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BRPI0909517A2 - painél de circuito eletrônico e aparelho de comunicação de linha de energia utilizando o mesmo - Google Patents

painél de circuito eletrônico e aparelho de comunicação de linha de energia utilizando o mesmo

Info

Publication number
BRPI0909517A2
BRPI0909517A2 BRPI0909517A BRPI0909517A BRPI0909517A2 BR PI0909517 A2 BRPI0909517 A2 BR PI0909517A2 BR PI0909517 A BRPI0909517 A BR PI0909517A BR PI0909517 A BRPI0909517 A BR PI0909517A BR PI0909517 A2 BRPI0909517 A2 BR PI0909517A2
Authority
BR
Brazil
Prior art keywords
circuit board
same
power line
electronic circuit
communication apparatus
Prior art date
Application number
BRPI0909517A
Other languages
English (en)
Inventor
Kawano Hiroshi
Yamaguchi Shuichiro
Naruse Takumi
Yamauchi Toshihiro
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008076372A external-priority patent/JP5225721B2/ja
Priority claimed from JP2008076373A external-priority patent/JP2009231606A/ja
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of BRPI0909517A2 publication Critical patent/BRPI0909517A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B3/00—Line transmission systems
    • H04B3/54—Systems for transmission via power distribution lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B2203/00—Indexing scheme relating to line transmission systems
    • H04B2203/54—Aspects of powerline communications not already covered by H04B3/54 and its subgroups
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B2203/00—Indexing scheme relating to line transmission systems
    • H04B2203/54—Aspects of powerline communications not already covered by H04B3/54 and its subgroups
    • H04B2203/5429—Applications for powerline communications
    • H04B2203/5445—Local network
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B2203/00—Indexing scheme relating to line transmission systems
    • H04B2203/54—Aspects of powerline communications not already covered by H04B3/54 and its subgroups
    • H04B2203/5462—Systems for power line communications
    • H04B2203/5483—Systems for power line communications using coupling circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
BRPI0909517A 2008-03-24 2009-03-24 painél de circuito eletrônico e aparelho de comunicação de linha de energia utilizando o mesmo BRPI0909517A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008076372A JP5225721B2 (ja) 2008-03-24 2008-03-24 電子回路装置およびこれを用いた電力線通信装置
JP2008076373A JP2009231606A (ja) 2008-03-24 2008-03-24 電子回路基板、電子回路装置およびこれを用いた電力線通信装置
PCT/JP2009/001308 WO2009119077A1 (ja) 2008-03-24 2009-03-24 電子回路基板、およびこれを用いた電力線通信装置

Publications (1)

Publication Number Publication Date
BRPI0909517A2 true BRPI0909517A2 (pt) 2018-01-09

Family

ID=41113288

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0909517A BRPI0909517A2 (pt) 2008-03-24 2009-03-24 painél de circuito eletrônico e aparelho de comunicação de linha de energia utilizando o mesmo

Country Status (4)

Country Link
US (1) US8582312B2 (pt)
CN (1) CN101982027A (pt)
BR (1) BRPI0909517A2 (pt)
WO (1) WO2009119077A1 (pt)

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* Cited by examiner, † Cited by third party
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JP5643752B2 (ja) * 2009-05-14 2014-12-17 ローム株式会社 半導体装置
GB0917700D0 (en) * 2009-10-09 2009-11-25 Onzo Ltd Device and method of making a device
EP2526572B1 (en) * 2010-01-19 2019-08-14 LG Innotek Co., Ltd. Package and manufacturing method of the same
US9008073B1 (en) * 2012-12-07 2015-04-14 Maxim Integrated Products, Inc. Routing for power line communication systems
JPWO2015141004A1 (ja) * 2014-03-20 2017-04-06 富士通株式会社 多層回路基板、半導体装置、及びその多層回路基板の製造方法
CN111478919B (zh) * 2014-11-19 2023-01-13 领特投资两合有限公司 用于利用应用触发的同步的pmd绑定的4线传输的系统
GB2550504B (en) * 2015-01-19 2021-09-29 Mitsubishi Electric Corp Controller
US10571984B2 (en) * 2015-08-25 2020-02-25 Molex, Llc Communication node with digital plane interface
EP3424227B1 (en) 2016-03-01 2022-04-13 Molex, LLC Communication node
CN106132069B (zh) * 2016-06-28 2018-12-04 广东欧珀移动通信有限公司 Pcb板及具有其的移动终端
JP6918668B2 (ja) * 2017-09-29 2021-08-11 株式会社シマノ 回路モジュール、自転車用の電気コンポーネント、および、通信システム
US10581208B2 (en) 2017-10-16 2020-03-03 Equipement Electroline Inc. Ethernet connector with electromagnetic filtering
US10912195B2 (en) * 2019-01-02 2021-02-02 The Boeing Company Multi-embedded radio frequency board and mobile device including the same
DE112020001192B4 (de) * 2019-03-12 2024-08-29 KYOCERA AVX Components Corporation (n. d. Ges. d. Staates Delaware) Doppelseitiges hochleistungs-dünnschichtfilter
US20230420358A1 (en) * 2022-06-28 2023-12-28 Intel Corporation Integrated circuit packages with silver and silicon nitride multi-layer

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US5166865A (en) * 1990-07-30 1992-11-24 Motorola, Inc. Compliancy tolerant pattern for circuit carrying substrate
JPH04252624A (ja) 1991-01-29 1992-09-08 Sumitomo Electric Ind Ltd 光受信器
JP3265669B2 (ja) * 1993-01-19 2002-03-11 株式会社デンソー プリント基板
JPH10190167A (ja) * 1996-12-27 1998-07-21 Olympus Optical Co Ltd 回路基板
JPH11145570A (ja) * 1997-11-10 1999-05-28 Mitsubishi Electric Corp プリント基板
US6038133A (en) * 1997-11-25 2000-03-14 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method for producing the same
JP3375555B2 (ja) 1997-11-25 2003-02-10 松下電器産業株式会社 回路部品内蔵モジュールおよびその製造方法
US6274978B1 (en) * 1999-02-23 2001-08-14 Sarnoff Corporation Fiber-based flat panel display
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Also Published As

Publication number Publication date
US8582312B2 (en) 2013-11-12
CN101982027A (zh) 2011-02-23
US20110019381A1 (en) 2011-01-27
WO2009119077A1 (ja) 2009-10-01

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Legal Events

Date Code Title Description
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B11E Dismissal acc. art. 34 of ipl - requirements for examination incomplete
B11T Dismissal of application maintained [chapter 11.20 patent gazette]