[go: up one dir, main page]

BRPI0911090A2 - design estrutural de arranjo de células de bit de memória magnetoresistiva de acesso aleatório (mram) - Google Patents

design estrutural de arranjo de células de bit de memória magnetoresistiva de acesso aleatório (mram)

Info

Publication number
BRPI0911090A2
BRPI0911090A2 BRPI0911090A BRPI0911090A BRPI0911090A2 BR PI0911090 A2 BRPI0911090 A2 BR PI0911090A2 BR PI0911090 A BRPI0911090 A BR PI0911090A BR PI0911090 A BRPI0911090 A BR PI0911090A BR PI0911090 A2 BRPI0911090 A2 BR PI0911090A2
Authority
BR
Brazil
Prior art keywords
mram
random access
cell array
structural design
memory bit
Prior art date
Application number
BRPI0911090A
Other languages
English (en)
Inventor
h xia William
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of BRPI0911090A2 publication Critical patent/BRPI0911090A2/pt
Publication of BRPI0911090B1 publication Critical patent/BRPI0911090B1/pt

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1653Address circuits or decoders
    • G11C11/1655Bit-line or column circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1653Address circuits or decoders
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1659Cell access
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/06Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G11C5/063Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/40Devices controlled by magnetic fields
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/902Specified use of nanostructure
    • Y10S977/932Specified use of nanostructure for electronic or optoelectronic application
    • Y10S977/933Spintronics or quantum computing

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
  • Semiconductor Memories (AREA)
BRPI0911090 2008-04-04 2009-03-23 design estrutural de arranjo de células de bit de memória magnetoresistiva de acesso aleatório (mram) BRPI0911090B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/098,017 US8159870B2 (en) 2008-04-04 2008-04-04 Array structural design of magnetoresistive random access memory (MRAM) bit cells
PCT/US2009/037935 WO2009123874A1 (en) 2008-04-04 2009-03-23 Array structural design of magnetoresistive random access memory (mram) bit cells

Publications (2)

Publication Number Publication Date
BRPI0911090A2 true BRPI0911090A2 (pt) 2018-03-20
BRPI0911090B1 BRPI0911090B1 (pt) 2019-12-10

Family

ID=40940420

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0911090 BRPI0911090B1 (pt) 2008-04-04 2009-03-23 design estrutural de arranjo de células de bit de memória magnetoresistiva de acesso aleatório (mram)

Country Status (12)

