BRPI0606914A2 - materiais de moldagem termoplásticos, uso dos mesmos, e, fibras, filmes e peça moldada de qualquer tipo - Google Patents
materiais de moldagem termoplásticos, uso dos mesmos, e, fibras, filmes e peça moldada de qualquer tipoInfo
- Publication number
- BRPI0606914A2 BRPI0606914A2 BRPI0606914-2A BRPI0606914A BRPI0606914A2 BR PI0606914 A2 BRPI0606914 A2 BR PI0606914A2 BR PI0606914 A BRPI0606914 A BR PI0606914A BR PI0606914 A2 BRPI0606914 A2 BR PI0606914A2
- Authority
- BR
- Brazil
- Prior art keywords
- weight
- films
- fibers
- thermoplastic molding
- molded parts
- Prior art date
Links
- 238000009757 thermoplastic moulding Methods 0.000 title abstract 2
- 239000000835 fiber Substances 0.000 title 1
- 239000012778 molding material Substances 0.000 title 1
- -1 use thereof Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 229920002873 Polyethylenimine Polymers 0.000 abstract 1
- 239000000654 additive Substances 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000000314 lubricant Substances 0.000 abstract 1
- 239000003381 stabilizer Substances 0.000 abstract 1
- 229920006345 thermoplastic polyamide Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L21/00—Compositions of unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/02—Polyamines
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Artificial Filaments (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005005847A DE102005005847A1 (de) | 2005-02-08 | 2005-02-08 | Wärmealterungsbeständige Polyamide |
| PCT/EP2006/050763 WO2006084862A1 (de) | 2005-02-08 | 2006-02-08 | Wärmealterungsbeständige polyamide |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BRPI0606914A2 true BRPI0606914A2 (pt) | 2009-12-01 |
| BRPI0606914B1 BRPI0606914B1 (pt) | 2017-04-04 |
Family
ID=36636651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0606914A BRPI0606914B1 (pt) | 2005-02-08 | 2006-02-08 | materiais de moldagem termoplásticos, uso dos mesmos, e, fibras, filmes e peça moldada de qualquer tipo |
Country Status (12)
| Country | Link |
|---|---|
| US (2) | US20080262133A1 (pt) |
| EP (1) | EP1851265B1 (pt) |
| JP (1) | JP5118976B2 (pt) |
| KR (2) | KR20130041392A (pt) |
| CN (1) | CN101115786B (pt) |
| AT (1) | ATE398645T1 (pt) |
| BR (1) | BRPI0606914B1 (pt) |
| DE (2) | DE102005005847A1 (pt) |
| ES (1) | ES2306429T3 (pt) |
| MY (1) | MY139749A (pt) |
| PL (1) | PL1851265T3 (pt) |
| WO (1) | WO2006084862A1 (pt) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1683830A1 (en) * | 2005-01-12 | 2006-07-26 | DSM IP Assets B.V. | Heat stabilized moulding composition |
| EP1681313A1 (en) * | 2005-01-17 | 2006-07-19 | DSM IP Assets B.V. | Heat stabilized moulding composition |
| JP5279722B2 (ja) | 2006-12-15 | 2013-09-04 | ビーエーエスエフ ソシエタス・ヨーロピア | 高分枝ポリカーボネート含有のポリマー分散液 |
| WO2009077492A2 (de) * | 2007-12-18 | 2009-06-25 | Basf Se | Thermoplastische polyamide mit polyetheraminen |
| US7902287B2 (en) * | 2008-01-21 | 2011-03-08 | Basf Aktiengesellschaft | Polyamide resin composition and method of preparing |
| KR20100125414A (ko) * | 2008-03-18 | 2010-11-30 | 바스프 에스이 | 고차분지형 폴리에틸렌이민을 갖는 폴리아미드 나노복합체 |
| EP2257597B1 (de) * | 2008-03-18 | 2011-11-30 | Basf Se | Polyamid-nanokomposite mit hyperverzweigten polyetheraminen |
| CN102209750A (zh) * | 2008-11-11 | 2011-10-05 | 巴斯夫欧洲公司 | 稳定的聚酰胺 |
| DE102008058246A1 (de) | 2008-11-19 | 2010-05-20 | Basf Se | Hochmolekulare Polyamide |
| WO2010076145A1 (de) * | 2008-12-16 | 2010-07-08 | Basf Se | Wärmealterungsbeständige polyamide |
| DE102010062538A1 (de) | 2009-12-17 | 2011-06-22 | Basf Se, 67063 | Verfahren zur Herstellung geschweisster Formkörper aus Polyamid-6.10 |
| US20120181487A1 (en) * | 2011-01-18 | 2012-07-19 | Basf Se | Thermoplastic molding composition |
