CN104507301A - Electromagnetic shielding film with metal coating and manufacturing technique of electromagnetic shielding film - Google Patents
Electromagnetic shielding film with metal coating and manufacturing technique of electromagnetic shielding film Download PDFInfo
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- CN104507301A CN104507301A CN201410774020.4A CN201410774020A CN104507301A CN 104507301 A CN104507301 A CN 104507301A CN 201410774020 A CN201410774020 A CN 201410774020A CN 104507301 A CN104507301 A CN 104507301A
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 45
- 239000002184 metal Substances 0.000 title claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000011248 coating agent Substances 0.000 title abstract description 8
- 238000000576 coating method Methods 0.000 title abstract description 8
- 238000000034 method Methods 0.000 title abstract 5
- 239000010410 layer Substances 0.000 claims abstract description 93
- 239000012790 adhesive layer Substances 0.000 claims abstract description 25
- 238000004544 sputter deposition Methods 0.000 claims abstract description 13
- 239000010408 film Substances 0.000 claims description 82
- 230000001681 protective effect Effects 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 12
- 238000000643 oven drying Methods 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- 229920002799 BoPET Polymers 0.000 claims description 6
- 239000005041 Mylar™ Substances 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229920001568 phenolic resin Polymers 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 229920005749 polyurethane resin Polymers 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 6
- 229920002545 silicone oil Polymers 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 6
- 239000005060 rubber Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 3
- 229920006269 PPS film Polymers 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses electromagnetic shielding film with a metal coating and a manufacturing technique of the electromagnetic shielding film. The electromagnetic shielding film with the metal coating comprises a carrier film layer, an ink layer coated on the carrier film layer, a metal film layer formed on the ink layer through vacuum sputtering, and a conductive adhesive layer coated on the metal film layer. The electromagnetic shielding film with the metal coating and the manufacturing technique of the electromagnetic shielding film have the beneficial effects that the electromagnetic shielding film is provided with the metal coating and has good shielding performance, the electromagnetic shielding film is manufactured to be super thin with the overall structural design, and meanwhile the flexibility requirement of the flexible circuit board industry is met; the manufacturing technique is easy to realize, can be realized through conventional FPC (flexible printed circuit) processing techniques (such as coating, sputtering and adhering), and is suitable for industrial popularization and application.
Description
Technical field
The present invention relates to a kind of electromagnetic shielding film with the coat of metal and manufacturing process thereof, have the advantages that thickness is thin.
Background technology
Printed substrate is material indispensable in electronic product, be widely used in computer and ancillary equipment, communication product and consumption electronic products at present, along with the sustainable growth of consumption electronic products demand, the requirement for printed circuit board (PCB) also grows with each passing day.
In flexible print circuit board industry, along with the update of the electronic equipment such as smart mobile phone, Ipad, also more and more higher to the requirement of electromagnetic shielding.In the course of processing of flexible circuit board, circuit will use electromagnetic shielding membrane material in large quantities.
The thickness of flexible circuit board main flow electromagnetic shielding film is 22 microns (μm) in the market, relative to the requirement of " light, thin, short, little " that flexible circuitry plate material is advocated, also has certain gap, gap is shown with the requirement of the Wearable electronic product of current hot topic, therefore, in the urgent need to developing the ultra-thin demand that a kind of new electromagnetic shielding film uses to meet product.
Summary of the invention
For solving the deficiencies in the prior art, the object of the present invention is to provide a kind of ultra-thin type electromagnetic screened film with the coat of metal, additionally providing the manufacturing process of this electromagnetic shielding film simultaneously.
In order to realize above-mentioned target, the present invention adopts following technical scheme:
A kind of electromagnetic shielding film with the coat of metal, comprise: carrier film layer, the ink layer coated on carrier film layer, the vacuum sputtering metal film layer on ink layer and the conduction adhesive layer coated on metal film layer, this electromagnetic shielding film is four layers of superthin structure.
Further, aforesaid conductive gluing layer is also provided with the release protective film of one deck, thus defines the electromagnetic shielding film of five layers of superthin structure.
Aforementioned bearer thin layer plays carrying effect to ink layer, is generally high molecular polymer thin layer, is specifically as follows the modified film of one or more of PET, PEN, PI, PBT, PPS film, and thickness is 25-200 μm.
