CN104002058A - Sn-Zn-Ag-Ni alloy lead-free solder and preparation method thereof - Google Patents
Sn-Zn-Ag-Ni alloy lead-free solder and preparation method thereof Download PDFInfo
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- CN104002058A CN104002058A CN201310058881.8A CN201310058881A CN104002058A CN 104002058 A CN104002058 A CN 104002058A CN 201310058881 A CN201310058881 A CN 201310058881A CN 104002058 A CN104002058 A CN 104002058A
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 95
- 239000000956 alloy Substances 0.000 title claims abstract description 95
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 57
- 229910017937 Ag-Ni Inorganic materials 0.000 title claims abstract description 46
- 229910017984 Ag—Ni Inorganic materials 0.000 title claims abstract description 46
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 229910052718 tin Inorganic materials 0.000 claims abstract description 22
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims abstract description 16
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 11
- 230000008018 melting Effects 0.000 claims abstract description 8
- 238000002844 melting Methods 0.000 claims abstract description 8
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 5
- 239000011135 tin Substances 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 239000000843 powder Substances 0.000 claims description 20
- 239000004411 aluminium Substances 0.000 claims description 16
- 238000005266 casting Methods 0.000 claims description 16
- 229910006414 SnNi Inorganic materials 0.000 claims description 14
- 238000005219 brazing Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 229910052725 zinc Inorganic materials 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910002804 graphite Inorganic materials 0.000 claims description 7
- 239000010439 graphite Substances 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 238000003801 milling Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 238000012387 aerosolization Methods 0.000 claims description 3
- 238000000889 atomisation Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000012216 screening Methods 0.000 claims description 3
- 229910001094 6061 aluminium alloy Inorganic materials 0.000 claims description 2
- 229910000553 6063 aluminium alloy Inorganic materials 0.000 claims description 2
- 241000143437 Aciculosporium take Species 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims 3
- 238000005476 soldering Methods 0.000 abstract description 6
- 230000008021 deposition Effects 0.000 abstract description 3
- -1 3A21 Chemical compound 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 239000011701 zinc Substances 0.000 description 13
- 150000002739 metals Chemical class 0.000 description 5
- 229910020994 Sn-Zn Inorganic materials 0.000 description 3
- 229910009069 Sn—Zn Inorganic materials 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004455 differential thermal analysis Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- VRAIHTAYLFXSJJ-UHFFFAOYSA-N alumane Chemical compound [AlH3].[AlH3] VRAIHTAYLFXSJJ-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000013031 physical testing Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Disclosed are a Sn-Zn-Ag-Ni alloy lead-free solder and a preparation method thereof. The Sn-Zn-Ag-Ni alloy lead-free solder is mainly applied to low-temperature soldering of pure aluminum and aluminum alloy. The Sn-Zn-Ag-Ni alloy lead-free solder is composed of, by weight percentage, 8.0-10.0% of Zn, 0.5-1.5% of Ag, 0.5-1.2% of Ni and Sn as balance. The Sn-Zn-Ag-Ni alloy lead-free solder is low in melting temperature, good in soldering technological property and high in lubricity, achieves a welding deposition rate higher than 75% and a welding line tensile strength sigma b higher than or equal to 50 MPa, and is applicable to low-temperature soldering of the pure aluminum and various aluminum alloys such as 3A21, 6063 and 6061.
Description
Technical field
The present invention relates to the low-temperature brazing filler metal of a kind of aluminium and aluminium alloy, be specifically related to Sn-Zn-Ag-Ni solder alloy.
Background technology
Fine aluminium and aluminium alloy have a wide range of applications in fields such as space flight, aviation, building, electrical equipment, automobile and boats and ships, and the connection of fine aluminium and aluminium alloy and preparation technology thereof play very important effect in product manufacture.The connected mode of aluminium alloy is varied, and low temperature brazing is very important one, particularly for portions of electronics element or device, implements low temperature brazing and both can meet connection request, also can fully ensure device performance.
A kind of metal connecting material using when low-temperature brazing filler metal is low temperature brazing.In order to obtain the soldered fitting of high-quality, low-temperature brazing filler metal should meet following requirement conventionally: (1) can soak mother metal, and is firmly connected with its formation; (2) good mobile performance, solder is sprawled in joint by capillarity, forms fine and close brazed seam; (3) composition is even, and fusing interval is little; (4) soldered fitting strength character is good, corrosion-resistant, and can meet the requirement of other properties.
