CN104503210A - Laser direct-imaging device and production method using the same - Google Patents
Laser direct-imaging device and production method using the same Download PDFInfo
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- CN104503210A CN104503210A CN201410580432.4A CN201410580432A CN104503210A CN 104503210 A CN104503210 A CN 104503210A CN 201410580432 A CN201410580432 A CN 201410580432A CN 104503210 A CN104503210 A CN 104503210A
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- circuit board
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- imaging equipment
- direct imaging
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 238000003384 imaging method Methods 0.000 title claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 13
- 239000011159 matrix material Substances 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 101100115215 Caenorhabditis elegans cul-2 gene Proteins 0.000 description 4
- 230000001737 promoting effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 1
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
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Abstract
The invention discloses a laser direct-imaging device and a production method using the same. The laser direct-imaging device comprises a CAM computer, a material code machine, a workbench surface, circuit boards and an alignment CCD. The CAM computer is in a net signal connection relationship with the material code machine. The circuit boards are arranged on the workbench surface and the alignment CCD aligns to the circuit boards (5). The circuit boards comprise at least two boards, have the same shapes and sizes and are arranged on the workbench surface in a way of an array. The laser direct-imaging device can realize splicing production of the at least two circuit boards with enough small sizes so that double production power is realized. In the production method, drawing data transmitted to the material code machine of the laser direct-imaging device by the CAM computer is drawing data of the circuit board so that production time and labor intensity are reduced, production efficiency is further guaranteed and a wide practical value and production prospect are obtained.
Description
Technical field
The present invention relates to a kind of laser direct imaging equipment and production method thereof, belong to VLSI (very large scale integrated circuit) equipment industry technology field laser direct-write photoetching technical field.
Background technology
Along with the rise of integrated circuit industry boom in recent years, most of integrated circuit foundries is all expected to obtain the plan of expanding production, wish to promote scale and benefit further by capacity expanding, the production capacity promoting existing equipment is the key factor that enterprise derives a profit, and the production capacity how promoting existing equipment is the problem that enterprise never stops studying with promoting the yield producing product, if it will be the thing that integrated circuit manufacturing and processing enterprise is dreamed of that the equipment of identical price realizes production capacity double by certain technology, so patent of the present invention is exactly realize a kind of double method of production capacity for the laser direct imaging equipment of VLSI (very large scale integrated circuit) industry under certain specified conditions.
Summary of the invention
For above-mentioned prior art Problems existing, the invention provides a kind of laser direct imaging equipment and production method thereof, realize production capacity double, guarantee production efficiency.
To achieve these goals, the present invention includes CAM computer, item number machine, work top, circuit board and contraposition CCD; Wherein, CAM computer is connected with item number machine network signal, and circuit board is placed on work top, contraposition CCD and circuit board (5) contraposition.
On the basis of said structure, circuit board arranges at least two, and physical dimension is identical, and is placed on work top by array.
Further, circuit board arranges four, and physical dimension is identical, and is placed on work top by array.
Further, circuit board uses pcb board, and IC support plate, soft board, semiconductor crystal wafer or chip are material.
For above-mentioned laser direct imaging equipment, its concrete production method is as follows:
1) CAM computer will draw the item number machine using figure to be transmitted through the network to laser direct imaging equipment;
2) on work top, item number machine is supplied to according to spacing data between the matrix of the circuit board of matrix arrangement placement;
3) carry out subregion contraposition by contraposition CCD to circuit board, it is about to the position of drawing to allow graphing know accurately;
4) use the figure of same circuit board to copy polylith same circuit board simultaneously.
Further, board production processing procedure is internal layer, outer, anti-welding processing procedure such as grade.
Further, in step 1), CAM computer transmission to the drawing data of the item number machine of laser direct imaging equipment is the drafting data of one piece of circuit board.