Country Link
US (2) US8159870B2 (pt)
EP (1) EP2269192B1 (pt)
JP (1) JP5575745B2 (pt)
KR (1) KR101227675B1 (pt)
CN (2) CN103956180B (pt)
BR (1) BRPI0911090B1 (pt)
CA (1) CA2719700C (pt)
ES (1) ES2401142T3 (pt)
MX (1) MX2010010909A (pt)
RU (1) RU2464654C2 (pt)
TW (1) TWI409814B (pt)
WO (1) WO2009123874A1 (pt)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5088465B2 (ja) * 2006-07-12 2012-12-05 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 不揮発性半導体メモリ
US8159870B2 (en) 2008-04-04 2012-04-17 Qualcomm Incorporated Array structural design of magnetoresistive random access memory (MRAM) bit cells
US8704319B2 (en) * 2010-12-31 2014-04-22 Samsung Electronics Co., Ltd. Method and system for providing magnetic layers having insertion layers for use in spin transfer torque memories
US8710602B2 (en) * 2011-12-20 2014-04-29 Samsung Electronics Co., Ltd. Method and system for providing magnetic junctions having improved characteristics
KR101929983B1 (ko) * 2012-07-18 2018-12-17 삼성전자주식회사 저항성 메모리 셀을 갖는 반도체 메모리 장치 및 그 테스트 방법
KR20160022809A (ko) 2013-06-21 2016-03-02 인텔 코포레이션 Mtj 스핀 홀 mram 비트-셀 및 어레이
KR102074943B1 (ko) 2013-08-30 2020-02-07 삼성전자 주식회사 자기 메모리 소자
KR102098244B1 (ko) 2014-02-04 2020-04-07 삼성전자 주식회사 자기 메모리 소자
CN106688041B (zh) * 2014-09-25 2020-12-08 英特尔公司 应变辅助自旋力矩翻转自旋转移力矩存储器
US20160254318A1 (en) * 2015-02-27 2016-09-01 Qualcomm Incorporated MAGNETIC RANDOM ACCESS MEMORY (MRAM) BIT CELLS EMPLOYING SOURCE LINES (SLs) AND/OR BIT LINES (BLs) DISPOSED IN MULTIPLE, STACKED METAL LAYERS TO REDUCE MRAM BIT CELL RESISTANCE
US9721634B2 (en) 2015-04-27 2017-08-01 Qualcomm Incorporated Decoupling of source line layout from access transistor contact placement in a magnetic tunnel junction (MTJ) memory bit cell to facilitate reduced contact resistance
US10043852B2 (en) * 2015-08-11 2018-08-07 Toshiba Memory Corporation Magnetoresistive memory device and manufacturing method of the same
WO2017052561A1 (en) * 2015-09-24 2017-03-30 Intel Corporation Memory with high overlay tolerance
WO2017052622A1 (en) * 2015-09-25 2017-03-30 Intel Corporation Spin hall effect mram with thin-film selector
US10580970B2 (en) 2015-09-25 2020-03-03 Intel Corporation PSTTM device with free magnetic layers coupled through a metal layer having high temperature stability
US10340445B2 (en) 2015-09-25 2019-07-02 Intel Corporation PSTTM device with bottom electrode interface material
WO2017052586A1 (en) * 2015-09-25 2017-03-30 Intel Corporation High density memory array with self-aligned via
CN108028313B (zh) 2015-09-25 2022-04-15 英特尔公司 具有多层过滤器堆叠体的psttm器件
KR20170064052A (ko) 2015-11-30 2017-06-09 에스케이하이닉스 주식회사 스위칭 소자 및 반도체 메모리를 포함하는 전자 장치
US9715916B1 (en) 2016-03-24 2017-07-25 Intel Corporation Supply-switched dual cell memory bitcell
KR102379706B1 (ko) 2017-10-25 2022-03-28 삼성전자주식회사 가변 저항 메모리 소자
KR20190122421A (ko) * 2018-04-20 2019-10-30 삼성전자주식회사 반도체 소자
US11151296B2 (en) 2018-05-18 2021-10-19 Taiwan Semiconductor Manufacturing Company, Ltd. Memory cell array circuit
US11502188B2 (en) 2018-06-14 2022-11-15 Intel Corporation Apparatus and method for boosting signal in magnetoelectric spin orbit logic
US11476412B2 (en) 2018-06-19 2022-10-18 Intel Corporation Perpendicular exchange bias with antiferromagnet for spin orbit coupling based memory
US11444237B2 (en) 2018-06-29 2022-09-13 Intel Corporation Spin orbit torque (SOT) memory devices and methods of fabrication
US11616192B2 (en) 2018-06-29 2023-03-28 Intel Corporation Magnetic memory devices with a transition metal dopant at an interface of free magnetic layers and methods of fabrication
JP2020035976A (ja) * 2018-08-31 2020-03-05 キオクシア株式会社 磁気記憶装置
US11557629B2 (en) 2019-03-27 2023-01-17 Intel Corporation Spin orbit memory devices with reduced magnetic moment and methods of fabrication
US11594673B2 (en) 2019-03-27 2023-02-28 Intel Corporation Two terminal spin orbit memory devices and methods of fabrication
US11244983B2 (en) 2019-06-25 2022-02-08 Taiwan Semiconductor Manufacturing Co., Ltd. MRAM memory cell layout for minimizing bitcell area
CN112837723A (zh) * 2019-11-22 2021-05-25 上海磁宇信息科技有限公司 错层式金属位线走线的磁性随机存储器存储阵列
CN113782077A (zh) * 2020-06-09 2021-12-10 上海磁宇信息科技有限公司 磁性随机存储器
US12080346B2 (en) 2022-05-17 2024-09-03 Taiwan Semiconductor Manufacturing Company, Ltd. Memory device, integrated circuit device and method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02117169A (ja) * 1988-10-27 1990-05-01 Sony Corp メモリ装置
JPH04125962A (ja) * 1990-09-18 1992-04-27 Sony Corp メモリ装置
TW411471B (en) 1997-09-17 2000-11-11 Siemens Ag Memory-cell device
JP4731041B2 (ja) * 2001-05-16 2011-07-20 ルネサスエレクトロニクス株式会社 薄膜磁性体記憶装置
JP3527230B2 (ja) * 2001-06-19 2004-05-17 松下電器産業株式会社 磁気メモリの駆動方法
JP3887272B2 (ja) * 2001-12-21 2007-02-28 株式会社東芝 磁気ランダムアクセスメモリの読み出し方法
DE60205569T2 (de) 2001-12-21 2006-05-18 Kabushiki Kaisha Toshiba MRAM mit gestapelten Speicherzellen
RU2310928C2 (ru) 2004-10-27 2007-11-20 Самсунг Электроникс Ко., Лтд. Усовершенствованное многоразрядное магнитное запоминающее устройство с произвольной выборкой и способы его функционирования и производства
KR100590563B1 (ko) * 2004-10-27 2006-06-19 삼성전자주식회사 멀티 비트 자기 메모리 소자와 그 동작 및 제조 방법
JP2007081161A (ja) * 2005-09-14 2007-03-29 Fujitsu Ltd 磁気抵抗素子メモリとその製造方法
JP4799218B2 (ja) 2006-03-03 2011-10-26 株式会社東芝 スピン注入書き込み型磁気記憶装置
EP1852874B1 (en) * 2006-05-04 2010-04-28 Hitachi Ltd. Magnetic memory device
US7345912B2 (en) * 2006-06-01 2008-03-18 Grandis, Inc. Method and system for providing a magnetic memory structure utilizing spin transfer
US7742329B2 (en) * 2007-03-06 2010-06-22 Qualcomm Incorporated Word line transistor strength control for read and write in spin transfer torque magnetoresistive random access memory
US8004880B2 (en) * 2007-03-06 2011-08-23 Qualcomm Incorporated Read disturb reduction circuit for spin transfer torque magnetoresistive random access memory
US8159870B2 (en) 2008-04-04 2012-04-17 Qualcomm Incorporated Array structural design of magnetoresistive random access memory (MRAM) bit cells

