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CA1001580A - Method of gold plating - Google Patents

Method of gold plating

Info

Publication number
CA1001580A
CA1001580A CA137,959A CA137959A CA1001580A CA 1001580 A CA1001580 A CA 1001580A CA 137959 A CA137959 A CA 137959A CA 1001580 A CA1001580 A CA 1001580A
Authority
CA
Canada
Prior art keywords
gold plating
plating
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA137,959A
Other versions
CA137959S (en
Inventor
Felix R. Rapids
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of CA1001580A publication Critical patent/CA1001580A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
CA137,959A 1971-11-18 1972-03-23 Method of gold plating Expired CA1001580A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20004571A 1971-11-18 1971-11-18

Publications (1)

Publication Number Publication Date
CA1001580A true CA1001580A (en) 1976-12-14

Family

ID=22740088

Family Applications (1)

Application Number Title Priority Date Filing Date
CA137,959A Expired CA1001580A (en) 1971-11-18 1972-03-23 Method of gold plating

Country Status (2)

Country Link
US (1) US3755089A (en)
CA (1) CA1001580A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3865697A (en) * 1973-05-25 1975-02-11 Robert Suggs Platinum plating process
US4035246A (en) * 1976-06-01 1977-07-12 Rapid Electroplating Process, Inc. Method and compositions for electroplating copper and brass
US4067781A (en) * 1977-01-10 1978-01-10 Rapids Felix R Method for electroplating
US4385968A (en) * 1980-04-23 1983-05-31 Brooktronics Engineering Corporation Electroplating a simulated bright brass finish
US4481081A (en) * 1983-09-29 1984-11-06 The Boeing Company Method for brush plating conductive plastics
US5346602A (en) * 1993-09-24 1994-09-13 Gold Effects, Inc. Mobile electroplating unit
US5985107A (en) * 1997-12-31 1999-11-16 Gold Effects, Inc. Portable self-powered hand-held electroplating wand
US6939447B2 (en) * 1998-04-06 2005-09-06 Tdao Limited Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
GB2336161B (en) * 1998-04-06 2003-03-26 John Michael Lowe Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
JP2000232078A (en) * 1999-02-10 2000-08-22 Toshiba Corp Plating method and plating equipment
US6373137B1 (en) * 2000-03-21 2002-04-16 Micron Technology, Inc. Copper interconnect for an integrated circuit and methods for its fabrication
JP2008102315A (en) * 2006-10-19 2008-05-01 Sumitomo Electric Ind Ltd Optical connecting component manufacturing method and optical connecting component
US9583125B1 (en) * 2009-12-16 2017-02-28 Magnecomp Corporation Low resistance interface metal for disk drive suspension component grounding

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2061591A (en) * 1936-11-24 Electrolytic device
US1552591A (en) * 1923-05-14 1925-09-08 Peter J F Batenburg Metal-plating device
US1787431A (en) * 1925-07-13 1931-01-06 Batenburg Electroplating device
DE801312C (en) * 1949-05-05 1950-11-23 Pforzheimer Elektrizitäts - Gesellschaft m. b. H., Pforzheim Process for the electrolytic deposition of gold and gold alloys
US2958928A (en) * 1955-12-14 1960-11-08 Western Electric Co Methods of making printed wiring circuits

Also Published As

Publication number Publication date
US3755089A (en) 1973-08-28

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