The optional lead-free solder of aluminium-aluminium low temperature brazing has Sn-Ag, Sn-Ag-Cu, Sn-Cu, Sn-Zn etc., wherein Sn-Zn eutectic solder, and 198 DEG C of fusion temperatures, have the advantages such as brazing manufacturability is good, color and luster is consistent with mother metal, joint is firm, are most widely used.But its shortcoming is joint corrosion-resistant, there is data to show, the joint of Sn-Zn brazed aluminum soaks in running water, and under room temperature, 3～4 week corroded disconnection.At 5%NaCl water soaking, disconnected less than 48 hours.
Summary of the invention
For the problems referred to above of prior art, the invention provides a kind of Sn-Zn-Ag-Ni solder alloy with stronger corrosion resistance and tensile strength.
For achieving the above object, the present invention includes following technical scheme:
A kind of Sn-Zn-Ag-Ni alloy lead-free solder, this solder is grouped into by the one-tenth of following content: Zn8.0～10.0wt%, Ag0.5～1.5wt%, Ni0.5～1.2wt%, Sn surplus.
Sn-Zn-Ag-Ni alloy lead-free solder as above, preferably, described solder is grouped into by the one-tenth of following content: Zn8.0wt%, Ag0.7wt%, Ni1.2wt%, Sn surplus.
Sn-Zn-Ag-Ni alloy lead-free solder as above, preferably, described solder is grouped into by the one-tenth of following content: Zn8.5wt%, Ag0.8wt%, Ni1.1wt%, Sn surplus.
Sn-Zn-Ag-Ni alloy lead-free solder as above, preferably, described solder is grouped into by the one-tenth of following content: Zn9.0wt%, Ag1.0wt%, Ni1.0wt%, Sn surplus.
Sn-Zn-Ag-Ni alloy lead-free solder as above, preferably, described solder is grouped into by the one-tenth of following content: Zn9.5wt%, Ag1.1wt%, Ni0.8wt%, Sn surplus
Sn-Zn-Ag-Ni alloy lead-free solder as above, preferably, described solder is grouped into by the one-tenth of following content: Zn10.0wt%, Ag1.2wt%, Ni0.7wt%, Sn surplus.
Sn-Zn-Ag-Ni alloy lead-free solder as above, preferably, the form of described solder is silk, paper tinsel or powder.
The application of Sn-Zn-Ag-Ni alloy lead-free solder as above in low temperature brazing fine aluminium, 3A21 aluminium alloy, 6063 aluminium alloys or 6061 aluminium alloys.
The preparation method of Sn-Zn-Ag-Ni alloy lead-free solder as above, the method comprises the steps:
A. take Zn, Ag, Ni and Sn raw metal according to the composition proportion of described solder;
B. Sn and Ni raw metal are shelved in graphite crucible, utilize intermediate frequency furnace, be heated to 600 DEG C of meltings, SnNi intermediate alloy is made in casting;
C. utilize intermediate frequency furnace, remaining Sn, Zn, Ag raw metal and SnNi intermediate alloy are carried out to founding at 250 DEG C to 300 DEG C, make bar-shaped or tabular Sn-Zn-Ag-Ni alloy cast ingot;
D. alloy bar-shaped cast ingot founding being made, makes welding wire, weldering paper tinsel or welding powder through extruder extruding, mill milling or gas-atomized powder method.
The preparation method of Sn-Zn-Ag-Ni alloy lead-free solder as above, preferably, described step D is the alloy bar-shaped cast ingot that founding is made, and through extruder extruding, makes diameter 0.5～1.5mm welding wire; Or the tabular ingot casting of the alloy that founding is made, through mill milling, make thickness 0.05～0.15mm weldering paper tinsel; Or adopt gas-atomized powder method, using nitrogen as atomization gas, it is 0.5MPa～1.0MPa that the bar-shaped cast ingot making is placed in to pressure, temperature is that under the condition of 250 DEG C～280 DEG C, alloy powder is made in aerosolization, by this alloy powder, by screening, obtain the alloy welding powder of granularity at 25um～45um.
A kind of Sn-Zn-Ag-Ni alloy lead-free solder, it adopts method as above to prepare.
