CN104311401A - Benzocyclobutene-perfluorocyclobutane unit-containing thermosetting monomer and its preparation method and use - Google Patents

Abstract

The invention provides a thermosetting monomer containing benzocyclobutene and perfluorocyclobutane units, a preparation method and application thereof. Specifically, the present invention provides a compound represented by the following formula I. The compound of formula I can be heat-cured to form a cured product. The cured product has good heat resistance and electrical properties, and is suitable as a high temperature resistant adhesive or packaging material for electronic components.

Description

Thermosetting monomer containing benzocyclobutene and perfluorocyclobutane units, preparation method and application thereof

technical field

The invention belongs to the field of high-performance polymer production, and specifically relates to a thermosetting resin monomer containing benzocyclobutene and hexafluorocyclobutane structural units, a preparation method and an application.

Background technique

Organic materials containing hexafluorocyclobutyl aryl ether units have attracted attention in the past three decades due to their excellent optical properties. These materials have high light transmission efficiency and minimal light loss, and are expected to be used as organic photoconductive materials (see Macromolecules 2004, 37, 5724 and Macromolecules 2005, 38, 8278). On the other hand, due to the small polarizability of the C-F bond, a thermosetting material with a hexafluorocyclobutyl aryl ether functional group in the main chain is obtained by curing at a high temperature with a di- or tri-functional trifluorovinyl ether structure as a prepolymer. Resins have been developed and used as low dielectric constant materials (see Mat. Res. Soc. Symp. Proc. 1997, 443, 177). Such materials not only have relatively low cost, but also have excellent mechanical properties and low moisture absorption (see WO9015043). However, the manufacture of hexafluorocyclobutyl aryl ether polymers through trifluorovinyl ether-containing prepolymers is often due to the incomplete reaction of trifluorovinyl ether, and the residual trifluorovinyl ether will affect the performance of the material. The unreacted trifluoroethylene group is easily attacked by nucleophiles, and is neither acid-resistant nor alkali-resistant, which will affect the medium resistance of the material (Macromolecules 2008, 41, 7490-7496).

In summary, there is still a lack of an organic material containing hexafluorocyclobutyl aryl ether units that does not contain or substantially does not contain residual trifluorovinyl ether.

Contents of the invention

The object of the present invention is to provide an organic material containing hexafluorocyclobutyl aryl ether units that does not contain or substantially does not contain residual trifluorovinyl ether.

The first aspect of the present invention provides a compound shown in the following formula I:

The second aspect of the present invention provides a method for preparing the compound of formula I as described in the first aspect of the present invention, said method comprising steps:

In an inert solvent, the compound of formula II is reacted with the compound of formula III to obtain the compound of formula I;

Preferably, the reaction is carried out under one or more reagents selected from the group consisting of monovalent copper salts, imidazole ligands, inorganic bases, or combinations thereof.

In another preferred example, the monovalent copper salt used is cuprous chloride, cuprous bromide or cuprous iodide, preferably cuprous chloride.

In another preferred example, the imidazole ligand used is 1-methylimidazole, 1,2-dimethylimidazole, N-butylimidazole or N-isopropylimidazole.

In another preferred example, the inorganic base used is an alkali metal; preferably, the inorganic base is selected from the group consisting of hydroxide, carbonate, or a combination thereof; more preferably, the inorganic base The base is potassium carbonate.

In another preferred example, in the reaction, the inert solvent is selected from the group consisting of toluene, dioxane, N,N-dimethylformamide, N,N-dimethylformamide, Dimethylsulfoxide, N-methylpyrrolidone, hexamethylphosphoramide, sulfolane, or combinations thereof.

In another preference, in the reaction, the molar ratio of the 4-bromobenzocyclobutene (compound of formula III) to 4,4'-dihydroxy-diphenylhexafluorocyclobutane ether 2 to 5:1.

