CN104076905B - Data center apparatus and its manufacture method and corrosion resistance verification method - Google Patents

Abstract

Embodiments of the present invention provide a data center device, a manufacturing method thereof, and a corrosion resistance verification method. The manufacturing method includes: treating the main board, power supply, memory, hard disk and structural parts of the device with a corrosion-resistant process, mainly including spraying tin, organic solder film OSP and nickel immersion gold on the surface of the pad of the PCB. At least one of the processes forms a protective layer; fills the via holes with tin or resin materials; sprays conformal paint on the PCB. The manufacturing method of the data center equipment proposed in the embodiment of the present invention can be used in the design of the corrosion-resistant server of the natural air-cooled data center. Through the corrosion-resistant enhancement design of the components of the server, the outdoor natural wind can be used to dissipate heat from the server. Reduce the overall energy consumption of the data center, and the energy saving effect is remarkable.

Description

Data center equipment, manufacturing method thereof, and corrosion resistance verification method

technical field

The embodiment of the present invention relates to an anti-corrosion processing technology for electrical equipment, and in particular to a data center equipment, a manufacturing method thereof, and a corrosion resistance verification method.

Background technique

With the rising cost of energy and people's emphasis on green environmental protection, the demand for energy saving in data centers is becoming more and more intense. Currently, the Power Usage Effectiveness (PUE) value of Google's data center is 1.13, while the PUE value of domestic data centers is still between 1.5 and 2.5.

Traditional servers in the data center have high requirements on environmental conditions, and the air corrosion level of the data center is required to be lower than the airborne pollutant level G1 (reference standard ISA-S71.04-1985 Environmental Conditions for Process Measurement and Control Systems: Airborne Contaminants, process measurement and control The environmental conditions of the system: air pollutants), and the return air temperature is lower than 28 degrees, and the humidity is 40-60%. However, the server has poor environmental corrosion resistance and has high requirements for air temperature, humidity, nitrides, sulfides, and dust. In order to meet the environmental conditions of the server and ensure the long-term stable operation of the server, expensive mechanical refrigeration heat exchange systems and air-conditioning systems are usually installed in the data center, which makes the initial investment of the system large, the operating cost high, and the PUE is high, and the energy-saving effect is poor. Once the air conditions exceed the allowable range, IT equipment such as servers or switches may experience batch corrosion failures.

Under the premise of ensuring the safe and high-performance operation of IT equipment in the data center computer room, through the design of IT equipment resistant to complex outdoor environments, improving the energy utilization efficiency of the data center, reducing PUE, energy saving and emission reduction has become one of the goals pursued by the data center infrastructure. one.

If corrosion-resistant IT equipment is developed and natural air-cooled data centers are built, the PUE of the data center can be reduced to below 1.1, which greatly reduces the energy consumption of the data center. However, outdoor air contains various pollutants that cause equipment corrosion, such as: sulfide, nitride, and dust. In addition, high humidity in the air will also accelerate the corrosion of IT equipment. In recent years, the heavily polluted outdoor air has also caused the corrosion level of the air inside the data center to exceed the allowable range of the equipment, resulting in batch corrosion failure of the equipment.

Therefore, the existing technology puts forward higher requirements on the corrosion resistance of data center equipment such as servers and switches.

Contents of the invention

Embodiments of the present invention provide a data center device, a manufacturing method thereof, and a corrosion resistance verification method, so as to improve the corrosion resistance and operational safety of the data center device and reduce energy consumption of the data center.