| US9951892B2 (en) * | 2011-02-22 | 2018-04-24 | Bridgestone Corporation | Polyamide resin composition, method for producing the same and refrigerant transporting hose |
| EP2570448A1 (de) * | 2011-09-13 | 2013-03-20 | Basf Se | Verwendung von Polyethyleniminen in der Herstellung von Polyamiden |
| US20130338260A1 (en) | 2012-06-13 | 2013-12-19 | E I Du Pont De Nemours And Company | Thermoplastic melt-mixed composition with epoxy-carboxylic acid compound heat stabilizer |
| WO2013188302A1 (en) | 2012-06-13 | 2013-12-19 | E. I. Du Pont De Nemours And Company | Thermoplastic melt-mixed composition with amino acid heat stabilizer |
| EP2861667A1 (en) | 2012-06-13 | 2015-04-22 | E.I. Du Pont De Nemours And Company | Thermoplastic melt-mixed composition with polyetherol heat stabilizer |
| US8871874B2 (en) | 2012-06-13 | 2014-10-28 | E I Du Pont De Nemours And Company | Thermoplastic melt-mixed composition with epoxy-amino acid compound heat stabilizer and processes for their preparation |
| EP2719726B1 (de) * | 2012-10-10 | 2017-03-22 | LANXESS Deutschland GmbH | Formmassen |
| KR102330567B1 (ko) * | 2013-08-21 | 2021-11-25 | 바스프 에스이 | 복합 플라스틱 부품에 함유된 플라스틱 성분들 간의 접착이 개선된 복합 플라스틱 부품 |
| US10030110B2 (en) * | 2013-08-21 | 2018-07-24 | Basf Se | Composite plastic part with improved resistance to heat aging |
| WO2015024913A1 (de) | 2013-08-21 | 2015-02-26 | Basf Se | Verfahren zur herstellung eines compositkunststoffteils (ck) |
| JP2015199938A (ja) * | 2014-04-03 | 2015-11-12 | 旭化成ケミカルズ株式会社 | ポリアミド樹脂組成物及び成形品 |
| CN104045922A (zh) * | 2014-07-16 | 2014-09-17 | 苏州新区华士达工程塑胶有限公司 | 一种改良性epdm |
| JP6724368B2 (ja) * | 2015-02-23 | 2020-07-15 | 東レ株式会社 | 成形品およびポリアミド樹脂組成物 |
| MX2018012043A (es) | 2016-10-18 | 2019-03-28 | Ascend Performance Mat Operations Llc | Composiciones de poliamida retardantes a las llamas de bajo halogeno resistentes al envejecimiento por calor. |
| KR20210090658A (ko) * | 2018-12-10 | 2021-07-20 | 닛뽕소다 가부시키가이샤 | 폴리알킬렌이민 변성 폴리아미드4 |
| EP3670576B8 (de) * | 2018-12-19 | 2020-12-09 | Ems-Chemie Ag | Polyamid-formmassen für glasverbunde |
| JP7513626B2 (ja) * | 2019-03-06 | 2024-07-09 | ビーエーエスエフ ソシエタス・ヨーロピア | 高光沢用途のためのポリアミド成形組成物 |
| MX2022010557A (es) * | 2020-02-26 | 2022-09-23 | Basf Se | Composiciones de moldeo de poliamida resistentes al envejecimiento termico. |
| EP4127062B1 (en) * | 2020-03-25 | 2024-05-08 | Basf Se | Heat-aging resistant polyamide molding compositions |
| JP7732756B2 (ja) * | 2021-03-31 | 2025-09-02 | 旭化成株式会社 | ポリアミド組成物、電装部品、及び電装部品の耐熱エージング性、流動性、及び耐イオンマイグレーション性を向上させる方法 |
| JP7670840B2 (ja) * | 2021-09-01 | 2025-04-30 | 旭化成株式会社 | ポリアミド組成物 |
| JP2023156045A (ja) * | 2022-04-12 | 2023-10-24 | 旭化成株式会社 | ポリアミド組成物 |
| CN115594966B (zh) * | 2022-09-30 | 2024-01-02 | 上海金发科技发展有限公司 | 一种聚酰胺复合材料及其制备方法和应用 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1225860A (pt) * | 1967-09-28 | 1971-03-24 | ||
| ES372097A1 (es) * | 1968-10-09 | 1971-12-16 | Union Carbide Canada Ltd | Procedimiento para preparar una composicion de nylon que tiene receptividad mejorada para los tintes acidos. |
| JPS54103475A (en) * | 1978-02-01 | 1979-08-14 | Mitsubishi Plastics Ind Ltd | Preparation of laminated drawn film |
| JPH0418426A (ja) * | 1990-05-11 | 1992-01-22 | Toyobo Co Ltd | 耐ブロッキング性の優れた易接着性フィルム |
| JPH04202357A (ja) * | 1990-11-29 | 1992-07-23 | Toray Ind Inc | 耐熱安定性の優れた難燃性ポリアミド樹脂組成物 |
| JPH04220460A (ja) * | 1990-12-20 | 1992-08-11 | Asahi Chem Ind Co Ltd | 耐熱性ポリアミド組成物 |
| DE4305166A1 (de) * | 1993-02-19 | 1994-08-25 | Bayer Ag | Thermostabile kupferhaltige Polyamidformmassen |
| DE4339509A1 (de) * | 1993-11-22 | 1995-05-24 | Basf Ag | PPE/PA-Frommassen zur Herstellung von Formkörpern mittels Blasformen, Profilextrusion und Rohrextrusion |
