CA1068466A - Building boards - Google Patents
Building boardsInfo
- Publication number
- CA1068466A CA1068466A CA272,565A CA272565A CA1068466A CA 1068466 A CA1068466 A CA 1068466A CA 272565 A CA272565 A CA 272565A CA 1068466 A CA1068466 A CA 1068466A
- Authority
- CA
- Canada
- Prior art keywords
- board
- heat
- cold
- building
- insert
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims abstract description 29
- 239000007787 solid Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 description 19
- 239000010410 layer Substances 0.000 description 12
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 5
- 239000007767 bonding agent Substances 0.000 description 4
- 239000011093 chipboard Substances 0.000 description 3
- 239000012792 core layer Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002023 wood Substances 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Inorganic materials [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 1
- ZOMBKNNSYQHRCA-UHFFFAOYSA-J calcium sulfate hemihydrate Chemical compound O.[Ca+2].[Ca+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O ZOMBKNNSYQHRCA-UHFFFAOYSA-J 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011507 gypsum plaster Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011431 lime mortar Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000010893 paper waste Substances 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000009290 primary effect Effects 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Floor Finish (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
A building board made of at least one base material, wherein the thermal conductivity of the board is increased by incorporating therein at least one insert comprising at least one heat or cold-transmitting member at least partially embed-ded in the board and connectable to a source of heat or cold disposed outside the board.
A building board made of at least one base material, wherein the thermal conductivity of the board is increased by incorporating therein at least one insert comprising at least one heat or cold-transmitting member at least partially embed-ded in the board and connectable to a source of heat or cold disposed outside the board.
Description
~068466 The invention relates to building boards.
The expression "building board" is a generic one ; for a variety of different boards made of or comprising an organic or a mineral (including ceramic) base material, or a mixture thereof. Regardless of the type of base material used for the manufacture of these boards, it is in most instances waste from manufacturing, mining or similar processes and consists therefore of particles of the respective base material, or materials, such as wood shavings, saw dust, vegetable fibers or plaster of Paris, which may, but need not neces~arily, be bonded by a suitable bonding agent. Another base material used for the manufacture of a building board may be pulped waste paper, i.e. a derivative of wood. The particles or the pulp may vary across the thickness of the board, either in density and/or as a result of using more than one of the aforementioned base materials, and such a variation may be a gradual or an abrupt one. If the latter is the case, the board may be said to comprise distinct layers. Whatever the arrangement is, the thermal conductivity of any of these conventional base materials is intrinsically low and hence that of the boards manufactured of them is also intrinsically low.
The present invention is concerned with a wide variety of such building boards which will be called, for the sake of brevity and where applicable, "a building board"
or "building boards of the kind referred to".
Building boards of the type referred to include, for example, the widely used wood-chip boards, plaster boards - with a cardboard covering or insert - and flooring boards known under the Cerman name "Estrich" boards made of or containing clay, lime mortar, cement or asphalt. As already mentioned, the thermal conductivity of any of these - 1 - ~
~068~66 boards is low. In addition, their sound conductivity generally is low. Building boards of the type referred to, particularly the three boards just specified, are used mainly as walls for temporary buildings such as building-site huts, as wall facings, as coverings in the furniture industry and for internal partitioning.
The low thermal conductivity may in some instances, for example, if the climatic conditions prevailing at the two opposite main faces of the board are different, be disadvan-tageous since the boards, due to insufficient thermal flux,may distort or buckle so that they will lose their shape of a flat plate.
Further, the building boards of the type referred to, particularly wood-chip boards, are used for some purposes in which their other characteristics are distinctly advantageous but in which their low thermal conductivity is disadvantageous for achieving the desired effect. This is the case, if, for example, the boards are used as coverings for surface-heating systems, particularly underfloor heating systems, in which instances good thermal flux from the heat-emitting element through the covering into the respective space is required.
It is an aim of the present invention to provide a building board of the kind referred to the thermal conduc-tivity of which is relatively good and in any case higher than that of the hitherto available boards, yet to preserve substantially all their other advantages such as easy work-ability - in most instances by means of wood-working tools or synthetic-materials-working tools and machines -, low sound conductivity and, possibly, their aesthetic effect.
~0684~;6 According to the present invention there ls provided a building board made of at least one base material, wherein the thermal conductivity of the board is increased by incorpora-ting therein at least one insert comprising at least one heat or cold-transmitting member at least partially embedded in the board and connectable to a source of heat or cold disposed out-side the board.
The at least one insert may be an insert the thermal conductivit~ of which is higher than that of the base material.
The measures o~ this embodiment will avoid heat-transfer losses which could occur if there were an air gap between the building board and the heat or cold-transmitting member, or members, which may form a part of a heating system~ Its, or their use as an insert, or inserts, in a board according to the invention will not reduce the desired primary effect of the inserts, i.e., to increase the thermal conductivity of the board.
Depending on the intended use of a building board according to the invention, it may be advantageous if the ther-mal conductivity is not the same throughout all its zones or layers. The inserts of a material of higher thermal conduc-tivity may therefore, be disposed exclusively or predominantly in a middle, or core, layer of the board.
In order to make the invention more readily under-stood, some embodiments thereof will now be described, by way of example only, with reference to the accompanying diagrammatic drawings, in which:
FIGURE 1 is a part cross-sectional view of one embo-diment of a building board according to the invention;
FIGURE 2 is a part cross-sectional view of another embodiment;
FIGURE 3 is a part cross-sectional view of yet another embodiment; and FIGURE 4 iS a part cross-sectional view of a further embodiment.
flO68~6 A building board, for example, a wood-chip board, as illustrated in Figurel has two main surfaces formed by two outer, or cover layers 1 and 2 between which a middle, or core, layer 3 is located. ~he density of particles of the base material, in this case wood chips, in the layers 1 and 2 is closer, and the si~e of the particles therein smaller, 1~68466 than of those in the middle layer 3. An insert of a material of higher thermal conductivity than that of the base material of the board, that is to say an integral body in the form of a web a metal 4 is disposed in the core layer 3. The configuration of the web 4 is such that it extends, similarly to a corrugated sheet, not only along the length, or width, of the board but also to some extent across the thickness of the layer 3.
Instead of incorpor~ting an integral web into the core layer 3 of the board, the insert may comprise a number of elements, for example metal strips, joined together in the same configuration as the web shown. As a further alternative, the insert may be a metal lattice. As will be observed from the drawings, the web 4 is only one of two inserts incorpo-rated into the core layer 3, the other being an aggregate 5 of particles having a higher thermal conductivity than the particles of the base material, the particles of the aggregate 5 being metal ones in the shape of cuttings, wool or similar shavings, preferably of aluminium. ~lthough not shown, it is feasible to incorporate in addition to the aggregate 5 another aggregate, for example powderized aluminium or particles of another material of higher thermal conductivity than that of the base material, which other material may be another metal or any other suitable material of high thermal conductivity.
Further, instead of incorporating a single web into the layer 3, it is possible to use more than one web.
In the embodiment illustrated in Figure 2, the insert is an aggregate of particles in the form of metal cuttings 6 substantially evenly distributed throughout the thickness of the board. As may readily be seen from this Figure, there is a gradual transition of the particles 6 to the two main surfaces 1 and 2 of the board. Alternatively, -- ,6 --~068466 the particles may be so arranged in the board as to form a sharply defined boundary relative to the surfaces land 2.
A building board as illustrated in Figure 3 comprises as an insert of higher thermal conductivity than that of the board's base material àn aggregate 7 of metal shavings. The density at which the shavings are arranged in the board increases from the main surface 1 towards the opposite main surface 2, that is to say from the main top surface towards the bottom one as illustrated in this Figure.
This arrangement may, of course, be reversed so that the density of the particles is closest at the top surface 1 and decreases towards the bottom surface 2.