In another preferred example, the molar ratio of the 4-bromobenzocyclobutene (compound of formula III) to the monovalent copper salt, the imidazole ligand and the inorganic base is 1 to 5:0.1 to 1:0.1 to 1 : 1~5.

In another preferred example, the reaction is carried out at 80-160°C.

In another preferred example, the reaction time is 5-30 hours.

In another preference, the compound of formula II is prepared by the following method:

In an inert solvent, react with a compound of formula IIa to obtain a compound of formula II;

In another preferred embodiment, the reaction is carried out in the presence of a reagent selected from the group consisting of boron tribromide, pyridine hydrochloride, or aluminum triiodide.

In another preferred example, the inert solvent is selected from the group consisting of dichloromethane, chloroform, dichloroethane, and toluene.

In another preferred example, the reaction is carried out at 10°C-40°C, preferably at room temperature.

In another preferred example, the reaction time is 10-20 hours.

In another preference, the compound of formula IIa is prepared by the following method:

In an inert solvent, a compound of formula IIb is used for polymerization to obtain a compound of formula IIa:

In another preferred embodiment, the solvent is selected from the group consisting of diphenyl ether, trimethylbenzene, sulfolane, or combinations thereof.

In another preferred example, the reaction is carried out at 120°C-180°C.

In another preferred example, the reaction time is 12-36 hours.

The third aspect of the present invention provides a use of the compound described in the first aspect of the present invention for preparing a cured product.

The fourth aspect of the present invention provides a cured product prepared by curing the compound of formula I according to the first aspect of the present invention.

In another preferred example, the cured product is prepared by curing the compound represented by formula I alone.

In another preferred example, the cured product is prepared by blending and curing the compound of formula I with other benzocyclobutene monomers or unsaturated double bond resins; preferably, the cured product is prepared by using the formula Compound I is prepared by blending and curing monomers selected from the following group: bismaleimide, toluene, toluene, or a combination thereof.

In another preferred example, the resin blending weight ratio of the thermosetting resin monomer and other benzocyclobutene monomers or unsaturated double bonds is 1:0.05-8.

In another preferred example, the cured product has the following schematic structure:

Among them, m and n are integers.

In another preferred example, the dielectric constant (1-30 MHz) of the cured product is 2.3-2.7.

In another preferred example, the 5% thermogravimetric loss temperature of the cured product in nitrogen is 450-490°C.

In another preferred example, the 5% thermogravimetric loss temperature in air of the cured product is 380-410°C.

In another preferred example, the residual carbon rate of the cured product in nitrogen at 1000° C. is ≥ 45%, preferably ≥ 50%.

In another preferred example, the curing is heat curing.

In another preferred example, the heating and curing temperature is 200-300°C.

In another preferred example, the heating curing includes: performing pre-curing at 150-200°C, and then performing thermal curing at 210-260°C.

In another preferred example, the pre-curing time is 0.5-4 hours.

In another preferred example, the thermal curing time is 1-8 hours.

The fifth aspect of the present invention provides a product, the product contains the compound as described in the first aspect of the present invention, or the product is prepared with the compound as described in the first aspect of the present invention.

In another preferred embodiment, the product is a high-temperature-resistant and ablation-resistant material, or an electronic component packaging material.

The sixth aspect of the present invention provides a product, the product contains the cured product as described in the fourth aspect of the present invention, or the product is prepared with the cured product as described in the fourth aspect of the present invention .

The seventh aspect of the present invention provides a method for preparing the product according to the fifth or sixth aspect of the present invention, the method comprising the steps of:

(1) provide the polymer as described in the first aspect of the present invention;

(2) molding the polymer as described in the first aspect of the present invention to obtain a preformed product;

(3) Curing the preformed product obtained in the step (2) to obtain the product according to the fifth or sixth aspect of the present invention.

In another preferred example, in the step (2), the forming is performed by a method selected from the group consisting of pouring, solution spin coating, and solution drop coating.

