CN104002039A - Method for acquiring laser focal point through laser gear - Google Patents
Method for acquiring laser focal point through laser gear Download PDFInfo
- Publication number
- CN104002039A CN104002039A CN201410177205.7A CN201410177205A CN104002039A CN 104002039 A CN104002039 A CN 104002039A CN 201410177205 A CN201410177205 A CN 201410177205A CN 104002039 A CN104002039 A CN 104002039A
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- axis
- laser
- processing
- laser spot
- axis coordinate
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000012544 monitoring process Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 241000931526 Acer campestre Species 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
- B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the field of laser technologies, in particular to a method for acquiring a laser focal point. The method includes the steps that the corresponding range H1 of the focal point on Z-axis coordinates is determined; a processing file is compiled, the file to be processed is set as a plurality of processing layers, and each processing layer corresponds to the Z-axis coordinates in the range H1; information of each processing layer is transmitted to a processing scanning system and a Z-axis motion control system through a software operating system, then, an integral two-dimensional coordinate system is formed, and processing graphs are acquired; line width detection is conducted on the processing graphs in different processing layers through a monitoring system so that a plurality of line width values can be acquired; the line width values are fit into a curve, and the Z-axis coordinate corresponding to the thinnest point on the curve is namely the Z-axis coordinate corresponding to the position where the focal point is located. By the design of the method for acquiring the laser focal point, on one hand, the work efficiency of technological adjustment of the laser gear is improved, on the other hand, the laser processing focal point can be accurately acquired, and the processing performance of a laser unit device is guaranteed.
Description
Technical field
The present invention relates to laser technology field, be specifically related to a kind of method that laser equipment obtains laser spot.
Background technology
At present, most industrial lasers equipment is all to utilize focusing system, becomes the tiny hot spot of high power density to carry out retrofit Laser Focusing, therefore the focusing power of focusing system determines its working ability.In actual production, the laser focal of focusing system has difference slightly because of the difference of amasthenic lens and optical system.For the laser equipment of batch production, how to obtain rapidly and accurately the laser focal of focusing system, become a difficult problem of laser technique for applying.
The existing method of obtaining laser focal mainly contains following two kinds:
1, vertical mobile focusing system, observes the size of processing spark by human eye, judge its laser focal, but this mode accuracy is not high, and is adopting human eye observation spark to have very large potential safety hazard.
2, motor drives focusing system vertically to move, and adopts photoelectric sensor to detect, but uses photoelectric sensor to have several lacking: the one, increase cost, and the 2nd, need software to coordinate and increase corresponding function, the 3rd, make device structure more complicated.
Summary of the invention
The technical problem to be solved in the present invention is, for the above-mentioned defect of prior art, a kind of method of obtaining laser spot is provided, can find rapidly and accurately the processing focus of laser equipment, and improved the operating efficiency of laser equipment process debugging, guarantee the performance of Laser Processing.
The technical solution adopted for the present invention to solve the technical problems is: provide a kind of laser equipment to obtain the method for laser focal, this laser equipment comprises operation system of software, processing scanning system, Z axis kinetic control system and monitoring system, in this Z axis control system, be provided with focusing system, wherein, described method comprises:
(1) determine focus corresponding scope H1 on Z axis coordinate;
(2) establishment processed file, file to be processed is set to several machined layer, the Z axis coordinate in the corresponding scope H1 of each machined layer difference;
(3) by operation system of software, by the communication of each machined layer, give processing scanning system and Z axis kinetic control system, form complete three-dimensional system of coordinate and obtain graphics processing;
(4) by monitoring system, the graphics processing of different machined layer is carried out to live width monitoring, obtain a plurality of line width values;
(5) by by a plurality of line width values by fitting to a curve, the corresponding Z axis coordinate of point the thinnest on curve is Z axis coordinate corresponding to focus position.
