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BRPI0508214A - surface deposit removal methods - Google Patents

surface deposit removal methods

Info

Publication number
BRPI0508214A
BRPI0508214A BRPI0508214-5A BRPI0508214A BRPI0508214A BR PI0508214 A BRPI0508214 A BR PI0508214A BR PI0508214 A BRPI0508214 A BR PI0508214A BR PI0508214 A BRPI0508214 A BR PI0508214A
Authority
BR
Brazil
Prior art keywords
removal methods
deposit removal
surface deposit
enhancement
nitrogen source
Prior art date
Application number
BRPI0508214-5A
Other languages
Portuguese (pt)
Inventor
Herbert Harold Sawin
Bo Bai
Original Assignee
Massachusetts Inst Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Massachusetts Inst Technology filed Critical Massachusetts Inst Technology
Publication of BRPI0508214A publication Critical patent/BRPI0508214A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • H10P95/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00—Capture or disposal of greenhouse gases
    • Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

MéTODOS DE REMOçãO DE DEPóSITOS DE SUPERFìCIE A presente invenção refere-se a um método de limpeza de plasma remoto aprimorado para a remoção de depósitos superficiais de uma superfície, tal como o lado interno de câmara de deposição que é utilizada na fabricação de dispositivos eletrónicos. O aprimoramento envolve a adição de fonte de nitrogênio à mistura de gases de alimentação composta de oxigênio e fluorocarbono. O aprimoramento também envolve o tratamento prévio de superfície interna do trajeto da câmara remota para os depósitos de superfície por meio da ativação de mistura de gases pré-tratamento que compreende fonte de nitrogênio e passagem do gás pré-tratamento ativado através do trajeto.SURFACE DEPOSIT REMOVAL METHODS The present invention relates to an improved remote plasma cleaning method for removing surface deposits from a surface such as the inner side of the deposition chamber that is used in the manufacture of electronic devices. The enhancement involves the addition of a nitrogen source to the oxygen and fluorocarbon feedstock mixture. The enhancement also involves pre-treating the internal surface of the remote chamber path to the surface deposits by activating a pretreatment gas mixture comprising nitrogen source and passing the activated pretreatment gas through the path.

BRPI0508214-5A 2004-03-24 2005-03-24 surface deposit removal methods BRPI0508214A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US55622704P 2004-03-24 2004-03-24
US64044404P 2004-12-30 2004-12-30
US64083304P 2004-12-30 2004-12-30
PCT/US2005/010693 WO2005090638A2 (en) 2004-03-24 2005-03-24 Remote chamber methods for removing surface deposits

Publications (1)

Publication Number Publication Date
BRPI0508214A true BRPI0508214A (en) 2007-07-17

Family

ID=34965582

Family Applications (3)

Application Number Title Priority Date Filing Date
BRPI0508205-6A BRPI0508205A (en) 2004-03-24 2005-03-24 surface deposit removal methods
BRPI0508214-5A BRPI0508214A (en) 2004-03-24 2005-03-24 surface deposit removal methods
BRPI0508204-8A BRPI0508204A (en) 2004-03-24 2005-03-24 method of removing deposits from a surface

Family Applications Before (1)

Application Number Title Priority Date Filing Date
BRPI0508205-6A BRPI0508205A (en) 2004-03-24 2005-03-24 surface deposit removal methods

Family Applications After (1)

Application Number Title Priority Date Filing Date
BRPI0508204-8A BRPI0508204A (en) 2004-03-24 2005-03-24 method of removing deposits from a surface

Country Status (6)

Country Link
EP (3) EP1737998A2 (en)
JP (3) JP2007531288A (en)
KR (3) KR20070040748A (en)
BR (3) BRPI0508205A (en)
TW (3) TWI281714B (en)
WO (3) WO2005090638A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0697467A1 (en) * 1994-07-21 1996-02-21 Applied Materials, Inc. Method and apparatus for cleaning a deposition chamber
US7581549B2 (en) 2004-07-23 2009-09-01 Air Products And Chemicals, Inc. Method for removing carbon-containing residues from a substrate
KR20080050401A (en) * 2005-08-02 2008-06-05 매사추세츠 인스티튜트 오브 테크놀로지 Remote chamber method using sulfur fluoride to remove surface deposits inside a COD / PEC-Plasma chamber
US9034199B2 (en) 2012-02-21 2015-05-19 Applied Materials, Inc. Ceramic article with reduced surface defect density and process for producing a ceramic article
US9212099B2 (en) 2012-02-22 2015-12-15 Applied Materials, Inc. Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics
WO2014094103A1 (en) * 2012-12-18 2014-06-26 Seastar Chemicals Inc. Process and method for in-situ dry cleaning of thin film deposition reactors and thin film layers
JP6202423B2 (en) * 2013-03-05 2017-09-27 パナソニックＩｐマネジメント株式会社 Plasma cleaning method and plasma cleaning apparatus
US9850568B2 (en) 2013-06-20 2017-12-26 Applied Materials, Inc. Plasma erosion resistant rare-earth oxide based thin film coatings
KR102476934B1 (en) * 2013-12-30 2022-12-14 더 케무어스 컴퍼니 에프씨, 엘엘씨 Chamber cleaning and semiconductor etching gases
SG11202106864TA (en) * 2018-12-25 2021-07-29 Showa Denko Kk Adhesion removal method and film-forming method
US11854773B2 (en) 2020-03-31 2023-12-26 Applied Materials, Inc. Remote plasma cleaning of chambers for electronics manufacturing systems
EP3954804A1 (en) * 2020-08-14 2022-02-16 Siltronic AG Device and method for depositing a layer of semiconductor material on a substrate wafer
CN116145106B (en) * 2023-02-21 2024-12-24 苏州鼎芯光电科技有限公司 Cleaning method for semiconductor coating process chamber

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5158644A (en) * 1986-12-19 1992-10-27 Applied Materials, Inc. Reactor chamber self-cleaning process
JP2002280376A (en) * 2001-03-22 2002-09-27 Research Institute Of Innovative Technology For The Earth Cleaning method for CVD apparatus and cleaning apparatus therefor

Also Published As

Publication number Publication date
EP1733071A2 (en) 2006-12-20
WO2005090638A8 (en) 2006-11-16
TW200623240A (en) 2006-07-01
WO2005090638A9 (en) 2006-01-26
EP1737998A2 (en) 2007-01-03
WO2005090638A2 (en) 2005-09-29
KR20070043697A (en) 2007-04-25
TWI281714B (en) 2007-05-21
TW200623251A (en) 2006-07-01
TWI281715B (en) 2007-05-21
WO2005095670A2 (en) 2005-10-13
JP2007530792A (en) 2007-11-01
KR20070040748A (en) 2007-04-17
TW200623281A (en) 2006-07-01
KR20070037434A (en) 2007-04-04
WO2005090638A3 (en) 2006-04-13
BRPI0508205A (en) 2007-07-17
BRPI0508204A (en) 2007-07-17
EP1733072A2 (en) 2006-12-20
WO2005095670A3 (en) 2006-05-04
WO2005098086A3 (en) 2006-05-04
TWI284929B (en) 2007-08-01
JP2007531288A (en) 2007-11-01
WO2005098086A2 (en) 2005-10-20
JP2007531289A (en) 2007-11-01

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 5A, 6A E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2158 DE 15/05/2012.