CN104102924A - Fingerprint identification device and fingerprint identification assembly with mould pressing protection layer - Google Patents
Fingerprint identification device and fingerprint identification assembly with mould pressing protection layer Download PDFInfo
- Publication number
- CN104102924A CN104102924A CN201410353937.7A CN201410353937A CN104102924A CN 104102924 A CN104102924 A CN 104102924A CN 201410353937 A CN201410353937 A CN 201410353937A CN 104102924 A CN104102924 A CN 104102924A
- Authority
- CN
- China
- Prior art keywords
- fingerprint recognition
- protective seam
- mold pressing
- recognition device
- fingerprint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003825 pressing Methods 0.000 title claims abstract description 52
- 230000001681 protective effect Effects 0.000 claims description 115
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 51
- 239000003822 epoxy resin Substances 0.000 claims description 18
- 229920000647 polyepoxide Polymers 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 238000009747 press moulding Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 7
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 7
- 229910000831 Steel Inorganic materials 0.000 claims description 6
- 238000005240 physical vapour deposition Methods 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- 150000002500 ions Chemical class 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 230000000712 assembly Effects 0.000 claims 4
- 238000000429 assembly Methods 0.000 claims 4
- 230000035945 sensitivity Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 239000010410 layer Substances 0.000 description 7
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 230000006978 adaptation Effects 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 3
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
Landscapes
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention relates to the technical field of integrated circuit manufacture and packaging, and discloses a fingerprint identification device and a fingerprint identification assembly with a mould pressing protection layer. In the invention, a mould pressing mode can be adopted to form a thinner protection layer, the protection layer is formed on the surface of a fingerprint identification chip to become one part of the fingerprint identification device without forming a lens for protection subsequently, so that, technical steps are reduced. Since the protection layer formed in the above way can be thin, the attenuation of a fingerprint signal after the fingerprint signal passes through the protection layer is reduced, the sensitivity of the fingerprint identification chip is enhanced, and fingerprint identification efficiency is improved.
Description
Technical field
The present invention relates to integrated circuit manufacture and encapsulation technology field, particularly a kind of fingerprint recognition device and fingerprint recognition assembly with mold pressing protective seam.
Background technology
Along with the development of mobile communication technology, smart mobile phone has been gathered the function of every field.For example, can send and receive e-mail by smart mobile phone, displaying video and audio file, record meeting summary or even open video conference etc.In addition, in mobile phone individual used, conventionally can preserve a large amount of data.If lost mobile phone or stolenly probably cause larger loss.Existing mobile phone adopts numerical ciphers or graphical passwords to protect conventionally, and this kind of password preserved trouble and be easily cracked.Therefore, popular use finger-print cipher, as the cryptoguard of mobile phone, has been guaranteed safety and the privacy of mobile phone at present.
Conventionally as shown in Figure 1, described fingerprint identification device comprises the fingerprint identification device of available technology adopting: fingerprint Identification sensor 10, the fingerprint recognition circuit 11 of being located at fingerprint Identification sensor 10 surfaces, lens 20, be located at ink 21 between lens 20 and fingerprint recognition circuit 11 and the basic ring 30 for fixing ink 21, lens 20.Wherein, fingerprint Identification sensor 10 also connects respective element in mobile phone (for accompanying drawing is simplified; not shown in Fig. 1); fingerprint Identification sensor 10 is for transmitting corresponding finger print data; fingerprint recognition circuit 11 is for identifying the finger print that is fitted in lens 20 surfaces; by mode fetching finger mark information such as couplings; and be transferred to fingerprint Identification sensor 10; lens 20 are generally glass or sapphire material; for the protection of fingerprint Identification sensor 10 and fingerprint recognition circuit 11; 21, ink, in order to shelter from fingerprint recognition circuit 11, increases attractive in appearance.