In the embodiment illustrated in Figure 4, there is incorporated, in addition an aggregate 10 of particles, such as metal shavings, of relatively high thermal conductivity, at one of the board's main surfaces - the bottom one as shown in the drawing - another aggregate of metal particles arranged at such high density that they form in practice a foil-like structure serving as the board's bottom layer or as a covering therefor. In addition, a plurality of heat - or cold-trans-mitting members 8 - only one of which is illustrated - are partly embedded as inserts of higher thermal conductivity in the board. The member, or members, 8 may serve as the sole insert and may be entirely embedded into the board. The members 8 in the embodiment illustrated are tubes serving as heat-exchangers and are connected to a source of heat or cold so that a heated or cooled fluid medium may serve to convey heat or cold therethrough. Instead of using a tubular heat exchanger, it is feasible to use a solid heat- or cold-transmitting conductor likewise connectable to a source of heat or cold disposed externally of the board.
_ ,~ _ ~C~68466 It is an advantage of a building board according to the invention that due to the inserts, regardless whether they are solid bodies, aggregates of particles, heat- or cold-transmitting members or a combination thereof, of a thermal conductivity higher than that of the base materials the conduction of heat through the board, particularly between the two main surfaces, or outer layers, is good and that therefore the temperature gradient from one main surface, or outer layer, to the opposite o~ne is small. As a result of this characteristic, it is possible to use, with advantage, a building board according to the invention in all such instances in which good heat transmission is desired and/or in which it is essential to prevent the board from being distorted if one of its surfaces only is exposed to the effects of heat. A building board according to the invention may, for example, be used with greatest advantage as a covering in connection with underfloor, wall- or ceiling-covered heating systems and also in connection with air-conditioning systems. In fact, the principal application of a building board according to the invention is in conjunction with the aforementioned heating or air-conditioning systems.
It was stated in connection with the embodiment illustrated in Figure 4 that a foil-like structure is formed at the bottom surface of the board. A like structure may be formed at the opposite, or top, surface. It will readily be appreciated that if such a structure is not formed, either one or both main surfaces may be covered by a metal foil joined thereto.
~068466 Finally, if the particles of the base material, or materials are bonded by a bonding agent, one or more aggregates of particles, preferably in powder orm, are added to the bonding agent prior to the latter being used for bonding the particles of the base material, or materials.
If this is done, the particles in the bonding agent may constitute the sole insert of a material of high thermal conductivity. ~owever, it is preferable to consider this possibility merely as an addit~ional measure besides the incorporation of inserts in the particles o the base material.
The expression "building board" is a generic one ; for a variety of different boards made of or comprising an organic or a mineral (including ceramic) base material, or a mixture thereof. Regardless of the type of base material used for the manufacture of these boards, it is in most instances waste from manufacturing, mining or similar processes and consists therefore of particles of the respective base material, or materials, such as wood shavings, saw dust, vegetable fibers or plaster of Paris, which may, but need not neces~arily, be bonded by a suitable bonding agent. Another base material used for the manufacture of a building board may be pulped waste paper, i.e. a derivative of wood. The particles or the pulp may vary across the thickness of the board, either in density and/or as a result of using more than one of the aforementioned base materials, and such a variation may be a gradual or an abrupt one. If the latter is the case, the board may be said to comprise distinct layers. Whatever the arrangement is, the thermal conductivity of any of these conventional base materials is intrinsically low and hence that of the boards manufactured of them is also intrinsically low.
The present invention is concerned with a wide variety of such building boards which will be called, for the sake of brevity and where applicable, "a building board"
or "building boards of the kind referred to".
Building boards of the type referred to include, for example, the widely used wood-chip boards, plaster boards - with a cardboard covering or insert - and flooring boards known under the Cerman name "Estrich" boards made of or containing clay, lime mortar, cement or asphalt. As already mentioned, the thermal conductivity of any of these - 1 - ~
~068~66 boards is low. In addition, their sound conductivity generally is low. Building boards of the type referred to, particularly the three boards just specified, are used mainly as walls for temporary buildings such as building-site huts, as wall facings, as coverings in the furniture industry and for internal partitioning.
The low thermal conductivity may in some instances, for example, if the climatic conditions prevailing at the two opposite main faces of the board are different, be disadvan-tageous since the boards, due to insufficient thermal flux,may distort or buckle so that they will lose their shape of a flat plate.