Beneficial effect of the present invention is the following aspects:
1, Sn-Zn-Ag-Ni solder alloy of the present invention is applicable to the low temperature brazing of fine aluminium and 3A21,2A50, the multiple aluminium alloys such as 6063 and 6061.
2, the fusion temperature of Sn-Zn-Ag-Ni solder alloy of the present invention is suitable, is 195 DEG C～210 DEG C, to fine aluminium and aluminium alloy brazing temperature not higher than 250 DEG C.
3, Sn-Zn-Ag-Ni solder alloy of the present invention has good wetability to fine aluminium and aluminium alloy, and brazing manufacturability is good.
4, soldered fitting rate of deposition is higher than 75%, weld seam tensile strength sigma
b>=50MPa soaks in 5%NaCl water, within 198 hours, does not ftracture.
5, the present invention prepares Sn-Zn-Ag-Ni solder alloy form and comprises silk, paper tinsel, powder, and preparation method is simple, is beneficial to batch production.
Brief description of the drawings
Fig. 1 is the process chart that the present invention prepares Sn-Zn-Ag-Ni solder alloy.
Fig. 2 is the differential thermal analysis collection of illustrative plates of the Sn-Zn-Ag-Ni solder alloy that obtains of the embodiment of the present invention 2.
Fig. 3 is that the Sn-Zn-Ag-Ni solder alloy that the embodiment of the present invention 2 obtains is tested for fine aluminium soldering, the T connector photo making.
Detailed description of the invention
The composition of each component in following examples, is respectively:
Embodiment 1:Sn-Zn-Ag-Ni solder alloy (Zn8.0wt%, Ag0.7wt%, Ni1.2wt%, Sn surplus)
Preparation process as shown in Figure 1.
Step 1: raw metal is weighed
By weight percentage, take respectively 80 grams of Zn, 7 grams of Ag, 12 grams of Ni and 901 grams of Sn;
Step 2: intermediate alloy founding
Take 120 grams of Sn again, be shelved in graphite crucible with 12 grams of Ni raw metals, utilize intermediate frequency furnace, be heated to 600 DEG C of meltings, SnNi intermediate alloy is made in casting;
Step 3: alloy casting
Utilize intermediate frequency furnace, remaining Sn, Zn, Ag raw metal and SnNi intermediate alloy are carried out to founding at 250 DEG C to 300 DEG C, make the bar-shaped Sn-Zn-Ag-Ni alloy cast ingot of diameter 30mm;
Step 4: welding wire preparation
By the alloy bar-shaped cast ingot after founding, through extruder extruding, make diameter 1mm welding wire.
Embodiment 2:Sn-Zn-Ag-Ni solder alloy (Zn8.5wt%, Ag0.8wt%, Ni1.1wt%, Sn surplus)
Step 1: raw metal is weighed
By weight percentage, take respectively 85 grams of Zn, 8 grams of Ag, 11 grams of Ni and 896 grams of Sn;
Step 2: intermediate alloy founding
Take 110 grams of Sn again, be shelved in graphite crucible with 11 grams of Ni raw metals, utilize intermediate frequency furnace, be heated to 600 DEG C of meltings, SnNi intermediate alloy is made in casting;
Step 3: alloy casting
Utilize intermediate frequency furnace, remaining Sn, Zn, Ag raw metal and SnNi intermediate alloy are carried out to founding at 250 DEG C to 300 DEG C, make the tabular Sn-Zn-Ag-Ni alloy cast ingot of thickness 5mm;
Step 4: weldering paper tinsel preparation
By tabular the alloy after founding ingot casting, through mill milling, make thickness 0.1mm weldering paper tinsel.
Embodiment 3:Sn-Zn-Ag-Ni solder alloy (Zn9.0wt%, Ag1.0wt%, Ni1.0wt%, Sn surplus)
Step 1: raw metal is weighed
By weight percentage, take respectively 90 grams of Zn, 10 grams of Ag, 10 grams of Ni and 890 grams of Sn;
Step 2: intermediate alloy founding
Take 100 grams of Sn again, be shelved in graphite crucible with 10 grams of Ni raw metals, utilize intermediate frequency furnace, be heated to 600 DEG C of meltings, SnNi intermediate alloy is made in casting;
Step 3: alloy casting
Utilize intermediate frequency furnace, remaining Sn, Zn, Ag raw metal and SnNi intermediate alloy are carried out to founding at 250 DEG C to 300 DEG C, make the bar-shaped Sn-Zn-Ag-Ni alloy cast ingot of diameter 30mm;
Step 4: welding powder preparation
Adopt gas-atomized powder method, using nitrogen as atomization gas, it is 0.5MPa～1.0MPa that the bar-shaped alloy cast ingot that step 3 is made is placed in pressure, temperature is that under the condition of 260 DEG C, alloy powder is made in aerosolization, by this alloy powder, by screening, obtain the alloy welding powder of granularity at 25um～45um.