But because the technique of lens 20 is limit, the thickness of lens 20 is conventionally more than 200 μ m, the material of lens 20 is conventionally more crisp, if reduce it to thinner, frangibility, cannot be protected serviceable life.The thickness that lens 20 are thicker also can reduce the efficiency of fingerprint recognition.In addition, lens 20 and ink 21 need to carry out extra technique and can be arranged on the surface of fingerprint Identification sensor 10 and fingerprint recognition circuit 11.
Summary of the invention
The object of the present invention is to provide a kind of fingerprint recognition device and fingerprint recognition assembly with mold pressing protective seam, use protective seam to substitute lens and ink, when playing protective effect, can also improve fingerprint recognition efficiency, and reduce processing step.
For solving the problems of the technologies described above, embodiments of the present invention provide a kind of fingerprint recognition device with mold pressing protective seam, comprise fingerprint recognition chip and cover the protective seam of described fingerprint recognition chip surface, and described protective seam adopts press moulding mode to form.
Embodiment of the present invention in terms of existing technologies; adopt press moulding mode can form thinner protective seam; protective seam is formed at the surface of fingerprint recognition chip; become a part for fingerprint recognition device, form again lens protection without follow-up, reduced processing step; because the protective layer thickness that adopts aforesaid way to form can be thinner; thereby can reduce the decay of fingerprint signal through protective seam, strengthen the sensitivity of fingerprint recognition chip, improve fingerprint recognition efficiency.
Further; in the described fingerprint recognition device with mold pressing protective seam, described protective seam adopts the combination of combination, epoxy resin and nano titanium carbide or the combination of epoxy resin and nanometer silicon carbide of epoxy resin, epoxy resin and nano aluminium oxide to form by press moulding mode.
Further, in the described fingerprint recognition device with mold pressing protective seam, described nano aluminium oxide, nanometer silicon carbide or the nano titanium carbide concentration in epoxy resin is greater than 50%.
In addition; embodiment of the present invention in terms of existing technologies; can be by regulating the component content of nano aluminium oxide or silit to carry out the hardness of corresponding raising protective seam; hardness difference; user's experience sense difference; also corresponding different to the protection intensity of fingerprint recognition chip, therefore can make the protective seam that meets different hardness demand.In addition, epoxy resin can be made different colors, and it can be for blocking fingerprint recognition chip, avoid fingerprint recognition chip to be directly exposed in sight line, can also, by changing himself color, make the more needs of Alternative of its adaptation simultaneously, further improve the aesthetic feeling of fingerprint recognition device.
Further, in the described fingerprint recognition device with mold pressing protective seam, the minimum thickness between described protective seam and described fingerprint recognition chip is less than 200 μ m.
In addition, in terms of existing technologies, the thickness of protective seam can accomplish to be less than 200 μ m to embodiment of the present invention; protective seam is under the prerequisite of not sacrificing hardness and shield; the thinner thickness of protective seam, can increase the sensitivity of fingerprint recognition, improves user's experience sense.
Further, in the described fingerprint recognition device with mold pressing protective seam, the Mohs value of described protective seam is more than or equal to 6H.
Further, in the described fingerprint recognition device with mold pressing protective seam, adopt PVD, CVD or ion sputtering technique to form aluminium oxide coating or silit coating on the surface of described protective seam.
The surface that adopts PVD, CVD or ion sputtering technique to be formed on described protective seam forms aluminium oxide or silit can improve the hardness of protective seam, thereby fingerprint recognition chip is played to better protective effect.
Further, between described protective seam and described aluminium oxide coating or silit coating, form color layers.Can, by changing the color of color layers, make the more needs of Alternative of its adaptation, further improve the aesthetic feeling of fingerprint recognition device.Can be as required, select various more common ink to be used to form color layers, ensure realizability of the present invention.
Further, in the described fingerprint recognition device with mold pressing protective seam, described fingerprint recognition chip comprises fingerprint Identification sensor and is located at the fingerprint recognition circuit on fingerprint Identification sensor surface.
Further, in the described fingerprint recognition device with mold pressing protective seam, also comprise P.e.c. hardboard, described fingerprint Identification sensor is located at the surface of described P.e.c. hardboard.
