CA1119920A - Copper based spinodal alloys - Google Patents
Copper based spinodal alloysInfo
- Publication number
- CA1119920A CA1119920A CA000311664A CA311664A CA1119920A CA 1119920 A CA1119920 A CA 1119920A CA 000311664 A CA000311664 A CA 000311664A CA 311664 A CA311664 A CA 311664A CA 1119920 A CA1119920 A CA 1119920A
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- aging
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 49
- 239000000956 alloy Substances 0.000 title claims abstract description 49
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 22
- 239000010949 copper Substances 0.000 title abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract description 10
- 230000032683 aging Effects 0.000 claims abstract description 31
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 20
- 238000005482 strain hardening Methods 0.000 claims abstract description 18
- 238000000137 annealing Methods 0.000 claims abstract description 16
- 238000010791 quenching Methods 0.000 claims abstract description 15
- 230000000171 quenching effect Effects 0.000 claims abstract description 15
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 14
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 13
- 229910052718 tin Inorganic materials 0.000 claims abstract description 13
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 11
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000012267 brine Substances 0.000 claims abstract description 3
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229910018100 Ni-Sn Inorganic materials 0.000 claims description 6
- 229910018532 Ni—Sn Inorganic materials 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 3
- 239000006104 solid solution Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 230000005587 bubbling Effects 0.000 claims description 2
- 238000005266 casting Methods 0.000 claims description 2
- 239000000374 eutectic mixture Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims 4
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 48
- 239000011135 tin Substances 0.000 description 28
- 239000000155 melt Substances 0.000 description 13
- 230000009286 beneficial effect Effects 0.000 description 4
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000003870 refractory metal Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910017489 Cu I Inorganic materials 0.000 description 1
- 229910017532 Cu-Be Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001257 Nb alloy Inorganic materials 0.000 description 1
- HFEFMUSTGZNOPY-UHFFFAOYSA-N OOOOOOOOOOOOOOOO Chemical compound OOOOOOOOOOOOOOOO HFEFMUSTGZNOPY-UHFFFAOYSA-N 0.000 description 1
- 241001163743 Perlodes Species 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001330 spinodal decomposition reaction Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
Abstract
Plewes, J. T. 7 ABSTRACT
COPPER BASED SPINODAL ALLOYS
This invention relates to alloys which contain Cu, Ni, Sn, and prescribed, relatively small amounts of Mo, Nb, Ta, V, or Fe. A predominantly spinodal structure is developed in such alloys by a treatment which requires annealing, rapid quenching, e.g., in water or brine and aging, and which does not require cold working to develop alloy properties. The shape of articles made from such alloys may be as cast, forged, extruded, hot worked, hot pressed, or cold worked.
Shaped articles are strong, ductile, and have isotropic formability. (FIG. 1) - i -
COPPER BASED SPINODAL ALLOYS
This invention relates to alloys which contain Cu, Ni, Sn, and prescribed, relatively small amounts of Mo, Nb, Ta, V, or Fe. A predominantly spinodal structure is developed in such alloys by a treatment which requires annealing, rapid quenching, e.g., in water or brine and aging, and which does not require cold working to develop alloy properties. The shape of articles made from such alloys may be as cast, forged, extruded, hot worked, hot pressed, or cold worked.
Shaped articles are strong, ductile, and have isotropic formability. (FIG. 1) - i -
Description
~l a~ ~
Plewes, .J. T. 7 Background of the Invention 1. Field of the Invention -The inven-tion is concerned with copper based alloys having predominantly spinodal structure.
Plewes, .J. T. 7 Background of the Invention 1. Field of the Invention -The inven-tion is concerned with copper based alloys having predominantly spinodal structure.
2. ~ n of the _rlor Art Alloys containing copper, nickel, and tin have been proposed as economical substitutes for copper-beryllium and phosphor-bronze alloys in the manufacture of shaped articles such as wire, wire connectors, springs, and relay elements~ ~mong alloy properties on which such use is based are high strength, good formability, corrosion resistance, solderability, and electrical conductivity. Cu-Ni^Sn alloys exhibiting desirable combinations of proper~ies are disclosed in U.S~
patent No~ 3,937,638, U.S. patent ~o. 4,052,204 and U.S.
patent No. 4,090,890, all in the name of J. T. Plewes~
U. SO patent No. 3,937,638 discloses a treatment of a Cu-Ni-Sn cast ingot which involves homogenizing, cold working, and aging and which leads to a 20predominantly spinodal structure in the treated alloy.
For example in the case of an alloy containing seven percent Ni, eight percent Sn, and remainder copper, an exemplary method calls for homogenizing the cast ingot, cold working to achieve 9~ percent area reduction, and aging for eight seconds at a temperature of 425 degrees C. The resulting article has 0.01 percent yield strength of 173,000 psi and ductility o~ 47 percent area reduction to fracture~
U.S. Patent No. 4,052,204 discloses 30 quaternary alloys containing not only Cu, Ni, and Sn, but also at least one additional element selected from among Plewes, J. T. 7 the elements Fe, Zn, ~n, Zr, Nb, Cr, Al, and Mg. A
predominantly spinodal structure is produced in these alloys by a treatment of homogenizing, cold working, and aging analogous to the treatment disclosed in U. S.
patent No. 3,937,538.
U.S. Patent No. 4,090,890 discloses cold rolled and aged strip material made of alloys having a composition similar to the composition of alloys disclosed in U. S. patent No. 3,937,638 and U.S. patent No.
10 4,052,204 and having not only high strength, but also essentially isotropic formability. As a consequence, such strip material is particularly suited for the manufacture of articles which require bending of the strip in directions having a substantial component perpendicular to the rolling direction.
Cu7Ni--Sn alloys and their properties are a subject also of the following papers: L. H. Schwartz, S. ~ahajan, and J. T. Plewes, "Spinodal ~ecomposition in a Cu~g wt%
Ni 6 wt% Sn Alloyi', Acta Metallurgica, Vol. 22, May 1974, 20pp. 601-509; L. H. Schwartz and J. T. Plewes, "Spinodal Decomposition in Cu~9wt% Ni~6wt% Sn'II. A Critical Examination of Mechanical Strength of Spinodal Alloys", Acta Metallurgica, Vol. 22, July 1974, pp. 911~921; John T. Plewes, "Spinodal Cu~Ni 5n Alloys are Strong and Superductile", Metal_P_~ress, July 1974, pp. 46~50; J. T.
Plewes, "High~Strength Cu~Ni Sn Alloys by Thermo~mechanical Processing", Metallur~al Transactions A, Vol. 6A, March 1975, pp. 537~544.
The achievement of good strength and bend 30 properties in copper based alloys containing Ni and Sn is an object also of the method disclosed in U. S. patent No. 3,941,620, M. J. Pryor et a]., "Method of Processing Copper Base Alloys". Pryor discloses a method for treating an ingot by homogenizing7 cold rolling, aging, and again cold rolling.
Summary of the Invention In accordance with an aspect of the invention there is provided a method for manufacturing a body of a predominantly spinodal alloy by a treatment of an initial body which, in an amount of at least 95 percent by weight, consists of Cu, Ni, .Sn and at least one additional element, wherein Ni is present in an amount of from 3-20 weight percent, Sn is present in an amount of from 3.5 to 10 weight percent at 3 percent Ni to 3.5 to 12 weight percent at 20 percent Ni, and said additional element is selected from Mo in an amount of from 0.02-0.07 weight percent at 3 percent Ni to 0.05-0.1 weight percent at 20 percent Ni, Nb ln an amount of from 0.05-0.3 weight percent at 3 percent Ni to 0.08-0.35 weight percent at 20 percent Mi, Ta in an amount of from 0.02-0.1 weight percent at 3 percent Ni to 0.05-0.3 weight percent at 20 percent Ni, V in an amount of from 0.1-0.5 weight percent at 3 percent Ni to 0.02-0.5 weight percent at 20 percent Ni, and Fe in an amoun-t of from 1-5 weight percent at 3 percent Ni to 2-7 weight percent at 20 percent Ni, wherein said treatment is conducted so as to terminate with the steps of short term low temperature annealing so as to form a solid solution of the Cu-Ni-Sn component of the alloy and to precipitate the said at least one additional element, rapid ~uenching and aging, carried out in the order stated, and, optionally, including in the said treatment a cold working in an amount of less than 25 percent area reduction to be conducted prior to the said aging.
It has been discovered that in copper based alloys containing from 3-20 weight percent Ni, from 3.5-10 weight percent Sn at 3 percent Ni and from 3.5-12 weight percent Sn at 20 percent Ni, an element selected from the group consisting of Mo, Nb, Ta, V, and Fe, and remainder copper, a predominantly spinodal structure can be developed by a treatment of annealing, ~uenchingl and aging. Since the treatment does not require cold deformation, such alloys are equally suited Eor the manufacture of articles by hot working, cold working, casting, forging, extruding, hot pressing, or cold working. Resulting article are strong, ductile, and have isotropic formability.
Brief Description of the Drawing FIG. 1 is a diagram which shows combinations of yield strength on the ordinate and fracture elongation on the abscissa realized in two prior art alloys (designated 1 and 2) and four alloys of the invention (designated 3, 4, 5 and 6).
FIG. 2 is a diagram which shows combinations of yield strength on the ordinate and elongation on the abscissa of ~ Cu-15Ni-8Sn-0.2Nb alloy which was annealed and aged by various amounts.
Detailed Description FIG. 1 shows curves 1 and 2 corresponding to prior art al]oys Cu - ]5 percent Ni - 8 percent Sn and Cu - 3a -Ple~es, J. T. 7 - 2 percent Be, and curves 3, 4, 5 and ~ corresponding, respectively, to new alloys Cu - 15 percent Ni - 8 percent Sn - 0.07 percent Mo, Cu - 15 percent Ni - 8 percent Sn -0.02 percent Ta, Cu - 15 percent Ni - 8 percent Sn - 0.18 percent Nb, and Cu - 15 percent Ni - ~ percent Sn - 0.38 percent V. Cu-Be alloy is as commercially available.
Cu-Ni-Sn alloys have been annealed a~ 825 degrees C~ for one hour, water quenched, and aged at 400 degrees C. by varying amounts, longer aging times corresponding to 10 higher levels of yield strength an~ shorter aging times corresponding to higher levels of fracture elongation.
FIG. 1 illustrates the superior strength and ductility of the new a11QYS as compared with prior art alloys.
~ IG. 2 shows properties of 0.03" (0.076 cm.~ wire of a Cu - 15 percent Ni - 8 percent Sn - 0.2 percent Nb alloy. Solid curves correspond to properties of a wire which was annealed at a temperature of 825 degrees C. for periods of from 7-20 minutes, 1 hour, 4 hours, and 17 hours, followed by quenching and aging at ~00 degrees C.