Further, the building boards of the type referred to, particularly wood-chip boards, are used for some purposes in which their other characteristics are distinctly advantageous but in which their low thermal conductivity is disadvantageous for achieving the desired effect. This is the case, if, for example, the boards are used as coverings for surface-heating systems, particularly underfloor heating systems, in which instances good thermal flux from the heat-emitting element through the covering into the respective space is required.
It is an aim of the present invention to provide a building board of the kind referred to the thermal conduc-tivity of which is relatively good and in any case higher than that of the hitherto available boards, yet to preserve substantially all their other advantages such as easy work-ability - in most instances by means of wood-working tools or synthetic-materials-working tools and machines -, low sound conductivity and, possibly, their aesthetic effect.
~0684~;6 According to the present invention there ls provided a building board made of at least one base material, wherein the thermal conductivity of the board is increased by incorpora-ting therein at least one insert comprising at least one heat or cold-transmitting member at least partially embedded in the board and connectable to a source of heat or cold disposed out-side the board.
The at least one insert may be an insert the thermal conductivit~ of which is higher than that of the base material.
The measures o~ this embodiment will avoid heat-transfer losses which could occur if there were an air gap between the building board and the heat or cold-transmitting member, or members, which may form a part of a heating system~ Its, or their use as an insert, or inserts, in a board according to the invention will not reduce the desired primary effect of the inserts, i.e., to increase the thermal conductivity of the board.
Depending on the intended use of a building board according to the invention, it may be advantageous if the ther-mal conductivity is not the same throughout all its zones or layers. The inserts of a material of higher thermal conduc-tivity may therefore, be disposed exclusively or predominantly in a middle, or core, layer of the board.
In order to make the invention more readily under-stood, some embodiments thereof will now be described, by way of example only, with reference to the accompanying diagrammatic drawings, in which:
FIGURE 1 is a part cross-sectional view of one embo-diment of a building board according to the invention;
FIGURE 2 is a part cross-sectional view of another embodiment;
FIGURE 3 is a part cross-sectional view of yet another embodiment; and FIGURE 4 iS a part cross-sectional view of a further embodiment.
flO68~6 A building board, for example, a wood-chip board, as illustrated in Figurel has two main surfaces formed by two outer, or cover layers 1 and 2 between which a middle, or core, layer 3 is located. ~he density of particles of the base material, in this case wood chips, in the layers 1 and 2 is closer, and the si~e of the particles therein smaller, 1~68466 than of those in the middle layer 3. An insert of a material of higher thermal conductivity than that of the base material of the board, that is to say an integral body in the form of a web a metal 4 is disposed in the core layer 3. The configuration of the web 4 is such that it extends, similarly to a corrugated sheet, not only along the length, or width, of the board but also to some extent across the thickness of the layer 3.
Instead of incorpor~ting an integral web into the core layer 3 of the board, the insert may comprise a number of elements, for example metal strips, joined together in the same configuration as the web shown. As a further alternative, the insert may be a metal lattice. As will be observed from the drawings, the web 4 is only one of two inserts incorpo-rated into the core layer 3, the other being an aggregate 5 of particles having a higher thermal conductivity than the particles of the base material, the particles of the aggregate 5 being metal ones in the shape of cuttings, wool or similar shavings, preferably of aluminium. ~lthough not shown, it is feasible to incorporate in addition to the aggregate 5 another aggregate, for example powderized aluminium or particles of another material of higher thermal conductivity than that of the base material, which other material may be another metal or any other suitable material of high thermal conductivity.
Further, instead of incorporating a single web into the layer 3, it is possible to use more than one web.
In the embodiment illustrated in Figure 2, the insert is an aggregate of particles in the form of metal cuttings 6 substantially evenly distributed throughout the thickness of the board. As may readily be seen from this Figure, there is a gradual transition of the particles 6 to the two main surfaces 1 and 2 of the board. Alternatively, -- ,6 --~068466 the particles may be so arranged in the board as to form a sharply defined boundary relative to the surfaces land 2.
A building board as illustrated in Figure 3 comprises as an insert of higher thermal conductivity than that of the board's base material àn aggregate 7 of metal shavings. The density at which the shavings are arranged in the board increases from the main surface 1 towards the opposite main surface 2, that is to say from the main top surface towards the bottom one as illustrated in this Figure.
