CN104565909A - LED (light emitting diode) lamp - Google Patents
LED (light emitting diode) lamp Download PDFInfo
- Publication number
- CN104565909A CN104565909A CN201410722928.0A CN201410722928A CN104565909A CN 104565909 A CN104565909 A CN 104565909A CN 201410722928 A CN201410722928 A CN 201410722928A CN 104565909 A CN104565909 A CN 104565909A
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- Prior art keywords
- heat
- led lamp
- outer cover
- heat sink
- luminescence component
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- 239000011324 bead Substances 0.000 claims abstract description 22
- 238000004020 luminiscence type Methods 0.000 claims description 38
- 230000005855 radiation Effects 0.000 claims description 38
- 230000017525 heat dissipation Effects 0.000 claims description 25
- 238000005452 bending Methods 0.000 claims description 9
- 239000006185 dispersion Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 13
- 238000005516 engineering process Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000012512 characterization method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses an LED (light emitting diode) lamp, which comprises a light emitting assembly (1) and a heat radiating assembly (2), wherein the heat radiating assembly (2) is used for radiating the heat of the light emitting assembly (1), the light emitting assembly (1) comprises a circuit board (3) and an LED lamp bead (4), the LED lamp bead (4) is arranged on the circuit board (3), the heat radiating assembly (2) comprises an outer cover (5) and a heat radiating plate (6), the outer cover (5) is used for radiating the heat of the light emitting assembly (1), the heat radiating plate (6) is connected with the lower end of the outer cover (5), the heat radiating assembly (2) comprises a chimney type heat radiating passage, the heat radiating passage is used for radiating the heat of the light emitting assembly (1), and the heat radiating passage extends from the bottom part of the heat radiating plate (6) to the top part of the outer cover (5). The LED lamp has the advantages that the structure is simple, the heat radiating cost is low, and the heat radiating effect is good.
Description
Technical field
The present invention relates to field of LED illumination, particularly relate to a kind of LED lamp.
Background technology
LED, because its luminous efficiency is high, long service life, free of contamination advantage, is widely used in production and life.Because each LED lamp bead component power is little, therefore LED lamp holder is all combined by connection in series-parallel by tens of or hundreds of LED lamp bead assemblies, and therefore LED produces a large amount of heats in luminescence process, if distributed not in time, greatly can reduce the light efficiency of LED, reduce the life-span of LED simultaneously.In prior art, especially high-power LED lamp, be generally install a radiator thereon to dispel the heat, such heat abstractor makes the complex structure of LED, and manufacturing cost is high, and large by the restriction of power.
The notification number of Chinese utility model patent is that CN 202452186 U discloses a kind of LED, comprise one or more LED chip, power supply and cover in the lamp back cover on described contrary with installed surface face, described LED chip and power supply are installed on installing plate, and face contrary with the installed surface installing described LED chip and power supply on described installing plate is rough and uneven in surface; In the utility model, the described face contrary with installed surface is wavy or wavy in triangle, and the inwall of described lamp back cover and/or outer wall are wavy or wavy in triangle.LED of the present utility model is by making folding shape by installing plate one side and the inner and/or outer wall of lamp back cover, although increase certain LED chip and power supply heat sinking area, improve radiating effect to a certain extent, but still there is following defect: the prior art still takes indirect heat radiation, therefore radiating effect is not good, and, this radiating mode, complex structure, manufacturing cost is high.
Summary of the invention
The present invention is directed to deficiency of the prior art, provide that a kind of structure is simple, heat radiation cost is low, the LED lamp of good heat dissipation effect.
In order to solve the problems of the technologies described above, the present invention is solved by following technical proposals:
A kind of LED lamp, comprise luminescence component and supply described luminescence component to carry out the radiating subassembly dispelled the heat, the LED lamp bead that described luminescence component comprises circuit board and arranges on circuit boards, described radiating subassembly comprises the described luminescence component of confession and carries out the outer cover dispelled the heat and the heat sink be connected with apart from described outer cover lower end; Aforesaid radiating subassembly also comprises the funnel-shaped heat dissipation channel that confession luminescence component carries out dispelling the heat, and described heat dissipation channel extends to outer cover top and formed bottom heat sink.
According to the embodiment of the present invention, alternatively, described heat sink is provided with the through hole for heat loss through convection.
