BRPI0806015A2 - process for the preparation of thin or ultra thin films and nanocomposites of metal oxide and / or metal oxide nanoparticles impregnated and / or deposited on glassy, polymeric, wood, metal and other substrates - Google Patents
process for the preparation of thin or ultra thin films and nanocomposites of metal oxide and / or metal oxide nanoparticles impregnated and / or deposited on glassy, polymeric, wood, metal and other substrates Download PDFInfo
- Publication number
- BRPI0806015A2 BRPI0806015A2 BRPI0806015A BRPI0806015A2 BR PI0806015 A2 BRPI0806015 A2 BR PI0806015A2 BR PI0806015 A BRPI0806015 A BR PI0806015A BR PI0806015 A2 BRPI0806015 A2 BR PI0806015A2
- Authority
- BR
- Brazil
- Prior art keywords
- metal
- metals
- wood
- substrates
- temperature
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 47
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 39
- 239000002184 metal Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 33
- 229910044991 metal oxide Inorganic materials 0.000 title claims abstract description 25
- 150000004706 metal oxides Chemical class 0.000 title claims abstract description 25
- 239000002023 wood Substances 0.000 title claims abstract description 19
- 230000008569 process Effects 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000002105 nanoparticle Substances 0.000 title claims description 7
- 239000010409 thin film Substances 0.000 title abstract description 16
- 239000002114 nanocomposite Substances 0.000 title abstract description 10
- 150000002739 metals Chemical class 0.000 claims abstract description 22
- 239000011521 glass Substances 0.000 claims abstract description 17
- 230000009477 glass transition Effects 0.000 claims abstract description 10
- 230000008859 change Effects 0.000 claims abstract description 7
- 230000003647 oxidation Effects 0.000 claims abstract description 7
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract 5
- 229920000307 polymer substrate Polymers 0.000 claims abstract 2
- 238000000151 deposition Methods 0.000 claims description 20
- 230000008021 deposition Effects 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 238000005470 impregnation Methods 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000001764 infiltration Methods 0.000 claims description 2
- 230000008595 infiltration Effects 0.000 claims description 2
- 239000002082 metal nanoparticle Substances 0.000 claims description 2
- -1 WHERE Substances 0.000 claims 3
- 230000007935 neutral effect Effects 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 239000011224 oxide ceramic Substances 0.000 claims 1
- 229910052574 oxide ceramic Inorganic materials 0.000 claims 1
- 230000000737 periodic effect Effects 0.000 claims 1
- 230000001603 reducing effect Effects 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 15
- 239000000126 substance Substances 0.000 abstract description 3
- 239000002131 composite material Substances 0.000 abstract 1
- 239000012467 final product Substances 0.000 abstract 1
- 239000010936 titanium Substances 0.000 description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 230000003993 interaction Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical group [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000007832 Na2SO4 Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004110 electrostatic spray deposition (ESD) technique Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000367 silver sulfate Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical And Physical Treatments For Wood And The Like (AREA)
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
PROCESSO DE PREPARAçãO DE FILMES FINOS OU ULTRA-FINOS E NANOCOMPóSITOS DE NANOPARTICULAS DE óXIDOS METáLICOS E/OU METAIS IMPREGNADOS E/OU DEPOSITADOS EM SUBSTRATOS VìTREOS, POLIM~RICOS, MADEIRAS, METAIS E OUTROS consiste na criação de uma metodologia de impregnação de óxidos metálicos e ou metais em substratos diversificados. Os resultados deste processo são exemplificados nesta patente e são geradores de filmes finos, filmes ultra-finos compósitos com a superfície do substrato, nanocompósitos com a superfície do substrato em superfície de vidros na forma de nanocompósitos a partir de óxidos metálicos e/ou metais pulverizados. O procedimento proposto diferencia-se das metodologias que são aplicadas atualmente por se aplicar óxidos metálicos e/ou metais exatamente na composição química que se pretende obter como o produto final do filme em temperaturas que estão abaixo da: temperatura de transição vítrea para substratos de vidro temperatura de amolecimento para substratos de polímeros, ponto de fulgor para substrato de madeira e temperatura de mudança de estado de oxidação para metais.PROCESS FOR PREPARATION OF FINE OR ULTRA FINE FILMS AND NANOCOMPOSITES OF METALLIC AND / OR METAL IMPREGNED AND / OR METAL NANOPARTICULES, CONTAINED IN METHODS, POLYMERICES, METALS AND METHODS and or metals on diversified substrates. The results of this process are exemplified in this patent and are thin film generators, ultra thin substrate surface composite films, glass surface substrate nanocomposites in the form of nanocomposites from metal oxides and / or pulverized metals. . The proposed procedure differs from the methodologies currently applied by applying metal oxides and / or metals exactly in the chemical composition intended to be obtained as the final product of the film at temperatures below: glass transition temperature for glass substrates softening temperature for polymer substrates, flash point for wood substrate and oxidation state change temperature for metals.
Description
PROCESSO DE PREPARAÇÃO DE FILMES FINOS OUULTRA-FINOS E NANOCOMPÓSITOS DENANOPARTiCULAS DE ÓXIDOS METÁLICOS E/OUMETAIS IMPREGNADOS E/OU DEPOSITADOS EMSUBSTRATOS VÍTREOS, POLIMÉRICOS, MADEIRAS,METAIS E OUTROSPREPARATION OF PREPARATION OF GOLDEN FINAL FILMS AND NANOCOMPOSITES OF IMPREGNED AND / OR DEPOSIT METAL, METAL, WOOD AND OIL SUBSTRATES
A presente invenção compreende a um método para fabricação defilmes finos ou ultra-finos e nanocompósitos de nanopartículas de óxidosmetálicos e/ou metais em interação com substratos de vidros ou poliméricos oumadeiras, metais ou ainda qualquer outro substrato que apresente ou possa segerar porosidade em sua superfície por meio de um processo de impregnaçãoe/ou deposição de pós de óxidos metálicos e/ou metais previamenteconstituídos em temperatura abaixo da transição vítrea ou do amolecimento oudo ponto de fulgor ou ainda abaixo de qualquer temperatura que acarrete namudança de estado físico do material quando associado a influência do tempoem que é processado o ensaio.The present invention comprises a method for the manufacture of thin or ultra-thin films and nanocomposites of metal oxide nanoparticles and / or metals in interaction with glass or polymeric substrates or wood, metals or any other substrate which may or may pore its surface. by a process of impregnating and / or depositing powders of metal oxides and / or metals previously constituted at a temperature below the glass transition or softening or flash point or below any temperature which results in a change in the physical state of the material when associated with influence of the time at which the assay is processed.
É comum encontrar na literatura científica estudos referentes àspropriedades de materiais relacionados à estrutura de superfície. Aspropriedades de superfície dos materiais podem ser modificadas a partir dediversas técnicas de deposição capazes de formar filmes finos, espessos ouainda ultra-finos. Algumas dessas técnicas são descritas a seguir.It is common to find in the scientific literature studies concerning the properties of materials related to surface structure. The surface properties of materials can be modified from various deposition techniques capable of forming thin, thick or still ultra thin films. Some of these techniques are described below.
Filmes finos podem ser produzidos por deposições de soluções salinasatravés do efeito da temperatura. Já se chegou a preparar filmes de comdeposição de íons Ag+ na superfície de vidros a partir de solução de Ag2SO4,CuSO4, Na2SO4, em presença de compostos orgânicos e dispersos em óleo. Atemperatura de tratamento foi de 300 0C, 320 0C e 350 0C, com tempo quevariou entre 1 e 48 h.Thin films can be produced by saline deposition through the effect of temperature. Ag + ion deposition films have already been prepared on the glass surface from Ag2SO4, CuSO4, Na2SO4 solution in the presence of organic compounds dispersed in oil. The treatment temperature was 300 ° C, 320 ° C and 350 ° C, with time ranging from 1 to 48 h.
Outra maneira de se obter filmes é a partir da depositaram por sprayeletrostático, por método de método de pulverização catódica e seguidos detratamento térmico.A técnica de plasma com arco catódico filtrado e fluxo de oxigêniotambém foi aplicada para depositar filmes finos de oxido de zinco em superfícievítrea e temperatura de 200 0C.Another way to obtain films is from electrostatic spray deposition, sputtering method followed by thermal treatment. The filtered cathodic arc plasma and oxygen flow technique was also applied to deposit thin surface zinc oxide films. and temperature of 200 ° C.
