[go: up one dir, main page]

CH496320A - Assembly for semiconductor elements, with at least two heat sinks held together by at least one clamping bolt - Google Patents

Assembly for semiconductor elements, with at least two heat sinks held together by at least one clamping bolt

Info

Publication number
CH496320A
CH496320A CH447669A CH447669A CH496320A CH 496320 A CH496320 A CH 496320A CH 447669 A CH447669 A CH 447669A CH 447669 A CH447669 A CH 447669A CH 496320 A CH496320 A CH 496320A
Authority
CH
Switzerland
Prior art keywords
assembly
semiconductor elements
held together
heat sinks
clamping bolt
Prior art date
Application number
CH447669A
Other languages
German (de)
Inventor
Riedel Guenter
Prenzlau Herbert
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH496320A publication Critical patent/CH496320A/en

Links

Classifications

    • H10W40/611—
    • H10W90/00—
    • H10W40/235—
    • H10W40/237—
CH447669A 1969-03-18 1969-03-25 Assembly for semiconductor elements, with at least two heat sinks held together by at least one clamping bolt CH496320A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1913546A DE1913546C3 (en) 1969-03-18 1969-03-18 module

Publications (1)

Publication Number Publication Date
CH496320A true CH496320A (en) 1970-09-15

Family

ID=5728415

Family Applications (1)

Application Number Title Priority Date Filing Date
CH447669A CH496320A (en) 1969-03-18 1969-03-25 Assembly for semiconductor elements, with at least two heat sinks held together by at least one clamping bolt

Country Status (6)

Country Link
US (1) US3590915A (en)
CH (1) CH496320A (en)
DE (1) DE1913546C3 (en)
FR (1) FR2035018A1 (en)
RO (1) RO59101A (en)
SE (1) SE345762B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2201612A1 (en) * 1972-10-03 1974-04-26 Cem Comp Electro Mec

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4292647A (en) * 1979-04-06 1981-09-29 Amdahl Corporation Semiconductor package and electronic array having improved heat dissipation
DE2939088C2 (en) * 1979-09-27 1988-07-28 Rohde & Schwarz GmbH & Co KG, 8000 München Device for dissipating the heat loss from electronic device modules installed in a cabinet frame
US5370178A (en) * 1993-08-25 1994-12-06 International Business Machines Corporation Convertible cooling module for air or water cooling of electronic circuit components
DE10009398C2 (en) * 2000-02-28 2002-03-14 Epcos Ag Heatsink module and arrangement of heatsink modules
US8091614B2 (en) * 2006-11-10 2012-01-10 International Business Machines Corporation Air/fluid cooling system
US20090263708A1 (en) * 2008-04-02 2009-10-22 Josh Bender System and method of integrated thermal management for a multi-cell battery pack
US20100136405A1 (en) * 2008-04-02 2010-06-03 Karl Johnson Battery pack with optimized mechanical, electrical, and thermal management
US8316976B2 (en) * 2008-11-20 2012-11-27 Mission Motor Company Frame for a ride-on vehicle having a plurality of battery packs
US8312954B2 (en) 2010-04-22 2012-11-20 Mission Motor Company Frame for a two wheeled electric vehicle
US20130164578A1 (en) * 2011-12-21 2013-06-27 Edward Thomas Sweet Battery module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1110322B (en) * 1958-11-26 1961-07-06 Siemens Ag Surface rectifier arrangement with a massive cooling element equipped with cooling vanes
DE1464515B2 (en) * 1962-09-06 1973-05-03 Ckd Praha, N.P., Prag SEMICONDUCTOR RECTIFIER BLOCK
US3220471A (en) * 1963-01-15 1965-11-30 Wakefield Engineering Co Inc Heat transfer
US3435891A (en) * 1967-03-23 1969-04-01 Int Rectifier Corp Air flow baffle for rectifier heat exchanger

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2201612A1 (en) * 1972-10-03 1974-04-26 Cem Comp Electro Mec

Also Published As

Publication number Publication date
DE1913546B2 (en) 1975-01-23
SE345762B (en) 1972-06-05
RO59101A (en) 1976-01-15
FR2035018A1 (en) 1970-12-18
US3590915A (en) 1971-07-06
DE1913546A1 (en) 1970-10-01
DE1913546C3 (en) 1975-08-28

Similar Documents

Publication Publication Date Title
CH534430A (en) Monolithic semiconductor device comprising at least two electroluminescent elements
CH440464A (en) Heat sinks for semiconductor elements
AT301959B (en) DEVICE WITH TWO COAXIAL ARRANGED ELEMENTS MOVING INTO EACH OTHER, WHERE THE SEAL BETWEEN THESE ELEMENTS IS CREATED BY A ROLLING MEMBRANE
DK123553B (en) Encapsulated semiconductor device with cooling element.
CH496320A (en) Assembly for semiconductor elements, with at least two heat sinks held together by at least one clamping bolt
CH550487A (en) CIRCUIT ARRANGEMENT WITH AT LEAST ONE CIRCUIT ELEMENT SUPPLIED BY RADIATION.
NL150621B (en) SEMI-CONDUCTOR DEVICE WITH COOLING ELEMENT.
AT263941B (en) Semiconductor component with at least one pressure contact transition
CH558084A (en) HOLDER WITH AT LEAST ONE DISC-SHAPED SEMICONDUCTOR ELEMENT.
NL151842B (en) SEMICONDUCTOR WITH MULTIPLE SEMI-CONDUCTOR DIODES ON A COMMON COOLING PLATE.
CH489905A (en) Semiconductor component with at least two zones of different conductivity types emerging at the surface
AT312069B (en) Circuit arrangement with two transistors
NL153030B (en) LIGHT-EMISSIONING SEMICONDUCTOR DIODE.
FR2045239A5 (en)
AT280546B (en) Garage with two parking spaces one above the other
AT336080B (en) SEMI-CONDUCTOR ARRANGEMENT WITH AT LEAST TWO FIELD EFFECT TRANSISTORS WITH INSULATED GATE ELECTRODE
AT310811B (en) Semiconductor element with cooling device
AT295658B (en) Semiconductor arrangement with at least two temperature-dependent resistance elements
CH526745A (en) Assembly jig for at least two pipe connections, especially for fittings
AT280423B (en) Semiconductor unit with a disk-shaped semiconductor element and two heat sinks, as well as method for assembling the semiconductor unit and assembly device for carrying out the method
AT303596B (en) Bridging plate, especially a narrowing plate for a cooling grate
CH517382A (en) Metal semiconductor diode
AT306860B (en) Heat sink unit for at least two semiconductor valves
AT303195B (en) Heat sinks for semiconductor components
CH529936A (en) Locking device for two interlocked furniture components

Legal Events

Date Code Title Description
PL Patent ceased