BRPI1009158A2 - Casting resin system for higher thermal distortion resistance insulators - Google Patents

Casting resin system for higher thermal distortion resistance insulators

Info

Publication number: BRPI1009158A2
Authority: BR; Brazil
Prior art keywords: resin system; higher thermal; casting resin; thermal distortion; distortion resistance
Prior art date: 2009-03-06

Application number

BRPI1009158A

Other languages

Portuguese (pt)

Inventor

Gernot Swiatkowski

Original Assignee

Siemens Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-03-06

Filing date

2010-02-23

Publication date

2016-03-01

2010-02-23 Application filed by Siemens Ag filed Critical Siemens Ag

2016-03-01 Publication of BRPI1009158A2 publication Critical patent/BRPI1009158A2/en

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Physics & Mathematics (AREA)
Spectroscopy & Molecular Physics (AREA)
Epoxy Resins (AREA)
Compositions Of Macromolecular Compounds (AREA)
Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Organic Insulating Materials (AREA)

BRPI1009158A 2009-03-06 2010-02-23 Casting resin system for higher thermal distortion resistance insulators BRPI1009158A2 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE102009012195A DE102009012195A1 (en)	2009-03-06	2009-03-06	Cast resin system for insulators with increased heat resistance
PCT/EP2010/052269 WO2010100058A1 (en)	2009-03-06	2010-02-23	Cast resin system for isolators

Publications (1)

Publication Number	Publication Date
BRPI1009158A2 true BRPI1009158A2 (en)	2016-03-01

Family

ID=42352706

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BRPI1009158A BRPI1009158A2 (en)	2009-03-06	2010-02-23	Casting resin system for higher thermal distortion resistance insulators

Country Status (12)

Country	Link
US (1)	US20120010328A1 (en)
EP (1)	EP2403893B1 (en)
KR (2)	KR102039409B1 (en)
CN (1)	CN102341427B (en)
AU (1)	AU2010220423B2 (en)
BR (1)	BRPI1009158A2 (en)
CA (1)	CA2754346C (en)
DE (1)	DE102009012195A1 (en)
MX (1)	MX2011008425A (en)
RU (1)	RU2523282C2 (en)
UA (1)	UA105378C2 (en)
WO (1)	WO2010100058A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102532484B (en) *	2011-12-14	2013-09-18	华东理工大学	Epoxy resin composition and method for preparing prepreg and composite material by using same
DE102015204885A1 (en)	2015-03-18	2016-09-22	Siemens Aktiengesellschaft	Isolation system, uses to it, as well as electric machine
DE102016203867A1 (en)	2016-03-09	2017-09-14	Siemens Aktiengesellschaft	Solid insulation material, use for this purpose and insulation system manufactured therewith
FI3794052T3 (en)	2018-05-16	2025-02-20	Huntsman Adv Mat Switzerland	Accelerator composition for the cure of polyfunctional isocyanates with epoxy resins