Embodiment 4:Sn-Zn-Ag-Ni solder alloy (Zn9.5wt%, Ag1.1wt%, Ni0.8wt%, Sn surplus)
Step 1: raw metal is weighed
By weight percentage, take respectively 95 grams of Zn, 11 grams of Ag, 8 grams of Ni and 886 grams of Sn;
Step 2: intermediate alloy founding
Take 80 grams of Sn again, be shelved in graphite crucible with 8 grams of Ni raw metals, utilize intermediate frequency furnace, be heated to 600 DEG C of meltings, SnNi intermediate alloy is made in casting;
Step 3: alloy casting
Utilize intermediate frequency furnace, remaining Sn, Zn, Ag raw metal and SnNi intermediate alloy are carried out to founding at 250 DEG C to 300 DEG C, make the bar-shaped Sn-Zn-Ag-Ni alloy cast ingot of diameter 30mm;
Step 4: welding wire preparation
By the alloy bar-shaped cast ingot after founding, through extruder extruding, make diameter 1mm welding wire.
Embodiment 5:Sn-Zn-Ag-Ni solder alloy (Zn10.0wt%, Ag1.2wt%, Ni0.7wt%, Sn surplus)
Step 1: raw metal is weighed
By weight percentage, take respectively 100 grams of Zn, 12 grams of Ag, 7 grams of Ni and 881 grams of Sn;
Step 2: intermediate alloy founding
Take 70 grams of Sn again, be shelved in graphite crucible with 7 grams of Ni raw metals, utilize intermediate frequency furnace, be heated to 600 DEG C of meltings, SnNi intermediate alloy is made in casting;
Step 3: alloy casting
Utilize intermediate frequency furnace, remaining Sn, Zn, Ag raw metal and SnNi intermediate alloy are carried out to founding at 250 DEG C to 300 DEG C, make the tabular Sn-Zn-Ag-Ni alloy cast ingot of thickness 5mm;
Step 4: weldering paper tinsel preparation
By tabular the alloy after founding ingot casting, through mill milling, make thickness 0.1mm weldering paper tinsel.
Embodiment 6
The solder of respectively being prepared by embodiment 1-5 carries out physical testing and fine aluminium low temperature brazing test, obtains test data in table 1.The solder differential thermal analysis curve that embodiment 2 makes is shown in Figure of description 2, and wherein Te refers to solder solid-state temperature, and Tf refers to solder liquidus temperature.Fig. 3 is that the Sn-Zn-Ag-Ni solder alloy that embodiment 2 obtains is tested for fine aluminium soldering, the T connector photo making.
Table 1
| ? | Solid-state temperature | Liquidus temperature | Mother metal | Soldering maximum temperature | Rate of deposition | Joint tensile strength |
| Embodiment 1 | 196℃ | 204℃ | Fine aluminium | 250℃ | 78.5％ | 50.5MPa |
| Embodiment 2 | 195℃ | 205℃ | Fine aluminium | 250℃ | 79.2％ | 52.0MPa |
| Embodiment 3 | 195℃ | 206℃ | Fine aluminium | 250℃ | 82.8％ | 53.5MPa |
| Embodiment 4 | 195℃ | 208℃ | Fine aluminium | 250℃ | 83.7％ | 56.0MPa |
| Embodiment 5 | 196℃ | 210℃ | Fine aluminium | 250℃ | 84.2％ | 57.5MPa |
In above-described embodiment, only enumerate the embodiment of Sn-Zn-Ag-Ni solder alloy part of the present invention; in the technical scheme of the invention described above: in described alloy compositions, the content of zinc, silver, nickel can freely be selected in prescribed limit; will not enumerate herein; therefore it is exemplary that the technical scheme that above explanation comprises should be considered as, but not in order to limit the protection domain of the present patent application patent.
