[go: up one dir, main page]

BRPI0719855A2 - método para transferência de calor e dispositivo para tal. - Google Patents

método para transferência de calor e dispositivo para tal.

Info

Publication number
BRPI0719855A2
BRPI0719855A2 BRPI0719855A BRPI0719855A BRPI0719855A2 BR PI0719855 A2 BRPI0719855 A2 BR PI0719855A2 BR PI0719855 A BRPI0719855 A BR PI0719855A BR PI0719855 A BRPI0719855 A BR PI0719855A BR PI0719855 A2 BRPI0719855 A2 BR PI0719855A2
Authority
BR
Brazil
Prior art keywords
heat transfer
transfer method
heat
transfer
Prior art date
Application number
BRPI0719855A
Other languages
English (en)
Inventor
Jeong Hyun Lee
Original Assignee
Jeong Hyun Lee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jeong Hyun Lee filed Critical Jeong Hyun Lee
Publication of BRPI0719855A2 publication Critical patent/BRPI0719855A2/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2225/00—Reinforcing means
    • F28F2225/04—Reinforcing means for conduits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Sorption Type Refrigeration Machines (AREA)
BRPI0719855A 2006-10-11 2007-07-27 método para transferência de calor e dispositivo para tal. BRPI0719855A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200607076-7A SG142174A1 (en) 2006-10-11 2006-10-11 Method for heat transfer and device therefor
PCT/KR2007/003622 WO2008044823A1 (en) 2006-10-11 2007-07-27 Method for heat transfer and device therefor

Publications (1)

Publication Number Publication Date
BRPI0719855A2 true BRPI0719855A2 (pt) 2015-11-03

Family

ID=39282999

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0719855A BRPI0719855A2 (pt) 2006-10-11 2007-07-27 método para transferência de calor e dispositivo para tal.

Country Status (9)

Country Link
US (1) US9250025B2 (pt)
EP (1) EP2074373B1 (pt)
KR (1) KR101169441B1 (pt)
CN (1) CN101542226B (pt)
BR (1) BRPI0719855A2 (pt)
IL (1) IL198136A0 (pt)
SG (1) SG142174A1 (pt)
TW (1) TW200826828A (pt)
WO (2) WO2008044823A1 (pt)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8353334B2 (en) * 2007-12-19 2013-01-15 Teledyne Scientific & Imaging, Llc Nano tube lattice wick system
US20090166008A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat spreader with vapor chamber
KR101164611B1 (ko) * 2008-09-22 2012-07-13 성균관대학교산학협력단 루프형 히트파이프 시스템용 증발기의 제조방법
JP4737285B2 (ja) * 2008-12-24 2011-07-27 ソニー株式会社 熱輸送デバイス及び電子機器
US20100163211A1 (en) * 2008-12-30 2010-07-01 Nelson N D Heat exchanger assembly
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
CN102374808A (zh) * 2010-08-26 2012-03-14 富准精密工业(深圳)有限公司 平板式均热板
US9603233B2 (en) 2010-11-11 2017-03-21 Schlumberger Technology Corporation Particle accelerator with a heat pipe supporting components of a high voltage power supply
ES2666801T3 (es) * 2011-07-11 2018-05-07 Dow Global Technologies Llc Películas microcapilares que contienen materiales de cambio de fase
TW201437591A (zh) * 2013-03-26 2014-10-01 華碩電腦股份有限公司 熱管結構
NO339680B1 (no) * 2014-07-02 2017-01-23 Goodtech Recovery Tech As Gittermanifold
US12523431B2 (en) 2014-09-15 2026-01-13 Kelvin Thermal Technologies, Inc. Polymer-based microfabricated thermal ground plane
US10731925B2 (en) 2014-09-17 2020-08-04 The Regents Of The University Of Colorado, A Body Corporate Micropillar-enabled thermal ground plane
US9921004B2 (en) 2014-09-15 2018-03-20 Kelvin Thermal Technologies, Inc. Polymer-based microfabricated thermal ground plane
US12385697B2 (en) 2014-09-17 2025-08-12 Kelvin Thermal Technologies, Inc. Micropillar-enabled thermal ground plane
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
CN111306972A (zh) * 2014-11-28 2020-06-19 台达电子工业股份有限公司 热管
US10458719B2 (en) * 2015-01-22 2019-10-29 Pimems, Inc. High performance two-phase cooling apparatus
CN105352352A (zh) * 2015-11-18 2016-02-24 上海利正卫星应用技术有限公司 一种超薄均温板装置及其制作方法
TWI639806B (zh) * 2016-02-05 2018-11-01 業強科技股份有限公司 導熱裝置及其製造方法
RU2720872C2 (ru) 2016-04-29 2020-05-13 Кимберли-Кларк Ворлдвайд, Инк. Капиллярная структура для направленного переноса жидкости (варианты) и подложка для направленного переноса жидкости
US11306974B2 (en) * 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
US11543188B2 (en) 2016-06-15 2023-01-03 Delta Electronics, Inc. Temperature plate device
CN106017174B (zh) * 2016-06-17 2018-05-04 浙江工业大学 一种滴状冷凝且自集水的微制冷器及其制造方法
US12104856B2 (en) 2016-10-19 2024-10-01 Kelvin Thermal Technologies, Inc. Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems
CN116936500A (zh) 2016-11-08 2023-10-24 开尔文热技术股份有限公司 用于在热接地平面中散布高热通量的方法和设备
EP3622238A4 (en) 2017-05-08 2021-01-13 Kelvin Thermal Technologies, Inc. THERMAL MANAGEMENT LEVELS
KR101826341B1 (ko) * 2017-05-29 2018-02-06 주식회사 씨지아이 박판형 히트파이프 제조방법
KR101826339B1 (ko) * 2017-05-29 2018-02-06 주식회사 씨지아이 관체를 이용한 박판형 히트파이프 제조방법
TWM562956U (zh) * 2017-10-12 2018-07-01 泰碩電子股份有限公司 內凸紋構成流道之均溫板
WO2019131790A1 (ja) * 2017-12-28 2019-07-04 古河電気工業株式会社 ヒートパイプ
US10739082B2 (en) * 2018-01-03 2020-08-11 Asia Vital Components Co., Ltd. Anti-pressure structure of heat dissipation device
US11306983B2 (en) * 2018-06-11 2022-04-19 The Regents Of The University Of Colorado, A Body Corporate Single and multi-layer mesh structures for enhanced thermal transport
US12498181B2 (en) 2018-12-11 2025-12-16 Kelvin Thermal Technologies, Inc. Vapor chamber
AT522521B8 (de) * 2019-05-06 2021-03-15 Miba Emobility Gmbh Kühlvorrichtung
US11930621B2 (en) 2020-06-19 2024-03-12 Kelvin Thermal Technologies, Inc. Folding thermal ground plane
CN114390845A (zh) * 2020-10-16 2022-04-22 超众科技股份有限公司 热传导部件和电子设备
FR3117729B1 (fr) * 2020-12-14 2023-12-29 Valeo Systemes Thermiques Système de traitement thermique d’un élément électrique et/ou électronique
AU2020483756B2 (en) 2020-12-30 2024-07-11 Razer (Asia-Pacific) Pte. Ltd. Vapor chamber having a reservoir
JP2022142665A (ja) * 2021-03-16 2022-09-30 富士通株式会社 冷却装置
KR102527272B1 (ko) * 2021-10-07 2023-05-02 전남대학교산학협력단 금속 그래핀 복합 구조 히트스프레더 제조 방법 및 이에 의해 제조된 히트스프레더

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5761037A (en) 1996-02-12 1998-06-02 International Business Machines Corporation Orientation independent evaporator
US5950710A (en) 1997-11-21 1999-09-14 Continocean Tech Inc. Overheat regulating system for vehicle passenger compartment
FI110030B (fi) * 1998-02-19 2002-11-15 Nokia Corp Työaineeseen olomuodon muutoksessa sitoutuvaan lämpöenergiaan perustuva lämmönsiirrin ja menetelmä työaineeseen olomuodon muutoksessa sitoutuvaan lämpöenergiaan perustuvan lämmönsiirtimen valmistamiseksi
JP2000124374A (ja) 1998-10-21 2000-04-28 Furukawa Electric Co Ltd:The 板型ヒートパイプとそれを用いた冷却構造
US6293332B2 (en) * 1999-03-31 2001-09-25 Jia Hao Li Structure of a super-thin heat plate
US20020020518A1 (en) * 2000-05-22 2002-02-21 Li Jia Hao Supportive wick structure of planar heat pipe
US6446706B1 (en) * 2000-07-25 2002-09-10 Thermal Corp. Flexible heat pipe
JP4516676B2 (ja) * 2000-08-21 2010-08-04 株式会社フジクラ 平板型ヒートパイプ
JP2002303494A (ja) 2001-04-02 2002-10-18 Mitsubishi Electric Corp 蒸発器およびこれを用いたループ型ヒートパイプ
JP3967697B2 (ja) 2002-08-21 2007-08-29 三星電子株式会社 平板型熱伝逹装置及びその製造方法
KR100495699B1 (ko) 2002-10-16 2005-06-16 엘에스전선 주식회사 판형 열전달장치 및 그 제조방법
CN1504715A (zh) * 2002-12-03 2004-06-16 徐惠群 热管成型结构
KR100468396B1 (ko) * 2002-12-12 2005-01-27 엘지전선 주식회사 판형 히트 파이프
JP2004245550A (ja) * 2003-02-17 2004-09-02 Fujikura Ltd 還流特性に優れたヒートパイプ
US7025124B2 (en) 2003-10-24 2006-04-11 Chin Wen Wang Supporting structure for planar heat pipe
CN2704925Y (zh) * 2004-06-07 2005-06-15 华音电器股份有限公司 改进的热管散热器结构
TWI273210B (en) * 2004-12-30 2007-02-11 Delta Electronics Inc Heat-dissipation device and fabricating method thereof
KR100698462B1 (ko) * 2005-01-06 2007-03-23 (주)셀시아테크놀러지스한국 하이드로필릭 윅을 사용한 판형 열전달 장치, 이의 제조 방법 및 이를 포함하는 칩 셋
KR200425267Y1 (ko) 2005-06-24 2006-09-05 쿨러 마스터 코포레이션 리미티드 수랭식 방열 장치
CN1913137B (zh) * 2005-08-12 2010-05-26 鸿富锦精密工业（深圳）有限公司 散热模组
CN101055158A (zh) * 2006-04-14 2007-10-17 富准精密工业(深圳)有限公司 热管
KR100775013B1 (ko) * 2006-04-18 2007-11-09 (주)셀시아테크놀러지스한국 판형 열전달 장치
KR20060059926A (ko) * 2006-04-24 2006-06-02 (주)아이큐리랩 박판 적층 구조를 갖는 판형 냉각 장치 및 이를 사용하는칩셋
CN101685330A (zh) * 2008-09-24 2010-03-31 富准精密工业(深圳)有限公司 散热装置及具有该散热装置的笔记本电脑

Also Published As

Publication number Publication date
EP2074373B1 (en) 2016-10-12
KR20090089303A (ko) 2009-08-21
US20100084113A1 (en) 2010-04-08
CN101542226B (zh) 2011-12-14
SG142174A1 (en) 2008-05-28
KR101169441B1 (ko) 2012-07-30
EP2074373A4 (en) 2013-08-28
TW200826828A (en) 2008-06-16
IL198136A0 (en) 2009-12-24
WO2008045004A1 (en) 2008-04-17
WO2008045004A8 (en) 2008-07-17
US9250025B2 (en) 2016-02-02
EP2074373A1 (en) 2009-07-01
CN101542226A (zh) 2009-09-23
WO2008044823A1 (en) 2008-04-17

Similar Documents

Publication Publication Date Title
BRPI0719855A2 (pt) método para transferência de calor e dispositivo para tal.
BRPI0810282A2 (pt) "método para troca de calor e sistemas de transferência de calor"
BRPI0817292A2 (pt) Método e aparelho para completação de poços.
BRPI0923315A2 (pt) método sistema e utilização para comutação de calor.
BRPI0819386A2 (pt) Sistema de limpeza para limpar superfícies de trocador de calor e método para operar um sistema de limpeza
BRPI0922615A2 (pt) aparelho e método para limpeza de mantas flexíveis.
PL1901584T3 (pl) Grzejnik, urządzenie oraz sposób z nim powiązany
NL1035770A1 (nl) Lithographic apparatus and thermal optical manipulator control method.
PT2334750T (pt) Processo de transferência de calor
IL193643A (en) Metal heat treating methods and devices
BRPI0915443A2 (pt) aparelho de aquecimento e método para produzir o aparelho de aquecimento
BRPI0823290A2 (pt) Método e aparelho para configuração de dispositivos.
EP2021718A4 (en) THERMAL EXCHANGE EQUIPMENT WITH TURBULATORS
BRPI0811296A2 (pt) Método e equipamento para suporte eficiente para múltiplas autenticacões.
BRPI0718446A2 (pt) Método e aparelho para executar operações de seleção
GB0810770D0 (en) Method and apparatus for cleaning heat structures
TWI318292B (en) Transfer characteristic calculation apparatus, transfer characteristic calculation method, and exposure apparatus
FI20080434L (fi) Menetelmä ja laite lämmön siirtoon
TWI340094B (en) Heat transfer system and heat transfer method
DE602006001840D1 (de) Wärmeaustauschvorrichtung
GB2440634B (en) cooling/heating apparatus
GB0913019D0 (en) A heat transfer apparatus and method
FI20060176L (fi) Laitteisto ja menetelmä liuoksen jäähdyttämiseksi
FI7470U1 (fi) Lämmönsiirtotela
GB0801383D0 (en) Heat exchanger apparatus,system and method

Legal Events

Date Code Title Description
B25A Requested transfer of rights approved

Owner name: NEXCHIP TECHNOLOGIES (QA)

B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2472 DE 22-05-2018 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.