and 2 . 3A is a schematic cross-sectional view for explaining the relationship between the spin chuck mounting table 10 and the substrate S, and is a view showing a state before the substrate S is mounted on the spin chuck mounting table 10 . 3B is a schematic cross-sectional view for explaining the relationship between the spin chuck mounting table 10 and the substrate S, and is a view showing a state in which the substrate S is mounted on the spin chuck mounting table 10 .

First, the substrate S is placed on the mounting surface 13 of the spin chuck mounting table 10 . Specifically, the substrate S is transferred onto the spin chuck mounting table 10 by the transfer arm 9 . Next, the spin chuck table 10 is raised (moved in the arrow U direction; refer to FIG. 3A ) by an elevating mechanism not shown, and the substrate S is transferred from the transfer arm 9 to the spin chuck table 10 . In addition, the structure is not limited to the above-mentioned structure, and the structure which lowers the conveyance arm 9 and transfers the board|substrate S from the conveyance arm 9 to the spin chuck mounting table 10 may be employ|adopted as the case may be.

When the substrate S is placed on the mounting surface 13 , the decompression unit 8 is driven, and the air in the suction tank 15 is sucked. Thereby, the board|substrate S is vacuum-adsorbed to the mounting surface 13. As shown in FIG. Next, the spin chuck mounting table 10 is rotated together with the rotary shaft 4 by driving the motor 5 . Before and after this, an appropriate amount of photoresist is dropped onto the substrate S from the nozzle 6 . In addition, before the high-speed rotation of the spin chuck table 10, a nearly sealed state is formed by the spin cup body 3a and the spin chamber 3b. The remaining photoresist is scattered by the centrifugal force accompanying the rotation of the substrate S, and the photoresist is evenly coated on the substrate S. In addition, the photoresist remaining after scattering is discharged to the outside of the cup body 2 through the discharge port 2 a.

When the application of the photoresist is completed, the driving of the motor 5 and the decompression unit 8 is stopped, and the substrate S placed on the mounting surface 13 is delivered to the transfer arm 9 . Specifically, after the driving of the motor 5 and the decompression unit 8 is stopped, the spin chuck table 10 is lowered (moved in the direction of the arrow D; refer to FIG. The chuck mounting table 10 is delivered to the transfer arm 9 . In addition, depending on circumstances, a structure may be employed in which the transfer arm 9 is raised to transfer the substrate S from the spin chuck mounting table 10 to the transfer arm 9 .

However, when the substrate S is delivered to the transfer arm 9 , peeling electrification occurs between the substrate S and the spin chuck mounting table 10 . The charges charged on the substrate S cause, for example, electrostatic destruction of elements formed on the surface of the substrate S, and therefore the charges (charged amount) are preferably as small as possible. Therefore, the spin chuck mounting table 10 of the present embodiment was considered so that the charge (charge amount) generated on the substrate S due to the peeling charge was very small. Hereinafter, this will be described.

4 is a perspective view schematically showing a substrate mounting table (spin chuck mounting table 10 ) according to the first embodiment of the present invention. In addition, in FIG. 4 , the through hole 14 and the suction groove 15 provided on the mounting surface 13 of the spin chuck mounting table 10 are omitted. As shown in FIG. 4 , the mounting surface 13 of the spin chuck mounting table 10 is roughened over substantially the entire area thereof. However, a region 11a (ring-shaped region) not subjected to roughening treatment is provided on the outer periphery (outermost periphery) of the mounting surface 13 for leak prevention. In addition, the area where the surface roughening treatment is performed may include the area where the adsorption groove 15 is formed, but may not include it in some cases.

The method of this roughening treatment is not particularly limited, and, for example, blast processing is used. As described above, the outer periphery of the mounting surface 13 is provided with the region 11 a that is not subjected to the roughening treatment, and this can be obtained by masking during blast processing. In addition, other than blast processing, for example, methods such as etching can also be used. By blasting, it is possible to randomly form a large number of fine irregularities (concavities and convexities having a gap smaller than the gap between the mounting surface 13 and the bottom surface of the suction groove 15) on the mounting surface 13 that is originally flat (smooth). . Alumina ceramics (an example of an abrasive material) is sprayed to roughen the surface of the mounting surface 13 with a flat surface state, for example, at Ra (profile arithmetic mean deviation, profile arithmetic mean deviation) = 0.8 μm. Thereby, a large number of minute unevennesses are randomly formed on the mounting surface 13, and a surface state having, for example, Ra of 0.6 to 1.0 μm can be obtained.

FIG. 5 is a schematic view for explaining the effects obtained by the substrate mounting table (spin chuck mounting table 10 ) according to the first embodiment of the present invention. FIG. 5 is a cross section showing a part of the mounting portion 11 (see FIG. 1 ) constituting the spin chuck mounting table 10 . The upper part (figure showing the configuration of the present embodiment) is a view showing a state where blast processing has been performed, and the lower part (figure for comparison) is a view showing a state where blast processing has not been performed. As shown in FIG. 5 , minute unevenness 16 is formed on the mounting surface 13 subjected to blast processing. Therefore, the contact area between the mounting surface 13 subjected to the blast processing and the substrate S is smaller than that of the mounting surface not subjected to the blast processing (corresponding to a conventional configuration). As a result, the charge amount of the substrate S caused by peeling the substrate S from the mounting surface 13 can be reduced.

In addition, when the Ra of the mounting surface 13 becomes too large, the coefficient of friction generated between the spin chuck mounting table 10 and the substrate S becomes small, and when the spin chuck mounting table 10 is rotated at a high speed (for example, 1100 rpm or more), , there is a possibility that the substrate S cannot be held. Therefore, the unevenness 16 formed on the mounting surface 13 is fine asperities, and it is preferable that the roughness of the mounting surface 13 does not become too large. The roughness (Ra) is preferably not less than 0.6 μm and not more than 1.4 μm, more preferably not less than 0.6 μm and not more than 1.0 μm, in order to reduce the charge amount and maintain the substrate S when the substrate S is rotated at high speed.

6 is a graph showing effects obtained by the substrate mounting table (spin chuck mounting table 10 ) according to the first embodiment of the present invention. FIG. 6 shows the results of measuring the charge amount in the substrate S peeled off from the spin chuck mounting table 10 . In FIG. 6 , "with blasting" corresponds to the configuration of the present invention (this embodiment), and "without blasting" is a comparative example. In FIG. 6 , it was actually verified that the charge amount of the substrate S peeled off from the spin chuck mounting table can be significantly reduced by performing spray processing on the spin chuck mounting table. Moreover, from the result of FIG. 6, when using PPS resin for the spin chuck mounting table 10, it turns out that a conductive type is slightly advantageous compared with an insulating type.

7 is another graph showing the effect obtained by the substrate mounting table (spin chuck mounting table 10 ) according to the embodiment of the present invention. FIG. 7 shows the results of investigation on changes in the charge amount of the substrate S accompanying changes in the number of sheets processed. As in the case of FIG. 6 , the charge amount is the charge amount of the substrate S peeled off from the spin chuck mounting table 10 , and is an actual measured value. In FIG. 7 , "with blast processing" corresponds to the configuration of the present invention (this embodiment), and "without blast processing" is a comparative example. In addition, in FIG. 7, the material of the spin chuck mounting table 10 is electroconductive PPS resin in the case of any of "with blast processing" and "without blast processing". From the results shown in FIG. 7 , it can be seen that by performing spray processing on the mounting surface 13 , even when the number of sheets to be processed increases, the charge amount of the substrate S can be stably kept low.

From the above, when the spin chuck table 10 of the present embodiment is used, it is possible to keep the charge amount of the substrate S peeled off from the spin chuck table 10 low after applying the photoresist. In other words, when the spin chuck mounting table 10 of the present embodiment is used, for example, the possibility that elements (TFTs, etc.) formed on the substrate S will be destroyed by static electricity can be reduced. In addition, the spin chuck mounting table 10 of this embodiment does not need to form an alumina coating on its surface, and its shape is simple, which is also advantageous in terms of manufacturing cost.

