CN104051603A - Manufacturing technology of LED lamp strip capable of emitting light from two sides - Google Patents
Manufacturing technology of LED lamp strip capable of emitting light from two sides Download PDFInfo
- Publication number
- CN104051603A CN104051603A CN201410105630.5A CN201410105630A CN104051603A CN 104051603 A CN104051603 A CN 104051603A CN 201410105630 A CN201410105630 A CN 201410105630A CN 104051603 A CN104051603 A CN 104051603A
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- Prior art keywords
- double
- led lamp
- layer
- lamp bar
- manufacturing process
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8581—Means for heat extraction or cooling characterised by their material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8585—Means for heat extraction or cooling being an interconnection
-
- H10W90/00—
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- Led Device Packages (AREA)
Abstract
The invention provides a manufacturing technology of a LED lamp strip capable of emitting light from the two sides. The manufacturing technology comprises the following steps that a two-sided substrate is provided, wherein the two-sided substrate comprises a first layer, second layers located on the two sides of the first layer and third layers located on the outer sides of the second layers and arranged at an equal interval; a plurality of crystal fixing grooves are formed in the two-sided substrate. Compared with the prior art, the LED lamp strip capable of emitting light from the two sides is simple in technology and better and evener in light emitting effect.
Description
Technical field
The present invention relates to lighting field, relate in particular to a kind of manufacturing process of LED lamp bar of double-side.
Background technology
Along with developing rapidly of LED (Light-Emitting Diode, light-emitting diode) industry, emerged in large numbers in the world a lot of LED manufacturing enterprises.The manufacturing process of existing LED lamp bar is complicated, need to be through two process, and the one, LED encapsulation, the 2nd, SMT (surface mount technology, surface mounting technology are called for short SMT) paster.And LED lamp bar majority of the prior art is that one side is luminous, and each LED chip on lamp bar is to be cut into an independently light-emitting particles after encapsulation.
In prior art, there is following defect: (1) existing production procedure is many and complicated, not only greatly improved production cost, and in semicon industry, technological process too much in production also can cause huge pollution to environment in the process of production; (2) the every LEDs particle on existing LED lamp bar is all self-existent, has granular sensation while lighting, and illumination effect is bad, non-uniform light; (3) the LED lamp bar that prior art is made only has one side luminous, and illumination effect is bad, and one side alight bar, and its substrate resource utilization is lower.
Therefore, be necessary defect of the prior art to make further improvements.
Summary of the invention
The object of the present invention is to provide the manufacturing process of the LED lamp bar of the double-side that a kind of technique is simple and illumination effect is good.
For reaching aforementioned object, the manufacturing process of the LED lamp bar of a kind of double-side of the present invention, it comprises the steps:
One double-sided substrate is provided, and it the 3rd layer of comprising ground floor, be positioned at the second layer of described ground floor both sides and be positioned at described second layer outside and uniformly-spaced arranging, is formed with several die bond grooves on described double-sided substrate;
Die bond is installed LED chip in described die bond groove;
Bonding wire, is electrically connected to the both positive and negative polarity on described LED chip surface by conductor wire with described the 3rd layer;
Pressing mold, is pressed in described LED chip surface by packaging plastic and phosphor mixture by mold pressing;
Die-cut, described double-sided substrate is cut into some LED lamp bars.
As preferred embodiment of the present invention, described the 3rd layer comprises fixed part and matched moulds portion, and described fixed part and matched moulds portion are arranged alternately with each other on the surface of the described second layer.
As preferred embodiment of the present invention, described die bond groove is that through the described second layer, the surface to described ground floor extends to form from the surface of described the 3rd layer of fixed part, and described LED chip is installed on the ground floor in described die bond groove.
As preferred embodiment of the present invention, described bonding wire is by conductor wire, the both positive and negative polarity on described LED chip surface to be electrically connected to the fixed part of described the 3rd layer.
As preferred embodiment of the present invention, described pressing mold is that packaging plastic and phosphor mixture are pressed in to the described LED chip surface on described fixed part by mold pressing integral body.
As preferred embodiment of the present invention, described die-cut be centre position described double-sided substrate to be cut into some LED lamp bars longitudinally along described matched moulds portion.
As preferred embodiment of the present invention, the exposed portion that comprises encapsulation and be positioned at encapsulation both sides on every LED lamp bar, described encapsulation is coated with several LED chips.
As preferred embodiment of the present invention, the ground floor of described double-sided substrate is aluminium sheet, and the described second layer is heat conductive insulating layer, and described the 3rd layer is circuit layer.
As preferred embodiment of the present invention, described heat conductive insulating layer is epoxy resin, and described circuit layer is Copper Foil.