In addition, embodiment of the present invention in terms of existing technologies, be convenient to follow-uply carry out mold pressing and make the protective seam forming more fully protect fingerprint recognition chip, increases its serviceable life by the surface that fingerprint Identification sensor is located to described P.e.c. hardboard.
Further, in the described fingerprint recognition device with mold pressing protective seam, the face of overlooking of described protective seam can be for circular, oval or square.
In addition, in terms of existing technologies, protective seam can form different shapes by press moulding mode to embodiment of the present invention, to meet the demand of different process.
The present invention also proposes a kind of fingerprint recognition assembly; be applied to the fingerprint identification function of mobile phone; described assembly comprises flexible PCB, fixed mount and the fingerprint recognition device with mold pressing protective seam as described above; wherein; the described fingerprint recognition device with mold pressing protective seam is fixed on described flexible PCB; described in described fixed mount is fixed on, there is the edge of the fingerprint recognition device of mold pressing protective seam, and described in exposing, there is the protective seam of the fingerprint recognition device of mold pressing protective seam.
Embodiment of the present invention in terms of existing technologies; fingerprint recognition assembly adopts the fingerprint recognition device with mold pressing protective seam as described above to make; can reach the object of saving lens production process; can also play the effect of protection fingerprint recognition chip, the sensitivity that improves fingerprint recognition simultaneously.
Further; in described fingerprint recognition assembly; also comprise quoit, described quoit is located at the periphery of the described fingerprint recognition device with plated film protective seam, and described fixed mount is fixed on the edge of the described fingerprint recognition device with plated film protective seam by described quoit.
Or in described fingerprint recognition assembly, fixed mount is quoit, described in described quoit is located at, have mold pressing protective seam fingerprint recognition device edge.
In addition; can play on the one hand the effect of electrostatic prevention at the fingerprint recognition device surrounding increase quoit with mold pressing protective seam; can also improve on the other hand the stability maintenance of the fingerprint recognition device with mold pressing protective seam, can also play and increase effect attractive in appearance.
Further, in described fingerprint recognition assembly, also comprise steel disc, described flexible PCB is fixed on described steel disc.
Brief description of the drawings
Fig. 1 is the diagrammatic cross-section of fingerprint identification device in prior art;
Fig. 2 is according to the fingerprint recognition device diagrammatic cross-section in first embodiment of the invention with mold pressing protective seam;
Fig. 3 splits schematic diagram according to the structure of the fingerprint recognition device in first embodiment of the invention with mold pressing protective seam;
Fig. 4 is according to the diagrammatic cross-section of fingerprint recognizer component in second embodiment of the invention;
Fig. 5 splits schematic diagram according to the structure of fingerprint recognizer component in second embodiment of the invention.
Embodiment
For clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the present invention chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details to realize developer's specific objective, for example, according to about system or about the restriction of business, change into another embodiment by an embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, the embodiments of the present invention are explained in detail.But, persons of ordinary skill in the art may appreciate that in the each embodiment of the present invention, in order to make reader understand the application better, many ins and outs are proposed.But, even without these ins and outs and the many variations based on following embodiment and amendment, also can realize the each claim of the application technical scheme required for protection.
Please refer to Fig. 2 and Fig. 3; the first embodiment of the present invention relates to a kind of fingerprint recognition device 1 with mold pressing protective seam; comprise fingerprint recognition chip and cover the protective seam 300 on fingerprint recognition circuit 220 surfaces; protective seam 300 adopts press moulding mode (Molding) to form, and fingerprint recognition chip is made up of fingerprint Identification sensor 210 and the fingerprint recognition circuit 220 of being located at fingerprint Identification sensor 210 surfaces.