Wherein, preferred version is: in described step (1), corresponding scope H1 is by regulating Z axis height, according to hot spot from large to small, the corresponding Z axis coordinate of the process of changing from small to big is again corresponding scope H1, and this correspondence scope H1 comprises the identical but corresponding different Z axis coordinate of at least one group of spot size.
Wherein: in described step (1), determine that focal range is by regulating Z axis height, tentatively determining focal range according to the Z axis height corresponding compared with large spot.
Wherein, preferred version is: between described any two adjacent Z axis coordinates, have identical difference.Wherein, preferred version is: described Z axis kinetic control system is to control its moving up and down on Z axis by motor.
Wherein, preferred version is: described motor is linear drive motor or stepper drive motors.
Wherein, preferred version is: described monitoring system is microscope.
Wherein, preferred version is: described processed file is the resulting processed file of identical material material to be processed.
Wherein, preferred version is: described processed file can be divided into the matrix square of a 3x3, and each square is a machined layer.
Wherein, preferred version is: in described matrix square, each machined layer is distinguished by color not of the same race.
Wherein, preferred version is: described corresponding scope H1 comprises minimum light spot, and these minimum light spot two ends Z axis coordinate corresponding to arbitrary a pair of big or small same spot is starting point and the terminal of corresponding scope H1.
Beneficial effect of the present invention is, compared with prior art, the present invention is by being divided into some machined layer by file to be processed, the Z value coordinate figure that each machined layer is corresponding independent, by the processing of each machined layer image is obtained to a plurality of line width values, by the plurality of line width values, fit to a curve, point the thinnest on this curve is focus, thereby by Z axis coordinate, obtain the focusing of laser, the method is simple, quick, accurate, simultaneously simple, cost-saved at its supporting apparatus structure, increase work efficiency, guarantee the performance of laser instrument processing.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the schematic flow sheet that the embodiment of the present invention is obtained laser spot;
Fig. 2 is the schematic diagram that the laser equipment of the embodiment of the present invention obtains focus control method;
Fig. 3 is the structural representation of embodiment of the present invention processed file.
The specific embodiment
Now by reference to the accompanying drawings, preferred embodiment of the present invention is elaborated.
As shown in Figure 2, the embodiment of the present invention provides a kind of laser equipment to obtain laser spot method, this laser equipment comprises operation system of software 31, processing scanning system 34, monitoring system 35 and Z axis kinetic control system 33, in this Z axis control system 33, is provided with focusing system 32.
As depicted in figs. 1 and 2, the step that the present embodiment obtains laser spot method comprises:
(1) determine focus corresponding scope H1 on Z axis coordinate; This correspondence scope H1 is by regulating Z axis height, according to the variation of spot size, tentatively determines hot spot from large to small, becoming the corresponding Z axis coordinate of large process is corresponding scope H1 again, and this correspondence scope H1 comprises the identical but corresponding different Z axis coordinate of at least one group of spot size.In the present embodiment, hot spot, in descending process of changing from small to big again, has comprised minimum light spot, and after definite this correspondence scope H1, down-stream is found out focus within the scope of this correspondence.There is the hot spot that some sizes are identical in the minimum light spot two ends of this enforcement, these minimum light spot two ends Z axis coordinate corresponding to arbitrary a pair of big or small same spot is starting point and the terminal of corresponding scope H1.。
(2) establishment processed file, file to be processed is set to several machined layer, the Z axis coordinate in the corresponding focal range of each machined layer difference;
(3) by operation system of software, by the communication of each machined layer, give processing scanning system and Z axis kinetic control system, form complete three-dimensional system of coordinate and obtain graphics processing;
(4) by monitoring system, the graphics processing of different machined layer is carried out to live width monitoring, obtain a plurality of line width values;
(5) by by a plurality of line width values by fitting to a curve, the corresponding Z axis coordinate of point the thinnest on curve is Z axis coordinate corresponding to focus position, and can obtain the focal length of laser.
In the present embodiment, described Z axis kinetic control system 33 is to control its moving up and down on Z axis by motor, and this motor is linear drive motor or stepper drive motors.
