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CH528340A - Machine tool for cutting a workpiece strand into individual slices - Google Patents

Machine tool for cutting a workpiece strand into individual slices

Info

Publication number
CH528340A
CH528340A CH1610070A CH1610070A CH528340A CH 528340 A CH528340 A CH 528340A CH 1610070 A CH1610070 A CH 1610070A CH 1610070 A CH1610070 A CH 1610070A CH 528340 A CH528340 A CH 528340A
Authority
CH
Switzerland
Prior art keywords
cutting
machine tool
individual slices
strand
workpiece
Prior art date
Application number
CH1610070A
Other languages
German (de)
Inventor
Robertson Owen
Original Assignee
Caplin Engineering Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Caplin Engineering Company Ltd filed Critical Caplin Engineering Company Ltd
Publication of CH528340A publication Critical patent/CH528340A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B24D5/126—Cut-off wheels having an internal cutting edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
CH1610070A 1969-10-29 1970-10-29 Machine tool for cutting a workpiece strand into individual slices CH528340A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5304369 1969-10-29

Publications (1)

Publication Number Publication Date
CH528340A true CH528340A (en) 1972-09-30

Family

ID=10466409

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1610070A CH528340A (en) 1969-10-29 1970-10-29 Machine tool for cutting a workpiece strand into individual slices

Country Status (4)

Country Link
CH (1) CH528340A (en)
DE (1) DE2052896C2 (en)
FR (1) FR2066707A5 (en)
GB (1) GB1319768A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2359096C3 (en) * 1973-11-27 1982-01-28 Siemens AG, 1000 Berlin und 8000 München Process for sawing semiconductor wafers with little deflection
FR2412385A1 (en) * 1977-12-22 1979-07-20 Crouzet Sa SILICON BAR SAWING MACHINE
US4420909B2 (en) * 1981-11-10 1997-06-10 Silicon Technology Wafering system
US4949700A (en) * 1987-12-17 1990-08-21 Tokyou Seimitsu Co., Ltd. Ingot support device in slicing apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3430318A (en) * 1967-03-10 1969-03-04 Babcock & Wilcox Co Machine tools and instruments

Also Published As

Publication number Publication date
DE2052896A1 (en) 1971-05-06
DE2052896C2 (en) 1982-02-25
GB1319768A (en) 1973-06-06
FR2066707A5 (en) 1971-08-06

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Legal Events

Date Code Title Description
PUE Assignment

Owner name: GENERAL SIGNAL CORPORATION

PL Patent ceased