Also Published As

Publication number Publication date
JP2011519476A (ja) 2011-07-07
WO2009123874A1 (en) 2009-10-08
CA2719700A1 (en) 2009-10-08
CN103956180A (zh) 2014-07-30
KR20100125478A (ko) 2010-11-30
KR101227675B1 (ko) 2013-01-29
US20090251949A1 (en) 2009-10-08
CN103956180B (zh) 2017-09-12
JP5575745B2 (ja) 2014-08-20
RU2464654C2 (ru) 2012-10-20
RU2010145133A (ru) 2012-05-20
US8159870B2 (en) 2012-04-17
US20130100732A1 (en) 2013-04-25
CN102017004B (zh) 2014-06-25
EP2269192B1 (en) 2013-02-13
EP2269192A1 (en) 2011-01-05
BRPI0911090B1 (pt) 2019-12-10
TWI409814B (zh) 2013-09-21
US8625341B2 (en) 2014-01-07
CN102017004A (zh) 2011-04-13
MX2010010909A (es) 2010-11-04
CA2719700C (en) 2014-01-28
ES2401142T3 (es) 2013-04-17
TW201003652A (en) 2010-01-16

Similar Documents

Publication Publication Date Title
BRPI0911090A2 (pt) design estrutural de arranjo de células de bit de memória magnetoresistiva de acesso aleatório (mram)
EP2227812A4 (en) MEMORY CELL READING
BRPI0914728A2 (pt) operação de escrita para memória de acesso aleatório magnetoresistiva de torque de transferência de rotação com tamanho de célula de bit reduzido
GB2468181B (en) Dynamic random access memory with shadow writes
EP2165369A4 (en) ANTI MELTING LINK MEMORY CELL
EP2313891A4 (en) VIRTUAL MEMORY DEVICES CONTROLLED INDEPENDENTLY IN MEMORY MODULES
GB0721940D0 (en) Memory cells
EP2399260A4 (en) REFRESHMENT OF DYNAMIC LIVE MEMORY (DRAM)
EP2342712A4 (en) MASS DATA MEMORY SYSTEM WITH NON-VOLATILE MEMORY MODULES
DE602007010547D1 (de) Phasenwechsel-Speicherzelle mit Nanoverbundisolator
EP2218073A4 (en) MEMORY CELL PROGRAMMING
EP2245661A4 (en) MULTIPLE MEMORY CELLS AND METHOD
FR2957186B1 (fr) Cellule memoire de type sram
EP2386087A4 (en) Shared virtual memory
EP2328194A4 (en) MAGNETIC RECORDING ELEMENT, MAGNETIC MEMORY CELL, AND MAGNETIC RANDOM MEMORY
TWI368316B (en) Multi-trapping layer flash memory cell
DK2263146T3 (da) Sikker adgang til hukommelse i en fluidpatron
TWI372459B (en) Integrated memory cell array
BRPI0909624A2 (pt) multiplexação de endereço em memória de porta pseudo-dual
EP2769414A4 (en) MEMORY CELLS AND MEMORY CELLAR ARRAYS
BRPI1007238A2 (pt) célula de memória de acesso aleatório estática de alto desempenho e baixa fuga utilizando transitores de te cnologia dual
EP2718929A4 (en) DIRECT ACCESS MAGNETIC MEMORY DEVICES WITH MULTIBIT CELLS
EP2718927A4 (en) DIRECT ACCESS MAGNETIC MEMORY DEVICES WITH MULTIBIT CELLS
TWI368914B (en) Memory repair circuit and repairable pseudo-static random access memory
BRPI0914571A2 (pt) arquitetura dinâmica de memória para economizar energia

Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B15K Others concerning applications: alteration of classification

Free format text: A CLASSIFICACAO ANTERIOR ERA: G11C 11/16

Ipc: G11C 11/16 (1968.09), G11C 5/06 (1968.09), H01L 29

B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 10/12/2019, OBSERVADAS AS CONDICOES LEGAIS. (CO) 10 (DEZ) ANOS CONTADOS A PARTIR DE 10/12/2019, OBSERVADAS AS CONDICOES LEGAIS