In another preferred example, the cured product is prepared by blending and curing the compound of formula I with other benzocyclobutene monomers or unsaturated double bond resins; preferably, the cured product is prepared by using the formula Compound I is prepared by blending and curing monomers selected from the following group: bismaleimide, toluene, toluene, or a combination thereof.

In another preferred example, the curing is heat curing.

In another preferred example, the heating and curing temperature is 200-300°C.

In another preferred example, the heating curing includes: performing pre-curing at 150-200°C, and then performing thermal curing at 210-260°C.

In another preferred example, the pre-curing time is 0.5-4 hours.

In another preferred example, the thermal curing time is 1-8 hours.

In another preferred example, the curing further includes performing heat treatment at 260-330° C. after the thermal curing is completed.

In another preferred example, the heat treatment time is 1-4 hours.

In another preferred example, in the step (2), the forming is film formation, and the film formation is by a method selected from the group consisting of heating and pressing, solution spin coating, and solution drop coating.

In another preferred embodiment, the solution spin coating or solution drop coating includes: dissolving the polymer as described in the first aspect of the present invention with an organic solvent, and then performing spin coating or drop coating on the substrate.

In another preferred example, the organic solvent is selected from the group consisting of toluene, trimethylbenzene, diphenyl ether, chloroform, acetone, N,N-dimethylformamide, N,N-dimethylethyl Amide, dimethylsulfoxide or N-methylpyrrolidone, or a combination thereof.

It should be understood that within the scope of the present invention, the above-mentioned technical features of the present invention and the technical features specifically described in the following (such as embodiments) can be combined with each other to form new or preferred technical solutions. Due to space limitations, we will not repeat them here.

Detailed ways

After long-term and in-depth research, the inventors have prepared a thermosetting monomer containing benzocyclobutene and hexafluorocyclobutane structural units, and a cured product thereof. The thermosetting monomer has good processability, and the cured product after heating and curing has good heat resistance and electrical conductivity. Based on the above findings, the inventors have accomplished the present invention.

Monomers containing benzocyclobutene and hexafluorocyclobutane structural units

Based on the theory of molecular design, the present invention introduces benzocyclobutene units into the molecular skeleton of hexafluorocyclobutyl aryl ether to obtain a thermosetting monomer, which can be used as a high-performance coating and packaging with high heat resistance and low dielectric constant Materials, used in the microelectronics industry, aerospace and defense and other fields. The invention provides a thermosetting resin monomer of benzocyclobutene and hexafluorocyclobutane structural units, and a preparation method thereof. The obtained benzocyclobutene resin has excellent performance and is suitable for microelectronics industry, aerospace and It is used as a high-performance resin matrix or packaging material in national defense and other fields.

Specifically, the present invention provides a compound shown in the following formula I:

The preparation method of described formula I compound comprises steps:

In an inert solvent, the compound of formula II is reacted with the compound of formula III to obtain the compound of formula I;

In another preferred embodiment, the reaction is carried out under one or more reagents selected from the group consisting of monovalent copper salts, imidazole ligands, inorganic bases, or combinations thereof.

In another preferred example, the monovalent copper salt used is cuprous chloride, cuprous bromide or cuprous iodide, preferably cuprous chloride.

In another preferred example, the imidazole ligand used is 1-methylimidazole, 1,2-dimethylimidazole, N-butylimidazole or N-isopropylimidazole.

In another preferred example, the inorganic base used is an alkali metal; preferably, the inorganic base is selected from the group consisting of hydroxide, carbonate, or a combination thereof; more preferably, the inorganic base The base is potassium carbonate.

In another preferred example, in the reaction, the inert solvent is selected from the group consisting of toluene, dioxane, N,N-dimethylformamide, N,N-dimethylformamide, Dimethylsulfoxide, N-methylpyrrolidone, hexamethylphosphoramide, sulfolane, or combinations thereof.