Processed file described in the present embodiment is that the rapidoprint of identical material is processed to the processed file obtaining, this processed file is several, the present embodiment is preferably divided into processed file the matrix square of a 3x3, when obtaining focal length, by each square, it is a machined layer, each machined layer is distinguished by color not of the same race, carry out again transmission and the image processing of hierarchical information, rapidoprint in the present embodiment can be rapidoprint arbitrarily, the rapidoprint that is just identical material for same procedure.
In the present embodiment, the establishment of the processed file of above-mentioned steps (1) can, with realizing with any file software of writing of digital control system that coordinates, have identical difference between any two adjacent Z axis coordinates, this difference approximately 100 μ m.
As shown in Figure 2, the present embodiment control method is: described software control system operating system is divided into some machined layer by processed file, each machined layer waits communication to Z axis kinematic system 33 and processes scanning system 34 with corresponding Z axis coordinate is corresponding one by one, by motor, drive the Z axis flat system 33 of moving to move up and down along Z-direction, and scan by the image of 34 pairs of every one decks of processing scanning system, form the transmission of complete three-dimensional system of coordinate, obtain graphics processing, finally by the graphics processing of 35 pairs of every one decks of monitoring system, carry out wire width measuring, obtain the thinnest one deck of live width, the Z axis coordinate figure shining upon by layer, obtain the focusing focal length of laser equipment.
Motor in the present embodiment is linear electric motors or stepper motor, and this Electric Machine Control Z axis kinetic control system 33 drives the Z axis coordinate position of laser focusing system 32, reach ± 2um of its degree of regulation.
Further, monitoring system 35 is generally microscope, after processing scan operation, can form graphics processing, this graphics processing is formed by multiple scanning patters, by microscope, the live width of machining locus on scanning patter is measured, obtained the thinnest corresponding machined layer of that scanning patter of live width, the Z axis height of this machined layer is exactly the Z axis height of the laser focal that obtains of the present invention.
As shown in Figure 3, after the each scan operation of processing scanning system of the present embodiment completes, scanning result is stored in corresponding processed file; Finally complete after whole scan operations, all scanning results that store processed file into are processed to processing, obtain graphics processing.
The method that the Laser Processing of the embodiment of the present invention obtains focal length can be applicable to the field of laser processing such as laser marking, laser weld, laser boring and laser ablation, and the wavelength of described Laser Processing can be any optical maser wavelength that can realize this Laser Processing.
As described above, be only most preferred embodiment of the present invention, and not for limiting the scope of the invention, all equivalences of doing according to the present patent application the scope of the claims change or modify, and are all the present invention and contain.
Claims (10)
1. laser equipment obtains a method for laser spot, and this laser equipment comprises operation system of software, processing scanning system, Z axis kinetic control system and monitoring system, in this Z axis control system, is provided with focusing system, it is characterized in that, described method comprises:
(1) determine focus corresponding scope H1 on Z axis coordinate;
(2) establishment processed file, file to be processed is set to several machined layer, the Z axis coordinate in the corresponding scope H1 of each machined layer difference;
(3) by operation system of software, by the communication of each machined layer, give processing scanning system and Z axis kinetic control system, form complete three-dimensional system of coordinate and obtain graphics processing;
(4) by monitoring system, the graphics processing of different machined layer is carried out to live width monitoring, obtain a plurality of line width values;
(5) by by a plurality of line width values by fitting to a curve, the corresponding Z axis coordinate of point the thinnest on curve is Z axis coordinate corresponding to focus position.
2. the method for obtaining laser spot according to claim 1, is characterized in that: in described step (1),
Corresponding scope H1 is by regulating Z axis height, and according to hot spot from large to small, the more corresponding Z axis coordinate of the process of changing from small to big is corresponding scope H1, and this correspondence scope H1 comprises the identical but corresponding different Z axis coordinate of some spot sizes.
3. the method for obtaining laser spot according to claim 2, is characterized in that: between described any two adjacent Z axis coordinates, have identical difference.