In the first aspect, an embodiment of the present invention provides a method for manufacturing data center equipment, which includes: processing the main board, power supply, memory, hard disk, and structural parts of the equipment using the following process, wherein:

The main board of the device is processed by at least one of the following processes:

For the pad surface of the printed circuit board PCB of the main board, at least one of the processes of spraying tin, organic solder protection film OSP and nickel immersion gold is used to form a protective layer;

The contacts of the connectors of the motherboard PCB are treated with gold-plating process, or with tin-plating process with a thickness of not less than 3.8 microns;

Filling the via holes on the main board PCB with tin or resin material;

Setting the distance between the main board PCB and the fan to reach a first set distance value, so that the surface wind speed of the main board is lower than the set wind speed value;

After completing the welding process of the components on the main board PCB, spray conformal paint on the main board; use at least one of the following processes for the power supply of the equipment:

For the pad surface of the PCB of the power supply, at least one of the processes of spraying tin, OSP and nickel immersion gold is used to form a protective layer;

The surface wiring on the power supply PCB within the second set distance value range from the fan is arranged on the inner layer of the power supply PCB;

Spraying conformal paint on the surface of the power supply PCB;

Arranging the surface wiring of the power supply PCB or a device whose pin spacing is smaller than the set pin spacing is arranged outside the range of the third set distance value from the fan;

Set the voltage trace spacing of the power supply PCB according to pollution level 3;

The memory of the device is processed by at least one of the following processes:

A protective layer is formed on the surface of the pad of the PCB of the memory by using a lead-free HASL process;

Spraying conformal paint on the surface of the memory PCB;

The hard disk of the device is processed by at least one of the following processes:

For the pad surface of the PCB of the hard disk, at least one of the processes of spraying tin, OSP and nickel immersion gold is used to form a protective layer;

Filling the via holes on the hard disk PCB with tin or resin material;

Spraying conformal paint on the surface of the hard disk PCB;

Outdoor corrosion-resistant fans are used for the fans of the equipment;

The structural parts of the equipment are prepared by hot-dip galvanized sheet.

In the second aspect, an embodiment of the present invention provides a data center device, including a motherboard, a power supply, a memory, a hard disk, and structural components, wherein:

The motherboard of the device adopts at least one of the following structures:

The pad surface of the printed circuit board PCB of the main board is formed with a protective layer by at least one of spray tin, organic solder protection film OSP and nickel immersion gold processes;

The contacts of the connector of the motherboard PCB are processed by gold-plating process, or by tin-plating process with a thickness not less than 3.8 microns;

The via holes on the main board PCB are filled with tin or resin material;

The distance between the motherboard PCB and the fan reaches a first set distance value, so that the motherboard

The surface wind speed is lower than the set wind speed value;

The main board is sprayed with conformal paint;

The power supply of the device adopts at least one of the following structures:

The surface of the pad of the PCB of the power supply is formed with a protective layer by at least one of the tin spraying, OSP and nickel immersion gold processes;

The surface wiring on the power supply PCB within the second set distance value range from the fan is arranged on the inner layer of the power supply PCB;

The surface of the power supply PCB is sprayed with three anti-paints;

The surface wiring of the power supply PCB or the device whose pin spacing is smaller than the set pin spacing is arranged outside the range of the third set distance value from the fan;

The voltage trace spacing of the power supply PCB meets the requirements of pollution level 3;

The memory of the device adopts at least one of the following structures:

The pad surface of the PCB of the memory is protected by a lead-free HASL process;

The surface of the memory PCB is sprayed with conformal paint;

The hard disk of the device adopts at least one of the following structures:

The pad surface of the PCB of the hard disk is formed with a protective layer by at least one of tin spraying, OSP and nickel immersion gold processes;

The via holes on the hard disk PCB are filled with tin or resin material;

The surface of the hard disk PCB is sprayed with three anti-paints;

The fan of the equipment is an outdoor corrosion-resistant fan;

The structural parts of the equipment are made of hot-dip galvanized sheet.

In the third aspect, the embodiment of the present invention further provides a method for verifying the corrosion resistance of data center equipment, including:

placing the data center equipment in a set environment to run for a set time;

Monitoring whether the operation of the data center equipment is abnormal;

Wherein, the setting environment is: the hydrogen sulfide concentration is 200mm ³ /m ³ , the sulfur dioxide concentration is 750mm ³ /m ³ , the nitride concentration is 1250mm ³ /m ³ , and the relative humidity is 75%. The set temperature is 45°C when the device is powered off, and the set temperature is 55°C when the device is powered off; the set time is 12 days.