Protective seam 300 adopts combination, epoxy resin and the nano titanium carbide of epoxy resin, epoxy resin and nano aluminium oxide or the combination of epoxy resin and the combination of nanometer silicon carbide to form by press moulding mode.Described nano aluminium oxide, nanometer silicon carbide or the nano titanium carbide concentration in epoxy resin is greater than 50%.Can be by regulating the component content of nano aluminium oxide, nano titanium carbide or nanometer silicon carbide to carry out the hardness of corresponding raising protective seam 300; hardness difference; user's experience sense difference; also corresponding different to the protection intensity of fingerprint recognition chip, in the present embodiment, can make the protective seam 300 that meets different hardness demand.
In addition, epoxy resin can be made different colors, it can be for blocking fingerprint recognition circuit 220, avoid fingerprint recognition circuit 220 to be directly exposed in sight line, simultaneously can also be by changing himself color, make the more needs of Alternative of its adaptation, further improve the aesthetic feeling of fingerprint recognition device.
Minimum thickness L between protective seam 300 and fingerprint recognition circuit 220 is less than 200 μ m, and its Mohs value is more than or equal to 6H conventionally, ensures that it has enough hardness protection fingerprint recognition circuit 220 and fingerprint recognition chip 210.In order to ensure that protective seam 300 has certain degree of hardness; preferably; can also adopt PVD (physical vapour deposition (PVD)), CVD (chemical vapor deposition) or ion sputtering technique to form one deck aluminium oxide coating or silit coating on the surface of protective seam 300; be used for improving hardness, realize fingerprint recognition chip is better protected.It adopts the higher material of hardness to be made conventionally, makes protective seam 300 in the situation that forming compared with minimal thickness, have enough hardness, plays good protection effect.Aluminium oxide or silit all can be produced Mohs value at the even protective seam 300 of 9H of 8H, and the protective seam 300 forming belongs to the part of fingerprint recognition chip, and not frangibility, can be good at playing protective effect.Protective seam 300, under the prerequisite of not sacrificing hardness and shield, has thinner thickness, can increase the sensitivity of fingerprint recognition, improves user's experience sense.
What deserves to be explained is; due to more commonly white and black in epoxy resin; want to form abundant color; between protective seam and aluminium oxide coating or silit coating, also can form color layers; can be by changing the color of color layers; make the more needs of Alternative of its adaptation, further improve the aesthetic feeling of fingerprint recognition device.Can be as required, select various more common ink to be used to form color layers, ensure realizability of the present invention.Such as; in order to make the solid colour of fingerprint recognition device and phone housing; can select and the ink of phone housing solid colour, between protective seam and aluminium oxide coating or silit coating, also can form color layers, thereby reach and the object of phone housing solid colour.
In addition; protective seam 300 becomes a part for fingerprint recognition device; additionally form again lens protection without follow-up; reduce processing step; because protective seam 300 thickness that adopt press moulding mode to form can be thinner, for example, be 50 μ m, thereby can reduce the decay of fingerprint signal through protective seam 300; strengthen the sensitivity of fingerprint recognition chip, improve fingerprint recognition efficiency.
In the present embodiment, the fingerprint recognition device 1 with mold pressing protective seam also comprises P.e.c. hardboard (PCB) 100, and fingerprint Identification sensor 210 is located at the surface of P.e.c. hardboard 100.Before carrying out press moulding mode; first fingerprint Identification sensor 210 is fixed on P.e.c. hardboard 100; then inject and form the required material of protective seam 300 on the surface of fingerprint recognition circuit 220; adopt press moulding mode to form protective seam 300; protective seam 300 can be formed on the surface of P.e.c. hardboard 100 and fingerprint recognition circuit 220 conventionally; comprehensive encirclement fingerprint Identification sensor 210 and fingerprint recognition circuit 220, play good protective effect, increases the serviceable life of fingerprint recognition chip.
The face of overlooking of protective seam 300 can be circular, oval or square (broken away view of Fig. 3 is only illustrated as circle), but the present invention is as limit, and protective seam 300 can form different shapes by press moulding mode, to meet the demand of different process.
