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CH545006A - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
CH545006A
CH545006A CH1486572A CH1486572A CH545006A CH 545006 A CH545006 A CH 545006A CH 1486572 A CH1486572 A CH 1486572A CH 1486572 A CH1486572 A CH 1486572A CH 545006 A CH545006 A CH 545006A
Authority
CH
Switzerland
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
CH1486572A
Other languages
English (en)
Inventor
Johan De Graaff Philip
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH545006A publication Critical patent/CH545006A/de

Links

Classifications

    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H10W40/778—
    • H10W70/453—
    • H10W72/00—
    • H10W74/124—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H10W72/07251—
    • H10W72/20—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CH1486572A 1971-10-14 1972-10-11 Halbleiteranordnung CH545006A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7114112A NL7114112A (de) 1971-10-14 1971-10-14

Publications (1)

Publication Number Publication Date
CH545006A true CH545006A (de) 1973-11-30

Family

ID=19814253

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1486572A CH545006A (de) 1971-10-14 1972-10-11 Halbleiteranordnung

Country Status (10)

Country Link
JP (1) JPS5329273B2 (de)
AU (1) AU474165B2 (de)
CA (1) CA964382A (de)
CH (1) CH545006A (de)
DE (1) DE2249730C3 (de)
FR (1) FR2156343B1 (de)
GB (1) GB1403786A (de)
IT (1) IT968868B (de)
NL (1) NL7114112A (de)
SE (1) SE378706B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2819287A1 (de) * 1977-05-05 1978-11-09 Fierkens Richardus Verfahren zum einkapseln von mikroelektronischen elementen

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4377316A (en) * 1981-02-27 1983-03-22 International Business Machines Corporation High density interconnection means for chip carriers
DE3530827A1 (de) * 1985-08-29 1987-03-05 Vdo Schindling Kontaktvorrichtung
DE10342295B4 (de) * 2003-09-12 2012-02-02 Infineon Technologies Ag Anordnung eines elektrischen Bauelements mit einer elektrischen Isolationsfolie auf einem Substrat und Verfahren zum Herstellen der Anordnung

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1534329A (fr) * 1966-08-16 1968-07-26 Signetics Corp Procédé de montage de circuits intégrés
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2819287A1 (de) * 1977-05-05 1978-11-09 Fierkens Richardus Verfahren zum einkapseln von mikroelektronischen elementen

Also Published As

Publication number Publication date
GB1403786A (en) 1975-08-28
DE2249730C3 (de) 1980-11-13
CA964382A (en) 1975-03-11
IT968868B (it) 1974-03-20
SE378706B (de) 1975-09-08
AU474165B2 (en) 1976-07-15
NL7114112A (de) 1973-04-17
FR2156343A1 (de) 1973-05-25
DE2249730A1 (de) 1973-04-19
AU4752572A (en) 1974-04-26
JPS5329273B2 (de) 1978-08-19
FR2156343B1 (de) 1977-12-23
JPS4847275A (de) 1973-07-05
DE2249730B2 (de) 1980-01-24

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Legal Events

Date Code Title Description
PL Patent ceased