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BRPI0519577A2 - sistema de resfriamento fechado, dispositivo eletrânico, e, uso de um sistema de resfriamento - Google Patents

sistema de resfriamento fechado, dispositivo eletrânico, e, uso de um sistema de resfriamento

Info

Publication number
BRPI0519577A2
BRPI0519577A2 BRPI0519577-2A BRPI0519577A BRPI0519577A2 BR PI0519577 A2 BRPI0519577 A2 BR PI0519577A2 BR PI0519577 A BRPI0519577 A BR PI0519577A BR PI0519577 A2 BRPI0519577 A2 BR PI0519577A2
Authority
BR
Brazil
Prior art keywords
cooling system
cooling
electronic device
generating
closed
Prior art date
Application number
BRPI0519577-2A
Other languages
English (en)
Inventor
Henry Madsen
Henrik Olsen
Original Assignee
Noise Limit Aps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noise Limit Aps filed Critical Noise Limit Aps
Publication of BRPI0519577A2 publication Critical patent/BRPI0519577A2/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20363—Refrigerating circuit comprising a sorber
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H10W40/47—
    • H10W40/73—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K1/00—Arrangement or mounting of electrical propulsion units
    • B60K2001/003—Arrangement or mounting of electrical propulsion units with means for cooling the electrical propulsion units
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

SISTEMA DE RESFRIAMENTO FECHADO, DISPOSITIVO ELETRâNICO, E, USO DE UM SISTEMA DE RESFRIAMENTO. A presente invenção é relativa a um sistema de resfriamento de diversas orientações com uma bomba de bolhas, para geração de um escoamento circulante de fluido de resfriamento. O sistema de resfriamento é um sistema de resfriamento fechado que compreende, pelo menos, um elemento oco que facilita escoamento do fluido de resfriamento, que compreende uma primeira parte de recebimento de calor, uma parte de emissão de calor e uma primeira parte tubular adaptada para funcionar em uma primeira orientação angular do sistema, como uma primeira bomba de bolhas, para geração de um escoamento de fluido no sistema, e que é posicionada a jusante da primeira parte de recebimento de calor e uma segunda parte tubular adaptada para funcionar em uma segunda orientação angular do sistema, como uma segunda bomba de bolhas para geração de um escoamento de fluido no sistema e que é posicionada a jusante da primeira parte de recebimento de calor.
BRPI0519577-2A 2005-01-03 2005-12-23 sistema de resfriamento fechado, dispositivo eletrânico, e, uso de um sistema de resfriamento BRPI0519577A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DKPA200500007 2005-01-03
PCT/DK2005/000824 WO2006072244A1 (en) 2005-01-03 2005-12-23 A multi-orientational cooling system with a bubble pump

Publications (1)

Publication Number Publication Date
BRPI0519577A2 true BRPI0519577A2 (pt) 2009-02-17

Family

ID=34974891

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0519577-2A BRPI0519577A2 (pt) 2005-01-03 2005-12-23 sistema de resfriamento fechado, dispositivo eletrânico, e, uso de um sistema de resfriamento

Country Status (8)

Country Link
US (1) US20100061062A1 (pt)
EP (1) EP1836449A1 (pt)
JP (1) JP2008527285A (pt)
KR (1) KR20070112370A (pt)
CN (1) CN101137881A (pt)
BR (1) BRPI0519577A2 (pt)
RU (1) RU2007129729A (pt)
WO (1) WO2006072244A1 (pt)