In another preference, in the reaction, the molar ratio of 4-bromobenzocyclobutene to 4,4'-dihydroxy-diphenylhexafluorocyclobutane ether is 2 to 5: 1.

In another preferred example, the molar ratio of the 4-bromobenzocyclobutene (compound of formula III) to the monovalent copper salt, the imidazole ligand and the inorganic base is 1 to 5:0.1 to 1:0.1 to 1 : 1~5.

In another preferred example, the reaction is carried out at 80-160°C.

In another preferred example, the reaction time is 5-30 hours.

In the reaction formula, each raw material can be obtained by conventional means, for example, in a preferred embodiment of the present invention, the compound of formula II is prepared by the following method:

In an inert solvent, react with a compound of formula IIa to obtain a compound of formula II;

In another preferred embodiment, the reaction is carried out in the presence of a reagent selected from the group consisting of boron tribromide, pyridine hydrochloride, or aluminum triiodide.

In another preferred embodiment, the inert solvent is selected from the group consisting of dichloromethane, chloroform, dichloroethane, toluene, or combinations thereof.

In another preferred example, the reaction is carried out at 10°C-40°C, preferably at room temperature.

In another preferred example, the reaction time is 10-20 hours.

In another preference, the compound of formula IIa is prepared by the following method:

In an inert solvent, a compound of formula IIb is used for polymerization to obtain a compound of formula IIa:

In another preferred embodiment, the solvent is selected from the group consisting of diphenyl ether, trimethylbenzene, sulfolane, or combinations thereof.

In another preferred example, the reaction is carried out at 120°C-180°C.

In another preferred example, the reaction time is 12-36 hours.

The compound of formula I can be used to prepare a cured product, eg, cured by heating to obtain a cured product. Preferably, heat curing is performed under an inert atmosphere to obtain a cured product.

Cured product containing benzocyclobutene and hexafluorocyclobutane structural units

The present invention also provides a cured product prepared by curing the compound of formula I according to the first aspect of the present invention.

The cured product can be prepared by curing the thermosetting monomer of formula I alone, or by blending with other benzocyclobutene monomers or unsaturated double bond resins. In a preferred embodiment of the present invention, the resin blending weight ratio of the thermosetting resin monomer and other benzocyclobutene monomers or unsaturated double bonds is 1:0.05-8.

The curing method is not particularly limited, preferably heat curing. Preferably, the heating and curing temperature is 200-300°C.

In another preferred example, the heating curing includes: performing pre-curing at 150-200°C, and then performing thermal curing at 210-260°C. Wherein, the pre-curing time is 0.5-4 hours, and the thermal curing time is 1-8 hours.

In another preferred example, the curing further includes performing heat treatment at 260-330° C. after the thermal curing is completed.

In another preferred example, the heat treatment time is 1-4 hours.

In another preferred example, the heat curing includes: treatment at 130-170°C for 0.5-2 hours, treatment at 180-220°C for 0.5-2 hours, treatment at 220-260°C for 0.5-2 hours, Treat at 240-280°C for 0.5-2 hours, at 260-300°C for 4-6 hours, and at 280-320°C for 4-6 hours.

In another preferred embodiment of the present invention, the cured product is a cross-linked structure formed by ring-opening and linking of cyclobutene structural units of the compound of formula I, such as the following schematic structure:

Among them, m and n are integers.

The cyclobutene structural unit can undergo ring-opening dimerization with other cyclobutene structural units, or can jointly ring-open with other cyclobutene structural units to form a chain or network polymer.

The cured product has excellent electrical properties and heat resistance. In another preferred example, the dielectric constant (1-30 MHz) of the cured product is 2.3-2.7.

In another preferred example, the 5% thermogravimetric loss temperature of the cured product in nitrogen is 450-490°C.

In another preferred example, the 5% thermogravimetric loss temperature in air of the cured product is 380-410°C.

In another preferred example, the residual carbon rate of the cured product in nitrogen at 1000° C. is ≥ 45%, preferably ≥ 50%.

Polymer articles containing benzocyclobutene and hexafluorocyclobutane structural units

The present invention also provides a product, which contains the polymer as described in formula I, or the product is prepared by using the polymer as described in formula I.

In another preferred example, the article contains a cured product obtained by curing the compound described in formula I, or the article is prepared by using the cured product obtained by curing the compound described in formula I.

In another preferred embodiment, the product is a high-temperature-resistant and ablation-resistant material, or an electronic component packaging material.

In a preferred example of the present invention, the preparation method of the product comprises the steps of:

(1) providing the monomer described in formula I;

(2) molding the monomer described in formula I to obtain a preformed product;

(3) curing the preformed product obtained in the step (2) to obtain the product.

In another preferred example, the curing is heat curing.

In another preferred example, the heating and curing temperature is 200-300°C.

In another preferred example, the heating curing includes: performing pre-curing at 150-200°C, and then performing thermal curing at 210-260°C.

In another preferred example, the pre-curing time is 0.5-4 hours.

In another preferred example, the thermal curing time is 1-8 hours.

In another preferred example, the curing further includes performing heat treatment at 260-330° C. after the thermal curing is completed.

In another preferred example, the heat treatment time is 1-4 hours.

The forming method is not particularly limited, and the forming method known in the art at room temperature can be selected for forming, such as forming by pouring, or forming a solution by spin coating or drop coating to form a film. In a preferred example of the present invention, in the step (2), the forming is film-forming, and the film-forming is by a method selected from the group consisting of heating molding, solution spin coating, solution drop coating .

In another preferred example, the solution spin coating or solution drop coating includes: dissolving the polymer as described in formula I with an organic solvent, and then performing spin coating or drop coating on the substrate.

In another preferred example, the organic solvent is selected from the group consisting of toluene, trimethylbenzene, diphenyl ether, chloroform, acetone, N,N-dimethylformamide, N,N-dimethylethyl Amide, dimethylsulfoxide or N-methylpyrrolidone, or a combination thereof.

Compared with the prior art, the main advantages of the present invention include:

(1) The present invention provides a thermosetting resin containing benzocyclobutene and hexafluorocyclobutane structural units. The resin has good processability and can be used for heating and curing to prepare a thermosetting resin.

(2) The present invention provides a cured resin product containing benzocyclobutene and hexafluorocyclobutane structural units. Compared with the prior art, there are less unreacted trifluoroethylene groups in the cured product of the present invention Ether end groups, so it has better electrical properties and thermal stability.

Below in conjunction with specific embodiment, further illustrate the present invention. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the scope of the present invention. For the experimental methods without specific conditions indicated in the following examples, the conventional conditions or the conditions suggested by the manufacturer are usually followed. Percentages and parts are by weight unless otherwise indicated.

Example 1 Preparation of precursor 1 (1-(2-bromo-1,1,2,2-tetrafluoroethoxy) anisole)

Under the protection of argon, add 49.6 grams of p-methoxyphenol, 156 grams of 1,2-dibromotetrafluoroethane and 350 milliliters of DMSO (dimethyl sulfoxide) steamed now in the reaction flask, and stir under ice-water bath for 30 Minutes, then add 83 grams of anhydrous potassium carbonate, remove the ice-water bath, react at room temperature for 6 hours, pour the reaction mixture solution into water, stir vigorously for 20 minutes, extract the product with chloroform in batches, and use saturated sodium chloride aqueous solution for the extract After washing, chloroform was removed by rotary evaporation, and the residue was purified by column chromatography (silica gel column, petroleum ether as eluent), with a yield of 77%. ¹ H NMR (300 MHz, CDCl ₃ ) δ (ppm): 3.81 (s, 3H), 6.89 (d, 2H), 7.15 (d, 2H); ¹⁹ F NMR (282 MHz) δ (ppm): -86.63 (t,2F),-68.36(t,2F).