In the present embodiment; fingerprint recognition chip comprises fingerprint Identification sensor 210 and is located at the fingerprint recognition circuit 220 on fingerprint Identification sensor 210 surfaces; fingerprint recognition circuit 220 is mainly used in identification and is fitted in the finger print information on protective seam 300 surfaces, and is fed back in fingerprint Identification sensor 210.Fingerprint recognition circuit 220 and fingerprint Identification sensor 210 can be by active electric capacity coupling, electromagnetic mode coupling, optics sensing, infrared sensing or other mode fetching finger mark information.
Please refer to Fig. 4 and Fig. 5, the second embodiment of the present invention relates to a kind of fingerprint recognition assembly, be applied to the fingerprint identification function of mobile phone, fingerprint recognition assembly comprises flexible PCB 2, fixed mount 3 and there is the fingerprint recognition device 1 of mold pressing protective seam, wherein, the fingerprint recognition device 1 with mold pressing protective seam is fixed on flexible PCB 2, fixed mount 3 is fixed on the edge of fingerprint recognition device 1 surrounding with mold pressing protective seam, for fixedly thering is the fingerprint recognition device 1 of mold pressing protective seam, and expose the protective seam 300 of the fingerprint recognition device 1 with mold pressing protective seam, being convenient to fingerprint conforms on protective seam 300, carry out fingerprint recognition.
Concrete, fingerprint recognition assembly also comprises quoit 4, and quoit 4 is located at the periphery with the fingerprint recognition device of plated film protective seam, and fixed mount 3 is fixed on the edge with the fingerprint recognition device of plated film protective seam by quoit 4.Or fixed mount 3 and quoit 4 are same parts, adopt integral formation method to make and obtain; Specifically, the fixed mount 3 in fingerprint recognition assembly is quoit, and quoit is located at the edge with the fingerprint recognition device 1 of plated film protective seam.Can play on the one hand the effect of electrostatic prevention at the fingerprint recognition device 1 surrounding increase quoit with plated film protective seam, can also improve on the other hand the stability maintenance with the fingerprint recognition device 1 of plated film protective seam, can also play and increase effect attractive in appearance.In addition, fingerprint recognition assembly also comprises steel disc 5, and flexible PCB 2 is fixed on steel disc 5.。Can play on the one hand the effect of electrostatic prevention at fingerprint recognition device 1 surrounding increase quoit 4, can also improve on the other hand the stability maintenance of fingerprint recognition device 1, can also play and increase effect attractive in appearance.
In the time carrying out fingerprint recognition, after finger plaster is bonded on protective seam 300, can carry out fingerprint recognition by fingerprint recognition circuit 220 and fingerprint Identification sensor 210.Fingerprint recognition circuit 220 and fingerprint Identification sensor 210 can be by active electric capacity coupling, electromagnetic mode coupling, optics sensing, infrared sensing or other mode fetching finger mark information.
In second embodiment of the invention, adopt and make as the fingerprint recognition device 1 in embodiment mono-with mold pressing protective seam; can reach the object of saving lens production process; can also play the effect of protection fingerprint recognition chip 1, the sensitivity that improves fingerprint recognition simultaneously.
Because the first embodiment is mutually corresponding with present embodiment, therefore present embodiment can with the enforcement of working in coordination of the first embodiment.The correlation technique details of mentioning in the first embodiment is still effective in the present embodiment, and the technique effect that can reach in the first embodiment can be realized in the present embodiment too, in order to reduce repetition, repeats no more here.
Above are only the preferred embodiments of the present invention, the present invention is not played to any restriction.Any person of ordinary skill in the field; not departing from the scope of technical scheme of the present invention; the technical scheme that the present invention is disclosed and technology contents make any type of variations such as replacement or amendment that are equal to; all belong to the content that does not depart from technical scheme of the present invention, within still belonging to protection scope of the present invention.
Claims (15)
1. a fingerprint recognition device with mold pressing protective seam, is characterized in that, comprises fingerprint recognition chip and covers the protective seam of described fingerprint recognition chip surface, and described protective seam adopts press moulding mode to form.