| DE19519820A1 (de) * | 1995-05-31 | 1996-12-05 | Bayer Ag | Thermostabile, witterungsbeständige Polyamidformmassen |
| JP3714788B2 (ja) * | 1998-02-13 | 2005-11-09 | 旭化成ケミカルズ株式会社 | 成形特性に優れるポリアミド樹脂組成物のペレットの製造方法 |
| JP2000344960A (ja) * | 1999-03-31 | 2000-12-12 | Chisso Corp | 難燃性樹脂組成物、それを用いた難燃性シートおよびフィルム成形物 |
| ATE250642T1 (de) * | 1999-06-29 | 2003-10-15 | Degussa | Hochverzweigte polyamid-pfropfcopolymere |
| DE10030553A1 (de) * | 2000-06-29 | 2002-01-10 | Basf Ag | Stabilisierte thermoplastische Formmassen |
| DE10064333A1 (de) * | 2000-12-21 | 2002-06-27 | Degussa | Mehrschichtverbund mit einer EVOH-Schicht |
| JP4245327B2 (ja) * | 2002-10-25 | 2009-03-25 | 旭化成ケミカルズ株式会社 | ポリアミド樹脂組成物 |
| EP1498445A1 (en) * | 2003-07-18 | 2005-01-19 | DSM IP Assets B.V. | Heat stabilized moulding composition |
-
2005
- 2005-02-08 DE DE102005005847A patent/DE102005005847A1/de not_active Withdrawn
-
2006
- 2006-01-24 MY MYPI20060314A patent/MY139749A/en unknown
- 2006-02-08 PL PL06708109T patent/PL1851265T3/pl unknown
- 2006-02-08 CN CN2006800044094A patent/CN101115786B/zh not_active Expired - Fee Related
- 2006-02-08 EP EP06708109A patent/EP1851265B1/de not_active Expired - Lifetime
- 2006-02-08 AT AT06708109T patent/ATE398645T1/de not_active IP Right Cessation
- 2006-02-08 KR KR1020137008597A patent/KR20130041392A/ko not_active Ceased
- 2006-02-08 BR BRPI0606914A patent/BRPI0606914B1/pt not_active IP Right Cessation
- 2006-02-08 WO PCT/EP2006/050763 patent/WO2006084862A1/de not_active Ceased
- 2006-02-08 ES ES06708109T patent/ES2306429T3/es not_active Expired - Lifetime
- 2006-02-08 DE DE502006000958T patent/DE502006000958D1/de not_active Expired - Lifetime
- 2006-02-08 KR KR1020077020471A patent/KR101278734B1/ko not_active Expired - Fee Related
- 2006-02-08 JP JP2007554552A patent/JP5118976B2/ja not_active Expired - Fee Related
- 2006-02-09 US US11/815,723 patent/US20080262133A1/en not_active Abandoned
-
2012
- 2012-02-16 US US13/398,574 patent/US20120149817A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN101115786A (zh) | 2008-01-30 |
| US20120149817A1 (en) | 2012-06-14 |
| JP2008530290A (ja) | 2008-08-07 |
| EP1851265A1 (de) | 2007-11-07 |
| ES2306429T3 (es) | 2008-11-01 |
| JP5118976B2 (ja) | 2013-01-16 |
| KR20070102739A (ko) | 2007-10-19 |
| EP1851265B1 (de) | 2008-06-18 |
| CN101115786B (zh) | 2012-06-20 |
| PL1851265T3 (pl) | 2008-11-28 |
| DE102005005847A1 (de) | 2006-08-10 |
| MY139749A (en) | 2009-10-30 |
| WO2006084862A1 (de) | 2006-08-17 |
| KR101278734B1 (ko) | 2013-06-25 |
| KR20130041392A (ko) | 2013-04-24 |
| US20080262133A1 (en) | 2008-10-23 |
| DE502006000958D1 (de) | 2008-07-31 |
| ATE398645T1 (de) | 2008-07-15 |
| BRPI0606914B1 (pt) | 2017-04-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06G | Technical and formal requirements: other requirements [chapter 6.7 patent gazette] |
Free format text: SOLICITA-SE A REGULARIZACAO DA PROCURACAO, UMA VEZ QUE BASEADO NO ARTIGO 216 1O DA LPI, O DOCUMENTO DE PROCURACAO DEVE SER APRESENTADO EM SUA FORMA AUTENTICADA; OU SEGUNDO MEMO/INPI/PROC/NO 074/93, DEVE CONSTAR UMA DECLARACAO DE VERACIDADE, A QUAL DEVE SER ASSINADA POR UMA PESSOA DEVIDAMENTE AUTORIZADA A REPRESENTAR O INTERESSADO, DEVENDO A MESMA CONSTAR NO INSTRUMENTO DE PROCURACAO, OU NO SEU SUBSTABELECIMENTO. |
|
| B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
| B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
| B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] | ||
| B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 19A ANUIDADE. |
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| B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2813 DE 03-12-2024 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |