CN104423458B - Foot pad structure and electronic device - Google Patents
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- CN104423458B CN104423458B CN201310411272.6A CN201310411272A CN104423458B CN 104423458 B CN104423458 B CN 104423458B CN 201310411272 A CN201310411272 A CN 201310411272A CN 104423458 B CN104423458 B CN 104423458B
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- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
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Abstract
本发明提供一种脚垫结构与电子装置。脚垫结构包括多个脚垫以及至少一管路。各个脚垫具有可挠性且相对的一第一面与一第二面。各个脚垫以第二面结合于电子装置的机体,而电子装置以这些脚垫的第一面抵接并置放于平台。管路配置于机体内且连通于这些脚垫的第二面。流体填充于管路并接触这些脚垫的第二面,其中当至少一脚垫的第一面受力而朝向第二面变形时,管路内的流体被挤压而驱动其余脚垫的第二面朝向第一面变形以支撑电子装置。
The present invention provides a foot pad structure and an electronic device. The foot pad structure includes a plurality of foot pads and at least one pipeline. Each foot pad has a first surface and a second surface that are flexible and opposite to each other. Each foot pad is combined with the body of the electronic device with its second surface, and the electronic device is abutted against and placed on a platform with the first surfaces of these foot pads. The pipeline is arranged in the body and connected to the second surfaces of these foot pads. Fluid is filled in the pipeline and contacts the second surfaces of these foot pads, wherein when the first surface of at least one foot pad is subjected to force and deforms toward the second surface, the fluid in the pipeline is squeezed and drives the second surfaces of the remaining foot pads to deform toward the first surface to support the electronic device.
Description
技术领域technical field
本发明是有关于一种脚垫结构与电子装置。The invention relates to a foot pad structure and an electronic device.
背景技术Background technique
受惠于半导体元件与显示器技术的进步,电子装置不断的朝向小型、多功能且携带方便的方向发展,常见的可携式电子装置包括个人数码助理器(personal digitalassistant)、手机(mobile phone)、笔记本电脑(notebook computer)等。可携式电子装置采用折叠方式来减少收纳面积,以达到电子产品轻薄短小的目的。Benefiting from the advancement of semiconductor components and display technologies, electronic devices are constantly developing towards small, multi-functional and portable electronic devices. Common portable electronic devices include personal digital assistants (personal digital assistants), mobile phones (mobile phones), Notebook computer, etc. The portable electronic device adopts a folding method to reduce the storage area, so as to achieve the purpose of light, thin and short electronic products.
以笔记本电脑为例,一般的笔记本电脑大多是由机体与显示屏幕所组成,其中机体与显示屏幕为相互枢接。使用者可通过机体与显示屏幕的相对转动使笔记本电脑的主机与显示屏幕闭合以方便携带,待欲使用笔记本电脑时再将显示屏幕展开以方便操作。Taking a notebook computer as an example, a general notebook computer is mostly composed of a body and a display screen, wherein the body and the display screen are pivotally connected to each other. The user can close the host computer and the display screen of the notebook computer through the relative rotation of the body and the display screen for easy carrying, and unfold the display screen for easy operation when the notebook computer is to be used.
然而,由于制造上的限制,机体大多具有些许的制造公差,且笔记本电脑通常是通过配置于机体的底部的多个脚垫而置放于工作平面上。因此,受到前述制造公差的影响,当笔记本电脑通过这些脚垫置放于工作平面上时,这些脚垫并无法完全抵贴于工作平面上。也就是说,这些脚垫的至少其中之一会与工作平面之间存在一高度落差,从而导致使用者在操作笔记本电脑的过程中,容易造成笔记本电脑的晃动。However, due to manufacturing constraints, the body usually has some manufacturing tolerances, and the notebook computer is usually placed on a work surface through a plurality of feet arranged at the bottom of the body. Therefore, affected by the aforementioned manufacturing tolerances, when the notebook computer is placed on the work plane through these foot pads, these foot pads cannot completely abut against the work plane. That is to say, there will be a height difference between at least one of the foot pads and the working plane, which will easily cause the notebook computer to shake when the user is operating the notebook computer.
发明内容Contents of the invention
本发明提供一种脚垫结构与电子装置。The invention provides a foot pad structure and an electronic device.
本发明提供一种脚垫结构,其能与机体内的管路结合并产生适度的变形,以让电子装置稳固地置放于工作平面上。The invention provides a foot pad structure, which can be combined with the pipeline in the body and produce moderate deformation, so that the electronic device can be stably placed on the working plane.
本发明提供一种电子装置,其通过脚垫结构能稳固地置放于工作平面上。The invention provides an electronic device which can be stably placed on a working plane through a foot pad structure.
本发明的脚垫结构适用于电子装置。脚垫结构包括多个脚垫以及至少一管路。各个脚垫具有可挠性且相对的一第一面与一第二面。各个脚垫以第二面结合于电子装置的机体,而电子装置以这些脚垫的第一面抵接并置放于平台。管路配置于机体内且连通于这些脚垫的第二面。流体适于填充于管路并接触这些脚垫的第二面,其中当至少一脚垫的第一面受力而朝向第二面变形时,管路内的流体被挤压而驱动其余脚垫的第二面朝向第一面变形以支撑电子装置。The foot pad structure of the present invention is suitable for electronic devices. The foot pad structure includes a plurality of foot pads and at least one pipeline. Each foot pad has a flexible and opposite first surface and a second surface. Each foot pad is combined with the body of the electronic device by the second surface, and the electronic device is placed on the platform by contacting the first surface of these foot pads. The pipeline is arranged in the body and communicated with the second surfaces of the foot pads. The fluid is adapted to fill the tubes and contact the second side of the pads, wherein when at least one of the pads is deformed toward the second side by force on the first side, the fluid in the tubes is squeezed to drive the remaining pads The second surface is deformed toward the first surface to support the electronic device.
本发明的电子装置包括机体以及脚垫结构。脚垫结构配置于机体。脚垫结构包括多个脚垫以及至少一管路。各个脚垫具有可挠性且相对的一第一面与一第二面。各个脚垫以第二面结合于电子装置,而电子装置以这些脚垫的第一面抵接并置放于平台。管路配置于机体内且连通于这些脚垫的第二面。流体适于填充于管路并接触这些脚垫的第二面,其中当至少一脚垫的第一面受力而朝向第二面变形时,管路内的流体被挤压而驱动其余脚垫的第二面朝向第一面变形以支撑电子装置。The electronic device of the present invention includes a body and a foot pad structure. The foot pad structure is configured on the body. The foot pad structure includes a plurality of foot pads and at least one pipeline. Each foot pad has a flexible and opposite first surface and a second surface. Each foot pad is combined with the electronic device by the second surface, and the electronic device is placed on the platform by abutting the first surface of these foot pads. The pipeline is arranged in the body and communicated with the second surfaces of the foot pads. Fluid is adapted to fill the tubes and contact the second side of the pads, wherein when at least one of the pads is deformed toward the second side by force on the first side, the fluid in the tubes is squeezed to drive the remaining pads The second surface is deformed toward the first surface to support the electronic device.
基于上述,本发明将脚垫结构与机体内的管路作结合,使得流体能流动于脚垫结构的多个脚垫与管路之间,其中当任一脚垫受力变形时,部分流体受到挤压而通过管路分流至其他脚垫,以驱动脚垫朝向平台变形,使得电子装置能通过脚垫结构而稳固地置放于平台上。Based on the above, the present invention combines the foot pad structure with the pipeline in the body, so that the fluid can flow between the multiple foot pads and the pipeline of the foot pad structure, wherein when any foot pad is deformed by force, part of the fluid It is squeezed and diverted to other foot pads through pipelines to drive the foot pads to deform toward the platform, so that the electronic device can be firmly placed on the platform through the foot pad structure.
为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合附图作详细说明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.
附图说明Description of drawings
图1是本发明一实施例的电子装置的立体示意图;FIG. 1 is a schematic perspective view of an electronic device according to an embodiment of the present invention;
图2是图1的电子装置的侧视图;FIG. 2 is a side view of the electronic device of FIG. 1;
图3是图1中截面A的示意图;Fig. 3 is the schematic diagram of section A in Fig. 1;
图4是图2的机体沿I-I线段的剖面示意图;Fig. 4 is a schematic sectional view of the body of Fig. 2 along the line I-I;
图5是本发明另一实施例的电子装置的局部剖面示意图;5 is a schematic partial cross-sectional view of an electronic device according to another embodiment of the present invention;
图6A至图6E绘示了其他多个可能实施例的机体的底视图。6A to 6E illustrate bottom views of bodies of other possible embodiments.
附图标记说明:Explanation of reference signs:
10:平台;10: platform;
110:机体;110: body;
110A,110B:电子装置;110A, 110B: electronic devices;
110a:底部;110a: bottom;
112:开孔;112: opening;
116:环状沟槽;116: annular groove;
200:脚垫结构;200: Pad structure;
210:脚垫;210: foot pad;
210a:第一面;210a: first side;
210b:第二面;210b: second side;
211:支撑部;211: support part;
212:环状部;212: annular portion;
212a:顶面;212a: top surface;
213:凸部;213: Convex part;
220、220a~220e:管路;220, 220a~220e: pipeline;
222:延伸管;222: extension tube;
222a:开口;222a: opening;
d:最短距离;d: the shortest distance;
W:流体。W: Fluid.
具体实施方式detailed description
图1是本发明一实施例的电子装置的立体示意图。图2是图1的电子装置的侧视图。图3是图1中截面A的示意图。请参考图1至图3,在本实施例中,电子装置100A例如是笔记本电脑,其通过配置于机体110的底部110a的脚垫结构200而置放于平台10上。具体而言,脚垫结构200包括多个脚垫210以及至少一管路220。脚垫210的数量例如是四个且分别配置于底部110a的四个角落,以使电子装置100A能稳固地置放于平台10上。FIG. 1 is a schematic perspective view of an electronic device according to an embodiment of the present invention. FIG. 2 is a side view of the electronic device of FIG. 1 . FIG. 3 is a schematic diagram of section A in FIG. 1 . Please refer to FIG. 1 to FIG. 3 , in this embodiment, the electronic device 100A is, for example, a notebook computer, which is placed on the platform 10 through the foot pad structure 200 disposed on the bottom 110 a of the body 110 . Specifically, the foot pad structure 200 includes a plurality of foot pads 210 and at least one pipeline 220 . The number of foot pads 210 is, for example, four and are respectively arranged at four corners of the bottom 110 a, so that the electronic device 100A can be placed on the platform 10 stably.
在本实施例中,脚垫210具有可挠性且相对的第一面210a与第二面210b,各个脚垫以第二面210b结合于电子装置100A的机体110,而电子装置100A以这些脚垫210的这些第一面210a抵接并置放于平台10。另一方面,管路220配置于机体110内且连通于这些脚垫的这些第二面210b。流体W适于填充于管路220并接触这些脚垫210的这些第二面210b。In this embodiment, the foot pads 210 have a flexible and opposite first surface 210a and a second surface 210b. The first surfaces 210 a of the pad 210 are abutted against and placed on the platform 10 . On the other hand, the pipeline 220 is disposed in the body 110 and communicates with the second surfaces 210b of the foot pads. The fluid W is suitable for filling the pipeline 220 and contacting the second surfaces 210 b of the foot pads 210 .
在本实施例中,管路220具有多个延伸管222。这些延伸管222分别延伸至机体110的底部110a的多个开孔112,其中延伸管222与开孔112是与各个脚垫210对应配置而位于机体110的底部110a的四个角落。具体来说,各个脚垫210以第二面210b覆盖对应的各个开孔112并且接合于对应的各延伸管222,以使流体W流通于管路220与这些脚垫210之间。In this embodiment, the pipeline 220 has a plurality of extension tubes 222 . These extension tubes 222 respectively extend to a plurality of openings 112 of the bottom 110 a of the body 110 , wherein the extension tubes 222 and the openings 112 are located at four corners of the bottom 110 a of the body 110 corresponding to each foot pad 210 . Specifically, the second surface 210 b of each foot pad 210 covers each corresponding opening 112 and is connected to each corresponding extension tube 222 , so that the fluid W flows between the pipeline 220 and these foot pads 210 .
详细而言,本实施例的管路220为装设于机体110内的塑胶管路,且例如是具有一环形轮廓的连通管,延伸管222一体成型于此塑胶管路上,而开孔112例如是以机械钻孔的方式而形成于机体110上。另一方面,脚垫210为橡胶,或其他兼具可挠性与防水性的材质所构成,以使流体W可容置于由管路220、延伸管222与脚垫210所构成的腔室之中,而不致外漏。详细而言,脚垫210包括支撑部211以及环绕支撑部211的环状部212,当电子装置100A通过这些脚垫210的第一面210a而置放于平台10上时,是由支撑部211抵接平台。In detail, the pipeline 220 of this embodiment is a plastic pipeline installed in the machine body 110, and is, for example, a communicating pipe with a circular outline. The extension pipe 222 is integrally formed on the plastic pipeline, and the opening 112 is, for example, It is formed on the body 110 by mechanical drilling. On the other hand, the foot pad 210 is made of rubber or other flexible and waterproof materials, so that the fluid W can be accommodated in the chamber formed by the pipeline 220 , the extension tube 222 and the foot pad 210 in, without leaking out. In detail, the foot pad 210 includes a support portion 211 and an annular portion 212 surrounding the support portion 211. When the electronic device 100A is placed on the platform 10 through the first surface 210a of these foot pads 210, the support portion 211 abutment platform.
另一方面,脚垫210通过环状部212接合于对应的各个延伸管222上,其中环状部212与开孔112之间以及环状部212与延伸管222可以胶体彼此接合,如此可防止脚垫210脱落以及流体W外漏,也能提升脚垫210与机体110之间的密封性,以避免外界水气入侵而致影响电子装置100A的正常运作及其使用寿命。On the other hand, the pads 210 are joined to corresponding extension tubes 222 through the ring portion 212, wherein the gap between the ring portion 212 and the opening 112 and between the ring portion 212 and the extension tube 222 can be glued to each other, so as to prevent The detachment of the foot pad 210 and the leakage of the fluid W can also improve the sealing between the foot pad 210 and the body 110 , so as to prevent the intrusion of external moisture from affecting the normal operation and service life of the electronic device 100A.
在本实施例中,流体W例如是一般常见的纯水。具体而言,将前述例如是塑胶管路的管路220设置于机体110内且脚垫210接合于其延伸管222后,流体W可通过机体110上与管路220或延伸管222相连通的注入孔(图未示)注入至由管路220、延伸管222与脚垫210所构成的腔室之中,其中在流体W充满于此腔室后,以防水胶填补注入孔(图未示)以防止流体W外漏。当然,注入孔(图未示)也可设置于脚垫210上,本发明对此不加以限制。此外,本发明并未限定脚垫210的设置方式,在其他可能的实施例中,脚垫210也可以双料射出成型的方式而固设于机体110的底部110a的四个角落。In this embodiment, the fluid W is, for example, common pure water. Specifically, after the aforementioned pipeline 220, such as a plastic pipeline, is set in the body 110 and the foot pad 210 is joined to its extension pipe 222, the fluid W can pass through the pipe 220 or the extension pipe 222 on the body 110. The injection hole (not shown in the figure) is injected into the cavity formed by the pipeline 220, the extension tube 222 and the foot pad 210, wherein after the fluid W is filled in the cavity, the injection hole (not shown in the figure) is filled with waterproof glue ) to prevent fluid W from leaking out. Certainly, the injection hole (not shown in the figure) can also be disposed on the foot pad 210 , and the present invention is not limited thereto. In addition, the present invention does not limit the arrangement of the foot pads 210 , and in other possible embodiments, the foot pads 210 may also be fixed on the four corners of the bottom 110 a of the body 110 by double injection molding.
图4是图2的机体沿I-I线段的剖面示意图。请参考图4,更进一步来说,当电子装置100A的机体110包含有制造公差并且通过脚垫结构200置放于平台10上时,各个脚垫210可能非同时抵接于平台10上,例如是以三个脚垫210抵接平台,而另一脚垫210与平台之间存在些许的高度落差。又或者是,各个脚垫210同时抵接于平台10后,机体110相对于平台10处于一倾斜的状态。Fig. 4 is a schematic cross-sectional view of the body of Fig. 2 along line I-I. Please refer to FIG. 4 , further speaking, when the body 110 of the electronic device 100A contains manufacturing tolerances and is placed on the platform 10 through the foot pad structure 200, each foot pad 210 may not abut on the platform 10 at the same time, for example Therefore, three foot pads 210 abut against the platform, and there is a slight height difference between the other foot pad 210 and the platform. Alternatively, after each foot pad 210 abuts against the platform 10 at the same time, the machine body 110 is in an inclined state relative to the platform 10 .
在此是以三个脚垫210抵接平台,而另一脚垫210与平台之间存在些许的高度落差情形作为举例说明。详细而言,前述三个脚垫210(图式中仅绘示一个举例说明)的第一面210a会受朝向机体110的外力F(例如是机体110重量于平台上所产生的反作用力)而朝第二面210b变形,其中管路220内的流体W被挤压而驱动未与平台10抵接的脚垫210的第二面210b朝向第一面210a变形,以通过支撑部211支撑电子装置100A。Here, a situation where three foot pads 210 abut against the platform and there is a slight height difference between the other foot pad 210 and the platform is used as an example for illustration. In detail, the first surface 210a of the aforementioned three foot pads 210 (only one example is shown in the figure) will be affected by an external force F towards the body 110 (such as the reaction force generated by the weight of the body 110 on the platform). Deform toward the second surface 210b, wherein the fluid W in the pipeline 220 is squeezed to drive the second surface 210b of the foot pad 210 that is not in contact with the platform 10 to deform toward the first surface 210a, so as to support the electronic device through the support part 211 100A.
换言之,在前述配置下,脚垫结构200可通过脚垫210的变形与流体W的分流,以达到自动调整的平衡机制,进而确保各个脚垫210皆能抵接于平台10以撑起电子装置100A,使得电子装置100A能通过脚垫结构200而稳固地置放于平台10而不会产生晃动的情形,从而提高使用者于操作过程中的舒适度。In other words, under the aforementioned configuration, the foot pad structure 200 can achieve an automatic adjustment balance mechanism through the deformation of the foot pads 210 and the diversion of the fluid W, thereby ensuring that each foot pad 210 can abut against the platform 10 to support the electronic device. 100A, the electronic device 100A can be stably placed on the platform 10 through the foot pad structure 200 without shaking, thereby improving the user's comfort during operation.
另一方面,为防止其他外力施加于机体110后,其可能致使脚垫210过度变形的情况。如图3所示,脚垫210还包括一与支撑部211以及环状部212相连接的凸部213。凸部213面向对应的延伸管222的开口222a,且凸部213与环状部212的顶面212a之间的最短距离d小于或等于1.1厘米。也就是说,当脚垫210受朝向机体110的外力变形时,其最大变形量将受到凸部213的限制而不致于超过最短距离d。On the other hand, in order to prevent other external forces from being applied to the body 110 , it may cause excessive deformation of the foot pad 210 . As shown in FIG. 3 , the foot pad 210 further includes a convex portion 213 connected to the support portion 211 and the ring portion 212 . The convex portion 213 faces the corresponding opening 222 a of the extension tube 222 , and the shortest distance d between the convex portion 213 and the top surface 212 a of the annular portion 212 is less than or equal to 1.1 cm. That is to say, when the foot pad 210 is deformed by an external force toward the body 110 , its maximum deformation amount will be limited by the protrusion 213 so as not to exceed the shortest distance d.
图5是本发明另一实施例的电子装置的局部剖面示意图。请同时参考图3、4与图5,图5的电子装置100B与图4的电子装置100A的不同处在于:在本实施例中,电子装置100B的机体110内的管路220是以机械钻孔的方式形成于机体之中,而延伸管222也例如是利用机械钻孔的方式以自机体110的底部110a延伸至管路220的通孔。另一方面,开孔112例如为这些延伸管222的开口,且机体110具有环绕各个开孔112的多个环状沟槽116。FIG. 5 is a schematic partial cross-sectional view of an electronic device according to another embodiment of the present invention. Please refer to FIG. 3, 4 and FIG. 5 at the same time. The difference between the electronic device 100B in FIG. 5 and the electronic device 100A in FIG. The body is formed in the form of a hole, and the extension pipe 222 is, for example, drilled mechanically to extend from the bottom 110a of the body 110 to the through hole of the pipeline 220 . On the other hand, the openings 112 are, for example, the openings of the extension tubes 222 , and the body 110 has a plurality of annular grooves 116 surrounding each opening 112 .