The manufacturing method of the data center equipment proposed in the embodiment of the present invention can be used in the design of the corrosion-resistant server of the natural air-cooled data center. Through the corrosion-resistant enhancement design of the components of the server, the outdoor natural wind can be used to dissipate heat from the server. Reduce the overall energy consumption of the data center, and the energy saving effect is remarkable.

Description of drawings

FIG. 1 is a flow chart of a method for manufacturing data center equipment provided by Embodiment 1 of the present invention;

FIG. 2 is a flowchart of a method for verifying corrosion resistance of data center equipment provided by Embodiment 3 of the present invention.

detailed description

The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

Embodiment one

Fig. 1 is a flow chart of a method for manufacturing data center equipment provided by Embodiment 1 of the present invention. This method is used to manufacture IT equipment installed in a data center such as servers and switches. It can be implemented during the initial manufacturing process of equipment, or It can be the transformation of already formed equipment.

In this method, the equipment is divided into main components such as the main board, power supply, memory, hard disk, and structural parts, and the components of the equipment are processed by the following process, wherein:

110. Use at least one of the following processes to process the main board of the device:

111. For the pad surface of the printed circuit board (PCB for short) of the main board, use at least one of HASL, Organic Solderability Preservatives (OSP for short) and nickel immersion gold processes to form The protective layer;

In the above operations, it is forbidden to use the silver plating process to protect the pads on the surface of the PCB main board, but to use at least one of the tin spraying, OSP, and nickel immersion gold processes to form a protective layer.

112. The contacts of the connectors of the motherboard PCB are treated with a gold-plating process, or a tin-plating process with a thickness of not less than 3.8 microns;

113. Fill the via holes on the main board PCB with tin or resin material;

114. Set the distance between the main board PCB and the fan to reach a first set distance value, so that the surface wind speed of the main board is lower than the set wind speed value;

The above operations are mainly applicable to board layout design. The layout method can be set to keep the motherboard PCB away from the fan, so as to avoid corrosion of the PCB due to excessive local wind speed. The first set distance value is preferably 5 cm, and the set wind speed value is 2 m/s. Then, the setting layout method is, for example, setting the distance between the PCB board of the main board and the fan to be more than 5 cm, so that the wind speed on the main board is lower than 2 m/s.

115. After completing the welding process of the components on the main board PCB, spray conformal paint on the main board;

The material of the three-proof paint can be acrylic resin or polyurethane, and the spraying thickness is not less than 60 microns, preferably between 60-200 microns. When spraying conformal paint, care should be taken to protect gold fingers, connectors and other parts.

120. Use at least one of the following processes to process the power supply of the equipment:

121. For the pad surface of the PCB of the power supply, at least one of tin spraying, OSP, and nickel immersion gold processes is used to form a protective layer; that is, the silver plating process is also disabled for the PCB of the power supply.

122. Arrange the wires on the surface of the power supply PCB within a second set distance from the fan on the inner layer of the power supply PCB; the second set distance is preferably 8 cm or 10 cm. The surface traces generally include signal traces, power supply lines, and the like.

123. Spray conformal paint on the surface of the power supply PCB; the material of the conformal paint can be acrylic resin or polyurethane.

124. Arrange the wiring on the surface of the power supply PCB or the device whose pin spacing is smaller than the set pin spacing, and arrange it outside the range of the third set distance value from the fan; wherein, the set pin spacing can be 1mm , the third setting distance value can be 5cm, within this distance range is the usual high wind speed area, and it is forbidden to lay signal lines, so as to ensure that the creepage distance and electrical clearance of the power supply are sufficient.

125. Set the voltage wiring spacing of the power supply PCB according to the pollution level 3; the pollution level can refer to the standard IEC60950.

130. The memory of the device is processed by at least one of the following processes:

131. For the surface of the soldering pad of the memory PCB, a protective layer is formed by using a lead-free HASL process; that is, the PCB of the memory also prohibits the silver process, and adopts a lead-free HASL process to improve corrosion resistance.

