CN104008868A - Open magnetic circuit chip inductor - Google Patents
Open magnetic circuit chip inductor Download PDFInfo
- Publication number
- CN104008868A CN104008868A CN201410183940.9A CN201410183940A CN104008868A CN 104008868 A CN104008868 A CN 104008868A CN 201410183940 A CN201410183940 A CN 201410183940A CN 104008868 A CN104008868 A CN 104008868A
- Authority
- CN
- China
- Prior art keywords
- magnetic core
- guide sheet
- copper guide
- hook
- chip inductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000004804 winding Methods 0.000 claims abstract 5
- 238000005452 bending Methods 0.000 claims abstract 2
- 238000004080 punching Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 239000003292 glue Substances 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 4
- 238000009713 electroplating Methods 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000012805 post-processing Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
The invention discloses an open magnetic circuit chip inductor which comprises a copper guide sheet, wherein the copper guide sheet comprises an upper substrate and a lower substrate, the upper substrate and the lower substrate are respectively connected to the bottom surface of a magnetic core, the upper substrate and the lower substrate are both semicircular, a side wall is convexly arranged on an arc, a wire hook is arranged in the middle of the side wall, and the wire hook is formed by stamping and bending a guide sheet upwards to form a hook body. According to the invention, the base, the winding, the soldering, the dispensing, the assembling, the post-processing printing, the testing or the packaging are carried out, the full automation is realized mainly aiming at the winding, the soldering and the assembling, the structure is reasonable, the inductance value is stable, the copper guide sheet adopts single-side electroplating, the adhesive force between the copper guide sheet and the magnetic core is enhanced, the problem of poor adhesive force between the tin and the glue on the surface of the traditional copper guide sheet is avoided, the winding hook is designed on the copper guide sheet, the full automation of the winding is realized, and the labor cost is greatly reduced.
Description
Technical field
The present invention relates to a kind of chip inductor, relate in particular to a kind of rational in infrastructurely, inductance value is stable, the open-flux path chip inductor of strong adhesion between element.
Background technology
Chinese Patent Application No.: CN201020633816.5, discloses a kind of SMT Inductor, relates in particular to a kind of SMT Inductor that SMT Inductor is pasted of being convenient to.It comprises I-type magnetic core and enamelled wire, and enamelled wire is wound on I-type magnetic core, and an end face of I-type magnetic core is provided with groove, and groove both sides are provided with the weld zone for being conducted and being connected with enamelled wire end.
Chinese Patent Application No.: CN201120154068.7, a kind of Novel chip inductor is disclosed, belong to Novel chip inductor technical field, its technical essential comprises housing, magnetic post core and coil, housing is provided with interior ghost chamber, coil encircling magnetic post core combines in the shell chamber that is arranged at housing and injecting glue is fixed as one, and its coil two ends form the face that line segment is positioned at housing.
Foregoing invention is created the welding be unfavorable for enamelled wire, coil and magnetic core, and useful life is short, and inductance weak strength is not had stability.
Summary of the invention
The object of the invention is to, overcome the above-mentioned defect of prior art, provide a kind of rational in infrastructure, inductance value is stable, the open-flux path chip inductor of strong adhesion between element.
For achieving the above object, technical scheme provided by the invention is as follows: a kind of open-flux path chip inductor, comprise a bronze medal guide card, copper guide card comprises substrate and subtegulum, upper substrate and subtegulum are connected to a magnetic core bottom surface, the equal semicircular in shape of upper substrate and subtegulum, the convex sidewall that is provided with of circular arc, sidewall middle part is provided with hanging wire and hooks, and hanging wire hooks by the guide card punching press that makes progress and bends out hook body and form.
It is cylindric that magnetic core is " work " word, and magnetic core middle part has ring-like groove, and magnetic core top, magnetic core bottom are respectively upper stop piece, lower stop piece, and magnetic core middle part is roll.
Upper stop piece, lower stop piece edge have location notch, and hanging wire hooks inner side and is fastened on location notch.
Usefulness of the present invention is: by hanging wire hook joint, pedestal, realizes coiling, and scolding tin, some glue, assembling, reprocessing lettering, test or packing, be mainly for coiling and scolding tin, assembling, realizes full automation.
1, copper guide card adopts one-side electroplating, strengthens the adhesive force of copper guide card and magnetic core, avoids the bad problem of adhesive force of the traditional surperficial tin of copper guide card and glue;
2, on copper guide card, design is hung around hook, realizes coiling full-automatic, greatly reduces cost of labor; Soldering tin technique in the design's finished product making, can realize complete unmanned operation automation;
3, use copper guide card to replace traditional end silver, be greatly better than traditional end silver products with the welding flatness of PCB;
4, the then mode of copper guide card and copper circle line is various, can the immersed solder of tin stove, and laser spot welding, high voltage butt-joint etc.;
5, magnetic core can be arranged to round, square, racetrack, can be used according to varying environment.
Accompanying drawing explanation
Fig. 1 is open-flux path chip inductor stereogram of the present invention;
Fig. 2 is copper deflector schematic diagram described in open-flux path chip inductor of the present invention;
Fig. 3 is magnetic core front view described in open-flux path chip inductor of the present invention;
Fig. 4 is magnetic core vertical view described in open-flux path chip inductor of the present invention.
Embodiment
Below in conjunction with accompanying drawing and preferred embodiment, with regard to technical scheme of the present invention, be further described.
As shown in Fig. 1 ~ Fig. 4, a kind of open-flux path chip inductor of the present invention, comprise a bronze medal guide card 1, copper guide card 1 adopts one-side electroplating, strengthen the adhesive force of copper guide card 1 and magnetic core 3, avoid the bad problem of the adhesive force of surperficial tin and glue in conventional art, copper guide card 1 comprises substrate 21 and subtegulum 22, upper substrate 21 is connected to magnetic core 3 bottom surfaces with subtegulum 21, upper substrate 21 and the equal semicircular in shape of subtegulum 22, the convex sidewall 4 that is provided with of circular arc of upper substrate 21 and subtegulum 22, middle part, two side is respectively equipped with the first hanging wire and hooks 42, the second hanging wire hooks 43, the first hanging wire hooks 42, the second hanging wire hook 43 by a guide card 41 upwards punching press bend out hook body 40 and form, first hangs around hook 42, second hangs the design around hook 43, realize coiling full-automatic, greatly reduce cost of labor, soldering tin technique in finished product is made, can realize complete unmanned operation automation.
It is cylindric that magnetic core 3 is " work " word, magnetic core 3 middle parts have ring-like groove 31, magnetic core 3 tops, magnetic core 3 bottoms are respectively top catch 31, bottom catch 32, magnetic core 3 middle parts are roll 33, copper circle wire-wound line can automation be realized in roll 33 outsides, and then mode is various, can the immersed solder of tin stove, laser spot welding, high voltage butt-joint etc.
Catch 31 edges in top all have the first location notch 51, the second location notch 52, the first location notchs 51 and the second location notch 52 and are symmetrical; Catch 32 edges in bottom all have the 3rd location notch (accompanying drawing does not show), the 4th location notch (53), and the 3rd location notch and the 4th location notch are symmetrical, and the first location notch 51, the second location notch 52 and the 3rd location notch, the 4th location notch position are corresponding up and down.
First hangs in hook 42 is snapped in the 3rd location notch, and second hangs in hook 43 is snapped in the 4th location notch 53.
Above-described is only principle of the present invention and preferred embodiment.It should be pointed out that to those skilled in the art, under the premise without departing from the principles of the invention, can also make some modification and improvement, also should be considered as belonging to protection scope of the present invention.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410183940.9A CN104008868A (en) | 2014-05-04 | 2014-05-04 | Open magnetic circuit chip inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410183940.9A CN104008868A (en) | 2014-05-04 | 2014-05-04 | Open magnetic circuit chip inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104008868A true CN104008868A (en) | 2014-08-27 |
Family
ID=51369489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410183940.9A Pending CN104008868A (en) | 2014-05-04 | 2014-05-04 | Open magnetic circuit chip inductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104008868A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109215981A (en) * | 2018-09-10 | 2019-01-15 | 陈楚彬 | Chip inductor and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07263251A (en) * | 1994-03-25 | 1995-10-13 | Toko Inc | Inductance element |
| JPH1022137A (en) * | 1996-06-28 | 1998-01-23 | Taiyo Yuden Co Ltd | Surface-mounting inductor |
| CN1702784A (en) * | 2004-05-25 | 2005-11-30 | 赤地义昭 | Coil device |
| CN203351345U (en) * | 2013-07-12 | 2013-12-18 | 湖南创一电子科技有限公司 | Novel magnetic core |
| CN203839175U (en) * | 2014-05-04 | 2014-09-17 | 太尼电电子科技（东莞）有限公司 | Open magnetic circuit chip inductor |
-
2014
- 2014-05-04 CN CN201410183940.9A patent/CN104008868A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07263251A (en) * | 1994-03-25 | 1995-10-13 | Toko Inc | Inductance element |
| JPH1022137A (en) * | 1996-06-28 | 1998-01-23 | Taiyo Yuden Co Ltd | Surface-mounting inductor |
| CN1702784A (en) * | 2004-05-25 | 2005-11-30 | 赤地义昭 | Coil device |
| CN203351345U (en) * | 2013-07-12 | 2013-12-18 | 湖南创一电子科技有限公司 | Novel magnetic core |
| CN203839175U (en) * | 2014-05-04 | 2014-09-17 | 太尼电电子科技（东莞）有限公司 | Open magnetic circuit chip inductor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109215981A (en) * | 2018-09-10 | 2019-01-15 | 陈楚彬 | Chip inductor and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140827 |