CA1311855C - Method and apparatus for packaging and cooling integrated circuit chips - Google Patents
Method and apparatus for packaging and cooling integrated circuit chipsInfo
- Publication number
- CA1311855C CA1311855C CA000592263A CA592263A CA1311855C CA 1311855 C CA1311855 C CA 1311855C CA 000592263 A CA000592263 A CA 000592263A CA 592263 A CA592263 A CA 592263A CA 1311855 C CA1311855 C CA 1311855C
- Authority
- CA
- Canada
- Prior art keywords
- assembly
- heat sink
- base
- chips
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H10W42/00—
-
- H10W40/611—
-
- H10W40/70—
-
- H10W76/40—
-
- H10W40/231—
-
- H10W40/233—
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- H10W40/242—
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
ABSTRACT
A packaging and cooling assembly for integrated circuit chips includes a base for reception of one or more circuit chips, and a combination heat sink and cover for attachment to the base. The circuit chips are mounted circuit side down on the base, and include flexible lead frames for attachment to bonding pads on the base.
Compliant cushions that generally conform to the shape and size of the chips are held loosely between the circuit sides of the chips, and the base. The heat sink engages the back sides of the circuit chips when it is attached to the base.
This causes the chips to compress the compliant cushions, thereby holding the chips firmly in position, and forming a high thermal conductivity interface between the chips and the heat sink. To further enhance the heat transfer characteristics of the interface, a thin film of fluid is coated on the back sides of each chip to fill in the microvoids which result from asperity contact of the heat sink and chip mating surfaces. A sealing gasket is provided between the heat sink and the base to form a protective enclosure for the chips.
Intermediate housings or heat spreader structures may alternatively be disposed between the chips and the heat sink.
A packaging and cooling assembly for integrated circuit chips includes a base for reception of one or more circuit chips, and a combination heat sink and cover for attachment to the base. The circuit chips are mounted circuit side down on the base, and include flexible lead frames for attachment to bonding pads on the base.
Compliant cushions that generally conform to the shape and size of the chips are held loosely between the circuit sides of the chips, and the base. The heat sink engages the back sides of the circuit chips when it is attached to the base.
This causes the chips to compress the compliant cushions, thereby holding the chips firmly in position, and forming a high thermal conductivity interface between the chips and the heat sink. To further enhance the heat transfer characteristics of the interface, a thin film of fluid is coated on the back sides of each chip to fill in the microvoids which result from asperity contact of the heat sink and chip mating surfaces. A sealing gasket is provided between the heat sink and the base to form a protective enclosure for the chips.
Intermediate housings or heat spreader structures may alternatively be disposed between the chips and the heat sink.
Description
~31 1855 METHOD AND APPARATUS FOR PACKAGING
AND COOLINÇ INTEGRATED CIRCUIT CHIPS
BACKGROUND OF THE INVE~TION
The present invention relates, in general, to a method and apparatus for packaging and cooling Tape Automated Bonding (TAB) type integrated circuit chips.
Removal of heat from integrated circuit tIC) chips is a central problem in modern high performance electronic packaging, requiring careful engineering. Often the well known or standard methods of thermal management are at odds `
with other package engineering or performance requirements. Incorporation of heat dissipation `
structures in a circuit chip module often undesirably increases complexity and size of the mechanical structure. The alternative is to design a structure which is usually not very ,`
efficient at removing heat from the circuit chips, and thus increases the likelihood of temperature related structural and electrical failures.
A number of different techniques have been proposed to avoid these problems. ~sually these techniques involve the use of the chip module housing or package as a heat sink. To insure maximum cooling of the chips contained within the housing, the chips are mechanically connected to ;
the housing or heat sink in a manner so that there is good thermal conductivity between them. This ~
can pose a problem, however, since a rigid -mechanical connection between the housing and the i`
circuit chips can cause excessive stress on the chips which could damage them. If, on the other hand, a less rigid mechanical connection i9 .:
employed, the efficiency of heat transfer from the -`
131 1~55 chips to the heat sink will be reduced, and the probability of chip malfunction due to excessive operating temperature will be correspondingly increased.
Another problem presented by the necessity of coupling the circuit chips to a common heat sink or housing is that the dimensional tolerances from chip to chip on tpe mounting substrate are such that it is difficult to insure that every chip in the module ~ill be coupled to the housing evenly. Some chips may not even be coupled at all to the housing, while excessive mechanical stress may be imparted to other chips.
There have been proposed a number of solutions in the past to these problems. One such solution is used by IBM in their Thermal Conduction Module for packaging and cooling IC's, and employs captive pistons within the heat sink to contact the chip backside, and accommodate variances in the mechanical features and tolerances. This technique is mechanically complex and therefore costly. Other techniques employ the use of thermally conductive material, such as solder or a thixotropic thermal compound to fill the gap between the chips and the heat sink. These techniques are difficult to implement, and there is little or no compliancy or spring action in the chip-heat sink subsystems to insure close mechanical and thermal contact, and accommodation of dimensional tolerance variations.
The present invention seeks to overcome the disadvantages of the prior techniques.
SUMMARY OF THE INVENTION
It is therefore the object of the present invention to provide an improved method and apparatus for packaging and cooling IC chips in which the chips are held in direct thermal contact 3 131 1855 ~
with a one piece heat sink without excessive mechanical stress, and without a requirement that the heat sink and chip assembly be constructed in ~
accordance with strict dimensional tolerances. ~-It is another object of the present invention to provide an efficient cooling structure for electrical circuit chips in which a heat sink also helps form a protective sealed enclosure for the chips.
It is yet another object of the present ;-invention to provide~-a method and apparatus for cooling electric circuit chips which improves the reliability of the chips through improved thermal management and reduced mechanical and thermal stress.
It is a further object of the present ,~
invention to provide a cooling and packaging structure for circuit chips which does not require the chip housings to be bonded to a substrate, and thus permits easy removal of the chips for replacement or reworking.
These and other objects of the invention are attained through the provision of a circuit chip module or assembly which includes a base for supporting a plurality of TAB type IC chips in a circuit side face down manner, and a protective enclosure for attachment to the base which includes a plurality of cooling fins on its top j side to permit the enclosure to act as a heat !:
sink. The inner top surface of the heat sink is',~
designed to contact the backsides of the IC chips when the heat sink is in position. Alternatively, the chips can be mounted within separate intermediate protective housings, or include intermediate heat spreader structures, which are then contacted by the heat sink.
'; '`
The heat sink also includes a peripheral ;
recess on its underside for the reception of a -compliant gasket or O-ring. When the heat sink is positioned on the base, the gasket acts as a sealing ring, and combined with the heat sink and the base, forms a protective enclosure for the IC
chips which prevents them from being exposed to external moisture, dirt, etc.
To accommodate variances in the dimensional tolerances of the assembly, a plurality of compliant elastomeric pads or cushions are disposed, one each, between each IC chip and the base. These pads are generally configured to each of the IC chips and can be, for example, circular or rectangular in shape. The IC chips rest on these pads, but are not bonded to them. Instead, flexible circuit lead frames, which lead from each side of the TAB chips to bonding pads on the base substrate, are bonded to the base, and thereby help secure the chips to the same.
When the heat sink is attached to the base, its inside top surface bears on the backsides of the chips, or housings for the same, and causes the cushions beneath the chips to compress slightly. The TAB flexible lead frames permit this vertical movement. As a result, each of the chips is held firmly in position, but without excessive stress. Also, the pressure exerted between the chips and the heat sink due to the compression of the cushions, causes an intimate mechanical contact between each of the chips and the heat sink, which enhances heat transfer between them.
To further enhance heat transfer between the chips and the heat sink, the interface between them is wetted with a very thin film of a ~;
non-spreading low vapor pressure fluid, such as a ' polyphenyl ether or a ll~uid metal, to fill in the microvoids resulting from asperity contact of the heat sink a.ld chip matlng surfacesO Alternatively, a gas filled gap can be employed for this purpose, although the use of a li~uid is preferred since it is less sensitive to misalignment and small changes in lnterface pressure .
The low stress of the separable interface between each chlp and the heat sink lmproves the rellabllity of the overall structure by reducing the likellhood of thermal stress cracking of the chlp, or breachlng the passivation moisture barrier through microcracking. Slip freedom of the chlp heat sink interface also reduces the tendency of the TAB frame to undergo thermal cycle fatigue induced by thermal mismatches among the varlous components of the assembly. This, comblned with the excellent thermal conductlvity characteristlcs of the interface, and the sealed nature of the enclosure, provldes an assembly for IC chlps whlch is relatlvely slmple in construction, and affords the chlps a great deal of protection from both t}lermal and mechanlcal stress, and external conditions.
The lnventlon may be summarlzed according to the flrst aspect, as an assembly for packaglng and coollng clrcult chips comprlsing: a base; compllant means dlsposed on sald base; a heat sink for engagement wlth sald base havlng an lnner top surface;
and a clamshell houslng surrounding at least a flrst circult chlp, sald clamshell houslng belng held ln posltion between said compliant means and the lnner top surface of said heat slnk.
Accordlng to a second broad aspect, the present inventlon provides an assembly for packaglng and cooling circult ~31 1855 5a chips comprlsing: a base; compllant means disposed on sald base;
at least a first circuit chip disposed with a first side on sald complalnt means, and a second slde faclng upwardly; a heat spreader element bonded to sald second slde of said circuit chlp;
and a heat slnk for engager.lent wlth said base having an inner top surface to contact said heat spreader and compress said compliant means SG that the contact pressure, and therefore the thermal conductivlty, between said inner top surface of sai.d heat sink and said heat spreader is increased.
BRIEF DESCRIPTION OF THF DRAWINGS
The foregolng and additional ob~ects, features, and advantages of the present lnventlon will be apparent from a conslderatlon of the following detailed descriptlon of a preferred embodlment thereof taken ln con~unctlon wlth the accompanylng drawlngs, in which:
FIG. 1 ls a perspective exploded vlew of an assembly for houslng a plurallty of IC chlps;
FIG. 2 ls a partial perspectlve exploded view of a TAB
type IC chlp, a mounting substrate, and a compliant cushion for disposal between the chip and the substrate;
FIG. 3 is a partial cross section of the assembly; and FIGS. 4A and 4B are partial cross sections of the assembly showing different types of chip housing structures.
DETAILED DESCRIPTION O~ THE PREFERRED EMBODIMENT
Turning now to a more detailed consideration of the invention, t~ere is illustrated in FIG. 1, an assembly 10 for housing a plurality of TAB type IC chip 12. Each of the chips 12, comprises an integrated circuit that is embedded or disposed on a silicon wafer, as is conventional. The assembly includes a base support plate 14, which is preferably constructed either of metal or rigid plastic. Disposed on plate 14 is a conventional ceramic format substrate 16 that includes embedded circuitry (not shown) for supplying power and signals to the IC chips 12. A multilayer thin film substrate 18 is disposed on top of format substrate 16, and also includes a plurality of embedded conductors for supplying power and signals from substrate 16 to a plurality of bonding pads (not shown) which are disposed on top of thin film substrate 18. Each of the TAB type IC chips 12 includes, as is conventional, flexible circuit lead frames 20 that are formed on a thin layer of carrier film, and extend from all sides of the chip. Lead frames 20 are bonded to the bonding pads on thin film substrate 18 to electrically connect, and mechanically secure each of the chips 12 to the same.
A plurality of conventional tape type flexible circuit electrical connectors 22 are attached by means of soldering to the bottom edges of format substrate 16. These connectors supply 131 1~55 power and signals to the circuit chips 12 via format substrate 16, thin film substrate 18, and lead frames 20.
A heat sink and protective cover 28 is secured to format substrate 16 and base support plate 14 with a plurality of screws 30 that are inserted through holes (not shown) in heat sink 28, and a plurality of~! holes 32 in substrate 16, plate 14 and connectors 22. Hea~ sink 28 includes a plurality of heat~conducting fins 33 disposed on the top thereof, and is preferably made of metal which has good thermal conductivity, and incidentally acts as an electromagnetic shielding means for chips 12. An O-ring or compliant gasket 34 is disposed between heat sink 28 and format substrate 16 that serves to seal the circuit chips 12 from external dust, water, corrosive gases, etc.
Turning now to FIG. 2, there is illustrated a single TAB type circuit 40 which includes an IC
chip 12 that is disposed circuit side down with a back side 41 facing up on a film type lead frame 20. Lead frame 20 includes a plurality of circuit leads 42 that are connected at one end to IC chip 12. Their other ends are positioned to be bonded to a plurality of bond pads 43 on multilayer thin film substrate 18 when circuit 40 is in position on the same.
A compliant cushion or pad 44 is disposed between thin film substrate 18 and chip 12. This cushion is shown in FIG. 2 as being circular in shape, but can be any shape that generally conforms to the size and shape of chip 12. As will be shown, cushion 44 is designed to be placed under a state of compression when heat sink 28 is attached to the assembly, and contacts the back side of circuit chip 12. Accordingly, cushion 44 should be made of a material, such as silicon rubber or Viton, which has a low modulus to avoid high stresses on chip 12, and is compatible with assembly, cleaning, and test processes. The thickness of cushion 44 should be such that it will be subject to no more than about 25%
compression. In one experiment, a cushion thickness of 0.017 inches was successfully employed.
A partial cross section of the assembled assembly 10 is illustrated in FIG. 3. As shown, heat sink 28 has an inner top surface 46 positioned to engage the back sides of the face down chips 12. Before heat sink 28 is secured to base support plate 14 and format substrate 16, however, a thin film of a non spreading low vapor pressure dielectric fluid 50 is applied to the backsides of chips 12. This film of fluid fills in the microvoids resulting from asperity contact of the heat sink and chip mating surfaces, and thereby enhances heat transfer between the two.
Both 5 and 6 ring polyphenyl ethers (PPE) have been tested for use as fluid 50, and found to perform very well. Alternatively, the thin layer of fluid 50 can be liquid metal, or a gas contained within the assembly.
The inner top surface 46 of heat sink 28 is provided with a smooth surface by standard machining methods to further assure that a low chip to heat sink thermal contact resistance is realized. ordinarily, the surfaces of the backsides of the chips 12 already have adequate smoothness. Typically, the spacing of the non-asperity contacting surfaces of the chips and the heat sink is between 0.5 and 2.0 microns which corresponds to the required thickness of fluid film 50.