According to the embodiment of the present invention, alternatively, described radiating subassembly also comprises thermal convection holes and heat radiation wall, and described through hole, heat radiation wall and thermal convection holes form aforementioned funnel-shaped heat dissipation channel.
According to the embodiment of the present invention, alternatively, described LED lamp bead dispersion is arranged on described circuit board.
According to the embodiment of the present invention, alternatively, the lampshade that can carry out heat loss through radiation to radiating subassembly that described LED lamp comprises.
According to the embodiment of the present invention, alternatively, described lampshade is aforementioned outer cover, and LED lamp bead is positioned at lampshade.
According to the embodiment of the present invention, alternatively, inner surface and the outer surface of described lampshade are radiating surface, and described radiating surface forms the radiation area of luminescence component.
According to the embodiment of the present invention, alternatively, described heat sink is circular slab, and the outside bending in two ends of described heat sink forms the connecting portion be connected with the medial surface of described outer cover.
According to the embodiment of the present invention, alternatively, described a pair heat radiation wall be outer cover from heat sink upper end toward the inwall of upper part.
According to the embodiment of the present invention, alternatively, the base plate that described heat sink comprises annular and the deflector one upwards extended in the middle part of base plate, the outside bending in two ends of described base plate forms the connecting portion be connected with the medial surface of described outer cover.
According to the embodiment of the present invention, alternatively, described a pair heat radiation wall is the inwall of deflector one.
According to the embodiment of the present invention, alternatively, described heat sink is circular slab, and the outside bending in two ends of described heat sink forms the connecting portion be connected with the medial surface of described outer cover.
Beneficial effect of the present invention:
(1) heat that, luminescence component of the present invention produces forms funnel-shaped heat dissipation channel by through hole, heat radiation wall and thermal convection holes and dispels the heat, heat forms convection current from bottom to top, and distribute from heat dissipation channel, dispelled the heat by radiator compared to existing technology, obviously the heat on luminescence component is reduced to 5 °-15 °, good heat dissipation effect; (2), the dispersion of the LED lamp bead of luminescence component is arranged on described circuit board by patent of the present invention, equivalent LED lamp bead on the unit heat sink material wasted work rate Q that falls apart significantly is reduced, add the heat carrier cross section of equivalence, to reach better radiating effect simultaneously; (3), the PN junction institute caloric value of LED lamp bead conducts to heat sink via thermal interfacial material and is in contact with it position, on heat sink, heat diffuses to whole heat sink by conduction pattern, then shell is conducted to by heat sink, especially the inner surface of lampshade and the radiation area of outer surface formation luminescence component, and the surfaces externally and internally of whole lampshade is all smooth, therefore, undertaken dispelling the heat by conduction pattern and radiation mode and also play a significant role, This further reduces junction temperature and rise Δ t, to reach better radiating effect.
Additional aspect of the present invention and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present invention.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide a further understanding of the present invention, and form a application's part, schematic description and description of the present invention, for explaining the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 is the structural representation of a kind of LED lamp embodiment one of the present invention;
Fig. 2 is the structural representation of a kind of LED lamp embodiment two of the present invention;
Fig. 3 is the structural representation of a kind of LED lamp embodiment three of the present invention.
Detailed description of the invention
For making the object of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing of the embodiment of the present invention, the technical scheme of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is a part of embodiment of the present invention, instead of whole embodiments.Based on described embodiments of the invention, the every other embodiment that those of ordinary skill in the art obtain under without the need to the prerequisite of creative work, all belongs to the scope of protection of the invention.
In describing the invention, it will be appreciated that, orientation or the position relationship of the instruction such as term " " center ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end " " interior ", " outward " they be based on orientation shown in the drawings or position relationship; be only the present invention for convenience of description and simplified characterization; instead of instruction or imply the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In describing the invention, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can comprise the first and second features and directly contact, also can comprise the first and second features and not be directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " comprise fisrt feature immediately below second feature and tiltedly below, or only represent that fisrt feature level height is less than second feature.
Unless otherwise defined, technical term used herein or scientific terminology should be in field belonging to the present invention the ordinary meaning that the personage with general technical ability understands." first ", " second " that use in patent application specification of the present invention and claims and similar word do not represent any order, quantity or importance, and are only used to distinguish different parts.Equally, the similar word such as " " or " " does not represent that quantity limits yet, but represents to there is at least one.
Embodiment one:
As shown in Figure 1, as embodiments of the invention, a kind of LED lamp, comprise luminescence component 1 and supply described luminescence component 1 to carry out the radiating subassembly 2 dispelled the heat, described luminescence component 1 comprises circuit board 3 and is arranged on the LED lamp bead 4 on circuit board 3, in the present embodiment, described LED lamp bead 4 dispersion is arranged on described circuit board 3; Described radiating subassembly 2 comprises the described luminescence component 1 of confession and carries out the outer cover 5 dispelled the heat and the heat sink 6 be connected with apart from described outer cover 5 lower end; Aforesaid radiating subassembly 2 also comprises the funnel-shaped heat dissipation channel that confession luminescence component 1 carries out dispelling the heat, and described heat dissipation channel extends to outer cover 5 top and formed bottom heat sink 6.
In the present embodiment, realize the heat loss through convection of LED, described heat sink 6 is provided with the through hole 7 for heat loss through convection, described outer cover 5 forms a pair heat radiation wall from heat sink 6 upper end toward the inwall of upper part, described thermal convection holes 8 is arranged on described outer cover 5, therefore, described through hole 7, heat radiation wall and thermal convection holes 8 form aforementioned funnel-shaped heat dissipation channel, heat forms convection current from bottom to top, and distribute from heat dissipation channel, dispelled the heat by radiator compared to existing technology, obviously the heat on luminescence component is reduced to 5 °-15 °, good heat dissipation effect.
In the present embodiment, described heat sink 6 is circular slab, and the outside bending in two ends of described heat sink 6 forms the connecting portion 9 be connected with the medial surface of described outer cover 5, and described connecting portion 9 is connected by welding or being fixed by connector etc. with described outer cover 5; Described circuit board 3 is bonded in the downside of heat sink 6 by heat-conducting glue.
For increasing area of dissipation, therefore preferred described outer cover 5 is the thin-wall semi shape structure of back-off.
And heat radiation of the present invention is also dispelled the heat by radiation mode, the lampshade that can carry out heat loss through radiation to radiating subassembly 2 that described LED lamp comprises, described lampshade in the present embodiment is aforementioned outer cover 5, LED lamp bead 4 is positioned at lampshade, inner surface and the outer surface of described lampshade are radiating surface, described radiating surface forms the radiation area of luminescence component 1, therefore, undertaken dispelling the heat by conduction pattern and radiation mode and also play a significant role, This further reduces junction temperature and rise Δ t, to reach better radiating effect.
Embodiment two:
As shown in Figure 2, as embodiments of the invention, a kind of LED lamp, comprise luminescence component 1 and supply described luminescence component 1 to carry out the radiating subassembly 2 dispelled the heat, described luminescence component 1 comprises circuit board 3 and is arranged on the LED lamp bead 4 on circuit board 3, in the present embodiment, described LED lamp bead 4 dispersion is arranged on described circuit board 3; Described radiating subassembly 2 comprises the described luminescence component 1 of confession and carries out the outer cover 5 dispelled the heat and the heat sink 6 be connected with apart from described outer cover 5 lower end; Aforesaid radiating subassembly 2 also comprises the funnel-shaped heat dissipation channel that confession luminescence component 1 carries out dispelling the heat, and described heat dissipation channel extends to outer cover 5 top and formed bottom heat sink 6.
In the present embodiment, realize the heat loss through convection of LED, described heat sink 6 is provided with the through hole 7 for heat loss through convection, described deflector 1 forms a pair heat radiation wall from heat sink 6 upper end toward the inwall of upper part, described thermal convection holes 8 is arranged on described deflector 1, therefore, described through hole 7, heat radiation wall and thermal convection holes 8 form aforementioned funnel-shaped heat dissipation channel, heat forms convection current from bottom to top, and distribute from heat dissipation channel, dispelled the heat by radiator compared to existing technology, obviously the heat on luminescence component is reduced to 5 °-15 °, good heat dissipation effect.
In the present embodiment, the base plate 10 that described heat sink 6 comprises annular and the deflector 1 upwards extended in the middle part of base plate 10, the outside bending in two ends of described base plate 10 forms the connecting portion 9 be connected with the medial surface of described outer cover 5, and described connecting portion 9 is connected by welding or being fixed by connector etc. with described outer cover 5; Described circuit board 3 is bonded in the downside of heat sink 6 by heat-conducting glue.
For increasing area of dissipation, therefore preferred described outer cover 5 is the thin-wall semi shape structure of back-off.
And heat radiation of the present invention is also dispelled the heat by radiation mode, the lampshade that can carry out heat loss through radiation to radiating subassembly 2 that described LED lamp comprises, described lampshade in the present embodiment is aforementioned outer cover 5, LED lamp bead 4 is positioned at lampshade, inner surface and the outer surface of described lampshade are radiating surface, described radiating surface forms the radiation area of luminescence component 1, therefore, undertaken dispelling the heat by conduction pattern and radiation mode and also play a significant role, This further reduces junction temperature and rise Δ t, to reach better radiating effect.
Embodiment three:
As shown in Figure 3, as embodiments of the invention, a kind of LED lamp, comprise luminescence component 1 and supply described luminescence component 1 to carry out the radiating subassembly 2 dispelled the heat, described luminescence component 1 comprises circuit board 3 and is arranged on the LED lamp bead 4 on circuit board 3, in the present embodiment, described LED lamp bead 4 dispersion is arranged on described circuit board 3; Described radiating subassembly 2 comprises the described luminescence component 1 of confession and carries out the outer cover 5 dispelled the heat and the heat sink 6 be connected with apart from described outer cover 5 lower end; Aforesaid radiating subassembly 2 also comprises the funnel-shaped heat dissipation channel that confession luminescence component 1 carries out dispelling the heat, and described heat dissipation channel extends to outer cover 5 top and formed bottom heat sink 6.
In the present embodiment, realize the heat loss through convection of LED, described heat sink 6 is provided with the through hole 7 for heat loss through convection, described deflector 2 12 forms a pair heat radiation wall from heat sink 6 upper end toward the inwall of upper part, described thermal convection holes 8 is arranged on described deflector 2 12, therefore, described through hole 7, heat radiation wall and thermal convection holes 8 form aforementioned funnel-shaped heat dissipation channel, heat forms convection current from bottom to top, and distribute from heat dissipation channel, dispelled the heat by radiator compared to existing technology, obviously the heat on luminescence component is reduced to 5 °-15 °, good heat dissipation effect.
In the present embodiment, described heat sink 6 is circular slab, and the outside bending in two ends of described heat sink 6 forms the connecting portion 9 be connected with the medial surface of described outer cover 5, and described connecting portion 9 is connected by welding or being fixed by connector etc. with described outer cover 5; Described circuit board 3 is bonded in the downside of heat sink 6 by heat-conducting glue.
For increasing area of dissipation, therefore preferred described outer cover 5 is the thin-wall semi shape structure of back-off.
And heat radiation of the present invention is also dispelled the heat by radiation mode, the lampshade that can carry out heat loss through radiation to radiating subassembly 2 that described LED lamp comprises, described lampshade in the present embodiment is aforementioned outer cover 5, LED lamp bead 4 is positioned at lampshade, inner surface and the outer surface of described lampshade are radiating surface, described radiating surface forms the radiation area of luminescence component 1, therefore, undertaken dispelling the heat by conduction pattern and radiation mode and also play a significant role, This further reduces junction temperature and rise Δ t, to reach better radiating effect.
Last it is noted that above embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to previous embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
In a word, the foregoing is only preferred embodiment of the present invention, all equalizations done according to the present patent application the scope of the claims change and modify, and all should belong to the covering scope of patent of the present invention.
Claims (11)
1. a LED lamp, comprise luminescence component (1) and supply described luminescence component (1) to carry out the radiating subassembly (2) dispelled the heat, described luminescence component (1) comprises circuit board (3) and is arranged on the LED lamp bead (4) on circuit board (3), it is characterized in that: described radiating subassembly (2) comprises the described luminescence component of confession (1) and carries out the outer cover (5) dispelled the heat and the heat sink (6) be connected with apart from described outer cover (5) lower end; Aforesaid radiating subassembly (2) also comprises the funnel-shaped heat dissipation channel that confession luminescence component (1) is carried out dispelling the heat, and described heat dissipation channel extends to outer cover (5) top from heat sink (6) bottom and formed.