4. the method for obtaining laser spot according to claim 3, is characterized in that: described Z axis kinetic control system is to control its moving up and down on Z axis by motor.
5. the method for obtaining laser spot according to claim 4, is characterized in that: described motor is linear drive motor or stepper drive motors.
6. the method for obtaining laser spot according to claim 1, is characterized in that: described monitoring system is microscope.
7. the method for obtaining laser spot according to claim 1, is characterized in that: described processed file is the resulting processed file of identical material material to be processed.
8. the method for obtaining laser spot according to claim 7, is characterized in that: described processed file can be divided into the matrix square of a 3x3, and each square is a machined layer.
9. the method for obtaining laser spot according to claim 8, is characterized in that: in described matrix square, each machined layer is distinguished by color not of the same race.
10. the method for obtaining laser spot according to claim 2, is characterized in that: described corresponding scope H1 comprises minimum light spot, and these minimum light spot two ends Z axis coordinate corresponding to arbitrary a pair of big or small same spot is starting point and the terminal of corresponding scope H1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410177205.7A CN104002039B (en) | 2014-04-29 | 2014-04-29 | A kind of laser equipment obtains the method for laser spot |
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| CN201410177205.7A CN104002039B (en) | 2014-04-29 | 2014-04-29 | A kind of laser equipment obtains the method for laser spot |
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| CN104002039A true CN104002039A (en) | 2014-08-27 |
| CN104002039B CN104002039B (en) | 2016-08-24 |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106141427A (en) * | 2015-04-27 | 2016-11-23 | 维嘉数控科技（苏州）有限公司 | Automatically the method obtaining laser spot |
| CN106493122A (en) * | 2016-10-27 | 2017-03-15 | 苏州菲镭泰克激光技术有限公司 | The laser accurate cleaning device of part and method |
| CN106513380A (en) * | 2016-10-27 | 2017-03-22 | 苏州菲镭泰克激光技术有限公司 | Laser cleaning device and method for multi-hole reticulate structure object |
| CN107264091A (en) * | 2017-06-22 | 2017-10-20 | 深圳市创鑫激光股份有限公司 | A kind of laser marking control method, laser marking machine and storage medium |
| CN107427959A (en) * | 2015-03-03 | 2017-12-01 | 通快激光与系统工程有限公司 | Initial pitch occupation for laser processing |
| CN107790891A (en) * | 2017-11-16 | 2018-03-13 | 惠州市契贝科技有限公司 | The marking method and marking device of vacuum flask |
| WO2018069308A1 (en) * | 2016-10-13 | 2018-04-19 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method and device for determining and regulating a focal position of a machining beam |
| CN108747029A (en) * | 2018-06-04 | 2018-11-06 | 广东水利电力职业技术学院（广东省水利电力技工学校） | A kind of teaching type laser engraving cutter and control method, application |
| CN113319423A (en) * | 2021-07-07 | 2021-08-31 | 深圳市杰普特光电股份有限公司 | Laser marking machine and adjusting method |
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| CN113639637A (en) * | 2021-08-17 | 2021-11-12 | 吉林大学 | Method for detecting focus in femtosecond laser processing by using image sensor and application thereof |
| CN113751887A (en) * | 2020-05-28 | 2021-12-07 | 深圳市大族数控科技股份有限公司 | Detection method, device and equipment of laser processing equipment and storage medium |
| CN114235348A (en) * | 2021-11-25 | 2022-03-25 | 大连透平机械技术发展有限公司 | Focal length determining method and device of pulse laser and storage medium |
| CN115488494A (en) * | 2021-06-18 | 2022-12-20 | 中国科学院上海光学精密机械研究所 | Method for confirming focus of ultrafast laser micro-nano processing platform |
| CN120080018A (en) * | 2025-03-19 | 2025-06-03 | 深圳拓竹科技有限公司 | Processing parameter calibration method of processing equipment and processing equipment |
| WO2025200098A1 (en) * | 2024-03-29 | 2025-10-02 | 海目星激光科技集团股份有限公司 | Laser focusing control method and apparatus |
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| US10843292B2 (en) | 2015-03-03 | 2020-11-24 | Trumpf Laser- Und Systemtechnik Gmbh | Initial distance approach for laser processing |
| CN107427959A (en) * | 2015-03-03 | 2017-12-01 | 通快激光与系统工程有限公司 | Initial pitch occupation for laser processing |
| CN106141427A (en) * | 2015-04-27 | 2016-11-23 | 维嘉数控科技（苏州）有限公司 | Automatically the method obtaining laser spot |
| CN106141427B (en) * | 2015-04-27 | 2018-05-18 | 维嘉数控科技（苏州）有限公司 | The automatic method for obtaining laser spot |
| WO2018069308A1 (en) * | 2016-10-13 | 2018-04-19 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method and device for determining and regulating a focal position of a machining beam |
| US12508673B2 (en) | 2016-10-13 | 2025-12-30 | TRUMPF Werkzeugmaschinen SE + Co. KG | Determining and regulating a focal position of a processing beam |
| CN106493122A (en) * | 2016-10-27 | 2017-03-15 | 苏州菲镭泰克激光技术有限公司 | The laser accurate cleaning device of part and method |
| CN106513380A (en) * | 2016-10-27 | 2017-03-22 | 苏州菲镭泰克激光技术有限公司 | Laser cleaning device and method for multi-hole reticulate structure object |
| CN106513380B (en) * | 2016-10-27 | 2019-09-17 | 苏州菲镭泰克激光技术有限公司 | The laser cleaner and method of porous network structure object |
| CN107264091A (en) * | 2017-06-22 | 2017-10-20 | 深圳市创鑫激光股份有限公司 | A kind of laser marking control method, laser marking machine and storage medium |
| CN107790891A (en) * | 2017-11-16 | 2018-03-13 | 惠州市契贝科技有限公司 | The marking method and marking device of vacuum flask |
| CN108747029A (en) * | 2018-06-04 | 2018-11-06 | 广东水利电力职业技术学院（广东省水利电力技工学校） | A kind of teaching type laser engraving cutter and control method, application |
| CN113751887A (en) * | 2020-05-28 | 2021-12-07 | 深圳市大族数控科技股份有限公司 | Detection method, device and equipment of laser processing equipment and storage medium |
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| CN117260011A (en) * | 2020-05-28 | 2023-12-22 | 深圳市大族数控科技股份有限公司 | A detection method, device, equipment and storage medium for laser processing equipment |
| CN113418485A (en) * | 2021-06-08 | 2021-09-21 | 深圳市大族数控科技股份有限公司 | Thickness measuring device and thickness measuring method |
| CN113418485B (en) * | 2021-06-08 | 2023-10-13 | 深圳市大族数控科技股份有限公司 | Thickness measuring device and thickness measuring method |
| CN115488494A (en) * | 2021-06-18 | 2022-12-20 | 中国科学院上海光学精密机械研究所 | Method for confirming focus of ultrafast laser micro-nano processing platform |
| CN113319423A (en) * | 2021-07-07 | 2021-08-31 | 深圳市杰普特光电股份有限公司 | Laser marking machine and adjusting method |
| CN113639637A (en) * | 2021-08-17 | 2021-11-12 | 吉林大学 | Method for detecting focus in femtosecond laser processing by using image sensor and application thereof |
| CN114235348A (en) * | 2021-11-25 | 2022-03-25 | 大连透平机械技术发展有限公司 | Focal length determining method and device of pulse laser and storage medium |
| WO2025200098A1 (en) * | 2024-03-29 | 2025-10-02 | 海目星激光科技集团股份有限公司 | Laser focusing control method and apparatus |
| CN120080018A (en) * | 2025-03-19 | 2025-06-03 | 深圳拓竹科技有限公司 | Processing parameter calibration method of processing equipment and processing equipment |
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| CN104002039B (en) | 2016-08-24 |
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