<Second Embodiment>

Next, a substrate processing apparatus (coating apparatus) and a substrate mounting table (spin chuck mounting table) according to the second embodiment will be described. However, the structure of the second embodiment is substantially the same as that of the first embodiment. Therefore, only the different parts will be described below. In addition, the same code|symbol is attached|subjected and demonstrated about the part which overlaps with the structure of 1st Embodiment.

In the first embodiment, the minute unevenness 16 is formed over substantially the entire area of the mounting surface 13 of the spin chuck mounting table 10 . However, in the second embodiment, as shown in FIG. 8 , minute unevenness 16 is formed only in a part of the mounting surface 13 of the spin chuck mounting table 10 . More specifically, the area where the fine unevenness 16 is provided is within a plurality of annular areas formed concentrically (with the through hole 14 at the center) at intervals (for example, 10 to 30 mm) on the mounting surface 13 . In other words, the fine unevenness 16 is provided in a plurality of annular regions provided along the annular groove 15 a (suction groove). In addition, the region where the suction groove 15 is formed may be included in the region where the minute unevenness 16 is provided, but may not be included. In addition, as in the case of the first embodiment, a region 11 a (ring-shaped region) not subjected to roughening treatment is provided on the outer periphery of the mounting surface 13 for leak prevention.

8 is a schematic plan view of a substrate mounting table (spin chuck mounting table 10 ) according to a second embodiment of the present invention viewed from above. In addition, in the second embodiment, the fine unevenness 16 is also obtained by, for example, blast processing. In the case of the second embodiment, a mask can be placed on a region where the fine unevenness 16 is not formed, and the blast processing can be performed.

When the structure of the second embodiment is adopted, the frictional force received by the substrate S from the mounting surface 13 is increased compared with the structure of the first embodiment. Therefore, when the spin chuck mounting table 10 is rotated at a high speed (for example, 1500 rpm), the possibility of the substrate S detaching from the spin chuck mounting table 10 can be reduced. Even in the case of this structure, the contact area between the mounting surface 13 and the substrate S is reduced due to the existence of the minute unevenness 16, so compared with the prior art (structure without roughening treatment at all), , it is possible to reduce the amount of charge (charge amount) on the substrate S caused by peeling the substrate S from the mounting surface 13 .

In addition, the structure in which the fine unevenness 16 is provided only in a part of the mounting surface 13 is not limited to the structure of the second embodiment, and the structure can be appropriately changed. However, when the area where the fine unevenness 16 is provided is too small, the effect of reducing the amount of charge (charge amount) on the substrate S caused by peeling the substrate S from the mounting surface 13 becomes small. Therefore, it is also necessary to take this point into consideration when adopting a configuration in which the minute unevenness 16 is provided only in a part of the mounting surface 13 . When adopting a structure in which minute unevenness 16 is provided only in a part of mounting surface 13 , it is preferable to configure minute unevenness 16 to occupy about 1/3 to 1/2 of mounting surface 13 , for example.

<Third Embodiment>

Next, a substrate processing apparatus (coating apparatus) and a substrate mounting table (spin chuck mounting table) according to a third embodiment will be described. However, the structure of the third embodiment is substantially the same as that of the first embodiment. Therefore, only the different parts will be described below. In addition, the same code|symbol is attached|subjected and demonstrated about the part which overlaps with the structure of 1st Embodiment.

9 is a schematic plan view of a substrate mounting table (spin chuck mounting table 10 ) according to a third embodiment of the present invention viewed from above. Fig. 9 shows not only the substrate mounting table (spin chuck mounting table 10) but also the rotating cup 3a. In addition, in FIG. 9, the board|substrate S is also shown together for easy understanding.

The spin chuck mounting table 10 of the third embodiment also has a configuration including a mounting portion 11 and a pillar portion 12 as in the case of the first embodiment. In the third embodiment, a plurality of (eight in this embodiment) lateral displacement preventing pins 20 are provided on the rotating cup body 3a. The lateral misalignment prevention pin 20 can be a cylindrical protrusion (pin) extending in the vertical direction (in FIG. 9 , corresponding to the direction perpendicular to the paper surface). Specifically, the lateral misalignment preventing pins 20 are provided with two lateral misalignment preventing pins at each of the four corners of the rectangular substrate S in a state where the substrate S is placed on the mounting surface 13 of the spin chuck mounting table 10 . 20 is disposed on the rotating cup body 3a in a sandwiched manner.

According to this configuration, when the spin chuck table 10 is rotated at a high speed (for example, 1500 rpm), even if the substrate S tends to deviate laterally from the spin chuck table 10, it is possible to prevent lateral displacement by contacting the substrate S. The pin 20 is used to prevent the lateral displacement of the substrate S. Therefore, irrespective of the provision of fine irregularities 16 on the mounting surface 13 of the spin chuck mounting table 10 , it is possible to suppress the possibility of the substrate S detaching from the spin chuck mounting table 10 during high-speed rotation. In addition, the height of the anti-lateral deflection pin 20 needs to be properly adjusted to a height that prevents the substrate S from laterally deflecting.

In addition, the lateral misalignment prevention pin 21 is an example of the lateral misalignment prevention part of this invention. In addition, in the present embodiment, the lateral misalignment preventing portion is constituted by the mechanical pin 21, but the scope of the present invention is not limited thereto. The lateral misalignment preventing portion may be, for example, a protruding portion having a substantially L-shape in a cross-sectional view, provided so as to abut against the four corners of the substrate S, respectively. In addition, depending on circumstances, the lateral displacement preventing portion may be provided on the spin chuck mounting table 10 by specially designing the shape of the spin chuck mounting table 10 . Furthermore, in the third embodiment, the minute unevenness 16 may be provided on substantially the entire area of the mounting surface 13 as in the first embodiment, or may be provided in only a part of the mounting surface 13 as in the second embodiment.

Explanation of reference signs

1 Coating equipment (substrate processing equipment)

5 Motor (rotating part)

8 decompression section

10 Spin Chuck Mounting Table (Substrate Mounting Table)

13 Loading surface

15 adsorption tank

16 tiny bumps

21 Lateral misalignment prevention pin (lateral misalignment prevention part)

S Substrate

Claims (11)

1. A substrate mounting table, characterized in that, comprising: a mounting surface on which the substrate is mounted; a suction groove provided on the loading surface for suctioning the substrate; and a plurality of minute irregularities randomly provided on a part of the mounting surface, The area not provided with the fine unevenness includes the outer peripheral portion of the mounting surface and the area other than the area provided with the adsorption groove, The minute unevenness is formed in a plurality of annular regions arranged concentrically at intervals larger than the width of the adsorption groove. 2. A substrate mounting table, characterized in that, comprising: a mounting surface on which the substrate is mounted; a suction groove provided on the loading surface for suctioning the substrate; and a plurality of minute irregularities randomly provided on a part of the mounting surface, The area not provided with the fine unevenness includes the outer peripheral portion of the mounting surface and the area other than the area provided with the adsorption groove, The plurality of ring-shaped regions provided with the minute unevenness and the plurality of ring-shaped regions not provided with the minute unevenness are concentrically arranged alternately. 3. The substrate mounting table according to claim 1 or 2, characterized in that: The substrate mounting table is provided to be rotatable. 4. The substrate mounting table according to claim 1 or 2, characterized in that: The outer periphery of the mounting surface is included in the area where the minute unevenness is not provided. 5. The substrate mounting table according to claim 1 or 2, characterized in that: The area where the adsorption groove is provided is included in the area where the minute unevenness is not provided. 6. The substrate mounting table according to claim 1 or 2, characterized in that: The fine unevenness occupies a range of 1/3 to 1/2 of the entire area of the mounting surface. 7. The substrate mounting table according to claim 1 or 2, characterized in that: The arithmetic average roughness Ra of the region provided with the fine unevenness is 0.6 μm or more and 1.0 μm or less. 8. The substrate mounting table according to claim 1 or 2, characterized in that: The substrate stage further includes a lateral displacement preventing portion that prevents lateral displacement of the substrate. 9. The substrate mounting table according to claim 1 or 2, characterized in that: The fine unevenness is formed by spray processing. 10. A substrate processing device, characterized in that: A substrate mounting table according to any one of claims 1 to 9 is included. 11. The substrate processing apparatus according to claim 10, further comprising: a rotating part that rotates the substrate stage; and A decompression part for depressurizing the adsorption tank.