20 for 1 hour~ Dashed curves correspond to properties of a wire which was annealed at 900 degrees C. for periods of 1 hour, 4 hours, and 17 hours, followed by quenching and aging at 400 degrees C. for 1 hour~ FIG. 2 illustrates the influence of anneal temperature on ultimate properties of the alloy and, for fixed anneal temperature, the influence of anneal time on such properties. Apparent, in view of FIG. 2, is the desirability of short anneal times and low anneal temperatures.
Alloys of the invention contain 3-20 weight 30 percent Ni, 3.5-10 weight percent Sn at 3 percent Ni and
patent No~ 3,937,638, U.S. patent ~o. 4,052,204 and U.S.
patent No. 4,090,890, all in the name of J. T. Plewes~
U. SO patent No. 3,937,638 discloses a treatment of a Cu-Ni-Sn cast ingot which involves homogenizing, cold working, and aging and which leads to a 20predominantly spinodal structure in the treated alloy.
For example in the case of an alloy containing seven percent Ni, eight percent Sn, and remainder copper, an exemplary method calls for homogenizing the cast ingot, cold working to achieve 9~ percent area reduction, and aging for eight seconds at a temperature of 425 degrees C. The resulting article has 0.01 percent yield strength of 173,000 psi and ductility o~ 47 percent area reduction to fracture~
U.S. Patent No. 4,052,204 discloses 30 quaternary alloys containing not only Cu, Ni, and Sn, but also at least one additional element selected from among Plewes, J. T. 7 the elements Fe, Zn, ~n, Zr, Nb, Cr, Al, and Mg. A
predominantly spinodal structure is produced in these alloys by a treatment of homogenizing, cold working, and aging analogous to the treatment disclosed in U. S.
patent No. 3,937,538.
U.S. Patent No. 4,090,890 discloses cold rolled and aged strip material made of alloys having a composition similar to the composition of alloys disclosed in U. S. patent No. 3,937,638 and U.S. patent No.
10 4,052,204 and having not only high strength, but also essentially isotropic formability. As a consequence, such strip material is particularly suited for the manufacture of articles which require bending of the strip in directions having a substantial component perpendicular to the rolling direction.
Cu7Ni--Sn alloys and their properties are a subject also of the following papers: L. H. Schwartz, S. ~ahajan, and J. T. Plewes, "Spinodal ~ecomposition in a Cu~g wt%
Ni 6 wt% Sn Alloyi', Acta Metallurgica, Vol. 22, May 1974, 20pp. 601-509; L. H. Schwartz and J. T. Plewes, "Spinodal Decomposition in Cu~9wt% Ni~6wt% Sn'II. A Critical Examination of Mechanical Strength of Spinodal Alloys", Acta Metallurgica, Vol. 22, July 1974, pp. 911~921; John T. Plewes, "Spinodal Cu~Ni 5n Alloys are Strong and Superductile", Metal_P_~ress, July 1974, pp. 46~50; J. T.
Plewes, "High~Strength Cu~Ni Sn Alloys by Thermo~mechanical Processing", Metallur~al Transactions A, Vol. 6A, March 1975, pp. 537~544.
The achievement of good strength and bend 30 properties in copper based alloys containing Ni and Sn is an object also of the method disclosed in U. S. patent No. 3,941,620, M. J. Pryor et a]., "Method of Processing Copper Base Alloys". Pryor discloses a method for treating an ingot by homogenizing7 cold rolling, aging, and again cold rolling.
Summary of the Invention In accordance with an aspect of the invention there is provided a method for manufacturing a body of a predominantly spinodal alloy by a treatment of an initial body which, in an amount of at least 95 percent by weight, consists of Cu, Ni, .Sn and at least one additional element, wherein Ni is present in an amount of from 3-20 weight percent, Sn is present in an amount of from 3.5 to 10 weight percent at 3 percent Ni to 3.5 to 12 weight percent at 20 percent Ni, and said additional element is selected from Mo in an amount of from 0.02-0.07 weight percent at 3 percent Ni to 0.05-0.1 weight percent at 20 percent Ni, Nb ln an amount of from 0.05-0.3 weight percent at 3 percent Ni to 0.08-0.35 weight percent at 20 percent Mi, Ta in an amount of from 0.02-0.1 weight percent at 3 percent Ni to 0.05-0.3 weight percent at 20 percent Ni, V in an amount of from 0.1-0.5 weight percent at 3 percent Ni to 0.02-0.5 weight percent at 20 percent Ni, and Fe in an amoun-t of from 1-5 weight percent at 3 percent Ni to 2-7 weight percent at 20 percent Ni, wherein said treatment is conducted so as to terminate with the steps of short term low temperature annealing so as to form a solid solution of the Cu-Ni-Sn component of the alloy and to precipitate the said at least one additional element, rapid ~uenching and aging, carried out in the order stated, and, optionally, including in the said treatment a cold working in an amount of less than 25 percent area reduction to be conducted prior to the said aging.
It has been discovered that in copper based alloys containing from 3-20 weight percent Ni, from 3.5-10 weight percent Sn at 3 percent Ni and from 3.5-12 weight percent Sn at 20 percent Ni, an element selected from the group consisting of Mo, Nb, Ta, V, and Fe, and remainder copper, a predominantly spinodal structure can be developed by a treatment of annealing, ~uenchingl and aging. Since the treatment does not require cold deformation, such alloys are equally suited Eor the manufacture of articles by hot working, cold working, casting, forging, extruding, hot pressing, or cold working. Resulting article are strong, ductile, and have isotropic formability.
Brief Description of the Drawing FIG. 1 is a diagram which shows combinations of yield strength on the ordinate and fracture elongation on the abscissa realized in two prior art alloys (designated 1 and 2) and four alloys of the invention (designated 3, 4, 5 and 6).
FIG. 2 is a diagram which shows combinations of yield strength on the ordinate and elongation on the abscissa of ~ Cu-15Ni-8Sn-0.2Nb alloy which was annealed and aged by various amounts.
Detailed Description FIG. 1 shows curves 1 and 2 corresponding to prior art al]oys Cu - ]5 percent Ni - 8 percent Sn and Cu - 3a -Ple~es, J. T. 7 - 2 percent Be, and curves 3, 4, 5 and ~ corresponding, respectively, to new alloys Cu - 15 percent Ni - 8 percent Sn - 0.07 percent Mo, Cu - 15 percent Ni - 8 percent Sn -0.02 percent Ta, Cu - 15 percent Ni - 8 percent Sn - 0.18 percent Nb, and Cu - 15 percent Ni - ~ percent Sn - 0.38 percent V. Cu-Be alloy is as commercially available.
Cu-Ni-Sn alloys have been annealed a~ 825 degrees C~ for one hour, water quenched, and aged at 400 degrees C. by varying amounts, longer aging times corresponding to 10 higher levels of yield strength an~ shorter aging times corresponding to higher levels of fracture elongation.
FIG. 1 illustrates the superior strength and ductility of the new a11QYS as compared with prior art alloys.
~ IG. 2 shows properties of 0.03" (0.076 cm.~ wire of a Cu - 15 percent Ni - 8 percent Sn - 0.2 percent Nb alloy. Solid curves correspond to properties of a wire which was annealed at a temperature of 825 degrees C. for periods of from 7-20 minutes, 1 hour, 4 hours, and 17 hours, followed by quenching and aging at ~00 degrees C.
20 for 1 hour~ Dashed curves correspond to properties of a wire which was annealed at 900 degrees C. for periods of 1 hour, 4 hours, and 17 hours, followed by quenching and aging at 400 degrees C. for 1 hour~ FIG. 2 illustrates the influence of anneal temperature on ultimate properties of the alloy and, for fixed anneal temperature, the influence of anneal time on such properties. Apparent, in view of FIG. 2, is the desirability of short anneal times and low anneal temperatures.
Alloys of the invention contain 3-20 weight 30 percent Ni, 3.5-10 weight percent Sn at 3 percent Ni and
3.5-12 weight percent Sn at 20 percent Ni. Limits on Sn %~
Plewes, J. T. 7 contents for intermediary levels of ~i may be obtained by linear interpolation between limits at 3 percent and 20 percent Ni.
While the preparation of a melt of a Cu-Ni-Sn Fe alloy of the invention may proceed by customary metallurgical practice, special care is required in the preparation of melts containing refractory elements Mo Nb, Ta, or V.
Preparation of such latter melts may proceed~ for 10 example, as follows. Cu and Ni or a Cu-Ni alloy are melted in air at a temperature in the vicinity of 1300 degrees C. resulting in a melt high in oxygen and low in hydrogen contents. To reduce oxygen contents a cover oE
dry graphite chips is placed on the melt.
Simultaneously, an inert gas such as argon is bubbled through the melt for a period of about one half hour to prevent hydrogen contents of the melt from increasing.
Sn is added while bubbling of the inert gas is maintained, and the temperature of the Cu~Ni~Sn melt is 20 reduced to the vicinity of 1250 degrees C. It has been found beneficial to add a small amount of Mn to the melt at this point to tie up residual sulfur. It is also beneficial at this point to plunge a small amount of Mg into the melt as a pre~deoxidant. Amounts of Mn in the range oE 0.1-0.3 percent and ~g in the range of 0.05:0.1 percent are generally adequate for such purposes, Mg being added preferably in the form of CuMg alloy. Mo, Nb, Ta, or V is now plunged into the melt, preferably as a eutectic mixture with Ni to facilitate mixing~ Lo~
30 meltin~ point eutectic compositions are as follows:
.4, Il, ~le~es, J T. 7 Ni-50 percent ~b, Ni-35 percent Ta, Ni-47 percent ~, Ni-46 percent Mo.
rhe process described above for adding refractory metals Mo, ~b, Ta, or V to a melt of Cu, Ni, and Sn has been found to have a yield of 60-80 percent. To ensure the presence in the final alloy of a desired percentage of the refractory metal, a correspondingly greater amount of starting material has to be added initially.
The addition of Mg to the melt as called for 10above may result in residual amounts of Mg to be present in the alloy. Such presence does not materially diminish optimal alloy properties and is tolerable in amounts of up to 0.1 percent Mg. Mn may be tolerated in even larger amounts and may be intentionally added in amounts up to 5 percent/ e.g., as a less expensive substitute for copper.
Similarly, amounts of up to 5 percent gn may replace Cu without undue degradation of alloy preperties. Other impurities, such as may be present in commercially available alloy ingredients, are tolerable in amounts of 20 up to 0.2 percent Co, 0.1 percent Al, 0~01 percent P, 0.05 percent Si, 0.005 percent Pb. ~xygen contents should be kept below 100 ppm to prevent the formation of refractory metal oxides. Combined amounts of impurities in the alloy should preferably not exceed 5 weight percent.
An article of the invention may be shaped as cast or a cast ingot may undergo processing and shaping at temperatures at or above the recrystallization temperature by means such a forging, extruding, hot 30 working, or hot pressing. The shaped article is annealed at a temperature in a range which depends on Ni and Sn - 6 _ Plewes, J. T. 7 contents of the alloy as shown in Table 1 for four exemplary alloys. In general, for fixed amounts of Ni, the upper limit on anneal temperature decreases with increasing amounts of Sn and the lower limit on anneal temperature increases with increasing amounts of Sn.
Conversely, for fixed amounts of Sn, both the upper and the lower limit on anneal temperature increase with increasing amounts of Ni. To prevent coarsening of the dis~ribution, annealing temperatures are preferably 10 chosen close to ~he lower limit of the permissible range as shown in Table 1 for exemplary combinations of Cu, Ni, and Sn. Moreover, as illustrated in FIG. 2, annealing times should preferably not exceed four hours.
Annealing times as short as 7-~0 minutes may be sufficient for small articles. Such annealing causes formation of a solid solution of the Cu-Ni-Sn component of the alloy and, simultaneously~ precipitation of the additional element at the grain boundaries as well as within the matrix.
After annealing, the article is water or brine quenched and aged at a temperature in the range of from 300 degrees C. to 475 degrees C. An aging temperature in the range of 375-425 degrees C. may be considered typical; however, aging temperature may be adjusted to compensate for longer or shorter aging time as may be practical depending on the size and shape of the article.
Specifically, in the interest of uniform internal temperature distribution, bulky articles are preferably aged for a longer perlod of time while wire and strip 30 material may be aged, e.g., in a continuous process, Eor a shorter period of time. An increase in aging time by a 3~ .
Plewes, J. T. 7 factor of ten typically corresponds to a decrease in aging temperature by about 50 degrees C. and conversely.
However, aging time must not exceed approximately 475 degrees C, higher temperatures beiny conducive to an undesirable embrittling nucleation-and-growth transformation. It is a characteristic feature of the disclosed method that no use need be made of cold working to develop a spinodal structure and that, consequently, an article of manufacture according to the invention may be shaped as cast, forged, hot worked, hot pressed, or e~truded, i~e., shaped at temperatures at or above the recrystallization temperature of the alloy. While processing involving no cold work is a preferred mode of manufacturing articles according to the invention, a step of cold working prior to aging to further shape an article by any desired amount is not precluded. The presence of an additional element selected from the group consisting of Mo, Nb, Ta, V, and Fe in the alloy has the additional beneficial effect that, in applications in 29 which strength o~ the shaped article is a primary requirement, higher levels of strength are achieved for a given amount of cold work compared with strength achieved in a correspondin~ Cu-I~i Sn alloy not containing such additional element. Amounts of cold work oE less than 25 percent area reduction or even less than 20 percent or 15 percent area reduction are beneficial in this context.
In the event cold working is utilized r customary duplexing of cold working and aging is not precluded.
Specifically, instead of terminating in se~uential 30annealing, quenching, cold working, and aging, such treatment may terminate, e.g., in the sequential steps of Plewes, J T. 7 annealing, quenching, cold working, aging, quenching, cold working, aging. Still more eleborate methods are also within the scope of the invention provided they comprise, in the order stated, the steps of annealing, quenching, and aging, which order is implied throuyhout this disclosure.
It has been ascertained that amounts of Mo, Nb, Ta, V, or Fe which are desirable for the purpose of the invention lie within relatively narrow and well-defined ranges outside of which distinctly inferior properties are realized. Specific limits for an alloy containing 3 percent Ni are 0.02-0.07 weight percent Mo, ~.05-0.3 weight percent Nb, 0.02-~.1 weight percent Ta, ~.10-0.5 weight percent V, or 1-5 weight percent Fe. For an alloy containing 20 percent Ni, corresponding limits are 0.05-0.1 weight percent Mo, 0.08-0.35 weight percent Nb, 0.05-0.3 weight percent Ta, 0.2-0.5 weight percent V, or 2-7 weight percent Fe. For intermediary amounts of nickel, limits for Mo, Nb, Ta, and V may be obtained by 20 linear interpolation between limits at 3 percent and at 2~ percent Ni. Amounts below the given lower limits are less desirable because of insufficient precipitation of the additional element during annealing, amounts exceeding the given upper limits favor the presence of Ni-refractory intermetallics which may cause reduced ductility. For the purpose of the invention, additives Mo, Nb, Ta, V, and Fe may also be used in combination in which case at least one o~ them should preferably be present in an amount within the stated limits.
Examples 1 through 18 are shown in Table 2.
Melts containing refractory elements Mo, Nb, Ta, or V
_ g _ Plewes, J. T. 7 were prepared by the method described a~ove. Cast ingots were cold rolled by an amount o~ 50 percent area reduction prior to annealing, quenching, and aging.
Annealing temperature was 825 degrees C. for examples 1-10, 850 degrees C. for examples 11-14, and 900 degrees ~;
C. for examples 15-18.
- 10 - ' ~A~LE 1 Plewes, J. T. 7 Annealin~ Ten~per~ture T:~e~rees ~, ,0 Ni ~ Sn P~n~e rel erred ~an~e ~25 ~ 975 652 - 700 ~ 67 5 - ~6û 67 5 - 7 50 ~; 740 - 975 75~ - 800 9 825 - 900 82 ~ - 850 77~ - 975 775 - 825 820 - 900 820 - 8~0 ; ' ' . ' ' ' ' '' ~ , ~
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Plewes, J. T. 7 contents for intermediary levels of ~i may be obtained by linear interpolation between limits at 3 percent and 20 percent Ni.
While the preparation of a melt of a Cu-Ni-Sn Fe alloy of the invention may proceed by customary metallurgical practice, special care is required in the preparation of melts containing refractory elements Mo Nb, Ta, or V.
Preparation of such latter melts may proceed~ for 10 example, as follows. Cu and Ni or a Cu-Ni alloy are melted in air at a temperature in the vicinity of 1300 degrees C. resulting in a melt high in oxygen and low in hydrogen contents. To reduce oxygen contents a cover oE
dry graphite chips is placed on the melt.
Simultaneously, an inert gas such as argon is bubbled through the melt for a period of about one half hour to prevent hydrogen contents of the melt from increasing.
Sn is added while bubbling of the inert gas is maintained, and the temperature of the Cu~Ni~Sn melt is 20 reduced to the vicinity of 1250 degrees C. It has been found beneficial to add a small amount of Mn to the melt at this point to tie up residual sulfur. It is also beneficial at this point to plunge a small amount of Mg into the melt as a pre~deoxidant. Amounts of Mn in the range oE 0.1-0.3 percent and ~g in the range of 0.05:0.1 percent are generally adequate for such purposes, Mg being added preferably in the form of CuMg alloy. Mo, Nb, Ta, or V is now plunged into the melt, preferably as a eutectic mixture with Ni to facilitate mixing~ Lo~
30 meltin~ point eutectic compositions are as follows:
.4, Il, ~le~es, J T. 7 Ni-50 percent ~b, Ni-35 percent Ta, Ni-47 percent ~, Ni-46 percent Mo.
rhe process described above for adding refractory metals Mo, ~b, Ta, or V to a melt of Cu, Ni, and Sn has been found to have a yield of 60-80 percent. To ensure the presence in the final alloy of a desired percentage of the refractory metal, a correspondingly greater amount of starting material has to be added initially.
The addition of Mg to the melt as called for 10above may result in residual amounts of Mg to be present in the alloy. Such presence does not materially diminish optimal alloy properties and is tolerable in amounts of up to 0.1 percent Mg. Mn may be tolerated in even larger amounts and may be intentionally added in amounts up to 5 percent/ e.g., as a less expensive substitute for copper.
Similarly, amounts of up to 5 percent gn may replace Cu without undue degradation of alloy preperties. Other impurities, such as may be present in commercially available alloy ingredients, are tolerable in amounts of 20 up to 0.2 percent Co, 0.1 percent Al, 0~01 percent P, 0.05 percent Si, 0.005 percent Pb. ~xygen contents should be kept below 100 ppm to prevent the formation of refractory metal oxides. Combined amounts of impurities in the alloy should preferably not exceed 5 weight percent.
An article of the invention may be shaped as cast or a cast ingot may undergo processing and shaping at temperatures at or above the recrystallization temperature by means such a forging, extruding, hot 30 working, or hot pressing. The shaped article is annealed at a temperature in a range which depends on Ni and Sn - 6 _ Plewes, J. T. 7 contents of the alloy as shown in Table 1 for four exemplary alloys. In general, for fixed amounts of Ni, the upper limit on anneal temperature decreases with increasing amounts of Sn and the lower limit on anneal temperature increases with increasing amounts of Sn.
Conversely, for fixed amounts of Sn, both the upper and the lower limit on anneal temperature increase with increasing amounts of Ni. To prevent coarsening of the dis~ribution, annealing temperatures are preferably 10 chosen close to ~he lower limit of the permissible range as shown in Table 1 for exemplary combinations of Cu, Ni, and Sn. Moreover, as illustrated in FIG. 2, annealing times should preferably not exceed four hours.
Annealing times as short as 7-~0 minutes may be sufficient for small articles. Such annealing causes formation of a solid solution of the Cu-Ni-Sn component of the alloy and, simultaneously~ precipitation of the additional element at the grain boundaries as well as within the matrix.
After annealing, the article is water or brine quenched and aged at a temperature in the range of from 300 degrees C. to 475 degrees C. An aging temperature in the range of 375-425 degrees C. may be considered typical; however, aging temperature may be adjusted to compensate for longer or shorter aging time as may be practical depending on the size and shape of the article.
Specifically, in the interest of uniform internal temperature distribution, bulky articles are preferably aged for a longer perlod of time while wire and strip 30 material may be aged, e.g., in a continuous process, Eor a shorter period of time. An increase in aging time by a 3~ .
Plewes, J. T. 7 factor of ten typically corresponds to a decrease in aging temperature by about 50 degrees C. and conversely.
However, aging time must not exceed approximately 475 degrees C, higher temperatures beiny conducive to an undesirable embrittling nucleation-and-growth transformation. It is a characteristic feature of the disclosed method that no use need be made of cold working to develop a spinodal structure and that, consequently, an article of manufacture according to the invention may be shaped as cast, forged, hot worked, hot pressed, or e~truded, i~e., shaped at temperatures at or above the recrystallization temperature of the alloy. While processing involving no cold work is a preferred mode of manufacturing articles according to the invention, a step of cold working prior to aging to further shape an article by any desired amount is not precluded. The presence of an additional element selected from the group consisting of Mo, Nb, Ta, V, and Fe in the alloy has the additional beneficial effect that, in applications in 29 which strength o~ the shaped article is a primary requirement, higher levels of strength are achieved for a given amount of cold work compared with strength achieved in a correspondin~ Cu-I~i Sn alloy not containing such additional element. Amounts of cold work oE less than 25 percent area reduction or even less than 20 percent or 15 percent area reduction are beneficial in this context.
In the event cold working is utilized r customary duplexing of cold working and aging is not precluded.
Specifically, instead of terminating in se~uential 30annealing, quenching, cold working, and aging, such treatment may terminate, e.g., in the sequential steps of Plewes, J T. 7 annealing, quenching, cold working, aging, quenching, cold working, aging. Still more eleborate methods are also within the scope of the invention provided they comprise, in the order stated, the steps of annealing, quenching, and aging, which order is implied throuyhout this disclosure.
It has been ascertained that amounts of Mo, Nb, Ta, V, or Fe which are desirable for the purpose of the invention lie within relatively narrow and well-defined ranges outside of which distinctly inferior properties are realized. Specific limits for an alloy containing 3 percent Ni are 0.02-0.07 weight percent Mo, ~.05-0.3 weight percent Nb, 0.02-~.1 weight percent Ta, ~.10-0.5 weight percent V, or 1-5 weight percent Fe. For an alloy containing 20 percent Ni, corresponding limits are 0.05-0.1 weight percent Mo, 0.08-0.35 weight percent Nb, 0.05-0.3 weight percent Ta, 0.2-0.5 weight percent V, or 2-7 weight percent Fe. For intermediary amounts of nickel, limits for Mo, Nb, Ta, and V may be obtained by 20 linear interpolation between limits at 3 percent and at 2~ percent Ni. Amounts below the given lower limits are less desirable because of insufficient precipitation of the additional element during annealing, amounts exceeding the given upper limits favor the presence of Ni-refractory intermetallics which may cause reduced ductility. For the purpose of the invention, additives Mo, Nb, Ta, V, and Fe may also be used in combination in which case at least one o~ them should preferably be present in an amount within the stated limits.
Examples 1 through 18 are shown in Table 2.
Melts containing refractory elements Mo, Nb, Ta, or V
_ g _ Plewes, J. T. 7 were prepared by the method described a~ove. Cast ingots were cold rolled by an amount o~ 50 percent area reduction prior to annealing, quenching, and aging.
Annealing temperature was 825 degrees C. for examples 1-10, 850 degrees C. for examples 11-14, and 900 degrees ~;
C. for examples 15-18.
- 10 - ' ~A~LE 1 Plewes, J. T. 7 Annealin~ Ten~per~ture T:~e~rees ~, ,0 Ni ~ Sn P~n~e rel erred ~an~e ~25 ~ 975 652 - 700 ~ 67 5 - ~6û 67 5 - 7 50 ~; 740 - 975 75~ - 800 9 825 - 900 82 ~ - 850 77~ - 975 775 - 825 820 - 900 820 - 8~0 ; ' ' . ' ' ' ' '' ~ , ~
:~ .
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_ 12 - : ,",....... ' . : , J, T. Plewes 7 t-.
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Claims (9)
1. A method for manufacturing a body of a predom-inantly spinodal alloy by a treatment of an initial body which, in an amount of at least 95 percent by weight, consists of Cu, Ni, Sn and at least one additional element, wherein Ni is present in an amount of from 3-20 weight percent, Sn is present in an amount of from 3.5 to 10 weight percent at 3 percent Ni to 3.5 to 12 weight percent at 20 percent Ni, and said additional element is selected from Mo in an amount of from 0.02 0.07 weight percent at 3 percent Ni to 0.05-0.1 weight percent at 20 percent Ni, Nb in an amount of from 0.05-0.3 weight percent at 3 percent Ni to 0.08-0.35 weight percent at 20 percent Ni r Ta in an amount of from 0.02-0.1 weight percent at 3 percent Ni to 0.05-0.3 weight percent at 20 percent Ni, V in an amount of from 0.1 0.5 weight percent at 3 percent Ni to 0.02-0.5 weight percent at 20 percent Ni, and Fe in an amount of from 1-5 weight percent at 3 percent Ni to 2-7 weight percent at 20 percent Ni, wherein said treatment is conducted so as to terminate with the steps of short term low temperature annealing so as to form a solid solution of the Cu-Ni-Sn component of the alloy and to precipitate the said at least one additional element, rapid quenching and aging, carried out in the order stated, and, optionally, including in the said treatment a cold working in an amount of less than 25 percent area reduction to be conducted prior to the said aging.
2. Method according to claim 1, which comprises carrying out the said aging at temperatures in the range of from 300 to 475 degrees C.
3. A method according to claim 1 which comprises conducting the said rapid quenching as a water quenching or brine quenching.
4. Method according to claim 1 or 2 or 3, which comprises conducting the said optional step of cold working in an amount of less than 20 percent area reduction, preferably of less than 15 percent.
5. Method according to claim 1 or 2 or 3 which comprises terminating said treatment in the sequential steps of the short term low temperature annealing, rapid quenching and aging.
6. Method according to claim 1, which comprises terminating said treatment in the sequential steps of the short term low temperature annealing, rapid quenching, cold working and aging.
7. Method according to claim 6, which comprises optionally repeating at least once the subsequence of steps of rapid quenching, cold working and aging.
8. Method according to claim 1 , which comprises selecting said additional element from Mo, Nb, Ta and/or V and casting said body from a final melt which is prepared by providing a first melt of constituent elements Cu and Ni, placing a cover of dry graphite on the first melt, bubbling an inert gas through the first melt, adding constituent element Sn to the first melt to obtain a second melt of Cu, Ni and Sn, adding to the second melt an amount of Mn in the range of from 0.1 to 0.3 weight percent and an amount of Mg in the range of from 0.05 to 0.1 weight percent to obtain a third melt, and plunging into the third melt a fourth constituent element selected from Mo, Nb, Ta and/or V
to obtain the final melt.
to obtain the final melt.
9. Method according to claim 8, which comprises plunging said fourth constituent element into the third melt in the form of a low melting eutectic mixture with Ni.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US83814177A | 1977-09-30 | 1977-09-30 | |
| US838,141 | 1977-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1119920A true CA1119920A (en) | 1982-03-16 |
Family
ID=25276368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000311664A Expired CA1119920A (en) | 1977-09-30 | 1978-09-20 | Copper based spinodal alloys |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS5457422A (en) |
| BE (1) | BE870756A (en) |
| CA (1) | CA1119920A (en) |
| DE (1) | DE2842321C2 (en) |
| FR (1) | FR2404680A1 (en) |
| GB (1) | GB2005304B (en) |
| IT (1) | IT1099626B (en) |
| NL (1) | NL174963C (en) |
| SE (1) | SE446992B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011219840A (en) * | 2010-04-14 | 2011-11-04 | Totoku Electric Co Ltd | Suspension wire |
| EP2971215B1 (en) * | 2013-03-14 | 2019-04-17 | Materion Corporation | Process for improving formability of wrought copper-nickel-tin alloys |
| EP4095276A1 (en) | 2013-04-23 | 2022-11-30 | Materion Corporation | Copper-nickel-tin alloy with high toughness |
| JP6563831B2 (en) * | 2016-02-29 | 2019-08-21 | 日本碍子株式会社 | Copper alloy and manufacturing method thereof |
| JP5925936B1 (en) * | 2015-04-22 | 2016-05-25 | 日本碍子株式会社 | Copper alloy |
| CN105506524A (en) * | 2015-12-03 | 2016-04-20 | 中铝洛阳铜业有限公司 | Aluminum iron nickel bronze extruded bar preparation process |
| JP6210572B1 (en) * | 2016-07-06 | 2017-10-11 | 古河電気工業株式会社 | Copper alloy wire rod and method for producing the same |
| JP6210573B1 (en) * | 2016-07-25 | 2017-10-11 | 古河電気工業株式会社 | Copper alloy wire rod and method for producing the same |
| CN112126817B (en) * | 2020-09-27 | 2021-06-15 | 西北有色金属研究院 | Preparation method of copper-based multi-element high-temperature hard-to-deform alloy wire for engine |
| CN113789459B (en) * | 2021-09-02 | 2022-07-12 | 宁波博威合金材料股份有限公司 | Copper-nickel-tin alloy and preparation method and application thereof |
| CN114561568A (en) * | 2022-02-23 | 2022-05-31 | 山西尼尔耐特机电技术有限公司 | Component design of high-performance copper-nickel-tin-molybdenum alloy, and preparation method and application thereof |
| CN116043061A (en) * | 2023-01-18 | 2023-05-02 | 中南大学 | Elastic copper alloy and preparation method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE506082C (en) * | 1926-11-11 | 1930-08-28 | Tinkoper Handelmij Nv | Bearing metal |
| DE809971C (en) * | 1949-04-06 | 1951-08-06 | Lothar Dipl-Ing Sempell | Bearing metal |
| CA980223A (en) * | 1972-10-10 | 1975-12-23 | John T. Plewes | Method for treating copper-nickel-tin alloy compositions and products produced therefrom |
| US4052204A (en) * | 1976-05-11 | 1977-10-04 | Bell Telephone Laboratories, Incorporated | Quaternary spinodal copper alloys |
-
1978
- 1978-09-20 CA CA000311664A patent/CA1119920A/en not_active Expired
- 1978-09-21 SE SE7809939A patent/SE446992B/en not_active IP Right Cessation
- 1978-09-26 BE BE190701A patent/BE870756A/en not_active IP Right Cessation
- 1978-09-27 GB GB7838305A patent/GB2005304B/en not_active Expired
- 1978-09-27 FR FR7827642A patent/FR2404680A1/en active Granted
- 1978-09-28 DE DE2842321A patent/DE2842321C2/en not_active Expired
- 1978-09-28 IT IT28202/78A patent/IT1099626B/en active
- 1978-09-29 NL NLAANVRAGE7809894,A patent/NL174963C/en not_active IP Right Cessation
- 1978-09-29 JP JP11942778A patent/JPS5457422A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5457422A (en) | 1979-05-09 |
| BE870756A (en) | 1979-01-15 |
| GB2005304A (en) | 1979-04-19 |
| NL174963B (en) | 1984-04-02 |
| DE2842321C2 (en) | 1984-03-01 |
| NL174963C (en) | 1984-09-03 |
| SE446992B (en) | 1986-10-20 |
| SE7809939L (en) | 1979-03-31 |
| NL7809894A (en) | 1979-04-03 |
| FR2404680B1 (en) | 1980-06-06 |
| IT7828202A0 (en) | 1978-09-28 |
| IT1099626B (en) | 1985-09-18 |
| DE2842321A1 (en) | 1979-04-12 |
| JPS6132386B2 (en) | 1986-07-26 |
| GB2005304B (en) | 1982-03-17 |
| FR2404680A1 (en) | 1979-04-27 |
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