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BRPI0823106A2 - Composição de resina de epóxi - Google Patents

Composição de resina de epóxi

Info

Publication number
BRPI0823106A2
BRPI0823106A2 BRPI0823106-0A BRPI0823106A BRPI0823106A2 BR PI0823106 A2 BRPI0823106 A2 BR PI0823106A2 BR PI0823106 A BRPI0823106 A BR PI0823106A BR PI0823106 A2 BRPI0823106 A2 BR PI0823106A2
Authority
BR
Brazil
Prior art keywords
resin composition
epoxy resin
epoxy
composition
resin
Prior art date
Application number
BRPI0823106-0A
Other languages
English (en)
Inventor
Stéphane Schaal
Cherif Ghoul
Patricia Gonzales
Original Assignee
Abb Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Research Ltd filed Critical Abb Research Ltd
Publication of BRPI0823106A2 publication Critical patent/BRPI0823106A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
BRPI0823106-0A 2008-09-19 2008-09-19 Composição de resina de epóxi BRPI0823106A2 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2008/062546 WO2010031445A1 (en) 2008-09-19 2008-09-19 Epoxy resin composition

Publications (1)

Publication Number Publication Date
BRPI0823106A2 true BRPI0823106A2 (pt) 2015-06-16

Family

ID=40626572

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0823106-0A BRPI0823106A2 (pt) 2008-09-19 2008-09-19 Composição de resina de epóxi

Country Status (6)

Country Link
US (1) US20110184092A1 (pt)
EP (1) EP2326679A1 (pt)
KR (1) KR20110043738A (pt)
CN (1) CN102159614A (pt)
BR (1) BRPI0823106A2 (pt)
WO (1) WO2010031445A1 (pt)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2411462T3 (es) * 2009-04-02 2013-07-05 Huntsman Advanced Materials (Switzerland) Gmbh Sobremoldeo directo
EP2372725B1 (en) * 2010-03-26 2013-09-11 ABB Research Ltd. Production of electrical insulation and insulated products
CN102376431A (zh) * 2010-08-26 2012-03-14 苏州华电电气股份有限公司 一种低局放简易高压引出套管
DE102012202161A1 (de) * 2012-02-14 2013-08-14 Elantas Gmbh Elektroisolierharz auf Basis von Isohexiddioldiglycidethern
JP6469943B2 (ja) * 2012-03-01 2019-02-13 住友ベークライト株式会社 ローター固定用樹脂組成物およびローター
CN103146148B (zh) * 2013-03-07 2014-03-05 明珠电气有限公司 一种无卤阻燃环氧树脂组合物及其浇注成的干式变压器
US10221276B2 (en) 2013-09-27 2019-03-05 Aditya Birla Chemicals (Thailand) Ltd. Self-healing epoxy resin composition
FR3020496A1 (fr) * 2014-04-24 2015-10-30 Arkema France Utilisation d'une composition de resine thermodurcissable de type vitrimere pour la fabrication de pieces d'isolation electrique
EP3364432A1 (en) * 2017-02-21 2018-08-22 ABB Schweiz AG Fire protection of a dry power transformer winding
CN110740997A (zh) 2017-06-09 2020-01-31 瀚森公司 用于复合材料的环氧树脂体系
CN107353577A (zh) * 2017-08-11 2017-11-17 芜湖凌梦电子商务有限公司 一种阻燃改性工程塑料及其制备方法
KR102044524B1 (ko) * 2017-09-01 2019-11-14 주식회사 케이씨씨 수성 에폭시 수지 분산액 및 이를 포함하는 도료 조성물
KR102065784B1 (ko) 2018-05-30 2020-01-14 주식회사 이원그린텍 무취의 2액형 에폭시수지 조성물
CN112847994A (zh) * 2021-01-07 2021-05-28 迈杰科输配电设备江苏有限公司 一种环氧树脂盆式绝缘子的静态浇注工艺
KR20250003587A (ko) * 2022-04-18 2025-01-07 아지노모토 가부시키가이샤 수지 조성물

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3658750A (en) * 1969-02-13 1972-04-25 Hitachi Ltd Thermosetting resin composition and electrical appliances using the same
BE759569A (fr) * 1969-11-28 1971-05-27 Minnesota Mining & Mfg Composition de resine epoxy stable
JPS518678B2 (pt) * 1973-02-24 1976-03-18
DE3326532A1 (de) * 1983-07-22 1985-01-31 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von epoxidharzformstoffen
US6194490B1 (en) * 1998-02-27 2001-02-27 Vantico, Inc. Curable composition comprising epoxidized natural oils
EP1165688B1 (de) * 1999-03-16 2007-01-24 Huntsman Advanced Materials (Switzerland) GmbH Härtbare zusammensetzung mit besonderer eigenschaftskombination
ATE355318T1 (de) * 2003-06-16 2006-03-15 Abb Technology Ltd Epoxyharzzusammensetzungen und verfahren zur herstellung von geformten gegenständen daraus
DK1978049T3 (da) * 2007-04-03 2010-06-14 Abb Research Ltd Epoxyharpikssammensætning, der kan hærdes

Also Published As

Publication number Publication date
CN102159614A (zh) 2011-08-17
KR20110043738A (ko) 2011-04-27
US20110184092A1 (en) 2011-07-28
EP2326679A1 (en) 2011-06-01
WO2010031445A1 (en) 2010-03-25

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 6A E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2343 DE 01-12-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.