Example 2 Preparation of precursor 2 (1-(1,2,2-trifluoroethyleneoxy) anisole)

Under argon protection, add 50 grams of 1-(2-bromo-1,1,2,2-tetrafluoroethoxy) anisole, 300 milliliters of freshly distilled acetonitrile, stir and dilute, add 25 grams of zinc powder, heated and refluxed for 24 hours. Pour the reaction solution into 600 ml of water, stir for more than 15 minutes, extract with chloroform in batches, combine the chloroform extracts, wash with saturated aqueous sodium chloride, and dry over anhydrous sodium sulfate for more than 12 hours. Chloroform was removed by rotary evaporation, and the residue of the concentrated solution was purified by column chromatography (silica gel column, petroleum ether as eluent) with a yield of 55%. ¹ H NMR (300 MHz, CDCl ₃ ): δ (ppm): 3.80 (s, 3H), 6.87 (d, 2H), 7.05 (d, 2H); ¹⁹ FNMR (282 MHz, CDCl ₃ ): δ (ppm )-133.89(dd,1F),-127.84(dd,1F),-120.79(dd,1F).

Example 3 Precursor 3 bis(methoxyphenol) hexafluorocyclobutyl ether (1,1'-(1,2,2,3,3,4,-hexafluorocyclobutane-1,2-di Oxygen)-bis(p-methoxybenzene)) preparation

Under the protection of argon, 20 g of 1-(1,2,2-trifluoroethyleneoxy) anisole and 50 ml of diphenyl ether were added into the reaction flask, and heated to 150° C. for 24 hours. After cooling to room temperature, flash column chromatography (petroleum ether/ethyl acetate, 10:1), the yield was 95%. ¹ H NMR (300 MHz, CDCl ₃ ): δ (ppm) 3.80 (s, 6H), 6.84 (d, 2H), 7.04-7.10 (m, 4H), 7.44 (d, 2H);

¹⁹ F NMR (282 MHz, CDCl ₃ ): δ (ppm) -132.47, -131.90, -131.65, -131.11, -130.85, -130.58, -130.31, -130.07, -129.90, -129.76, -129.54, -129.11 ,128.97,-128.75,-128.32,-127.41.

Example 4 Preparation of precursor 4 (4,4'-dihydroxy-diphenylhexafluorocyclobutane ether)

Under the protection of argon, add precursor 3 bis(methoxyphenol) hexafluorocyclobutyl ether (10 g), dichloromethane (100 ml) into the reaction flask, cool the mixture to 0 °C, and slowly add A solution of boron tribromide in ether (20 g) was added, and the mixture was stirred overnight at room temperature. After the reaction was quenched with water, the organic layer was separated. After removing the solvent, the crude product was separated by column chromatography (petroleum ether/ethyl acetate, 10:1) to obtain 4,4'-dihydroxy-diphenylhexafluorocyclobutane ether with a yield of 89%. ¹ H NMR(300 MHz, CDCl ₃ ): δ(ppm)6.82(d,2H),7.01-7.08(m,4H),7.41(d,2H). ¹⁹ F NMR(282 MHz,CDCl ₃ ):δ(ppm) (ppm) -132.44, -131.88, -131.50, -131.00, -130.85, -130.52, -130.30, -130.01, -129.85, -129.79, -129.51, -129.01, 128.90, -128.71, -128.303, -127

Example 5 Preparation of thermosetting monomers containing benzocyclobutene and perfluorocyclobutane units

