CA979603A - Electroless copper plating - Google Patents

Electroless copper plating

Info

Publication number: CA979603A
Authority: CA; Canada
Prior art keywords: copper plating; electroless copper; electroless; plating; copper
Prior art date: 1971-05-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA134,344A

Other versions

CA134344S (en

Inventor

Michael Gulla

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Shipley Co Inc

Original Assignee

Shipley Co Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1971-05-20

Filing date

1972-02-09

Publication date

1975-12-16

1972-02-09 Application filed by Shipley Co Inc filed Critical Shipley Co Inc

1975-12-16 Application granted granted Critical

1975-12-16 Publication of CA979603A publication Critical patent/CA979603A/en

Status Expired legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

CA134,344A 1971-05-20 1972-02-09 Electroless copper plating Expired CA979603A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US14550871A	1971-05-20	1971-05-20

Publications (1)

Publication Number	Publication Date
CA979603A true CA979603A (en)	1975-12-16

Family

ID=22513423

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA134,344A Expired CA979603A (en)	1971-05-20	1972-02-09	Electroless copper plating

Country Status (5)

Country	Link
US (1)	US3661597A (en)
JP (1)	JPS5236089B1 (en)
CA (1)	CA979603A (en)
GB (1)	GB1352087A (en)
IT (1)	IT946822B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3751289A (en) *	1971-08-20	1973-08-07	M & T Chemicals Inc	Method of preparing surfaces for electroplating
JPS56156749A (en) *	1980-05-08	1981-12-03	Toshiba Corp	Chemical copper plating solution
EP0132594B1 (en) *	1983-07-25	1988-09-07	Hitachi, Ltd.	Electroless copper plating solution
EP0179212B1 (en) *	1984-09-27	1991-12-27	Kabushiki Kaisha Toshiba	Chemical copper plating solution
US4600609A (en) *	1985-05-03	1986-07-15	Macdermid, Incorporated	Method and composition for electroless nickel deposition
US5288313A (en) *	1990-05-31	1994-02-22	Shipley Company Inc.	Electroless plating catalyst
US5075039A (en) *	1990-05-31	1991-12-24	Shipley Company Inc.	Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles
US5120578A (en) *	1990-05-31	1992-06-09	Shipley Company Inc.	Coating composition
WO2000075395A1 (en)	1999-06-09	2000-12-14	Laird Technologies, Inc.	Electrically conductive polymeric foam and method of preparation thereof
US20050121327A1 (en) *	2003-12-04	2005-06-09	Giin-Shan Chen	Electroless-plated deposit process for silicon based dielectric insulating material
EP1793013B1 (en) *	2005-12-05	2017-07-19	Rohm and Haas Electronic Materials LLC	Metallization of dielectrics
EP2639335B1 (en) *	2012-03-14	2015-09-16	Atotech Deutschland GmbH	Alkaline plating bath for electroless deposition of cobalt alloys
TWI707061B (en) *	2015-11-27	2020-10-11	德商德國艾托特克公司	Plating bath composition and method for electroless plating of palladium
EP4545680A1 (en) *	2023-10-26	2025-04-30	Atotech Deutschland GmbH & Co. KG	Electroless, nickel-free copper plating solution and method of using the solution

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3472664A (en) *	1966-09-15	1969-10-14	Enthone	Inhibiting stardusting in electroless copper plating
US3457089A (en) *	1967-04-07	1969-07-22	Shipley Co	Electroless copperplating

1971
- 1971-05-20 US US145508A patent/US3661597A/en not_active Expired - Lifetime
1972
- 1972-01-21 IT IT19688/72A patent/IT946822B/en active
- 1972-02-09 CA CA134,344A patent/CA979603A/en not_active Expired
- 1972-02-29 GB GB930472A patent/GB1352087A/en not_active Expired
- 1972-05-04 JP JP47043801A patent/JPS5236089B1/ja active Pending

Also Published As

Publication number	Publication date
GB1352087A (en)	1974-05-15
JPS5236089B1 (en)	1977-09-13
DE2205869A1 (en)	1972-12-07
IT946822B (en)	1973-05-21
DE2205869B2 (en)	1976-02-19
US3661597A (en)	1972-05-09

Publication	Publication Date	Title
CA976043A (en)	1975-10-14	Activation method for electroless plating
AU7611474A (en)	1976-06-10	Electroless plating
CA979603A (en)	1975-12-16	Electroless copper plating
AU467404B2 (en)	1975-11-27	Electroless copper plating solution and process
CA1001581A (en)	1976-12-14	Plating copper on aluminum
AU464729B2 (en)	1975-09-04	Electroless copper plating
AU462943B2 (en)	1975-06-25	Nickel plating
CA982080A (en)	1976-01-20	Plating metal onto small flexibly based conductors
CA945305A (en)	1974-04-16	Electroless silver plating
CA984236A (en)	1976-02-24	Primer for electroless plating
CA871026A (en)	1971-05-18	Electroless copper plating
CA880776A (en)	1971-09-14	Electroless copper plating solution
CA859001A (en)	1970-12-22	Electroless copper plating
AU430890B2 (en)	1973-01-04	Electroless copper plating
CA936304A (en)	1973-11-06	Electroless copper plating
CA838568A (en)	1970-04-07	Electroless copper plating
CA973509A (en)	1975-08-26	Nickel plating
CA902303A (en)	1972-06-13	Electroless copper plating
AU443206B2 (en)	1973-12-13	Electroless copper plating
AU3138271A (en)	1973-01-04	Electroless copper plating
CA855601A (en)	1970-11-10	Electroless copper plating composition
CA989104A (en)	1976-05-18	Electroless copper plating
AU424078B2 (en)	1971-07-01	Electroless copper plating
AU429168B2 (en)	1971-02-04	Electroless; copper plating
AU428073B2 (en)	1970-06-18	Electroless copper plating