2. LED lamp according to claim 1, is characterized in that: described heat sink (6) is provided with the through hole (7) for heat loss through convection.
3. LED lamp according to claim 2, it is characterized in that: described radiating subassembly (2) also comprises thermal convection holes (8) and heat radiation wall, and described through hole (7), heat radiation wall and thermal convection holes (8) form aforementioned funnel-shaped heat dissipation channel.
4. the LED lamp according to any one of claim 1-3, is characterized in that: described LED lamp bead (4) dispersion is arranged on described circuit board (3).
5. LED lamp according to claim 4, is characterized in that: the lampshade that can carry out heat loss through radiation to radiating subassembly (2) that described LED lamp comprises.
6. LED lamp according to claim 5, is characterized in that: described lampshade is aforementioned outer cover (5), and LED lamp bead (4) is positioned at lampshade.
7. LED lamp according to claim 6, is characterized in that: inner surface and the outer surface of described lampshade are radiating surface, and described radiating surface forms the radiation area of luminescence component (1).
8. LED lamp according to claim 7, it is characterized in that: described heat sink (6) is circular slab, the outside bending in two ends of described heat sink (6) forms the connecting portion (9) be connected with the medial surface of described outer cover (5).
9. LED lamp according to claim 8, is characterized in that: described a pair heat radiation wall be outer cover (5) from heat sink (6) upper end toward the inwall of upper part.
10. LED lamp according to claim 7, it is characterized in that: the base plate (10) that described heat sink (6) comprises annular and the deflector one (11) upwards extended from base plate (10) middle part, the outside bending in two ends of described base plate (10) forms the connecting portion (9) be connected with the medial surface of described outer cover (5); Described a pair heat radiation wall is the inwall of deflector one (11).
11. LED lamp according to claim 7, it is characterized in that: described heat sink (6) is circular slab, the outside bending in two ends of described heat sink (6) forms the connecting portion (9) be connected with the medial surface of described outer cover (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410722928.0A CN104565909A (en) | 2014-12-03 | 2014-12-03 | LED (light emitting diode) lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410722928.0A CN104565909A (en) | 2014-12-03 | 2014-12-03 | LED (light emitting diode) lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104565909A true CN104565909A (en) | 2015-04-29 |
Family
ID=53082626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410722928.0A Pending CN104565909A (en) | 2014-12-03 | 2014-12-03 | LED (light emitting diode) lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104565909A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201448612U (en) * | 2009-07-01 | 2010-05-05 | 牛学仁 | An energy-saving lighting lamp |
| CN201526837U (en) * | 2009-09-27 | 2010-07-14 | 沈李豪 | LED bulb with multilayer heat dissipation structure |
| CN102667334A (en) * | 2009-10-09 | 2012-09-12 | 英特曼帝克司公司 | Solid-state lamps with passive cooling |
| CA2820798A1 (en) * | 2012-12-06 | 2014-06-06 | Relume Technologies, Inc. | Led heat sink apparatus |
| CN104456188A (en) * | 2014-11-14 | 2015-03-25 | 杭州制高媒体科技有限公司 | LED lamp |
| CN205065303U (en) * | 2014-12-03 | 2016-03-02 | 方恒 | Light emitting diode (LED) lamp |
-
2014
- 2014-12-03 CN CN201410722928.0A patent/CN104565909A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201448612U (en) * | 2009-07-01 | 2010-05-05 | 牛学仁 | An energy-saving lighting lamp |
| CN201526837U (en) * | 2009-09-27 | 2010-07-14 | 沈李豪 | LED bulb with multilayer heat dissipation structure |
| CN102667334A (en) * | 2009-10-09 | 2012-09-12 | 英特曼帝克司公司 | Solid-state lamps with passive cooling |
| CA2820798A1 (en) * | 2012-12-06 | 2014-06-06 | Relume Technologies, Inc. | Led heat sink apparatus |
| CN104456188A (en) * | 2014-11-14 | 2015-03-25 | 杭州制高媒体科技有限公司 | LED lamp |
| CN205065303U (en) * | 2014-12-03 | 2016-03-02 | 方恒 | Light emitting diode (LED) lamp |
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Application publication date: 20150429 |