Aforementioned ink layer has the function of rapid curing and insulation, and be the mixture of one or more in epoxy resin, polyacrylic resin, modified rubber, phenolic resins, mylar, polyurethane resin, thickness is 5-50 μm.
Preferably, aforementioned metal thin layer is the mixture of one or more in silver, copper, aluminium, nickel, and thickness is 20-3000nm.
Aforesaid conductive adhesive layer is made up of adhesive main body and the conducting powder be distributed in adhesive main body, the material of conducting powder is the mixture of one or more in silver powder, silver-coated copper powder, copper powder and nickel powder, adhesive main body is the mixture of one or more in modified epoxy, polyacrylic resin, polyimide resin, modified rubber, phenolic resins, mylar, polyurethane resin, the thickness of Conductive adhesive layer is 3-15 μm, the preferred 1-15 μm of particle diameter of conducting powder.
Particularly; aforementioned release protective film is the one in PET release film, PP release film, PBT release film, release liners; release protective film is coated with silicone oil or non-silicone oil mould release, and the thickness of release protective film is 12-200 μm, gives the characteristic that this conductive adhesive film can easily be peeled off.
In addition, the invention also discloses a kind of manufacturing process of electromagnetic shielding film of aforesaid four layers of superthin structure, step is as follows:
A1, remove greasy dirt on carrier thin film volume inner face and foreign matter, and dope layer of ink thereon, through oven drying, ink layer is solidified;
A2, on ink layer vacuum sputtering layer of metal thin layer, thickness is 20-3000nm;
A3, on metal film layer, be coated with one deck conductive adhesive layer, thickness is 3-15 μm, is incorporated to oven drying, and oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min;
A4, rolling.
The manufacturing process of the electromagnetic shielding film of aforesaid five layers of superthin structure, step is as follows:
B1, remove greasy dirt on carrier thin film volume inner face and foreign matter, and dope layer of ink thereon, through oven drying, ink layer is solidified;
B2, on ink layer vacuum sputtering layer of metal thin layer, thickness is 20-3000nm;
B3, on metal film layer, be coated with one deck conductive adhesive layer, thickness is 3-15 μm, is incorporated to oven drying, and oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min;
B4, on conductive adhesive layer the release protective film of thermal-adhering one deck;
B5, rolling.
Usefulness of the present invention is: electromagnetic shielding film of the present invention is with the coat of metal, advantages of good shielding performance, conductive adhesive layer has excellent conduction property, ink layer has good insulating properties, overall construction design can make the electromagnetic shielding film thickness ultrathin obtained, and the gross thickness of ink layer, the coat of metal and conductive adhesive layer is only 8-16um; Ink layer and the conductive adhesive layer of screened film have fabulous pliability, can meet the softness requirements of flexible circuitry board industry; Manufacturing process of the present invention easily realizes, and can be realized, facilitate commercial introduction to apply by the FPC processing technology (as coating, sputtering, laminating etc.) of routine.
Accompanying drawing explanation
Fig. 1 is the structural representation of the electromagnetic shielding film of four layers of superthin structure of the present invention;
Fig. 2 is the structural representation of the electromagnetic shielding film of five layers of superthin structure of the present invention.
The implication of Reference numeral in figure: 1, carrier film layer, 2, ink layer, 3, metal film layer, 4, Conductive adhesive layer, 5, release protective film.
Embodiment
Below in conjunction with the drawings and specific embodiments, concrete introduction is done to the present invention.
See Fig. 1, a kind of electromagnetic shielding film with the coat of metal of the present invention, comprise: carrier film layer 1, the ink layer 2 coated on carrier film layer 1, the vacuum sputtering metal film layer 3 on ink layer 2 and the conduction adhesive layer coated on metal film layer 3, so, the electromagnetic shielding film of four layers of superthin structure is constituted.
Preferably, carrier film layer 1 pair of ink layer 2 plays carrying effect, is generally high molecular polymer thin layer, is specifically as follows the modified film of one or more of PET, PEN, PI, PBT, PPS film, and thickness is 25-200 μm; Ink layer 2 has the function of rapid curing and insulation, is generally the mixture of one or more in epoxy resin, polyacrylic resin, modified rubber, phenolic resins, mylar, polyurethane resin, and thickness is 5-50 μm; Metal film layer 3 is the mixture of one or more in silver, copper, aluminium, nickel, and thickness is 20-3000nm; Conductive adhesive layer is made up of adhesive main body and the conducting powder be distributed in adhesive main body, the material of conducting powder is the mixture of one or more in silver powder, silver-coated copper powder, copper powder and nickel powder, adhesive main body is the mixture of one or more in modified epoxy, polyacrylic resin, polyimide resin, elastomer, phenolic resins, mylar, polyurethane resin, the thickness of Conductive adhesive layer 4 is 3-15 μm, the preferred 1-15 μm of particle diameter of conducting powder.
Further, as shown in Figure 2, conduction adhesive layer is also provided with the release protective film 5 of one deck, thus defines the electromagnetic shielding film of five layers of superthin structure.Particularly, release protective film 5 is the one in PET release film, PP release film, PBT release film, release liners, and release diaphragm is coated with silicone oil or non-silicone oil mould release, and the thickness of release diaphragm is 12-200 μm.
The electromagnetic shielding film of four layers of superthin structure of the present invention and the electromagnetic shielding film of five layers of superthin structure all have good pliability, thickness ultrathin, heat resistance meet tin soldering liquid soak reach 340 DEG C * 30 seconds, not stratified foaming, and have good conduction property, conducting resistance is below 300 milliohms, and effectiveness is good, can more than 50db be reached, meet the demand of electronic product industry well.
In order to apply the present invention better, be introduced the manufacturing process of the electromagnetic shielding film of four layers of superthin structure of the present invention below, step is as follows:
A1, remove greasy dirt on carrier thin film volume inner face and foreign matter, and dope layer of ink 2 thereon, through oven drying, ink layer 2 is solidified;
A2, on ink layer 2 vacuum sputtering layer of metal thin layer 3, thickness is 20-3000nm;
A3, on metal film layer 3, be coated with one deck conductive adhesive layer, thickness is 3-15 μm, is incorporated to oven drying, and oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min;
A4, rolling.
The manufacturing process of the electromagnetic shielding film of five layers of superthin structure and upper similar, concrete steps are as follows:
B1, remove greasy dirt on carrier thin film volume inner face and foreign matter, and dope layer of ink 2 thereon, through oven drying, ink layer 2 is solidified;
B2, on ink layer 2 vacuum sputtering layer of metal thin layer 3, thickness is 20-3000nm;
B3, on metal film layer 3, be coated with one deck conductive adhesive layer, thickness is 3-15 μm, is incorporated to oven drying, and oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min;
B4, on conductive adhesive layer the release protective film 5 of thermal-adhering one deck;
B5, rolling.
As can be seen here, the operation such as removing foreign matter, coating, baking and curing, vacuum sputtering used in manufacturing process of the present invention is all mature common technologies of industry in prior art, do not repeat, adopt the mature technology of these routines, make manufacturing process of the present invention be simple and easy to realize and can effectively control cost, be convenient to industrially apply.
More than show and describe general principle of the present invention, principal character and advantage.The technical staff of the industry should understand, and above-described embodiment does not limit the present invention in any form, the technical scheme that the mode that all employings are equal to replacement or equivalent transformation obtains, and all drops in protection scope of the present invention.
Claims (9)
1. with an electromagnetic shielding film for the coat of metal, it is characterized in that, comprising: carrier film layer, the ink layer coated on carrier film layer, the vacuum sputtering metal film layer on ink layer and the conduction adhesive layer coated on metal film layer.
2. a kind of electromagnetic shielding film with the coat of metal according to claim 1, is characterized in that, described conduction adhesive layer is also provided with the release protective film of one deck.
3. a kind of electromagnetic shielding film with the coat of metal according to claim 1, it is characterized in that, described carrier film layer is high molecular polymer thin layer, and be the modified film of one or more of PET, PEN, PI, PBT, PPS film, thickness is 25-200 μm.
4. a kind of electromagnetic shielding film with the coat of metal according to claim 1, it is characterized in that, described ink layer is the mixture of one or more in epoxy resin, polyacrylic resin, modified rubber, phenolic resins, mylar, polyurethane resin, and thickness is 5-50 μm.
5. a kind of electromagnetic shielding film with the coat of metal according to claim 1, is characterized in that, described metal film layer is the mixture of one or more in silver, copper, aluminium, nickel, and thickness is 20-3000nm.