2. the fingerprint recognition device with mold pressing protective seam according to claim 1; it is characterized in that, described protective seam adopts the combination of combination, epoxy resin and nano titanium carbide or the combination of epoxy resin and nanometer silicon carbide of epoxy resin, epoxy resin and nano aluminium oxide to form by press moulding mode.
3. the fingerprint recognition device with mold pressing protective seam according to claim 2, is characterized in that, described nano aluminium oxide, nanometer silicon carbide or the nano titanium carbide concentration in epoxy resin is greater than 50%.
4. the fingerprint recognition device with mold pressing protective seam according to claim 1, is characterized in that, the minimum thickness between described protective seam and described fingerprint recognition chip is less than 200 μ m.
5. the fingerprint recognition device with mold pressing protective seam according to claim 1, is characterized in that, the Mohs value of described protective seam is more than or equal to 6H.
6. the fingerprint recognition device with mold pressing protective seam according to claim 1, is characterized in that, adopts PVD, CVD or ion sputtering technique to form aluminium oxide coating or silit coating on the surface of described protective seam.
7. the fingerprint recognition device with mold pressing protective seam according to claim 6, is characterized in that, between described protective seam and described aluminium oxide coating or silit coating, forms color layers.
8. the fingerprint recognition device with mold pressing protective seam according to claim 7, is characterized in that, described color layers is ink.
9. the fingerprint recognition device with mold pressing protective seam according to claim 1, is characterized in that, described fingerprint recognition chip comprises fingerprint Identification sensor and is located at the fingerprint recognition circuit on fingerprint Identification sensor surface.
10. the fingerprint recognition device with mold pressing protective seam according to claim 9, is characterized in that, also comprise P.e.c. hardboard, described fingerprint Identification sensor is located at the surface of described P.e.c. hardboard.
The 11. fingerprint recognition devices with mold pressing protective seam according to claim 1, is characterized in that, the face of overlooking of described protective seam is for circular, oval or square.
12. 1 kinds of fingerprint recognition assemblies; be applied to the fingerprint identification function of mobile phone; it is characterized in that; described assembly comprises flexible PCB, fixed mount and the fingerprint recognition device with mold pressing protective seam as described in any one in claim 1 to 11; wherein; the described fingerprint recognition device with mold pressing protective seam is fixed on described flexible PCB; described in described fixed mount is fixed on, there is the edge of the fingerprint recognition device of mold pressing protective seam, and described in exposing, there is the surface of the fingerprint recognition device of mold pressing protective seam.
13. fingerprint recognition assemblies according to claim 12; it is characterized in that; also comprise quoit; described in described quoit is located at, there is the periphery of the fingerprint recognition device of mold pressing protective seam, described in described fixed mount is fixed on by described quoit, there is the edge of the fingerprint recognition device of mold pressing protective seam.
14. fingerprint recognition assemblies according to claim 12, is characterized in that, described fixed mount is quoit, have the edge of the fingerprint recognition device of mold pressing protective seam described in described quoit is located at.
15. fingerprint recognition assemblies according to claim 12, is characterized in that, also comprise steel disc, described flexible PCB is fixed on described steel disc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410353937.7A CN104102924B (en) | 2014-07-23 | 2014-07-23 | Fingerprint recognition device and fingerprint recognition component with molding protective layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410353937.7A CN104102924B (en) | 2014-07-23 | 2014-07-23 | Fingerprint recognition device and fingerprint recognition component with molding protective layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104102924A true CN104102924A (en) | 2014-10-15 |
| CN104102924B CN104102924B (en) | 2017-11-24 |
Family
ID=51671064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410353937.7A Ceased CN104102924B (en) | 2014-07-23 | 2014-07-23 | Fingerprint recognition device and fingerprint recognition component with molding protective layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104102924B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105988161A (en) * | 2015-02-16 | 2016-10-05 | 上海箩箕技术有限公司 | Fabrication method of optical fiber board, optical fiber board, fingerprint imaging module set and mobile terminal |
| CN106445266A (en) * | 2016-10-27 | 2017-02-22 | 广东星弛光电科技有限公司 | A mobile phone glass window protective screen fingerprint recognition component and preparation method thereof |
| CN108062498A (en) * | 2016-11-08 | 2018-05-22 | 致伸科技股份有限公司 | Fingerprint identification module and manufacturing method thereof |
| CN108256441A (en) * | 2016-12-28 | 2018-07-06 | 曦威科技股份有限公司 | Fingerprint identification device, mobile device and manufacturing method of fingerprint identification device |
| CN111985391A (en) * | 2020-08-18 | 2020-11-24 | Oppo（重庆）智能科技有限公司 | Detection method and device of protective film, mobile terminal and storage medium |
| CN113913740A (en) * | 2021-10-19 | 2022-01-11 | 陈水和 | Sterilization adhesive film and winding plating method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050033452A1 (en) * | 2003-08-07 | 2005-02-10 | Milne Donald A. | Integrated portable identification and verification device |
| CN101241194A (en) * | 2007-02-07 | 2008-08-13 | 北京传世唯信科技有限责任公司 | Composition for light scattering membrane and light scattering membrane comprising same |
| CN201265711Y (en) * | 2008-10-06 | 2009-07-01 | 黄泽生 | Nano glass inner lining steel pipe |
| CN101643612A (en) * | 2009-07-17 | 2010-02-10 | 华南农业大学 | Waterproof antiseptic wearproof nano paint, preparation method, use method and application thereof |
| US8074878B1 (en) * | 2009-09-04 | 2011-12-13 | F3M3 Companies, Inc. | System and method of pre-approving applicants for visa processing using an emerging country's international travel approval control card |
| CN102332408A (en) * | 2010-07-13 | 2012-01-25 | 矽品精密工业股份有限公司 | Chip size package and method for making the same |
| CN103602211A (en) * | 2013-10-10 | 2014-02-26 | 安徽真信涂料有限公司 | Antirust paint used for boat bottom and preparation method thereof |
| CN103793688A (en) * | 2014-01-23 | 2014-05-14 | 深圳市汇顶科技股份有限公司 | Biometric feature recognition device and electronic equipment |
| CN204203990U (en) * | 2014-07-23 | 2015-03-11 | 上海思立微电子科技有限公司 | Fingerprint recognition element and fingerprint recognition module |
-
2014
- 2014-07-23 CN CN201410353937.7A patent/CN104102924B/en not_active Ceased
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050033452A1 (en) * | 2003-08-07 | 2005-02-10 | Milne Donald A. | Integrated portable identification and verification device |
| CN101241194A (en) * | 2007-02-07 | 2008-08-13 | 北京传世唯信科技有限责任公司 | Composition for light scattering membrane and light scattering membrane comprising same |
| CN201265711Y (en) * | 2008-10-06 | 2009-07-01 | 黄泽生 | Nano glass inner lining steel pipe |
| CN101643612A (en) * | 2009-07-17 | 2010-02-10 | 华南农业大学 | Waterproof antiseptic wearproof nano paint, preparation method, use method and application thereof |
| US8074878B1 (en) * | 2009-09-04 | 2011-12-13 | F3M3 Companies, Inc. | System and method of pre-approving applicants for visa processing using an emerging country's international travel approval control card |
| CN102332408A (en) * | 2010-07-13 | 2012-01-25 | 矽品精密工业股份有限公司 | Chip size package and method for making the same |
| CN103602211A (en) * | 2013-10-10 | 2014-02-26 | 安徽真信涂料有限公司 | Antirust paint used for boat bottom and preparation method thereof |
| CN103793688A (en) * | 2014-01-23 | 2014-05-14 | 深圳市汇顶科技股份有限公司 | Biometric feature recognition device and electronic equipment |