Further, in step 3), contraposition CCD carries out contraposition process to multiple jigsaw and carries out subregion contraposition process to workbench zones of different and be plotted on polylith circuit board by identical CAM image simultaneously, carries out contracting rise according to the actual conditions of each area circuit plate.。
Contrast prior art, the present invention in the structure, circuit board arranges at least two, and physical dimension is identical, and be placed on work top by array, above-mentioned design, relative to original laser imaging apparatus, can complete the layout production of at least two pieces and above circuit board, realize production capacity double under the condition that circuit board is enough little; Simultaneously, in production method, CAM computer transmission to the drawing data of the item number machine of laser direct imaging equipment is the drafting data of one piece of circuit board, has saved the time and labour intensity of producing, further ensure that production efficiency, there is practical value and prospect of production widely.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
In figure: 1, CAM computer; 2, item number machine; 3, contraposition CCD; 4, work top; 5, circuit board.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described.
As shown in Figure 1, a kind of laser direct imaging equipment, comprises CAM computer 1, item number machine 2, work top 4, circuit board 5 and contraposition CCD3; Wherein, described CAM computer 1 is connected with item number machine 2 network signal, and circuit board 5 is placed on work top 4, contraposition CCD3 and circuit board 5 contraposition;
On this basis, described circuit board 5 arranges at least two, and physical dimension is identical, and is placed on work top 4 by array.
As the preferred mode of the present invention, described circuit board 5 arranges four, and physical dimension is identical, and is placed on work top 4 by array, guarantees the effect in production run, ensures production efficiency.
As the preferred mode of the present invention, circuit board 5 uses pcb board, IC support plate, soft board, and semiconductor crystal wafer or chip are material, ensures the quality of circuit board.
For above-mentioned laser direct imaging equipment, its concrete production method is as follows:
1) CAM computer 1 will draw the item number machine 2 using figure to be transmitted through the network to laser direct imaging equipment;
2) on work top 4, item number machine 2 is supplied to according to spacing data between the matrix of the circuit board 5 of matrix arrangement placement;
3) carry out subregion contraposition by contraposition CCD3 to circuit board 5, it is about to the position of drawing to allow graphing know accurately;
4) use the figure of same circuit board 5 to copy polylith same circuit board simultaneously.
As the preferred mode of the present invention, circuit board 5 procedure for producing is internal layer, outer, and anti-welding processing procedure such as grade, guarantees the quality of circuit board further.
As the preferred mode of the present invention, in step 1, the drawing data that described CAM computer 1 transfers to the item number machine 2 of laser direct imaging equipment is the drafting data of one piece of circuit board 5, has saved the time and labour intensity of producing, further ensure that the efficiency of production.
As the preferred mode of the present invention, in step 3, contraposition CCD3 carries out contraposition process to multiple jigsaw and carries out subregion contraposition process to workbench zones of different and be plotted on polylith circuit board 5 by identical CAM image simultaneously, carry out contracting according to the actual conditions of each area circuit plate to rise, guarantee the effect processed, ensure product quality.
In sum, contrast prior art, the present invention in the structure, circuit board 5 arranges at least two, and physical dimension is identical, and be placed on work top 4 by array, above-mentioned design is relative to original laser imaging apparatus, the layout production of at least two pieces and above circuit board can be completed under the condition that circuit board 5 is enough little, realize production capacity double; Simultaneously, in production method, the drawing data that CAM computer 1 transfers to the item number machine 2 of laser direct imaging equipment is the drafting data of one piece of circuit board 5, has saved the time and labour intensity of producing, further ensure that production efficiency, there is practical value and prospect of production widely.
Claims (7)
1. a laser direct imaging equipment, comprises CAM computer (1), item number machine (2), work top (4), circuit board (5) and contraposition CCD(3);
Wherein, described CAM computer (1) is connected with item number machine (2) network signal, and circuit board (5) is placed on work top (4), contraposition CCD(3) and circuit board (5) contraposition;
It is characterized in that, described circuit board (5) arranges at least two, and physical dimension is identical, and is placed on work top (4) by array.
2. a kind of laser direct imaging equipment according to claim 1, is characterized in that, described circuit board (5) arranges four, and physical dimension is identical, and is placed on work top (4) by array.
3. a kind of laser direct imaging equipment according to claim 1, is characterized in that, described circuit board (5) uses pcb board, and IC support plate, soft board, semiconductor crystal wafer or chip are material.
4. a kind of laser direct imaging equipment according to claim 1, it is characterized in that, concrete production method is as follows:
1) CAM computer (1) will draw the item number machine (2) using figure to be transmitted through the network to laser direct imaging equipment;
2) on work top (4), item number machine (2) is supplied to according to spacing data between the matrix of the circuit board (5) of matrix arrangement placement;
3) by contraposition CCD(3) subregion contraposition is carried out to circuit board (5), it is about to the position of drawing to allow graphing know accurately;
4) use the figure of same circuit board (5) to copy polylith same circuit board simultaneously.
5. the production method of a kind of laser direct imaging equipment according to claim 1, is characterized in that, described circuit board (5) procedure for producing is internal layer, outer, anti-welding processing procedure such as grade.
6. the production method of a kind of laser direct imaging equipment according to claim 1, it is characterized in that, in step 1), the drawing data that described CAM computer (1) transfers to the item number machine (2) of laser direct imaging equipment is the drafting data of one piece of circuit board (5).
7. the production method of a kind of laser direct imaging equipment according to claim 1, it is characterized in that, in step 3), contraposition CCD(3) contraposition process is carried out to multiple jigsaw subregion contraposition process is carried out to workbench zones of different identical CAM image is plotted on polylith circuit board (5) simultaneously, carry out contracting according to the actual conditions of each area circuit plate and rise.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410580432.4A CN104503210A (en) | 2014-10-27 | 2014-10-27 | Laser direct-imaging device and production method using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410580432.4A CN104503210A (en) | 2014-10-27 | 2014-10-27 | Laser direct-imaging device and production method using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104503210A true CN104503210A (en) | 2015-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410580432.4A Pending CN104503210A (en) | 2014-10-27 | 2014-10-27 | Laser direct-imaging device and production method using the same |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107561876A (en) * | 2017-10-19 | 2018-01-09 | 苏州源卓光电科技有限公司 | A kind of new mask-free photolithography system and its technological process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020132172A1 (en) * | 2001-03-13 | 2002-09-19 | Amit Ghosh | Semiconductor mask alignment system |
| US20060050256A1 (en) * | 2004-09-03 | 2006-03-09 | Canon Kabushiki Kaisha | Exposure apparatus, exposure method, and device manufacturing method |
| CN101221375A (en) * | 2008-01-25 | 2008-07-16 | 上海微电子装备有限公司 | Machine vision system used for step photo-etching machine alignment system and its calibration method |
| CN102722304A (en) * | 2012-06-21 | 2012-10-10 | 中山新诺科技有限公司 | Method for preparing touch screen in joint way |
| CN202886840U (en) * | 2012-09-21 | 2013-04-17 | 胡朝阳 | Device for making mask plate |
-
2014
- 2014-10-27 CN CN201410580432.4A patent/CN104503210A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020132172A1 (en) * | 2001-03-13 | 2002-09-19 | Amit Ghosh | Semiconductor mask alignment system |
| US20060050256A1 (en) * | 2004-09-03 | 2006-03-09 | Canon Kabushiki Kaisha | Exposure apparatus, exposure method, and device manufacturing method |
| CN101221375A (en) * | 2008-01-25 | 2008-07-16 | 上海微电子装备有限公司 | Machine vision system used for step photo-etching machine alignment system and its calibration method |
| CN102722304A (en) * | 2012-06-21 | 2012-10-10 | 中山新诺科技有限公司 | Method for preparing touch screen in joint way |
| CN202886840U (en) * | 2012-09-21 | 2013-04-17 | 胡朝阳 | Device for making mask plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107561876A (en) * | 2017-10-19 | 2018-01-09 | 苏州源卓光电科技有限公司 | A kind of new mask-free photolithography system and its technological process |
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Application publication date: 20150408 |