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CH408608A - Method for producing a soldered connection - Google Patents

Method for producing a soldered connection

Info

Publication number
CH408608A
CH408608A CH120163A CH120163A CH408608A CH 408608 A CH408608 A CH 408608A CH 120163 A CH120163 A CH 120163A CH 120163 A CH120163 A CH 120163A CH 408608 A CH408608 A CH 408608A
Authority
CH
Switzerland
Prior art keywords
producing
soldered connection
soldered
connection
Prior art date
Application number
CH120163A
Other languages
German (de)
Inventor
Gerhard Dr Gramberg
Heinz-Guenther Dr Plust
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH120163A priority Critical patent/CH408608A/en
Priority to DEA42456A priority patent/DE1199103B/en
Priority to FR961951A priority patent/FR1382473A/en
Publication of CH408608A publication Critical patent/CH408608A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CH120163A 1963-01-31 1963-01-31 Method for producing a soldered connection CH408608A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CH120163A CH408608A (en) 1963-01-31 1963-01-31 Method for producing a soldered connection
DEA42456A DE1199103B (en) 1963-01-31 1963-02-28 Use of a bismuth-tellurium alloy as a solder and method for producing a solder connection
FR961951A FR1382473A (en) 1963-01-31 1964-01-29 Process for obtaining a welded connection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH120163A CH408608A (en) 1963-01-31 1963-01-31 Method for producing a soldered connection

Publications (1)

Publication Number Publication Date
CH408608A true CH408608A (en) 1966-02-28

Family

ID=4204865

Family Applications (1)

Application Number Title Priority Date Filing Date
CH120163A CH408608A (en) 1963-01-31 1963-01-31 Method for producing a soldered connection

Country Status (2)

Country Link
CH (1) CH408608A (en)
DE (1) DE1199103B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63238994A (en) * 1987-03-25 1988-10-05 Tdk Corp Solder component material
JP3671815B2 (en) * 2000-06-12 2005-07-13 株式会社村田製作所 Solder composition and soldered article
DE10309677B4 (en) * 2003-02-27 2008-07-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Microelectromechanical component and method for producing a microelectromechanical component

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB878481A (en) * 1960-01-21 1961-10-04 Evgeny Andreevich Kolenko Solder for thermocouples

Also Published As

Publication number Publication date
DE1199103B (en) 1965-08-19

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