132. Spray conformal paint on the surface of the memory PCB; the conformal paint can be used when the lead-free tin spraying process is adopted or not. Preferably, when the protective layer is not formed by the lead-free tin-spraying process, it needs to be protected by spraying conformal paint. The material of the three anti-paint can be acrylic resin or polyurethane.

140. The hard disk of the device is processed by at least one of the following processes:

141. For the pad surface of the PCB of the hard disk, at least one of the processes of spraying tin, OSP and nickel immersion gold is used to form a protective layer; that is, the silver process is prohibited to improve corrosion resistance.

142. Fill the via holes on the hard disk PCB with tin or resin material;

143. Spray conformal paint on the surface of the hard disk PCB; the conformal paint can be sprayed entirely, or after the hard disk adopts the process of operation 141 and/or 142, it can be sprayed only when the corrosion resistance fails. The material of the three anti-paint can be acrylic resin or polyurethane.

150. An outdoor corrosion-resistant fan is used for the fan of the equipment;

160. The structural parts of the equipment are prepared with hot-dip galvanized sheets, so as to enhance the corrosion resistance of the structure.

Those skilled in the art will understand that the above-mentioned corrosion-resistant treatment processes may be used alone or in combination, and the order in which they are performed is not limited to the order in which the above-mentioned operations are listed.

The components processed based on the above-mentioned corrosion-resistant technology are assembled into a complete machine, and the corrosion-resistant equipment for data centers in natural air-cooled environments can be obtained.

The equipment prepared by the manufacturing method of data center equipment proposed in the embodiment of the present invention can be used in the design of corrosion-resistant servers in natural air-cooled data centers. By enhancing the corrosion resistance of each component of the server, the outdoor natural wind can be used to The server performs heat dissipation to reduce the overall energy consumption of the data center, and the energy saving effect is remarkable.

Embodiment two

Embodiment 2 of the present invention also provides a data center device, which includes a motherboard, a power supply, a memory, a hard disk, and structural components. The device may be an IT device installed in the data center, such as a server or a switch. The equipment can be prepared by using the manufacturing method of the data center equipment provided in the embodiment of the present invention or subjected to corrosion-resistant modification. The motherboard, power supply, memory, hard disk and structural parts of the device may have the following characteristics:

The motherboard of the device adopts at least one of the following structures:

The pad surface of the printed circuit board PCB of the main board is formed with a protective layer by at least one of spray tin, organic solder protection film OSP and nickel immersion gold processes;

The contacts of the connector of the motherboard PCB are processed by gold-plating process, or by tin-plating process with a thickness not less than 3.8 microns;

The via holes on the main board PCB are filled with tin or resin material;

The distance between the main board PCB and the fan reaches a first set distance value, so that the surface wind speed of the main board is lower than the set wind speed value; wherein, the first set distance value can be 5 cm; the The set wind speed value can be 2 m/s.

The main board is sprayed with three-proof paint; the material of the three-proof paint can be acrylic resin or polyurethane, and the spray thickness is not less than 60 microns.

The power supply of the device adopts at least one of the following structures:

The surface of the pad of the PCB of the power supply is formed with a protective layer by at least one of the tin spraying, OSP and nickel immersion gold processes;

The surface wiring on the power supply PCB within a second set distance value range from the fan is arranged on the inner layer of the power supply PCB; the second set distance value is preferably 8 cm or 10 cm;

The surface of the power supply PCB is sprayed with conformal paint; the material of the conformal paint can be acrylic resin or polyurethane.

The surface wiring of the power supply PCB or the device whose pin spacing is smaller than the set pin spacing is arranged outside the range of the third set distance value from the fan; the set pin spacing can be 1 mm, so The third set distance value is preferably 5 cm;

The voltage trace spacing of the power supply PCB meets the requirements of pollution level 3;

The memory of the device adopts at least one of the following structures:

The pad surface of the PCB of the memory is protected by a lead-free HASL process;

The surface of the memory PCB is sprayed with conformal paint; the material of the conformal paint can be acrylic resin or polyurethane.