Claims (6)
1. a Sn-Zn-Ag-Ni alloy lead-free solder, is characterized in that, this solder is grouped into by the one-tenth of following content: Zn8.0～10.0wt%, Ag0.5～1.5wt%, Ni0.5～1.2wt%, Sn surplus.
2. Sn-Zn-Ag-Ni alloy lead-free solder as claimed in claim 1, is characterized in that, the form of described solder is silk, paper tinsel or powder.
3. the application of Sn-Zn-Ag-Ni alloy lead-free solder as claimed in claim 1 in low temperature brazing fine aluminium, 3A21 aluminium alloy, 6063 aluminium alloys or 6061 aluminium alloys.
4. the preparation method of the Sn-Zn-Ag-Ni alloy lead-free solder as described in any one in claim 1-3, is characterized in that, the method comprises the steps:
A. take Zn, Ag, Ni and Sn raw metal according to the composition proportion of described solder;
B. the Sn raw material of 7～20 % by weight and whole Ni raw material are shelved in graphite crucible, utilize intermediate frequency furnace, be heated to 590～610 DEG C of meltings, SnNi intermediate alloy is made in casting;
C. utilize intermediate frequency furnace, Zn, Ag, remaining Sn raw material and SnNi intermediate alloy are carried out to founding at 250 DEG C to 300 DEG C, make bar-shaped or tabular Sn-Zn-Ag-Ni alloy cast ingot;
D. alloy bar-shaped cast ingot founding being made, makes welding wire, weldering paper tinsel or welding powder through extruder extruding, mill milling or gas-atomized powder method.
5. the preparation method of Sn-Zn-Ag-Ni alloy lead-free solder as claimed in claim 4, is characterized in that, described step D is the alloy bar-shaped cast ingot that founding is made, and through extruder extruding, makes diameter 0.5～1.5mm welding wire; Or the tabular ingot casting of the alloy that founding is made, through mill milling, make thickness 0.05～0.15mm weldering paper tinsel; Or adopt gas-atomized powder method, using nitrogen as atomization gas, it is 0.5MPa～1.0MPa that the bar-shaped cast ingot making is placed in to pressure, temperature is that under the condition of 250 DEG C～280 DEG C, alloy powder is made in aerosolization, by this alloy powder, by screening, obtain the alloy welding powder of granularity at 25um～45um.
6. a Sn-Zn-Ag-Ni alloy lead-free solder, is characterized in that, it adopts method as claimed in claim 4 to prepare.
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| CN201310058881.8A CN104002058B (en) | 2013-02-25 | 2013-02-25 | A kind of Sn Zn Ag Ni alloy lead-free solders and preparation method thereof |
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| CN201310058881.8A CN104002058B (en) | 2013-02-25 | 2013-02-25 | A kind of Sn Zn Ag Ni alloy lead-free solders and preparation method thereof |
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Cited By (4)
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| CN109352207A (en) * | 2018-11-14 | 2019-02-19 | 清华大学 | A kind of preparation method of SnZn-based low temperature lead-free solder |
| CN109706342A (en) * | 2018-12-29 | 2019-05-03 | 郑州机械研究所有限公司 | A kind of copper-zinc-silicon-based powder brazing material containing modifier and preparation method thereof |
| CN111872600A (en) * | 2020-07-08 | 2020-11-03 | 中国矿业大学 | MOFs carbonized product, preparation method and application in lead-free solder modification |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106392365A (en) * | 2016-11-11 | 2017-02-15 | 江苏师范大学 | 3D packaging interconnection solder for MEMS devices |
| CN109352207A (en) * | 2018-11-14 | 2019-02-19 | 清华大学 | A kind of preparation method of SnZn-based low temperature lead-free solder |
| CN109352207B (en) * | 2018-11-14 | 2020-10-20 | 北京联金新材科技有限公司 | Preparation method of SnZn-based low-temperature lead-free solder |
| CN109706342A (en) * | 2018-12-29 | 2019-05-03 | 郑州机械研究所有限公司 | A kind of copper-zinc-silicon-based powder brazing material containing modifier and preparation method thereof |
| CN111872600A (en) * | 2020-07-08 | 2020-11-03 | 中国矿业大学 | MOFs carbonized product, preparation method and application in lead-free solder modification |
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