Outra maneira ainda de se alterar as propriedades superficiais dosmateriais está na adição direta de dopantes durante o processo de síntese queformam novos materiais com novas propriedades, conseqüentemente,mudando também as propriedades superficiais.Still another way of altering the surface properties of the materials is in the direct addition of dopants during the synthesis process that form new materials with new properties, consequently also changing the surface properties.
Atualmente, 3 tipos de substratos são utilizados no desenvolvimento defilmes finos: 1) Lâminas metálicas, utilizada para fabricação de filmes finospara capacitores em placas de circuito impresso por meio de recobrimentoscomo níquel ou cobre. 2) Substratos cerâmicos. 3) Bolachas de silício, parafabricação de filmes finos de óxidos metálicos. Sabe-se que uma condiçãobásica para a seleção de um substrato para fabricação de filmes finos é baixarugosidade superficial.Currently, 3 types of substrates are used in the development of thin films: 1) Metal foils, used to make thin films for capacitors on printed circuit boards through coatings such as nickel or copper. 2) Ceramic substrates. 3) Silicon crackers, paraffin fabrication of metal oxide thin films. It is known that a basic condition for the selection of a thin film substrate is low surface roughness.
Entre os vários métodos existentes para fabricação de filmes finos,podemos citar: Pulverização Catódica (Sputtering), Deposição de VaporQuímico (CVD), Sol-Gel, Spray-pirólise, etc. Todos estes métodos possuemvantagens e desvantagens, mas em geral possuem dificuldades como altocusto, dificuldades em reproduzir resultados, trincas superficiais e porosidades.Among the many existing methods for thin film manufacturing we can mention: Sputtering, Chemical Vapor Deposition (CVD), Sol-Gel, Spray Pyrolysis, etc. All these methods have advantages and disadvantages, but in general they have difficulties such as high cost, difficulties in reproducing results, superficial cracks and porosities.
Deve-se considerar também, que os métodos acima descritos, podemconstituir os óxidos que se pretende obter na forma de filmes, somente seforem misturados durante o processo de síntese desses materiais. Para aformação de filmes em substratos já processados os óxidos se formam a partirde substâncias precursoras depositadas nos substratos que, por tratamento(normalmente térmico), formam os filmes de óxidos que se pretende obter.It should also be noted that the methods described above may constitute the oxides to be obtained in the form of films only mixed during the synthesis process of these materials. For the formation of films on already processed substrates, oxides are formed from precursor substances deposited on the substrates that, by treatment (usually thermal), form the oxide films to be obtained.
Cabe ressaltar que os materiais vítreos quando submetidos atemperaturas elevadas atingem um estado de "amolecimento" que, pordefinição, é conhecido como transição vítrea (Tg). Esta transição vítrea muitasvezes é fator Iimitante para os métodos de obtenção de filmes e impregnaçãode materiais particulados na superfície dos vidros e, se for substrato poliméricopode-se atingir o amolecimento e, se for madeira o ponto de fulgor e, metal aoxidação, etc.A presente invenção compreende a um método para fabricação defilmes finos ou ultra-finos e nanocompósitos de nanopartículas de óxidosmetálicos em interação com substratos de vidros ou poliméricos ou madeiras,metais ou ainda qualquer outro substrato que apresente ou possa se gerarporosidade em sua superfície por meio de um processo de impregnação e/oudeposição de pós de óxidos metálicos previamente constituídos emtemperatura abaixo da transição vítrea ou do amolecimento ou do ponto defulgor ou ainda abaixo de qualquer temperatura que acarrete na mudança deestado físico do material quando associado a influência do tempo em que éprocessado o ensaio.It is noteworthy that the vitreous materials when subjected to high temperatures reach a state of "softening" which, by definition, is known as glass transition (Tg). This glass transition is often a limiting factor for filmmaking methods and impregnation of particulate materials on the glass surface, and if it is a polymeric substrate softening can be achieved and if it is wood the flash point and metal oxidation etc. The present invention comprises a method for the manufacture of thin or ultra-thin films and nanocomposites of metal oxide nanoparticles in interaction with glass or polymeric substrates or woods, metals or any other substrate which presents or may generate porosity on its surface by means of a surface. a process of impregnation and / or deposition of previously constituted metal oxide powders at a temperature below the glass transition or softening or flash point or below any temperature resulting in a change in the physical state of the material when associated with the influence of the time at which the test is performed .