Under argon protection, 4,4'-dihydroxy-diphenylhexafluorocyclobutane ether (19g, 0.05 mol) 4-bromobenzocyclobutene (36.6g, 0.2 mol), 1.95 gram of cuprous iodide (0.01 mol), 6.15 gram of N-butylimidazole (0.05 mol), 13.86 gram of potassium carbonate (0.1 mol), 100 milliliters of toluene, warming up to 140 ℃ for 16 hours, cooling to room temperature, and using Diluted with chloroform, the organic layer was washed with dilute hydrochloric acid and then neutralized with saturated aqueous sodium bicarbonate. The crude product was obtained as a solid after removal of the organic solvent by rotary evaporation. Purification by column chromatography (petroleum ether/ethyl acetate, 6:1) gave a white solid product with a yield of 66%. Proton nuclear magnetic resonance spectrum ¹ H-NMR results (300 MHz, CDCl ₃ , ppm) δ3.12 (s, 8H), 6.73-7.15 (14H). Mass spectrometry (EI/MS) characterizes m/z: 584.14 (100.0%).

Example 6 Preparation of thermosetting monomers containing benzocyclobutene and perfluorocyclobutane units

Same as Example 5, but using cuprous chloride as a catalyst, the product yield is 51%.

Example 7 Preparation of thermosetting monomers containing benzocyclobutene and perfluorocyclobutane units

Same as Example 5, but the solvent is N-methylpyrrolidone, and the yield is 61%.

Example 8 Curing of thermosetting monomers of benzocyclobutene and perfluorocyclobutane units

Take 4 grams of the product obtained in Example 5 and place it in a sealed glass tube (2.5 cm in diameter and 8.5 cm in height) filled with argon, then place the glass tube in an oil bath, and heat up in stages, 150 ° C × 1 Hours, 200°C x 1 hour, 240°C x 1 hour, 260°C x 1 hour, 280°C x 5 hours, 300°C x 5 hours. After cooling a light colored columnar crosslinked resin was obtained.

Embodiment 9 The performance of cured product

The cross-linked resin obtained in Example 8 was sanded into a disc with a diameter of 2 cm and a thickness of 3 mm, and its dielectric properties were tested. Simultaneously, the pellet was pulverized, and the resulting powder was used for TGA measurement. The following table shows the dielectric and thermal properties of cured resins.

All documents mentioned in this application are incorporated by reference in this application as if each were individually incorporated by reference. In addition, it should be understood that after reading the above teaching content of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of the present application.

Claims (10)

1. one kind as shown in the formula the compound shown in I:

2. the preparation method of formula I as claimed in claim 1, is characterized in that, comprise step:

In inert solvent, react with formula II compound and formula III compound, obtain formula I;

Preferably, described reaction is carried out under one or more reagent being selected from lower group: cuprous salt, imidazole ligands, mineral alkali, or its combination.

3. method as claimed in claim 2, it is characterized in that, described formula II compound is prepared by the following method:

In inert solvent, react with formula IIa compound, obtain formula II compound;

4. method as claimed in claim 3, it is characterized in that, described formula IIa compound is prepared by the following method:

In inert solvent, carry out polyreaction with formula IIb compound, obtain formula IIa compound:

5. the purposes of compound as claimed in claim 1, is characterized in that, for the preparation of cured product.

6. a cured product, is characterized in that, described cured product formula I as claimed in claim 1 is cured thus prepares.

7. goods, is characterized in that, described goods are containing, for example compound according to claim 1, or prepared by described goods compound as claimed in claim 1.

8. goods, is characterized in that, described goods are containing, for example cured product according to claim 6, or prepared by described goods cured product as claimed in claim 6.

9. a preparation method for goods as claimed in claim 7 or 8, is characterized in that, comprises step:

(1) polymkeric substance as claimed in claim 1 is provided;

(2) carry out shaping to polymkeric substance as claimed in claim 1, obtain pre-shaped articles;

(3) pre-shaped articles obtained in described step (2) is cured, obtains goods as claimed in claim 7 or 8.

10. method as claimed in claim 9, it is characterized in that, in described step (2), described is shaped to film forming, and described film forming is the method by being selected from lower group: heating and mould pressing, solution spin coating, molten drop-coated.