The hard disk of the device adopts at least one of the following structures:

The pad surface of the PCB of the hard disk is formed with a protective layer by at least one of tin spraying, OSP and nickel immersion gold processes;

The via holes on the hard disk PCB are filled with tin or resin material;

The surface of the hard disk PCB is sprayed with conformal paint; the material of the conformal paint can be acrylic resin or polyurethane.

The fan of the equipment is an outdoor corrosion-resistant fan;

The structural parts of the equipment are made of hot-dip galvanized sheet.

The data center equipment provided by the embodiments of the present invention can be used for corrosion-resistant servers in natural air-cooled data centers. By enhancing the corrosion-resistant design of each component of the server, the outdoor natural wind can be used to dissipate heat from the server, reducing the cost of the data center. Overall energy consumption, energy saving effect is remarkable.

Embodiment Three

FIG. 2 is a flowchart of a method for verifying corrosion resistance of data center equipment provided by Embodiment 3 of the present invention.

In order to ensure that the corrosion-resistant equipment can work stably for 5 years in the pollution level 3 environment of the natural air-cooled data center, an accelerated life test is required. The embodiment of the present invention also provides a corrosion resistance verification method for data center equipment. Methods include:

210. Place the data center equipment in a set environment to run for a set time;

220. Monitor whether the operation of the data center equipment is abnormal.

Wherein, the setting environment is: the hydrogen sulfide concentration is 200mm ³ /m ³ , the sulfur dioxide concentration is 750mm ³ /m ³ , the nitride concentration is 1250mm ³ /m ³ , and the relative humidity is 75%. The set temperature is 45°C when the device is powered off, and the set temperature is 55°C when the device is powered off; the set time is 12 days.

In the above solution, monitoring whether the operation of the data center equipment is abnormal may specifically be to perform at least one of the following:

Monitor whether the function of the device is normal; that is, whether the original data sending and receiving and processing functions of the device are still performed normally.

Monitor whether the performance of the device is normal; that is, whether some performance parameters of the device are within the normal range, such as temperature, power consumption, CPU performance, memory performance, hard disk input and output capabilities, etc.

Monitor said equipment for shedding of skin or debris and for rust.

The verification method provided by the embodiment of the present invention can verify the corrosion resistance of the equipment through the accelerated life test, so as to ensure the long-term and reliable operation of the equipment in the data center.

Note that the above are only preferred embodiments and technical principles used in the present invention. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the present invention, and the present invention The scope is determined by the scope of the appended claims.

Claims (6)