As preferred embodiment of the present invention, the LED chip on described double-sided substrate two sides is symmetrical set based on described double-sided substrate.
Beneficial effect of the present invention: compared with prior art, the manufacturing process of the LED lamp bar of double-side of the present invention, its technique is simple, has greatly improved production efficiency; And the LED lamp bar of technique manufacture of the present invention is double-side, and not only illumination effect is good, and the utilance of substrate is improved greatly, and light-emitting area of the present invention is strip, and several emitting led particles link together, and illumination effect is better more even.
Accompanying drawing explanation
Fig. 1 is the manufacturing process flow of the LED lamp bar of double-side of the present invention;
Fig. 2 A (1) is the structural representation of the double-sided substrate that uses of the LED lamp bar of double-side of the present invention;
Fig. 2 A (2) is the part-structure schematic diagram of double-sided substrate in Fig. 2 A (1)
Fig. 2 A (3) is that the A of Fig. 2 A (2) is to cutaway view;
Fig. 2 B is the structural representation of die bond step in the manufacturing process flow of LED lamp bar of double-side of the present invention;
Fig. 2 C is the structural representation of bonding wire step in the manufacturing process flow of LED lamp bar of double-side of the present invention;
Fig. 2 D (1) is the structural representation that double-sided substrate of the present invention is arranged in mould;
Fig. 2 D (2) is the structural representation of the double-sided substrate after pressing mold;
Fig. 2 E is the structural representation of the LED lamp bar of double-side of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
Alleged " embodiment " or " embodiment " refers to special characteristic, structure or the characteristic that can be contained at least one implementation of the present invention herein.Different local in this manual " in one embodiment " that occur not all refer to same embodiment, neither be independent or the embodiment mutually exclusive with other embodiment optionally.
Refer to Fig. 1 and Fig. 2 A-2E, the manufacturing process flow of the LED lamp bar that Fig. 1 is double-side of the present invention.The manufacturing process of the LED lamp bar of double-side specifically comprises the steps:
Step S310 a: double-sided substrate is provided.Refer to Fig. 2 A (1)-2A (3), Fig. 2 A (1) is the structural representation of the double-sided substrate that uses of the LED lamp bar of double-side of the present invention, Fig. 2 A (2) is the part-structure schematic diagram of double-sided substrate in Fig. 2 A (1), and Fig. 2 A (3) is that the A of Fig. 2 A (2) is to cutaway view.As shown in Fig. 2 A (1)-2A (3), described double-sided substrate 300 comprises ground floor 301, is positioned at the second layer 302 of ground floor 301 both sides and is positioned at several the 3rd layers 303 that the second layer 302 outsides also uniformly-spaced arrange.On described double-sided substrate 300, be formed with several die bond grooves 304.
Described the 3rd layer 303 comprises fixed part 3031 and matched moulds portion 3032, and described fixed part 3031 and matched moulds portion 3032 are arranged alternately with each other on the surface of the described second layer 302.In this embodiment, described die bond groove 304 is that through the described second layer 302, the surface to described ground floor 301 extends to form from the surface of the fixed part 3031 of described the 3rd layer 303.Wherein, the ground floor 301 of described double-sided substrate 300 is aluminium sheet, and the described second layer 302 is for having the heat conductive insulating layer of high thermal conductivity; Described the 3rd layer 303 is circuit layer, and in this embodiment, described heat conductive insulating layer is epoxy resin, has higher heat conductivility, and described circuit layer is Copper Foil.The present invention does not limit the thickness of described ground floor 301, the second layer 302 and the 3rd layer 303, can be according to actual conditions specific design.