脚垫210通过环状部212接合于对应的各个环状沟槽116内,并以胶体彼此接合,藉此防止脚垫210脱落以及流体W外漏,也能提升脚垫210与机体110之间的密封性,以避免外界水气入侵而致影响电子装置100B的正常运作及其使用寿命。另一方面,将流体W注入至由管路220、延伸管222与脚垫210所构成的腔室内的方式与上述实施例大致上相同,于此不再赘述。简言之,如此配置下,电子装置100B与其脚垫结构200也可达到与上述实施例相同的技术功效。The foot pads 210 are engaged in the corresponding annular grooves 116 through the annular portion 212, and are joined to each other by colloid, thereby preventing the foot pads 210 from falling off and the fluid W from leaking out, and also can lift the gap between the foot pads 210 and the body 110. The airtightness of the electronic device 100B is prevented from being affected by the intrusion of external moisture and the normal operation and service life of the electronic device 100B. On the other hand, the method of injecting the fluid W into the chamber formed by the pipeline 220 , the extension tube 222 and the foot pad 210 is substantially the same as that of the above-mentioned embodiment, and will not be repeated here. In short, with such a configuration, the electronic device 100B and its foot pad structure 200 can also achieve the same technical effect as the above-mentioned embodiment.
具体而言,本发明并未对机体110内的管路220的配置方式加以限制。举例来说,在其他未绘示的实施例中,管路220也可为形成于机体110内部的凹槽,并且此凹槽上粘贴覆盖有防水性的构件,以防止凹槽内的液体如纯水渗出而浸蚀机体内的电子元件。Specifically, the present invention does not limit the arrangement of the pipeline 220 in the body 110 . For example, in other unillustrated embodiments, the pipeline 220 can also be a groove formed inside the body 110, and the groove is pasted and covered with a waterproof member to prevent the liquid in the groove from Pure water seeps out and corrodes the electronic components inside the machine.
另一方面,本发明并未限制管路220的结构型态,图6A至图6E绘示了其他多个可能实施例的机体的底视图,如图6A至图6E所示,管路220a至220e分别具有ㄷ型、X型、I型、N型或U型等轮廓。On the other hand, the present invention does not limit the structural form of the pipeline 220. FIG. 6A to FIG. 220e has ㄷ-shaped, X-shaped, I-shaped, N-shaped or U-shaped contours respectively.
综上所述,本发明将脚垫结构与机体内的管路作结合,并将流体注入于由管路与脚垫结构所构成的腔室之中,以使得流体能流动于脚垫与管路之间,其中当任一脚垫受力变形时,部分流体受到挤压而通过管路分流至其他脚垫,使得脚垫朝向平台变形,以让电子装置能通过脚垫结构而稳固地置放于平台上。In summary, the present invention combines the foot pad structure with the pipeline in the body, and injects fluid into the chamber formed by the pipeline and the foot pad structure, so that the fluid can flow between the foot pad and the pipe. Between the channels, when any foot pad is deformed by force, part of the fluid is squeezed and diverted to other foot pads through the pipeline, so that the foot pad is deformed towards the platform, so that the electronic device can be firmly placed through the foot pad structure Put it on the platform.
最后应说明的是:以上各实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述各实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the various embodiments of the present invention. scope.
Claims (12)
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| CN104423458B true CN104423458B (en) | 2017-10-27 |
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| US6498719B1 (en) * | 1999-12-10 | 2002-12-24 | Dell Usa, L.P. | Apparatus and method for reducing impact-induced shock and vibration in a portable computer |
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| CN101175383A (en) * | 2006-10-31 | 2008-05-07 | 佛山市顺德区顺达电脑厂有限公司 | Foot cushion structure |
| CN201984389U (en) * | 2011-03-07 | 2011-09-21 | 纬创资通股份有限公司 | Electronic device and foot pad thereof |
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| US20040025993A1 (en) * | 2002-08-07 | 2004-02-12 | Russell Paul Grady | Protective pad attachment for portable computing devices |
| US20080251663A1 (en) * | 2007-04-11 | 2008-10-16 | Tracy Mark S | Anti-skid foot assembly |
| TW201236553A (en) * | 2011-02-17 | 2012-09-01 | Compal Electronics Inc | Electronic device and stand |
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| US6498719B1 (en) * | 1999-12-10 | 2002-12-24 | Dell Usa, L.P. | Apparatus and method for reducing impact-induced shock and vibration in a portable computer |
| CN2694434Y (en) * | 2004-02-05 | 2005-04-20 | 光宝科技股份有限公司 | Foot pad |
| CN2806949Y (en) * | 2005-07-25 | 2006-08-16 | 英保达股份有限公司 | Seat structure |
| CN101175383A (en) * | 2006-10-31 | 2008-05-07 | 佛山市顺德区顺达电脑厂有限公司 | Foot cushion structure |
| CN201984389U (en) * | 2011-03-07 | 2011-09-21 | 纬创资通股份有限公司 | Electronic device and foot pad thereof |
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