1. A manufacturing method of data center equipment, characterized in that, comprising: the main board, power supply, memory, hard disk and structural parts of the equipment are processed by the following process, wherein: The main board of the device is processed by at least one of the following processes: For the pad surface of the printed circuit board PCB of the main board, at least one of the processes of spraying tin, organic solder protection film OSP and nickel immersion gold is used to form a protective layer; The contacts of the connectors of the motherboard PCB are treated with gold-plating process, or with tin-plating process with a thickness of not less than 3.8 microns; Filling the via holes on the main board PCB with tin or resin material; Setting the distance between the main board PCB and the fan to reach a first set distance value, so that the surface wind speed of the main board is lower than the set wind speed value; After completing the component welding process on the main board PCB, spray conformal paint on the main board; The power supply of the device is processed by at least one of the following processes: For the pad surface of the PCB of the power supply, at least one of the processes of spraying tin, OSP and nickel immersion gold is used to form a protective layer; The surface wiring on the power supply PCB within the second set distance value range from the fan is arranged on the inner layer of the power supply PCB; Spraying conformal paint on the surface of the power supply PCB; Arranging the surface wiring of the power supply PCB or a device whose pin spacing is smaller than the set pin spacing is arranged outside the range of the third set distance value from the fan; Set the voltage wiring spacing of the power supply PCB according to pollution level 3, wherein the pollution level 3 refers to the standard IEC60950; The memory of the device is processed by at least one of the following processes: A protective layer is formed on the surface of the pad of the PCB of the memory by using a lead-free HASL process; Spraying conformal paint on the surface of the memory PCB; The hard disk of the device is processed by at least one of the following processes: For the pad surface of the PCB of the hard disk, at least one of the processes of spraying tin, OSP and nickel immersion gold is used to form a protective layer; Filling the via holes on the hard disk PCB with tin or resin material; Spraying conformal paint on the surface of the hard disk PCB; Outdoor corrosion-resistant fans are used for the fans of the equipment; The structural parts of the equipment are prepared by hot-dip galvanized sheet. 2. The method according to claim 1, characterized in that: The first set distance value is 5 cm; the set wind speed value is 2 m/s; The second set distance value is 8 cm or 10 cm; The set pin pitch is 1 mm, and the third set distance is 5 cm; The material of the three-proof paint is acrylic resin or polyurethane, and the spray thickness is not less than 60 microns. 3. A kind of data center equipment, adopts the manufacturing method described in claim 1 to prepare, comprises motherboard, power supply, memory, hard disk and structural parts, is characterized in that: The motherboard of the device adopts at least one of the following structures: The pad surface of the printed circuit board PCB of the main board is formed with a protective layer by at least one of spray tin, organic solder protection film OSP and nickel immersion gold processes; The contacts of the connector of the motherboard PCB are processed by gold-plating process, or by tin-plating process with a thickness not less than 3.8 microns; The via holes on the main board PCB are filled with tin or resin material; The distance between the main board PCB and the fan reaches a first set distance value, so that the surface wind speed of the main board is lower than the set wind speed value; The main board is sprayed with conformal paint; The power supply of the device adopts at least one of the following structures: The surface of the pad of the PCB of the power supply is formed with a protective layer by at least one of the tin spraying, OSP and nickel immersion gold processes; The surface wiring on the power supply PCB within the second set distance value range from the fan is arranged on the inner layer of the power supply PCB; The surface of the power supply PCB is sprayed with three anti-paints; The surface wiring of the power supply PCB or the device whose pin spacing is smaller than the set pin spacing is arranged outside the range of the third set distance value from the fan; The voltage trace spacing of the power supply PCB meets the requirements of pollution level 3, wherein the pollution level 3 refers to the standard IEC60950; The memory of the device adopts at least one of the following structures: The pad surface of the PCB of the memory is protected by a lead-free HASL process; The surface of the memory PCB is sprayed with conformal paint; The hard disk of the device adopts at least one of the following structures: The pad surface of the PCB of the hard disk is formed with a protective layer by at least one of tin spraying, OSP and nickel immersion gold processes; The via holes on the hard disk PCB are filled with tin or resin material; The surface of the hard disk PCB is sprayed with three anti-paints; The fan of the equipment is an outdoor corrosion-resistant fan; The structural parts of the equipment are made of hot-dip galvanized sheet. 4. The data center equipment according to claim 3, characterized in that: The first set distance value is 5 cm; the set wind speed value is 2 m/s; The second set distance value is 8 cm or 10 cm; The set pin pitch is 1 mm, and the third set distance is 5 cm; The material of the three-proof paint is acrylic resin or polyurethane, and the spray thickness is not less than 60 microns. 5. A method for verifying the corrosion resistance of data center equipment, comprising: placing the data center equipment described in claim 3 or 4 in a set environment to run for a set time; Monitoring whether the operation of the data center equipment is abnormal; Wherein, the setting environment is: the hydrogen sulfide concentration is 200mm ³ /m ³ , the sulfur dioxide concentration is 750mm ³ /m ³ , the nitride concentration is 1250mm ³ /m ³ , and the relative humidity is 75%. The set temperature is 45°C when the device is powered off, and the set temperature is 55°C when the device is powered off; the set time is 12 days. 6. The method according to claim 5, wherein monitoring whether the operation of the data center equipment is abnormal comprises at least one of the following: monitoring the proper functioning of said equipment; monitor the normal performance of said equipment; Monitor said equipment for shedding of skin or debris and for rust.