Step S320: die bond.Refer to Fig. 2 B, the structural representation of die bond step in the manufacturing process flow of its LED lamp bar that is double-side of the present invention.Several LED chips 305 are installed in described die bond groove 304.Refer to Fig. 2 A and 2B, first described double-sided substrate 300 is placed on base plate carrier 400, one is faced up, utilize Glue dripping head from lacquer disk(-sc), to dip tin cream, again the tin cream point of taking-up is invested in the die bond groove 304 of double-sided substrate 300 one side upward, then LED chip 305 is placed on the aluminium sheet that a little has the ground floor 301 in the die bond of tin cream groove 304, after compacting, be warmed up to eutectic temperature, make the metal of LED chip 305 bottom surfaces and ground floor aluminium sheet realize eutectic by tin cream and weld, and then it is fixing to complete the LED chip 305 of wherein one side of double-sided substrate; Upset double-sided substrate, makes its another side upward, repeats above-mentioned die bond step S320, completes the die bond technique of another side.In this embodiment, described LED chip 305 is to be fixed on the aluminium sheet of the ground floor 301 in described die bond groove 304, the bottom of described LED chip 305 directly contacts with the aluminium sheet of ground floor 301, the heat part that will make so described LED chip 305 produce is directly conducted the aluminium sheet to described ground floor 301, aluminium sheet by described ground floor 301 conducts heat again, heat another part that described LED chip 305 produces also conducts the aluminium sheet to described ground floor 301 rapidly by the heat conductive insulating layer of the second layer 302, and then the aluminium sheet by ground floor 301 distributes again, therefore, can play good radiating effect, extended greatly the useful life of LED chip.In other embodiments, described LED chip 305 can also be fixed on the surface of the second layer 302 on described fixed part 3031, and the heat radiation of described LED chip directly directly conducts heat the effect that reaches heat radiation to the aluminium sheet of ground floor 301 by the heat conductive insulating layer of the second layer 302.In this embodiment, in order to make LED lamp bar luminous evenly, the LED chip 305 on described double-sided substrate 300 two sides is symmetrical set based on described double-sided substrate 300, and in other embodiments, the LED chip on described double-sided substrate 300 two sides also can arrange arbitrarily according to actual conditions.
Step S330: bonding wire.Refer to Fig. 2 C, the structural representation of bonding wire step in the manufacturing process flow of its LED lamp bar that is double-side of the present invention.First, described double-sided substrate 300 is placed on base plate carrier 500, one is faced up, by conductor wire 306, the both positive and negative polarity on described LED chip 305 surfaces is electrically connected to the wire on described the 3rd layer 303; Upset double-sided substrate 300, makes its another side upward, by conductor wire 306, the wire on described the 3rd layer 303 of the both positive and negative polarity on described LED chip 305 surfaces of double-sided substrate 300 another sides and double-sided substrate 300 another sides is electrically connected to, and completes bonding wire.Wherein, the wire on described the 3rd layer 303 is electrically connected to external power source, by external power source, described LED chip is lighted.
Step S340: pressing mold.Packaging plastic and phosphor mixture are pressed in to described LED chip surface by mold pressing.Refer to Fig. 2 D (1), it is the structural representation that double-sided substrate of the present invention is arranged in mould.Refer to Fig. 2 D (2), it is the partial cross section schematic diagram of the double-sided substrate after pressing mold.First packaging plastic and fluorescent material are fully uniformly mixed as encapsulating compound 307, the double-sided substrate 300 that has welded conductor wire is sent in the patrix 501 of mold pressing board and the die cavity of counterdie 502, encapsulating compound 307 is put into mould simultaneously, after equipment is to mold heated, encapsulating compound 307 solidifies, then equipment sends out the good double-sided substrate 300 of mold pressing automatically, completes pressing mold.The present invention does not limit the mixed proportion of packaging plastic and fluorescent material, can determine according to actual conditions.Refer to Fig. 2 D (2), in this embodiment, described encapsulating compound 307 is to be pressed in the described LED chip surface on described fixed part 3031 by mold pressing integral body.
Step S350: die-cut.Please continue to refer to Fig. 2 D (2), along described matched moulds portion 3032, centre position the double-sided substrate after pressing mold 300 is cut into some LED lamp bars 310 longitudinally.Refer to Fig. 2 E, the structural representation of the LED lamp bar that it is double-side of the present invention.As shown in Fig. 2 D (2) and 2E, the exposed portion 312 that comprises encapsulation 311 and be positioned at encapsulation 311 both sides on every LED lamp bar 310, described encapsulation 311 is coated with several LED chips.In this embodiment, the encapsulation of described LED lamp bar 310 is packaging plastic in the present invention and the mixture of fluorescent material, the luminous generation heat of a described LED chip part distributes by described coated portion 311, in the present invention, described exposed portion 312 is a part for double-sided substrate 300, this exposed portion 312 can prevent that operator from encountering coated portion 311 when picking up LED lamp bar, and avoiding causing in coated portion 311 has artificial impurity to occur, and then affects illumination effect.
In the present invention, the size and dimension of described double-sided substrate is not limited, under the prerequisite that guarantees double-sided substrate peak use rate, can determine according to the quantity of the required lamp bar of reality and LED chip.
It should be noted that, the manufacture craft of LED lamp bar of the present invention is applicable to the manufacture of single LEDs chip equally.
The manufacturing process of the LED lamp bar of double-side of the present invention, its technique is simple, has greatly improved production efficiency; And the LED lamp bar of technique manufacture of the present invention is double-side, and not only illumination effect is good, and the utilance of substrate is improved greatly, and light-emitting area of the present invention is strip, and several emitting led particles link together, and illumination effect is better more even.
Above-mentioned explanation has fully disclosed the specific embodiment of the present invention.It is pointed out that being familiar with any change that person skilled in art does the specific embodiment of the present invention does not all depart from the scope of claims of the present invention.Correspondingly, the scope of claim of the present invention is also not limited only to previous embodiment.
Claims (10)
1. a manufacturing process for the LED lamp bar of double-side, is characterized in that: it comprises the steps:
One double-sided substrate is provided, and it the 3rd layer of comprising ground floor, be positioned at the second layer of described ground floor both sides and be positioned at described second layer outside and uniformly-spaced arranging, is formed with several die bond grooves on described double-sided substrate;
Die bond is installed LED chip in described die bond groove;
Bonding wire, is electrically connected to the both positive and negative polarity on described LED chip surface by conductor wire with described the 3rd layer;
Pressing mold, is pressed in described LED chip surface by packaging plastic and phosphor mixture by mold pressing;
Die-cut, described double-sided substrate is cut into some LED lamp bars.
2. the manufacturing process of the LED lamp bar of double-side according to claim 1, is characterized in that: described the 3rd layer comprises fixed part and matched moulds portion, and described fixed part and matched moulds portion are arranged alternately with each other on the surface of the described second layer.
3. the manufacturing process of the LED lamp bar of double-side according to claim 2, it is characterized in that: described die bond groove is that through the described second layer, the surface to described ground floor extends to form from the surface of described the 3rd layer of fixed part, and described LED chip is installed on the ground floor in described die bond groove.
4. the manufacturing process of the LED lamp bar of double-side according to claim 1, is characterized in that: described bonding wire is by conductor wire, the both positive and negative polarity on described LED chip surface to be electrically connected to the fixed part of described the 3rd layer.
5. the manufacturing process of the LED lamp bar of double-side according to claim 1, is characterized in that: described pressing mold is that packaging plastic and phosphor mixture are pressed in to the described LED chip surface on described fixed part by mold pressing integral body.
6. the manufacturing process of the LED lamp bar of double-side according to claim 1, is characterized in that: described die-cut be centre position described double-sided substrate to be cut into some LED lamp bars longitudinally along described matched moulds portion.
7. the manufacturing process of the LED lamp bar of double-side according to claim 1, is characterized in that: the exposed portion that comprises encapsulation and be positioned at encapsulation both sides on every LED lamp bar, described encapsulation is coated with several LED chips.
8. the manufacturing process of the LED lamp bar of double-side according to claim 1, is characterized in that: the ground floor of described double-sided substrate is aluminium sheet, and the described second layer is heat conductive insulating layer, and described the 3rd layer is circuit layer.
9. the manufacturing process of the LED lamp bar of double-side according to claim 8, is characterized in that: described heat conductive insulating layer is epoxy resin, and described circuit layer is Copper Foil.
10. the manufacturing process of the LED lamp bar of double-side according to claim 1, is characterized in that: the LED chip on described double-sided substrate two sides is symmetrical set based on described double-sided substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410105630.5A CN104051603B (en) | 2014-03-20 | 2014-03-20 | A kind of manufacturing process of the LED light bar of double-side |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410105630.5A CN104051603B (en) | 2014-03-20 | 2014-03-20 | A kind of manufacturing process of the LED light bar of double-side |
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| CN104051603A true CN104051603A (en) | 2014-09-17 |
| CN104051603B CN104051603B (en) | 2017-06-09 |
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| CN201410105630.5A Expired - Fee Related CN104051603B (en) | 2014-03-20 | 2014-03-20 | A kind of manufacturing process of the LED light bar of double-side |
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Cited By (4)
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| CN105235114A (en) * | 2015-10-19 | 2016-01-13 | 厦门多彩光电子科技有限公司 | LED lamp filament die and LED lamp filament preparing method |
| CN105762265A (en) * | 2014-10-27 | 2016-07-13 | 财团法人工业技术研究院 | Light emitting device and manufacturing method thereof |
| WO2021243673A1 (en) * | 2020-06-05 | 2021-12-09 | Tridonic Gmbh & Co Kg | Led lighting strip and the manufacturing system thereof |
| WO2022036681A1 (en) * | 2020-08-21 | 2022-02-24 | 柯银湖 | Led light-emitting source device and manufacturing method therefor |
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| WO2022036681A1 (en) * | 2020-08-21 | 2022-02-24 | 柯银湖 | Led light-emitting source device and manufacturing method therefor |
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| Publication number | Publication date |
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| CN104051603B (en) | 2017-06-09 |
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