| CN204203990U (en) * | 2014-07-23 | 2015-03-11 | 上海思立微电子科技有限公司 | Fingerprint recognition element and fingerprint recognition module |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105988161A (en) * | 2015-02-16 | 2016-10-05 | 上海箩箕技术有限公司 | Fabrication method of optical fiber board, optical fiber board, fingerprint imaging module set and mobile terminal |
| CN105988161B (en) * | 2015-02-16 | 2019-03-12 | 上海箩箕技术有限公司 | Production method, fibre optic plate, fingerprint imaging mould group and the mobile terminal of fibre optic plate |
| CN106445266A (en) * | 2016-10-27 | 2017-02-22 | 广东星弛光电科技有限公司 | A mobile phone glass window protective screen fingerprint recognition component and preparation method thereof |
| CN108062498A (en) * | 2016-11-08 | 2018-05-22 | 致伸科技股份有限公司 | Fingerprint identification module and manufacturing method thereof |
| CN108256441A (en) * | 2016-12-28 | 2018-07-06 | 曦威科技股份有限公司 | Fingerprint identification device, mobile device and manufacturing method of fingerprint identification device |
| CN108256441B (en) * | 2016-12-28 | 2021-03-30 | 莆田杰木科技有限公司 | Fingerprint identification device, mobile device and manufacturing method of fingerprint identification device |
| CN111985391A (en) * | 2020-08-18 | 2020-11-24 | Oppo（重庆）智能科技有限公司 | Detection method and device of protective film, mobile terminal and storage medium |
| CN111985391B (en) * | 2020-08-18 | 2023-11-28 | Oppo（重庆）智能科技有限公司 | Method and device for detecting protective film, mobile terminal and storage medium |
| CN113913740A (en) * | 2021-10-19 | 2022-01-11 | 陈水和 | Sterilization adhesive film and winding plating method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104102924B (en) | 2017-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104123564A (en) | Fingerprint identification device and assembly with coated film protective layer | |
| CN204203987U (en) | A kind of fingerprint detection assembly and fingerprint recognition module | |
| CN104102924A (en) | Fingerprint identification device and fingerprint identification assembly with mould pressing protection layer | |
| CN204203990U (en) | Fingerprint recognition element and fingerprint recognition module | |
| US12314915B2 (en) | Communication device to sense one or more biometric characteristics of a user | |
| US9971923B2 (en) | Fingerprint identification device and mobile terminal having same | |
| US10713631B2 (en) | System or device for receiving a plurality of biometric inputs | |
| AU2013312252B2 (en) | Credit card form factor secure mobile computer and methods | |
| KR101368804B1 (en) | Method of manufacturing fingerprint recognition home key having offset structure of deco part and the structure of fingerprint recognition home key thereof | |
| US20130108124A1 (en) | Electronic device packages and methods | |
| CN104917876B (en) | Mobile terminal and its control method | |
| CN204791061U (en) | Terminal | |
| CN118612337A (en) | Privacy protection method for electronic device and electronic device | |
| KR101298636B1 (en) | Method of manufacturing fingerprint recognition home key for strengthening adhesion and screening effect between sensing surface and coating layer and the fingerprint recognition home key structure thereof | |
| KR20150066832A (en) | An electronic device including openable cover | |
| WO2002086759A3 (en) | Method of calling up object-specific information | |
| CA2569355C (en) | System and method for handling permits for user authentication tokens | |
| EP2814054A2 (en) | Method of manufacturing fingerprint recognition home key | |
| CN204442455U (en) | Mobile terminal | |
| KR101458893B1 (en) | Method of manufacturing fingerprint recognition home key having surface layer | |
| KR101317246B1 (en) | Method of manufacturing fingerprint recognition home key in mobile apparatus | |
| US20180361630A1 (en) | Housing including patterned-structure layer and method thereof | |
| CN204066143U (en) | Fingerprint recognition device and fingerprint recognition assembly | |
| KR101505993B1 (en) | Fingerprint recognition sensor package and method for manufacturing fingerprint recognition sensor package | |
| KR101506316B1 (en) | Fingerprint recognition sensor package and method for manufacturing fingerprint recognition sensor package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20190816 Decision number of declaring invalidation: 41364 Granted publication date: 20171124 |
|
| IW01 | Full invalidation of patent right |