CH476114A - Gold electrolytic plating process and electrolytic bath for the implementation of this process - Google Patents
Gold electrolytic plating process and electrolytic bath for the implementation of this processInfo
- Publication number
- CH476114A CH476114A CH1240967A CH1240967A CH476114A CH 476114 A CH476114 A CH 476114A CH 1240967 A CH1240967 A CH 1240967A CH 1240967 A CH1240967 A CH 1240967A CH 476114 A CH476114 A CH 476114A
- Authority
- CH
- Switzerland
- Prior art keywords
- implementation
- electrolytic
- gold
- plating process
- bath
- Prior art date
Links
- 238000000034 method Methods 0.000 title 2
- 238000009713 electroplating Methods 0.000 title 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title 1
- 239000010931 gold Substances 0.000 title 1
- 229910052737 gold Inorganic materials 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US57761866A | 1966-09-07 | 1966-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH476114A true CH476114A (en) | 1969-07-31 |
Family
ID=24309474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1240967A CH476114A (en) | 1966-09-07 | 1967-09-04 | Gold electrolytic plating process and electrolytic bath for the implementation of this process |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3562120A (en) |
| CH (1) | CH476114A (en) |
| DE (1) | DE1621169B1 (en) |
| GB (1) | GB1200110A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3833488A (en) * | 1971-08-20 | 1974-09-03 | Auric Corp | Gold electroplating baths and process |
| GB1442325A (en) * | 1972-07-26 | 1976-07-14 | Oxy Metal Finishing Corp | Electroplating with gold and gold alloys |
| US4435253A (en) * | 1983-01-28 | 1984-03-06 | Omi International Corporation | Gold sulphite electroplating solutions and methods |
| JP6393526B2 (en) * | 2014-06-11 | 2018-09-19 | メタローテクノロジーズジャパン株式会社 | Cyan-based electrolytic gold plating bath and bump forming method using the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3149057A (en) * | 1959-04-27 | 1964-09-15 | Technic | Acid gold plating |
| NL277808A (en) * | 1961-05-01 |
-
1966
- 1966-09-07 US US577618A patent/US3562120A/en not_active Expired - Lifetime
-
1967
- 1967-08-01 GB GB35230/67A patent/GB1200110A/en not_active Expired
- 1967-09-04 CH CH1240967A patent/CH476114A/en not_active IP Right Cessation
- 1967-09-06 DE DE1967S0111697 patent/DE1621169B1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US3562120A (en) | 1971-02-09 |
| DE1621169B1 (en) | 1970-05-14 |
| GB1200110A (en) | 1970-07-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |