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BRPI0820148A2 - Sistema de aberturas, sistema de computador e método para usinar aberturas - Google Patents

Sistema de aberturas, sistema de computador e método para usinar aberturas

Info

Publication number
BRPI0820148A2
BRPI0820148A2 BRPI0820148A BRPI0820148A2 BR PI0820148 A2 BRPI0820148 A2 BR PI0820148A2 BR PI0820148 A BRPI0820148 A BR PI0820148A BR PI0820148 A2 BRPI0820148 A2 BR PI0820148A2
Authority
BR
Brazil
Prior art keywords
openings
machining
computer system
computer
machining openings
Prior art date
Application number
Other languages
English (en)
Inventor
Christopher N Rijken
Mark D Tupa
Michael R Durham
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Publication of BRPI0820148A2 publication Critical patent/BRPI0820148A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/20—Compensating for effects of temperature changes other than those to be measured, e.g. changes in ambient temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Control Of Temperature (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
BRPI0820148 2008-01-31 2008-01-31 Sistema de aberturas, sistema de computador e método para usinar aberturas BRPI0820148A2 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2008/052562 WO2009096966A1 (en) 2008-01-31 2008-01-31 Insulating aperture in printed circuit boards

Publications (1)

Publication Number Publication Date
BRPI0820148A2 true BRPI0820148A2 (pt) 2015-05-12

Family

ID=40913098

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0820148 BRPI0820148A2 (pt) 2008-01-31 2008-01-31 Sistema de aberturas, sistema de computador e método para usinar aberturas

Country Status (8)

Country Link
US (1) US8335077B2 (pt)
JP (1) JP2011511455A (pt)
CN (1) CN101933410B (pt)
BR (1) BRPI0820148A2 (pt)
DE (1) DE112008003664T5 (pt)
GB (1) GB2469242B (pt)
TW (1) TWI437929B (pt)
WO (1) WO2009096966A1 (pt)

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US8878071B2 (en) 2011-01-20 2014-11-04 International Business Machines Corporation Integrated device with defined heat flow
DE102011004353B4 (de) * 2011-02-18 2015-08-27 Continental Automotive Gmbh Leiterplatte mit einer Überwachungselektronik zur Überwachung von Batteriezellen, sowie damit ausgestatteter elektrischer Energiespeicher
US8363411B2 (en) 2011-03-18 2013-01-29 Eldon Technology Limited Passive, low-profile heat transferring system
US8619427B2 (en) 2011-03-21 2013-12-31 Eldon Technology Limited Media content device chassis with internal extension members
US8681495B2 (en) 2011-03-29 2014-03-25 Eldon Technology Limited Media device having a piezoelectric fan
DE102011107316A1 (de) * 2011-07-06 2013-06-06 Abb Ag Anordnung zum Kühlen von Baugruppen eines Automatisierungs- oder Steuerungssystems
CN103138940B (zh) * 2011-11-28 2016-06-01 英业达科技有限公司 服务器机架系统
EP2640175B1 (de) * 2012-03-12 2017-07-12 Siemens Aktiengesellschaft Baugruppe für ein modulares Automatisierungsgerät
KR20140019043A (ko) * 2012-06-29 2014-02-14 삼성디스플레이 주식회사 평판표시장치
FR3004057B1 (fr) 2013-03-26 2017-02-17 Valeo Systemes Thermiques Module de commande d'un appareil electrique
US9398682B2 (en) * 2013-03-28 2016-07-19 Control Techniques Limited Devices and methods for cooling components on a PCB
US9743555B2 (en) * 2013-04-02 2017-08-22 Gerald Ho Kim Silicon-based heat dissipation device for heat-generating devices
DE102014104976B4 (de) * 2013-04-29 2017-07-06 Toyota Jidosha Kabushiki Kaisha Gedruckte Leiterplatinen mit Temperaturmanagementeigenschaften und diese aufweisende Temperaturmanagementvorrichtungen
DE102014104970A1 (de) * 2013-04-29 2014-10-30 Toyota Motor Engineering & Manufacturing North America, Inc. Kompositlaminat mit Temperaturmanagementeigenschaften und dieses aufweisende Temperaturmanagementvorrichtungen
DE112013007328B4 (de) * 2013-08-09 2020-06-18 Therm-O-Disc, Incorporated Drahtlose Temperatur- und/oder Feuchtigkeitssensoranordnung
WO2015177904A1 (ja) * 2014-05-22 2015-11-26 三菱電機株式会社 電動モータ用制御装置
JP2016524820A (ja) * 2014-06-23 2016-08-18 ▲ホア▼▲ウェイ▼技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． チップ放熱構造体および端末装置
JP6252873B2 (ja) * 2015-03-27 2017-12-27 株式会社オートネットワーク技術研究所 車載配電基板、電気接続箱および充放電コントローラ
KR102709687B1 (ko) * 2017-01-06 2024-09-26 삼성전자주식회사 방열 구조 및 그를 포함하는 전자 장치
JP6985900B2 (ja) * 2017-11-16 2021-12-22 アズビル株式会社 温度センサ
US10962422B2 (en) * 2018-09-05 2021-03-30 Hamilton Sundstrand Corporation Differential and high rate of change temperature sensing circuit
KR102792206B1 (ko) 2019-04-25 2025-04-04 주식회사 엘지에너지솔루션 Bms 회로, bms 회로를 포함하는 배터리팩
IT202000007009A1 (it) * 2020-04-02 2021-10-02 St Microelectronics Srl Sensore di temperatura ambientale accoppiabile a una scheda di circuito stampato con incapsulamento perfezionato
JP7681451B2 (ja) * 2021-07-20 2025-05-22 シャープ株式会社 温度検出素子付きの電子回路
WO2023203750A1 (ja) * 2022-04-22 2023-10-26 日立Astemo株式会社 電子制御装置

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Also Published As

Publication number Publication date
GB2469242B (en) 2011-12-28
JP2011511455A (ja) 2011-04-07
DE112008003664T5 (de) 2010-12-30
TWI437929B (zh) 2014-05-11
CN101933410A (zh) 2010-12-29
WO2009096966A1 (en) 2009-08-06
US20100290183A1 (en) 2010-11-18
GB201012152D0 (en) 2010-09-01
US8335077B2 (en) 2012-12-18
GB2469242A (en) 2010-10-06
TW200942094A (en) 2009-10-01
CN101933410B (zh) 2013-10-16

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Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

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