This arrangement may, of course, be reversed so that the density of the particles is closest at the top surface 1 and decreases towards the bottom surface 2.
In the embodiment illustrated in Figure 4, there is incorporated, in addition an aggregate 10 of particles, such as metal shavings, of relatively high thermal conductivity, at one of the board's main surfaces - the bottom one as shown in the drawing - another aggregate of metal particles arranged at such high density that they form in practice a foil-like structure serving as the board's bottom layer or as a covering therefor. In addition, a plurality of heat - or cold-trans-mitting members 8 - only one of which is illustrated - are partly embedded as inserts of higher thermal conductivity in the board. The member, or members, 8 may serve as the sole insert and may be entirely embedded into the board. The members 8 in the embodiment illustrated are tubes serving as heat-exchangers and are connected to a source of heat or cold so that a heated or cooled fluid medium may serve to convey heat or cold therethrough. Instead of using a tubular heat exchanger, it is feasible to use a solid heat- or cold-transmitting conductor likewise connectable to a source of heat or cold disposed externally of the board.
_ ,~ _ ~C~68466 It is an advantage of a building board according to the invention that due to the inserts, regardless whether they are solid bodies, aggregates of particles, heat- or cold-transmitting members or a combination thereof, of a thermal conductivity higher than that of the base materials the conduction of heat through the board, particularly between the two main surfaces, or outer layers, is good and that therefore the temperature gradient from one main surface, or outer layer, to the opposite o~ne is small. As a result of this characteristic, it is possible to use, with advantage, a building board according to the invention in all such instances in which good heat transmission is desired and/or in which it is essential to prevent the board from being distorted if one of its surfaces only is exposed to the effects of heat. A building board according to the invention may, for example, be used with greatest advantage as a covering in connection with underfloor, wall- or ceiling-covered heating systems and also in connection with air-conditioning systems. In fact, the principal application of a building board according to the invention is in conjunction with the aforementioned heating or air-conditioning systems.
It was stated in connection with the embodiment illustrated in Figure 4 that a foil-like structure is formed at the bottom surface of the board. A like structure may be formed at the opposite, or top, surface. It will readily be appreciated that if such a structure is not formed, either one or both main surfaces may be covered by a metal foil joined thereto.
~068466 Finally, if the particles of the base material, or materials are bonded by a bonding agent, one or more aggregates of particles, preferably in powder orm, are added to the bonding agent prior to the latter being used for bonding the particles of the base material, or materials.
If this is done, the particles in the bonding agent may constitute the sole insert of a material of high thermal conductivity. ~owever, it is preferable to consider this possibility merely as an addit~ional measure besides the incorporation of inserts in the particles o the base material.
Claims (6)
1. A building board made of at least one base material, wherein the thermal conductivity of the board is increased by incorporating therein at least one insert comprising at least one heat or cold-transmitting member at least partially embedded in the board and connectable to a source of heat or cold dis-posed outside the board.
2. A building board according to claim 1, wherein said at least one insert is an insert the thermal conductivity of which is higher than that of the base material.
3. A building board according to claim 1 or 2, wherein the at least one heat or cold-transmitting member is a solid conductor.
4. A building board according to claim 1 or 2, wherein the at least one heat or cold-transmitting member is a tubular heat-exchanger for the circulation therethrough of a heated or cooled fluid medium.
5. A building board according to claim 1 or 2, wherein said at least one heat or cold-transmitting member is entirely embedded in the board.
6. A building board according to claim 1 or 2, wherein said at least one heat or cold-transmitting member is disposed in a core, layer of the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA272,565A CA1068466A (en) | 1977-02-24 | 1977-02-24 | Building boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA272,565A CA1068466A (en) | 1977-02-24 | 1977-02-24 | Building boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1068466A true CA1068466A (en) | 1979-12-25 |
Family
ID=4108010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA272,565A Expired CA1068466A (en) | 1977-02-24 | 1977-02-24 | Building boards |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1068466A (en) |
-
1977
- 1977-02-24 CA CA272,565A patent/CA1068466A/en not_active Expired
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