6. a kind of electromagnetic shielding film with the coat of metal according to claim 1, it is characterized in that, described conduction adhesive layer is made up of adhesive main body and the conducting powder be distributed in adhesive main body, the material of conducting powder is silver powder, silver-coated copper powder, the mixture of one or more in copper powder and nickel powder, adhesive main body is modified epoxy, polyacrylic resin, polyimide resin, modified rubber, phenolic resins, mylar, the mixture of one or more in polyurethane resin, the thickness of Conductive adhesive layer is 3-15 μm, the particle diameter of conducting powder is 1-15 μm.
7. a kind of electromagnetic shielding film with the coat of metal according to claim 2; it is characterized in that; described release protective film is the one in PET release film, PP release film, PBT release film and release liners; release protective film is coated with silicone oil or non-silicone oil mould release, and the thickness of release protective film is 12-200 μm.
8. the manufacturing process of a kind of electromagnetic shielding film with the coat of metal as claimed in claim 1, it is characterized in that, step is as follows:
A1, remove greasy dirt on carrier thin film volume inner face and foreign matter, and dope layer of ink thereon, through oven drying, ink layer is solidified;
A2, on ink layer vacuum sputtering layer of metal thin layer, thickness is 20-3000nm;
A3, on metal film layer, be coated with one deck conductive adhesive layer, thickness is 3-15 μm, is incorporated to oven drying, and oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min;
A4, rolling.
9. the manufacturing process of a kind of electromagnetic shielding film with the coat of metal as claimed in claim 2, it is characterized in that, step is as follows:
B1, remove greasy dirt on carrier thin film volume inner face and foreign matter, and dope layer of ink thereon, through oven drying, ink layer is solidified;
B2, on ink layer vacuum sputtering layer of metal thin layer, thickness is 20-3000nm;
B3, on metal film layer, be coated with one deck conductive adhesive layer, thickness is 3-15 μm, is incorporated to oven drying, and oven temperature is 60-120 DEG C, and linear velocity is 5-30m/min;
B4, on conductive adhesive layer the release protective film of thermal-adhering one deck;
B5, rolling.
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| CN201410774020.4A CN104507301A (en) | 2014-12-16 | 2014-12-16 | Electromagnetic shielding film with metal coating and manufacturing technique of electromagnetic shielding film |
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| CN201410774020.4A CN104507301A (en) | 2014-12-16 | 2014-12-16 | Electromagnetic shielding film with metal coating and manufacturing technique of electromagnetic shielding film |
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| CN104797081A (en) * | 2015-04-24 | 2015-07-22 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film applicable to rigid-flex printed circuit boards and production technique of electromagnetic shielding film |
| CN104883865A (en) * | 2015-05-12 | 2015-09-02 | 苏州城邦达力材料科技有限公司 | High-efficient low-cost electromagnetic shielding film and manufacturing method thereof |
| CN105491786A (en) * | 2015-12-18 | 2016-04-13 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film applicable to high-frequency signal and manufacturing process thereof |
| CN105491788A (en) * | 2016-01-14 | 2016-04-13 | 苏州城邦达力材料科技有限公司 | Graphene heat radiation type shielding film and preparation method thereof |
| CN105950054A (en) * | 2016-06-24 | 2016-09-21 | 海宁卓泰电子材料有限公司 | Manufacture method of electromagnetic shielding films |
| CN106102428A (en) * | 2016-06-24 | 2016-11-09 | 海宁卓泰电子材料有限公司 | A kind of manufacture method of electromagnetic shielding film |
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| CN105491788A (en) * | 2016-01-14 | 2016-04-13 | 苏州城邦达力材料科技有限公司 | Graphene heat radiation type shielding film and preparation method thereof |
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| CN105950054B (en) * | 2016-06-24 | 2019-09-24 | 海宁卓泰电子材料有限公司 | A kind of production method of electromagnetic shielding film |
| CN106102428A (en) * | 2016-06-24 | 2016-11-09 | 海宁卓泰电子材料有限公司 | A kind of manufacture method of electromagnetic shielding film |
| CN106118528B (en) * | 2016-06-24 | 2020-03-03 | 海宁卓泰电子材料有限公司 | Method for manufacturing electromagnetic shielding film |
| CN106102428B (en) * | 2016-06-24 | 2019-01-04 | 海宁卓泰电子材料有限公司 | A kind of production method of electromagnetic shielding film |
| CN105950054A (en) * | 2016-06-24 | 2016-09-21 | 海宁卓泰电子材料有限公司 | Manufacture method of electromagnetic shielding films |
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Application publication date: 20150408 |