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3998983A (en) *	1975-06-27	1976-12-21	Westinghouse Electric Corporation	Resin rich epoxide-mica flexible high voltage insulation
JPH04185628A (en) *	1990-11-21	1992-07-02	Sumitomo Bakelite Co Ltd	Liquid epoxy resin composition for electrical insulation
EP0507271A3 (en) *	1991-04-03	1993-04-21	The Dow Chemical Company	Epoxy resin compositions for use in electrical laminates
JP3359410B2 (en) *	1994-03-04	2002-12-24	三菱電機株式会社	Epoxy resin composition for molding, molded product for high voltage equipment using the same, and method for producing the same
DE59502297D1 (en) *	1994-03-10	1998-07-02	Ciba Geigy Ag	Thermally curable epoxy resin systems with good reactivity / stability behavior
JP3290295B2 (en) *	1994-05-13	2002-06-10	太陽インキ製造株式会社	Curable resin composition, multilayer printed wiring board using the composition, and method for producing the same
ES2203643T3 (en) *	1994-07-01	2004-04-16	Vantico Ag	EPOXI RESIN BASED COLADA COMPOSITION.
US6046257A (en) *	1995-07-18	2000-04-04	Toray Industries, Inc.	Composition for prepreg comprising epoxy resin, polyamide block copolymer and curing agent
JP3648743B2 (en) *	1996-02-02	2005-05-18	東レ株式会社	"Resin composition for fiber reinforced composite material and its manufacturing method, prepreg, fiber reinforced composite material, honeycomb structure"
DE69730683T2 (en) *	1996-07-04	2005-02-10	Tohto Kasei Co., Ltd.	HYDROXYLENTHOLDING MODIFIED RESIN, ITS NETWORKABLE COMPOSITION, EPOXYED PRODUCT OF THIS MODIFIED RESIN AND ITS NETWORKABLE COMPOSITION
JP2001506313A (en) *	1997-07-24	2001-05-15	ロックタイトコーポレーション	Thermosetting resin composition useful as underfill sealant
US20020006484A1 (en) *	1998-05-20	2002-01-17	Balasubramaniam Ramalingam	Adhesive and coating formulations for flexible packaging
JP3442006B2 (en) *	1999-08-24	2003-09-02	日東電工株式会社	Epoxy resin composition for casting
JP2001170950A (en) *	1999-12-15	2001-06-26	Nitto Denko Corp	Multi-layer resin plate and manufacturing method thereof
JP4319332B2 (en) *	2000-06-29	2009-08-26	株式会社東芝	Electrical insulating material and manufacturing method thereof
JP2004359792A (en) *	2003-06-04	2004-12-24	Murata Mfg Co Ltd	Casting resin composition for high pressure part and high pressure part
DE60312143T2 (en) *	2003-06-16	2007-11-29	Abb Technology Ltd.	Epoxy resin compositions and methods of making molded articles therefrom
EP1881033A1 (en) *	2006-07-20	2008-01-23	Abb Research Ltd.	Diluent free epoxy resin formulation
EP1978049B1 (en) *	2007-04-03	2010-02-24	ABB Research Ltd	Curable Epoxy Resin Composition

2009
- 2009-03-06 DE DE102009012195A patent/DE102009012195A1/en not_active Ceased
2010
- 2010-02-23 BR BRPI1009158A patent/BRPI1009158A2/en not_active IP Right Cessation
- 2010-02-23 WO PCT/EP2010/052269 patent/WO2010100058A1/en not_active Ceased
- 2010-02-23 EP EP10706981.7A patent/EP2403893B1/en active Active
- 2010-02-23 AU AU2010220423A patent/AU2010220423B2/en not_active Ceased
- 2010-02-23 CA CA2754346A patent/CA2754346C/en not_active Expired - Fee Related
- 2010-02-23 KR KR1020177012042A patent/KR102039409B1/en active Active
- 2010-02-23 MX MX2011008425A patent/MX2011008425A/en active IP Right Grant
- 2010-02-23 RU RU2011140468/04A patent/RU2523282C2/en not_active IP Right Cessation
- 2010-02-23 CN CN201080010189.2A patent/CN102341427B/en active Active
- 2010-02-23 US US13/254,864 patent/US20120010328A1/en not_active Abandoned
- 2010-02-23 KR KR1020117020659A patent/KR20110135931A/en not_active Ceased
- 2010-02-23 UA UAA201110710A patent/UA105378C2/en unknown

Also Published As

Publication number	Publication date
US20120010328A1 (en)	2012-01-12
DE102009012195A1 (en)	2010-09-09
CN102341427B (en)	2014-06-11
AU2010220423B2 (en)	2013-04-04
CN102341427A (en)	2012-02-01
KR102039409B1 (en)	2019-11-04
WO2010100058A1 (en)	2010-09-10
UA105378C2 (en)	2014-05-12
EP2403893B1 (en)	2018-12-19
CA2754346C (en)	2017-06-06
CA2754346A1 (en)	2010-09-10
RU2523282C2 (en)	2014-07-20
EP2403893A1 (en)	2012-01-11
KR20170051541A (en)	2017-05-11
AU2010220423A1 (en)	2011-09-08
MX2011008425A (en)	2011-09-01
KR20110135931A (en)	2011-12-20
RU2011140468A (en)	2013-04-20

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Legal Events

Date	Code	Title	Description
2018-04-17	B06F	Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
2018-12-18	B08F	Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]	Free format text: REFERENTE A 9A ANUIDADE.
2019-04-02	B08K	Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]	Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2502 DE 18-12-2018 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.
2021-06-01	B350	Update of information on the portal [chapter 15.35 patent gazette]