Os desenhos descritos a seguir referem-se a resultados na forma deexemplificação da invenção da metodologia para fabricação de filmes finos ouultra-finos e nanocompósitos de nanopartículas de óxidos metálicos eminteração com substratos de vidros ou poliméricos ou madeiras, metais ouainda qualquer outro substrato que apresente ou possa se gerar porosidadeem sua superfície por meio de um processo de impregnação e/ou deposiçãode pós de óxidos metálicos previamente constituídos em temperatura abaixoda transição vítrea ou do amolecimento ou do ponto de fulgor ou ainda abaixode qualquer temperatura que acarrete na mudança de estado físico associadosa influência do tempo em que é submetido o ensaio, nos quais:The following drawings refer to results in the exemplary form of the invention of the methodology for manufacturing thin oxide or ultra-thin films and nanocomposites of metal oxide nanoparticles in interaction with glass or polymeric substrates or woods, metals, or any other substrate presenting or porosity can be generated on its surface by a process of impregnation and / or deposition of metal oxide powders previously constituted at a temperature below the glass transition or from the softening or the flash point or even below any temperature that results in the change of physical state associated with the influence of the time at which the test is submitted, in which:
a fig. 1 representa uma seqüência de micrografias pormicroscopia eletrônica de varredura com 3000 X de ampliação, que vai dosubstrato de vidro puro até a deposição do filme Sn02 nánoparticulado tratadoà 485°C.fig. 1 is a sequence of 3,000 X magnification scanning electron micrographs from pure glass substrate to the deposition of unparticulated Sn02 film treated at 485 ° C.
a fig. 2 representa um exemplo de deposição de óxido decobalto por MEV.fig. 2 represents an example of decobalt oxide deposition by SEM.
a fig. 3 representa um exemplo de deposição de óxido deferro Ill por MEV.fig. 3 represents an example of iron oxide III deposition by SEM.
a fig. 4 representa um exemplo de deposição deóxido de titânio por MEV.fig. 4 depicts an example of deposition of titanium oxide by SEM.
a fig. 5 representa um exemplo de deposição deóxido de alumínio por MEV.a fig. 6 representa um exemplo de deposição deóxido de cobre por MEV.fig. 5 depicts an example of deposition of aluminum oxide by SEM. FIG. 6 represents an example of deposition of copper oxide by SEM.
A presente invenção compreende um processo para fabricação defilmes finos de óxidos metálicos de filmes em temperaturas abaixo datemperatura de transição vítrea, ou da temperatura de amolecimento, ou doponto de fulgor ou ainda da mudança no estado de oxidação, dependendo dosubstrato, alta pressão em função do tempo do ensaio. O processo consistede: (a) deposição de pós metálicos na superfície de substrato, (b) aplicação degás resfriado sob alta pressão, (c) infiltração e/ou deposição dos pós nasuperfície do substrato e (d) temperatura de aquecimento abaixo datemperatura de transição vítrea (para vidros), amolecimento (para polímeros),ponto de fulgor (para madeira) e oxidação (para metais) em função do tempo.Após a impregnação e/ou deposição, sob alta pressão, os óxidos metálicosformarão uma segunda fase, como em um compósito, que dependendo defatores como constituição química do substrato, granulometria e área desuperfície específica dos pós de óxidos metálicos, pressão de gás aplicada,tipo de gás, tempo de tratamento e temperatura, poderão estar em um estadoamorfo ou nanocristalino, podendo, portanto formar um filme fino constituídoou não de matérias denominados de nanocompósito.The present invention comprises a process for the manufacture of thin films of metal oxides of films at temperatures below the glass transition temperature, the softening temperature, the glow point or the change in oxidation state depending on the substrate, high pressure as a function of rehearsal time. The process consists of: (a) deposition of metal powders on the substrate surface, (b) application of high pressure cooled degassing, (c) infiltration and / or deposition of powders on the substrate surface and (d) heating temperature below transition temperature glass (for glass), softening (for polymers), flash point (for wood) and oxidation (for metals) as a function of time. After impregnation and / or deposition under high pressure, metal oxides will form a second phase, such as depending on factors such as substrate chemical constitution, particle size and specific surface area of metal oxide powders, applied gas pressure, gas type, treatment time and temperature, may be in a amorphous or nanocrystalline state and may therefore form a thin film consisting of non-nanocomposite materials.
A figura 1 compreende um exemplo de filme fino de óxidos metálicosimpregnados e/ou depositados por alta pressão limite (Pl) em substrato. Nestafigura 1 pode-se verificar que, mesmo a pressão Pl, no ponto (1) o substratonão sofre nenhum tratamento (temperatura To=O e tempo to=0),conseqüentemente, o óxido metálico e/ou metal não é depositado.Figure 1 shows an example of thin film of metal oxides impregnated and / or deposited by high limit pressure (P1) on substrate. From this figure 1 it can be seen that even at the pressure P1, at point (1) the substratum is not treated (temperature To = O and time to = 0), consequently, the metal oxide and / or metal is not deposited.
Com aplicação da pressão limite ou superior a Pl, em um tratamentotérmico a uma temperatura Ti>T0 e tempo ti>to pode-se perceber que começaa ocorrer à impregnação e/ou deposição do óxido metálico e/ou metal com osubstrato levando ao ponto (2) da figura 1.With the application of the limit pressure or higher than Pl, in a heat treatment at a temperature Ti> T0 and time ti> to it can be seen that it begins to occur to the impregnation and / or deposition of metal oxide and / or metal with the substrate leading to the point ( 2) of figure 1.
Quando a pressão limite for mantida constante, pode-se melhorar adeposição e/ou impregnação do filme se elevar a temperatura de Ti para T2 ouelevar o tempo de ti para X2 ou elevar a temperatura e o tempo para T2 e hrespectivamente. Porém, mantendo-se constante a temperatura em Ti e otempo em ti, mas, elevando-se a pressão em valor superior a Pl também épossível atingir um filme indicado pelo estágio (3) da figura 1.When the limit pressure is kept constant, film adhesion and / or impregnation can be improved by raising the temperature from Ti to T2 or raising the time from ti to X2 or raising the temperature and time to T2 and respectively. However, keeping the temperature constant at Ti and the time at Ti, but by increasing the pressure higher than Pl it is also possible to reach a film indicated by stage (3) of Figure 1.
Analogamente, ainda na figura 1, pode-se atingir o estágio 3 se: apressão limite for mantida constante e a temperatura de T2 for elevada para T3ou ainda, se o tempo for acrescido de t2 para k ou elevar ambos para T3 e t3respectivamente. Neste mesmo exemplo, também se chega ao mesmoresultado se manter constante a temperatura em T2 e o tempo em t2, mas, se apressão aplicada for superior a pressão exercida no estágio (2).Similarly, still in figure 1, stage 3 can be reached if: the limit pressure is kept constant and the temperature of T2 is raised to T3 or even if the time is increased from t2 to k or raise both to T3 and t3 respectively. In this same example, it is also reached the same result if the temperature at T2 and the time at t2 remain constant, but if the applied pressure is greater than the pressure exerted at stage (2).
Desta forma, comprova-se que aplicando-se uma pressão bastanteelevada, e uma temperatura Tn (onde η é um valor superior a zero) que variapara, temperatura abaixo da temperatura de transição vítrea quando osubstrato for vidro, temperatura abaixo da temperatura de amolecimentoquando o substrato for polímero, temperatura abaixo do ponto de fulgorquando o substrato for madeira e temperatura abaixo da temperatura deoxidação para metais e um tempo tm (onde m é um valor superior a zero) pode-se ter uma metodologia diferenciada da obtenção de filmes finos ou ultra-finose nanocompósitos de nanopartículas de óxidos metálicos e/ou metais eminteração com substratos de vidros ou poliméricos ou madeiras, metais ouainda qualquer outro substrato que apresente ou possa se gerar porosidadeem sua superfície por meio de um processo de impregnação e/ou deposiçãoda elevada pressão função do tempoThus, it is shown that by applying a very high pressure, and a temperature Tn (where η is greater than zero) which varies for, temperature below the glass transition temperature when the substrate is glass, temperature below the softening temperature when the substrate for polymer, temperature below flash point when substrate for wood and temperature below oxidation temperature for metals and a tm time (where m is greater than zero) can have a different methodology for obtaining thin or ultra thin films. - finose nanocomposites of metal oxide and / or metal nanoparticles in interaction with glass or polymeric substrates or woods, metals or any other substrate which may or may generate porosity on its surface by a high pressure impregnation and / or deposition process of time
Por sua vez, as figuras que vão desde a figura 2 até a figura 6demonstram a possibilidade de se aplicar diferentes óxidos constituídos emsubstratos quando se aplica uma pressão igual ou superior a Pl, umatemperatura Ti ou superior a ela e um tempo de seja de no mínimo ti.In turn, the figures from figure 2 to figure 6 demonstrate the possibility of applying different substrate oxides when a pressure of P1 or greater, a temperature of Ti or greater and a time of at least you.
Ainda referente às figuras já mencionadas e, de acordo com a propostadeste processo de preparação de filmes em substratos, pode-se verificar apossibilidades de se impregnar e/ou depositar óxido de cobalto (figura 2),óxido de ferro Ill (figura 3), óxido de titânio (figura 4), óxido de alumínio (figura5), óxido de cobre (figura 6) ou qualquer outro tipo de óxido metálico e/oumetal, nos substratos de vidro, polímero, madeira ou metal, desde que serespeite as condições de pressão, temperatura e tempo proposto nesteprocesso inventivo.Still referring to the figures already mentioned and, according to the proposal of this process of preparing films on substrates, it is possible to verify the possibility of impregnating and / or depositing cobalt oxide (figure 2), iron oxide III (figure 3), titanium oxide (figure 4), aluminum oxide (figure 5), copper oxide (figure 6) or any other type of metal and / or metal oxide on glass, polymer, wood or metal substrates, provided pressure, temperature and time proposed in this inventive process.
Claims (8)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BRPI0806015 BRPI0806015A2 (en) | 2008-12-29 | 2008-12-29 | process for the preparation of thin or ultra thin films and nanocomposites of metal oxide and / or metal oxide nanoparticles impregnated and / or deposited on glassy, polymeric, wood, metal and other substrates |
| PCT/BR2009/000419 WO2010075615A1 (en) | 2008-12-29 | 2009-12-23 | Process for preparing thin or ultra-thin films and nanocomposites of metal oxide and/or metal nanoparticles for impregnating and/or coating glass, polymer, wood and metal substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BRPI0806015 BRPI0806015A2 (en) | 2008-12-29 | 2008-12-29 | process for the preparation of thin or ultra thin films and nanocomposites of metal oxide and / or metal oxide nanoparticles impregnated and / or deposited on glassy, polymeric, wood, metal and other substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0806015A2 true BRPI0806015A2 (en) | 2010-09-14 |
Family
ID=42309733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0806015 BRPI0806015A2 (en) | 2008-12-29 | 2008-12-29 | process for the preparation of thin or ultra thin films and nanocomposites of metal oxide and / or metal oxide nanoparticles impregnated and / or deposited on glassy, polymeric, wood, metal and other substrates |
Country Status (2)
| Country | Link |
|---|---|
| BR (1) | BRPI0806015A2 (en) |
| WO (1) | WO2010075615A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3516091A4 (en) * | 2016-09-20 | 2020-04-01 | Agency for Science, Technology and Research | REDOXACTIVE METAL / METAL OXIDE COMPOUNDS FOR ANTIMICROBIAL APPLICATIONS |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5399388A (en) * | 1994-02-28 | 1995-03-21 | The United States Of America As Represented By The Secretary Of The Navy | Method of forming thin films on substrates at low temperatures |
| US6573531B1 (en) * | 1999-09-03 | 2003-06-03 | The Trustees Of Columbia University In The City Of New York | Systems and methods using sequential lateral solidification for producing single or polycrystalline silicon thin films at low temperatures |
| DE10312658A1 (en) * | 2003-03-21 | 2004-09-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process for coating flexible substrates, e.g. polymer films, with aluminum comprises coating the substrate with a thin aluminum oxide layer before applying the aluminum |
| ATE362803T1 (en) * | 2005-06-11 | 2007-06-15 | Tutech Innovation Gmbh | METHOD FOR MICROENCAPSULATING ORGANIC SUBSTANCES IN PARTICLE FORM BY SPRAYING AN INERT SUPERCRITICAL CARRIER GAS TOGETHER WITH COATING MATERIAL FOR THE ORGANIC SUBSTANCES INTO A HIGH PRESSURE FLUIDIZED LAYER IN AN AUTOCLAVE |
| US8628714B2 (en) * | 2006-09-29 | 2014-01-14 | Massachusetts Institute Of Technology | System and method for providing the capability of peeling thin polymer films from a substrate |
-
2008
- 2008-12-29 BR BRPI0806015 patent/BRPI0806015A2/en not_active Application Discontinuation
-
2009
- 2009-12-23 WO PCT/BR2009/000419 patent/WO2010075615A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010075615A1 (en) | 2010-07-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Hora et al. | Inorganic thin film deposition and application on organic polymer substrates | |
| Deshmukh et al. | Structural, optical and electrical characterization of spray-deposited TiO2 thin films | |
| Zhao et al. | Thermal and plasma-enhanced atomic layer deposition of yttrium oxide films and the properties of water wettability | |
| Biederman et al. | Nanocomposite and nanostructured films with plasma polymer matrix | |
| Xia et al. | Significantly enhanced dielectric and hydrophobic properties of SiO 2@ MgO/PMMA composite films | |
| Niu et al. | Preparation, characterization and application of high-temperature Al2O3 insulating film | |
| Kwon et al. | Structural and surface properties of NiCr thin films prepared by DC magnetron sputtering under variation of annealing conditions | |
| Kylián et al. | Core@ shell Cu/hydrocarbon plasma polymer nanoparticles prepared by gas aggregation cluster source followed by in‐flight plasma polymer coating | |
| Varnagiris et al. | Incorporation of SiO2 and TiO2 additives into expanded polystyrene foam using physical vapour deposition technique | |
| CN104350172B (en) | There is the arc deposited Al-Cr-O coating strengthening coating performance | |
| Choukourov et al. | Structured Ti/hydrocarbon plasma polymer nanocomposites produced by magnetron sputtering with glancing angle deposition | |
| Kumar et al. | Modern coating processes and technologies | |
| Cheng et al. | Low-temperature deposition of α-Al2O3 film using Al+ α-Al2O3 composite target by radio frequency magnetron sputtering | |
| JP5219059B2 (en) | Protective film composed of clay alignment film | |
| JP2000096212A (en) | Photocatalyst film-coated member and method of manufacturing the same | |
| Shearer et al. | Composite SiO2/TiO2 and amine polymer/TiO2 nanoparticles produced using plasma-enhanced chemical vapor deposition | |
| Hansen et al. | Luminescent properties of multilayered Eu2O3 and TiO2 grown by atomic layer deposition | |
| BRPI0806015A2 (en) | process for the preparation of thin or ultra thin films and nanocomposites of metal oxide and / or metal oxide nanoparticles impregnated and / or deposited on glassy, polymeric, wood, metal and other substrates | |
| Kim et al. | Making porous conductive carbon films with unbalanced magnetron sputtering | |
| Lee et al. | Structural and X‐Ray Photoelectron Spectroscopy Study of Al‐Doped Zinc‐Oxide Thin Films | |
| Choi et al. | Annealing temperature effect on the surface properties of the MoSe thin films | |
| Duan et al. | Effect of ZrB2 and Polyvinyl Butyral Content on the Oxidation Resistance of ZrB2–SiC Coatings Produced by Slurry Brushing Method | |
| WO2019031263A1 (en) | Gas barrier laminate | |
| Thompson et al. | Single-Stage Synthesis and Characterization of Reflective and Conductive Silver− Polyimide Films Prepared from Silver (I) Complexes with ODPA/4, 4′-ODA | |
| JP5104273B2 (en) | Raw material powder of evaporation source material for ion plating, evaporation source material for ion plating and manufacturing method thereof, gas barrier sheet and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B03A | Publication of an application: publication of a patent application or of a certificate of addition of invention | ||
| B06F | Objections, documents and/or translations needed after an examination request according art. 34 industrial property law | ||
| B06I | Technical and formal requirements: publication cancelled | ||
| B07A | Technical examination (opinion): publication of technical examination (opinion) | ||
| B09B | Decision: refusal | ||
| B09B | Decision: refusal |
Free format text: MANTIDO O INDEFERIMENTO UMA VEZ QUE NAO FOI APRESENTADO RECURSO DENTRO DO PRAZO LEGAL |