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US20080236795A1 (en) * 2007-03-26 2008-10-02 Seung Mun You Low-profile heat-spreading liquid chamber using boiling
US20070119572A1 (en) 2005-11-30 2007-05-31 Raytheon Company System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements
WO2007116461A1 (ja) * 2006-03-31 2007-10-18 Mitsubishi Denki Kabushiki Kaisha 冷却器
JP4730624B2 (ja) * 2008-11-17 2011-07-20 株式会社豊田自動織機 沸騰冷却装置
JP2010243036A (ja) * 2009-04-03 2010-10-28 Sony Corp 熱輸送装置、電子機器及び熱輸送装置の製造方法
CN101725501B (zh) * 2009-11-20 2012-07-11 上海理工大学 带有气泡收集装置的气泡泵
PL217073B1 (pl) * 2010-07-26 2014-06-30 Univ Warmińsko Mazurski W Olsztynie Sposób samoczynnego przekazywania ciepła w kierunku odwrotnym do konwekcji naturalnej i urządzenie do samoczynnego przekazywania ciepła w kierunku odwrotnym do konwekcji naturalnej
JP5842355B2 (ja) * 2011-03-23 2016-01-13 日本電気株式会社 沸騰冷却装置
JP5664397B2 (ja) * 2011-03-25 2015-02-04 富士通株式会社 冷却ユニット
CN102901220B (zh) * 2011-07-25 2017-04-12 杨泰和 闭路型均温装置
US20130048254A1 (en) * 2011-08-31 2013-02-28 Troy W. Livingston Heat transfer bridge
JP2013197125A (ja) * 2012-03-16 2013-09-30 Nec Corp 冷却構造およびそれを用いた電子機器
JP6041187B2 (ja) * 2012-05-16 2016-12-07 公益財団法人若狭湾エネルギー研究センター 熱輸送方向が自動反転するヒートパイプ
JP2013247148A (ja) * 2012-05-23 2013-12-09 Toshiba Corp 自然循環型冷却装置
JP6394331B2 (ja) * 2013-12-27 2018-09-26 富士通株式会社 冷却部品及び電子機器
JP6605819B2 (ja) 2015-03-06 2019-11-13 株式会社東芝 冷却装置
WO2016148065A1 (ja) * 2015-03-13 2016-09-22 大沢健治 放冷用熱伝達器
CN205726818U (zh) * 2016-03-29 2016-11-23 深圳市光峰光电技术有限公司 投影设备及其液冷散热系统
JP6053240B1 (ja) * 2016-06-20 2016-12-27 株式会社レーベン販売 温度調整装置
US11839062B2 (en) * 2016-08-02 2023-12-05 Munters Corporation Active/passive cooling system
US11255611B2 (en) * 2016-08-02 2022-02-22 Munters Corporation Active/passive cooling system
WO2018047529A1 (ja) * 2016-09-09 2018-03-15 株式会社デンソー 機器温調装置
US10859318B2 (en) * 2017-02-16 2020-12-08 J R Thermal, LLC Serial thermosyphon
TWI648941B (zh) * 2017-12-04 2019-01-21 奇鋐科技股份有限公司 水冷排裝置
CN108168155B (zh) * 2018-01-11 2021-03-19 合肥华凌股份有限公司 制冷设备用冷凝器、制冷系统和制冷设备
CN109287100B (zh) * 2018-10-08 2024-05-03 云南靖创液态金属热控技术研发有限公司 一种液态金属散热装置以及电子设备
JP2020106207A (ja) * 2018-12-27 2020-07-09 川崎重工業株式会社 ループ型ヒートパイプ及び輸送機
WO2022061127A1 (en) * 2020-09-18 2022-03-24 Honeywell International Inc. Low-pressure heat pipes and heat transfer methods using low-pressure for heat pipes
US12359876B1 (en) * 2023-03-01 2025-07-15 Government Of The United States As Represented By The Secretary Of The Air Force Ground testable spacecraft heat pipe

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JP3964580B2 (ja) * 1999-09-03 2007-08-22 富士通株式会社 冷却ユニット
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JP2003234590A (ja) * 2002-02-08 2003-08-22 Denso Corp 沸騰冷却装置
JP4214881B2 (ja) * 2003-01-21 2009-01-28 三菱電機株式会社 気泡ポンプ型熱輸送機器
WO2005055319A2 (en) * 2003-12-08 2005-06-16 Noise Limit Aps A cooling system with a bubble pump

Also Published As

Publication number Publication date
RU2007129729A (ru) 2009-02-10
US20100061062A1 (en) 2010-03-11
KR20070112370A (ko) 2007-11-23
EP1836449A1 (en) 2007-09-26
JP2008527285A (ja) 2008-07-24
WO2006072244A1 (en) 2006-07-13
CN101137881A (zh) 2008-03-05

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]