131 1~55 When heat sink 28 is assembled to base support plate 14 and format substrate 16 as illustrated in FIG. 3, inner top surface 46 bears down on backside of chip 12, and causes cushion 44 to slightly compress. This movement is permitted by the inherent vertical compliance of TAB type lead frame 20. In this manner, a low stress, but efficient thermal interface is achieved between heat sink 28 and circùit chip 12. The compressibility of ~ushion 44 compensates for minor dimensional variances that may be present in the assembly, and insures that intimate mechanical and thermal contact is maintained between each of the chips 12, and the heat sink 28. Compliant gasket 34, which is shown in FIG. 3 as belng disposed in a peripheral recess 52 in the bottom of heat sink 28, serves to form a sealed enclosure 54 for the chips 12, when heat sink 28 is assembled to base support plate 14. As stated before, this protects the chips 12 from external moisture, dirt, gases, etc.
Turning now to FIGs. 4A and 4B, there are illustrated two alternative embodiments of the present invention wherein the circuit chip 12 is bonded to or contained in, an intermediate housing or structure. Specifically, in FIG. 4A, circuit chip 12 is shown contained in a clamshell housing 60, which is preferably made of high thermal conductivity ceramic, and includes a lower half 62, and an upper half 64. Disposed between the mating surfaces of these two halves are seal means 66 and 68, through which, the TAB lead frame 20 of chip 12 passes. Clamshell housing 60 thus provides a sealed enclosure for chip 12.
Disposed beneath lower half 62 of clamshell 60, is the compliant cushion 44 which sits on multilayer thin film substrate 18, and format substrate 16. The top half 64 of clamshell 60 is held in intimate contact with the inner top surface 46 of heat sink 28, and as in FIG. 3, the fluid layer 50 is disposed between these two elements to improve heat transfer between them.
This, combined with the fact that chip 12 i5 bonded to the inner surface of upper half 64, provides a good thermal path between chip 12 and heat sink 28.
The embodiment illustrated in FIG 4B is similar, however, a heat spreader element 70 is employed in place of clamshell housing 60. Heat spreader 70 is bonded to chip 12, and its top surface is held in contact with the inner top surface 46 of heat sink 28. As with the previous embodiments, fluid layer 50 is provided between heat sink 28, and heat spreader 70.
Two compliant cushion elements, 44a, and 44b, are provided: one disposed beneath chip 12, and the other disposed beneath depending legs 72 and 74 on heat spreader 70.
The embodiments illustrated in FIGs. 4A and 4B achieve the same function as the embodiment illustrated in FIG. 3, however, provide additional sealing and heat dissipation means for the chip 12 as well.
Although the invention has been illustrated in terms of a preferred embodiment, it will be understood that numerous variations and modifications can be made by those of skill in the art without departing from the true spirit and scope of the inventive concept as set forth in the following claims.
AND COOLINÇ INTEGRATED CIRCUIT CHIPS
BACKGROUND OF THE INVE~TION
The present invention relates, in general, to a method and apparatus for packaging and cooling Tape Automated Bonding (TAB) type integrated circuit chips.
Removal of heat from integrated circuit tIC) chips is a central problem in modern high performance electronic packaging, requiring careful engineering. Often the well known or standard methods of thermal management are at odds `
with other package engineering or performance requirements. Incorporation of heat dissipation `
structures in a circuit chip module often undesirably increases complexity and size of the mechanical structure. The alternative is to design a structure which is usually not very ,`
efficient at removing heat from the circuit chips, and thus increases the likelihood of temperature related structural and electrical failures.
A number of different techniques have been proposed to avoid these problems. ~sually these techniques involve the use of the chip module housing or package as a heat sink. To insure maximum cooling of the chips contained within the housing, the chips are mechanically connected to ;
the housing or heat sink in a manner so that there is good thermal conductivity between them. This ~
can pose a problem, however, since a rigid -mechanical connection between the housing and the i`
circuit chips can cause excessive stress on the chips which could damage them. If, on the other hand, a less rigid mechanical connection i9 .:
employed, the efficiency of heat transfer from the -`
131 1~55 chips to the heat sink will be reduced, and the probability of chip malfunction due to excessive operating temperature will be correspondingly increased.
Another problem presented by the necessity of coupling the circuit chips to a common heat sink or housing is that the dimensional tolerances from chip to chip on tpe mounting substrate are such that it is difficult to insure that every chip in the module ~ill be coupled to the housing evenly. Some chips may not even be coupled at all to the housing, while excessive mechanical stress may be imparted to other chips.
There have been proposed a number of solutions in the past to these problems. One such solution is used by IBM in their Thermal Conduction Module for packaging and cooling IC's, and employs captive pistons within the heat sink to contact the chip backside, and accommodate variances in the mechanical features and tolerances. This technique is mechanically complex and therefore costly. Other techniques employ the use of thermally conductive material, such as solder or a thixotropic thermal compound to fill the gap between the chips and the heat sink. These techniques are difficult to implement, and there is little or no compliancy or spring action in the chip-heat sink subsystems to insure close mechanical and thermal contact, and accommodation of dimensional tolerance variations.
The present invention seeks to overcome the disadvantages of the prior techniques.
SUMMARY OF THE INVENTION
It is therefore the object of the present invention to provide an improved method and apparatus for packaging and cooling IC chips in which the chips are held in direct thermal contact 3 131 1855 ~
with a one piece heat sink without excessive mechanical stress, and without a requirement that the heat sink and chip assembly be constructed in ~
accordance with strict dimensional tolerances. ~-It is another object of the present invention to provide an efficient cooling structure for electrical circuit chips in which a heat sink also helps form a protective sealed enclosure for the chips.
It is yet another object of the present ;-invention to provide~-a method and apparatus for cooling electric circuit chips which improves the reliability of the chips through improved thermal management and reduced mechanical and thermal stress.
It is a further object of the present ,~
invention to provide a cooling and packaging structure for circuit chips which does not require the chip housings to be bonded to a substrate, and thus permits easy removal of the chips for replacement or reworking.
These and other objects of the invention are attained through the provision of a circuit chip module or assembly which includes a base for supporting a plurality of TAB type IC chips in a circuit side face down manner, and a protective enclosure for attachment to the base which includes a plurality of cooling fins on its top j side to permit the enclosure to act as a heat !:
sink. The inner top surface of the heat sink is',~
designed to contact the backsides of the IC chips when the heat sink is in position. Alternatively, the chips can be mounted within separate intermediate protective housings, or include intermediate heat spreader structures, which are then contacted by the heat sink.
'; '`
The heat sink also includes a peripheral ;
recess on its underside for the reception of a -compliant gasket or O-ring. When the heat sink is positioned on the base, the gasket acts as a sealing ring, and combined with the heat sink and the base, forms a protective enclosure for the IC
chips which prevents them from being exposed to external moisture, dirt, etc.
To accommodate variances in the dimensional tolerances of the assembly, a plurality of compliant elastomeric pads or cushions are disposed, one each, between each IC chip and the base. These pads are generally configured to each of the IC chips and can be, for example, circular or rectangular in shape. The IC chips rest on these pads, but are not bonded to them. Instead, flexible circuit lead frames, which lead from each side of the TAB chips to bonding pads on the base substrate, are bonded to the base, and thereby help secure the chips to the same.
When the heat sink is attached to the base, its inside top surface bears on the backsides of the chips, or housings for the same, and causes the cushions beneath the chips to compress slightly. The TAB flexible lead frames permit this vertical movement. As a result, each of the chips is held firmly in position, but without excessive stress. Also, the pressure exerted between the chips and the heat sink due to the compression of the cushions, causes an intimate mechanical contact between each of the chips and the heat sink, which enhances heat transfer between them.
To further enhance heat transfer between the chips and the heat sink, the interface between them is wetted with a very thin film of a ~;
non-spreading low vapor pressure fluid, such as a ' polyphenyl ether or a ll~uid metal, to fill in the microvoids resulting from asperity contact of the heat sink a.ld chip matlng surfacesO Alternatively, a gas filled gap can be employed for this purpose, although the use of a li~uid is preferred since it is less sensitive to misalignment and small changes in lnterface pressure .
The low stress of the separable interface between each chlp and the heat sink lmproves the rellabllity of the overall structure by reducing the likellhood of thermal stress cracking of the chlp, or breachlng the passivation moisture barrier through microcracking. Slip freedom of the chlp heat sink interface also reduces the tendency of the TAB frame to undergo thermal cycle fatigue induced by thermal mismatches among the varlous components of the assembly. This, comblned with the excellent thermal conductlvity characteristlcs of the interface, and the sealed nature of the enclosure, provldes an assembly for IC chlps whlch is relatlvely slmple in construction, and affords the chlps a great deal of protection from both t}lermal and mechanlcal stress, and external conditions.
The lnventlon may be summarlzed according to the flrst aspect, as an assembly for packaglng and coollng clrcult chips comprlsing: a base; compllant means dlsposed on sald base; a heat sink for engagement wlth sald base havlng an lnner top surface;
and a clamshell houslng surrounding at least a flrst circult chlp, sald clamshell houslng belng held ln posltion between said compliant means and the lnner top surface of said heat slnk.
Accordlng to a second broad aspect, the present inventlon provides an assembly for packaglng and cooling circult ~31 1855 5a chips comprlsing: a base; compllant means disposed on sald base;
at least a first circuit chip disposed with a first side on sald complalnt means, and a second slde faclng upwardly; a heat spreader element bonded to sald second slde of said circuit chlp;
and a heat slnk for engager.lent wlth said base having an inner top surface to contact said heat spreader and compress said compliant means SG that the contact pressure, and therefore the thermal conductivlty, between said inner top surface of sai.d heat sink and said heat spreader is increased.
BRIEF DESCRIPTION OF THF DRAWINGS
The foregolng and additional ob~ects, features, and advantages of the present lnventlon will be apparent from a conslderatlon of the following detailed descriptlon of a preferred embodlment thereof taken ln con~unctlon wlth the accompanylng drawlngs, in which:
FIG. 1 ls a perspective exploded vlew of an assembly for houslng a plurallty of IC chlps;
FIG. 2 ls a partial perspectlve exploded view of a TAB
type IC chlp, a mounting substrate, and a compliant cushion for disposal between the chip and the substrate;
FIG. 3 is a partial cross section of the assembly; and FIGS. 4A and 4B are partial cross sections of the assembly showing different types of chip housing structures.
DETAILED DESCRIPTION O~ THE PREFERRED EMBODIMENT
Turning now to a more detailed consideration of the invention, t~ere is illustrated in FIG. 1, an assembly 10 for housing a plurality of TAB type IC chip 12. Each of the chips 12, comprises an integrated circuit that is embedded or disposed on a silicon wafer, as is conventional. The assembly includes a base support plate 14, which is preferably constructed either of metal or rigid plastic. Disposed on plate 14 is a conventional ceramic format substrate 16 that includes embedded circuitry (not shown) for supplying power and signals to the IC chips 12. A multilayer thin film substrate 18 is disposed on top of format substrate 16, and also includes a plurality of embedded conductors for supplying power and signals from substrate 16 to a plurality of bonding pads (not shown) which are disposed on top of thin film substrate 18. Each of the TAB type IC chips 12 includes, as is conventional, flexible circuit lead frames 20 that are formed on a thin layer of carrier film, and extend from all sides of the chip. Lead frames 20 are bonded to the bonding pads on thin film substrate 18 to electrically connect, and mechanically secure each of the chips 12 to the same.
A plurality of conventional tape type flexible circuit electrical connectors 22 are attached by means of soldering to the bottom edges of format substrate 16. These connectors supply 131 1~55 power and signals to the circuit chips 12 via format substrate 16, thin film substrate 18, and lead frames 20.
A heat sink and protective cover 28 is secured to format substrate 16 and base support plate 14 with a plurality of screws 30 that are inserted through holes (not shown) in heat sink 28, and a plurality of~! holes 32 in substrate 16, plate 14 and connectors 22. Hea~ sink 28 includes a plurality of heat~conducting fins 33 disposed on the top thereof, and is preferably made of metal which has good thermal conductivity, and incidentally acts as an electromagnetic shielding means for chips 12. An O-ring or compliant gasket 34 is disposed between heat sink 28 and format substrate 16 that serves to seal the circuit chips 12 from external dust, water, corrosive gases, etc.
Turning now to FIG. 2, there is illustrated a single TAB type circuit 40 which includes an IC
chip 12 that is disposed circuit side down with a back side 41 facing up on a film type lead frame 20. Lead frame 20 includes a plurality of circuit leads 42 that are connected at one end to IC chip 12. Their other ends are positioned to be bonded to a plurality of bond pads 43 on multilayer thin film substrate 18 when circuit 40 is in position on the same.
A compliant cushion or pad 44 is disposed between thin film substrate 18 and chip 12. This cushion is shown in FIG. 2 as being circular in shape, but can be any shape that generally conforms to the size and shape of chip 12. As will be shown, cushion 44 is designed to be placed under a state of compression when heat sink 28 is attached to the assembly, and contacts the back side of circuit chip 12. Accordingly, cushion 44 should be made of a material, such as silicon rubber or Viton, which has a low modulus to avoid high stresses on chip 12, and is compatible with assembly, cleaning, and test processes. The thickness of cushion 44 should be such that it will be subject to no more than about 25%
compression. In one experiment, a cushion thickness of 0.017 inches was successfully employed.
A partial cross section of the assembled assembly 10 is illustrated in FIG. 3. As shown, heat sink 28 has an inner top surface 46 positioned to engage the back sides of the face down chips 12. Before heat sink 28 is secured to base support plate 14 and format substrate 16, however, a thin film of a non spreading low vapor pressure dielectric fluid 50 is applied to the backsides of chips 12. This film of fluid fills in the microvoids resulting from asperity contact of the heat sink and chip mating surfaces, and thereby enhances heat transfer between the two.
Both 5 and 6 ring polyphenyl ethers (PPE) have been tested for use as fluid 50, and found to perform very well. Alternatively, the thin layer of fluid 50 can be liquid metal, or a gas contained within the assembly.
The inner top surface 46 of heat sink 28 is provided with a smooth surface by standard machining methods to further assure that a low chip to heat sink thermal contact resistance is realized. ordinarily, the surfaces of the backsides of the chips 12 already have adequate smoothness. Typically, the spacing of the non-asperity contacting surfaces of the chips and the heat sink is between 0.5 and 2.0 microns which corresponds to the required thickness of fluid film 50.
131 1~55 When heat sink 28 is assembled to base support plate 14 and format substrate 16 as illustrated in FIG. 3, inner top surface 46 bears down on backside of chip 12, and causes cushion 44 to slightly compress. This movement is permitted by the inherent vertical compliance of TAB type lead frame 20. In this manner, a low stress, but efficient thermal interface is achieved between heat sink 28 and circùit chip 12. The compressibility of ~ushion 44 compensates for minor dimensional variances that may be present in the assembly, and insures that intimate mechanical and thermal contact is maintained between each of the chips 12, and the heat sink 28. Compliant gasket 34, which is shown in FIG. 3 as belng disposed in a peripheral recess 52 in the bottom of heat sink 28, serves to form a sealed enclosure 54 for the chips 12, when heat sink 28 is assembled to base support plate 14. As stated before, this protects the chips 12 from external moisture, dirt, gases, etc.
Turning now to FIGs. 4A and 4B, there are illustrated two alternative embodiments of the present invention wherein the circuit chip 12 is bonded to or contained in, an intermediate housing or structure. Specifically, in FIG. 4A, circuit chip 12 is shown contained in a clamshell housing 60, which is preferably made of high thermal conductivity ceramic, and includes a lower half 62, and an upper half 64. Disposed between the mating surfaces of these two halves are seal means 66 and 68, through which, the TAB lead frame 20 of chip 12 passes. Clamshell housing 60 thus provides a sealed enclosure for chip 12.
Disposed beneath lower half 62 of clamshell 60, is the compliant cushion 44 which sits on multilayer thin film substrate 18, and format substrate 16. The top half 64 of clamshell 60 is held in intimate contact with the inner top surface 46 of heat sink 28, and as in FIG. 3, the fluid layer 50 is disposed between these two elements to improve heat transfer between them.
This, combined with the fact that chip 12 i5 bonded to the inner surface of upper half 64, provides a good thermal path between chip 12 and heat sink 28.
The embodiment illustrated in FIG 4B is similar, however, a heat spreader element 70 is employed in place of clamshell housing 60. Heat spreader 70 is bonded to chip 12, and its top surface is held in contact with the inner top surface 46 of heat sink 28. As with the previous embodiments, fluid layer 50 is provided between heat sink 28, and heat spreader 70.
Two compliant cushion elements, 44a, and 44b, are provided: one disposed beneath chip 12, and the other disposed beneath depending legs 72 and 74 on heat spreader 70.
The embodiments illustrated in FIGs. 4A and 4B achieve the same function as the embodiment illustrated in FIG. 3, however, provide additional sealing and heat dissipation means for the chip 12 as well.
Although the invention has been illustrated in terms of a preferred embodiment, it will be understood that numerous variations and modifications can be made by those of skill in the art without departing from the true spirit and scope of the inventive concept as set forth in the following claims.
Claims (23)
1. An assembly for packaging and cooling circuit chips comprising:
a base;
compliant means disposed on said base;
a heat sink for engagement with said base having an inner top surface; and a clamshell housing surrounding at least a first circuit chip, said clamshell housing being held in position between said compliant means and the inner top surface of said heat sink.
a base;
compliant means disposed on said base;
a heat sink for engagement with said base having an inner top surface; and a clamshell housing surrounding at least a first circuit chip, said clamshell housing being held in position between said compliant means and the inner top surface of said heat sink.
2. The assembly of claim 1 wherein a thin film of fluid is disposed between said clamshell housing and said heat sink to increase the thermal conductivity between the two.
3. The assembly of claim 2, wherein said fluid is a liquid.
4. The assembly of claim 3, wherein said liquid is a polyphenyl ether.
5. The assembly of claim 3, wherein said liquid is a liquid metal.
6. The assembly of claim 2, wherein said fluid is a gas.
7. The assembly of claim 1, further including seal means disposed between said heat sink and said base to form a sealed enclosure for said clamshell housing.
8. The assembly of claim 1, wherein a flexible circuit lead frame is mechanically and electrically attached at a first end to said circuit chip, extends through said clamshell housing and is attached at a second end to a plurality of bonding pads disposed on said base.
9. The assembly of claim 8, wherein said compliant means comprises a thin elastomeric cushion that is sized generally to conform to said clamshell housing, and held in place between said clamshell housing and said base by said flexible circuit lead frame, and the pressure exerted through said clamshell housing to said cushion by the inner top surface of said heat sink.
10. The assembly of claim 8, wherein said circuit chip and said circuit lead frame form a TAB type integrated circuit.
11. The assembly of claim 1, wherein said heat sink is made of metal to act as an electromagnetic shield for said circuit chip.
12. The assembly of claim 1, wherein said clamshell housing is made of high thermal conductivity ceramic.
13. An assembly for packaging and cooling circuit chips comprising:
a base;
compliant means disposed on said base;
at least a first circuit chip disposed with a first side on said compliant means, and a second side facing upwardly;
a heat spreader element bonded to said second side of said circuit chip; and, a heat sink for engagement with said base having an inner top surface to contact said heat spreader and compress said compliant means so that the contact pressure, and therefore the thermal conductivity, between said inner top surface of said heat sink and said heat spreader is increased.
a base;
compliant means disposed on said base;
at least a first circuit chip disposed with a first side on said compliant means, and a second side facing upwardly;
a heat spreader element bonded to said second side of said circuit chip; and, a heat sink for engagement with said base having an inner top surface to contact said heat spreader and compress said compliant means so that the contact pressure, and therefore the thermal conductivity, between said inner top surface of said heat sink and said heat spreader is increased.
14. The assembly of claim 13, wherein a thin film of fluid is disposed between said heat spreader and said inner top surface of said heat sink to further increase the thermal conductivity between the two.
15. The assembly of claim 13, wherein said fluid is a liquid.
16. The assembly of claim 15, wherein said liquid is a polyphenyl ether.
17. The assembly of claim 15, wherein said liquid is a liquid metal.
18. The assembly of claim 13, wherein said fluid is a gas.
19. The assembly of claim 13, further including seal means disposed between said heat sink and said base to form a sealed enclosure for said circuit ship for protection of the circuit chip from external ambient conditions.
20. The assembly of claim 13, wherein a flexible circuit lead frame is mechanically and electrically attached at a first end to said circuit chip, and at a second end to a plurality of bonding pads disposed on said base.
21. The assembly of claim 20, wherein said compliant means comprises a first elastomeric cushion disposed between said circuit chip and said base, and a second elastomeric cushion disposed between said heat spreader and said base.
22. The assembly of claim 20, wherein said circuit chip and said circuit lead frame form a TAB type integrated circuit.
23. The assembly of claim 13, wherein said heat sink is made of metal to act as an electromagnetic shield for said circiut chip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16267188A | 1988-03-01 | 1988-03-01 | |
| US162,671 | 1988-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1311855C true CA1311855C (en) | 1992-12-22 |
Family
ID=22586637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000592263A Expired - Fee Related CA1311855C (en) | 1988-03-01 | 1989-02-28 | Method and apparatus for packaging and cooling integrated circuit chips |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0357747A1 (en) |
| JP (1) | JPH02501178A (en) |
| CA (1) | CA1311855C (en) |
| WO (1) | WO1989008327A1 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4849856A (en) * | 1988-07-13 | 1989-07-18 | International Business Machines Corp. | Electronic package with improved heat sink |
| US5003429A (en) * | 1990-07-09 | 1991-03-26 | International Business Machines Corporation | Electronic assembly with enhanced heat sinking |
| DE69112389T2 (en) * | 1991-06-06 | 1996-03-21 | Ibm | Electronic packing module. |
| DE4210834C2 (en) * | 1992-04-01 | 1995-10-05 | Siemens Nixdorf Inf Syst | Device for cooling housing-less, film-mounted, integrated components, which are combined in flat assemblies |
| DE4210835C1 (en) * | 1992-04-01 | 1993-06-17 | Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De | |
| DE4217597C2 (en) * | 1992-05-27 | 1994-09-08 | Siemens Nixdorf Inf Syst | Installation system for highly integrated housing-free components mounted on printed circuit boards |
| US6035523A (en) * | 1995-06-16 | 2000-03-14 | Apple Computer, Inc. | Method and apparatus for supporting a component on a substrate |
| JPH10335579A (en) * | 1997-05-27 | 1998-12-18 | Toshiba Corp | High power semiconductor module device |
| US9554488B2 (en) * | 2014-04-18 | 2017-01-24 | Raytheon Company | Method to align surface mount packages for thermal enhancement |
| CN112083776A (en) * | 2020-09-17 | 2020-12-15 | 西安超越申泰信息科技有限公司 | Method for installing computer chip heat-conducting silicone grease |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3234451A (en) * | 1962-01-05 | 1966-02-08 | Int Rectifier Corp | High power rectifier structure |
| US4449580A (en) * | 1981-06-30 | 1984-05-22 | International Business Machines Corporation | Vertical wall elevated pressure heat dissipation system |
| EP0103068B1 (en) * | 1982-09-09 | 1989-01-04 | Siemens Aktiengesellschaft | Cooling device for a plurality of integrated components assembled as a flat structure |
| JPS614255A (en) * | 1984-06-19 | 1986-01-10 | Nec Corp | Package for integrated circuit |
-
1989
- 1989-02-28 WO PCT/US1989/000732 patent/WO1989008327A1/en not_active Ceased
- 1989-02-28 EP EP89903336A patent/EP0357747A1/en not_active Withdrawn
- 1989-02-28 JP JP1503117A patent/JPH02501178A/en active Pending
- 1989-02-28 CA CA000592263A patent/CA1311855C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02501178A (en) | 1990-04-19 |
| WO1989008327A1 (en) | 1989-09-08 |
| EP0357747A1 (en) | 1990-03-14 |
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| Date | Code | Title | Description |
|---|---|---|---|
| MKLA | Lapsed |