BRPI0404454A - Composição termorreversìvel reativa à umidade, processo para misturar ingredientes, e, construção de compósito - Google Patents
Composição termorreversìvel reativa à umidade, processo para misturar ingredientes, e, construção de compósitoInfo
- Publication number
- BRPI0404454A BRPI0404454A BR0404454-1A BRPI0404454A BRPI0404454A BR PI0404454 A BRPI0404454 A BR PI0404454A BR PI0404454 A BRPI0404454 A BR PI0404454A BR PI0404454 A BRPI0404454 A BR PI0404454A
- Authority
- BR
- Brazil
- Prior art keywords
- reactive
- moisture
- mixing ingredients
- composite construction
- heat
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 6
- 238000000034 method Methods 0.000 title abstract 5
- 239000002131 composite material Substances 0.000 title abstract 3
- 238000010276 construction Methods 0.000 title abstract 3
- 239000004615 ingredient Substances 0.000 title abstract 3
- -1 and Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract 2
- 229920000058 polyacrylate Polymers 0.000 abstract 1
- 229920001228 polyisocyanate Polymers 0.000 abstract 1
- 239000005056 polyisocyanate Substances 0.000 abstract 1
- 229920005862 polyol Polymers 0.000 abstract 1
- 150000003077 polyols Chemical class 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
- C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/2805—Compounds having only one group containing active hydrogen
- C08G18/288—Compounds containing at least one heteroatom other than oxygen or nitrogen
- C08G18/289—Compounds containing at least one heteroatom other than oxygen or nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6629—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/36 or hydroxylated esters of higher fatty acids of C08G18/38
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/20—Compositions for hot melt adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Polyurethanes Or Polyureas (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
"COMPOSIçãO TERMORREVERSìVEL REATIVA à UMIDADE, PROCESSO PARA MISTURAR INGREDIENTES, E, CONSTRUçãO DE COMPóSITO". Fornecidos são composições termorreversíveis reativas à umidade e métodos para fazer tais composições termorreversíveis reativas à umidade. As composições são formadas por um processo compreendendo ingredientes de mistura que compreendem pelo menos um poliol, pelo menos um poliisocianato e pelo menos um polímero acrílico. Também fornecidas são construções de compósito formadas por um processo compreendendo aplicar uma película de tais composições a um primeiro substrato e contatar pelo menos um substrato subseq³ente com aquela película.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US51695603P | 2003-11-03 | 2003-11-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0404454A true BRPI0404454A (pt) | 2005-06-21 |
Family
ID=34421840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR0404454-1A BRPI0404454A (pt) | 2003-11-03 | 2004-10-21 | Composição termorreversìvel reativa à umidade, processo para misturar ingredientes, e, construção de compósito |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP1528093B1 (pt) |
| JP (1) | JP3970860B2 (pt) |
| CN (1) | CN100588686C (pt) |
| BR (1) | BRPI0404454A (pt) |
| DE (1) | DE602004008390T2 (pt) |
| ES (1) | ES2291826T3 (pt) |
| MX (1) | MXPA04010756A (pt) |
| TW (1) | TW200530357A (pt) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE502006004082D1 (de) * | 2006-11-17 | 2009-08-06 | Sika Technology Ag | Polyaldimin enthaltende feuchtigkeitshärtende Heissschmelzklebstoff-Zusammensetzung |
| JP5283551B2 (ja) * | 2009-03-31 | 2013-09-04 | アイカ工業株式会社 | 湿気硬化型反応性ホットメルト接着剤 |
| JP6509492B2 (ja) * | 2014-02-28 | 2019-05-08 | ヘンケルジャパン株式会社 | 灯具用湿気硬化型ホットメルト接着剤 |
| EP3313911A1 (en) * | 2015-06-29 | 2018-05-02 | Basf Se | Reactive hot melt adhesive |
| CN105295818B (zh) * | 2015-11-30 | 2018-06-29 | 佛山市高明绿色德化工有限公司 | 一种用于模内注塑的胶粘剂及其制备方法 |
| CN106010409A (zh) * | 2016-06-28 | 2016-10-12 | 广西众昌树脂有限公司 | 木材用聚氨酯热熔胶 |
| CN107841274A (zh) * | 2017-11-21 | 2018-03-27 | 上海天洋热熔粘接材料股份有限公司 | 湿固化聚氨酯热熔胶的制备工艺 |
| CN110373148A (zh) * | 2019-08-18 | 2019-10-25 | 上海回天新材料有限公司 | 一种家电面板粘贴用胶黏剂 |
| CN120882778A (zh) * | 2023-04-24 | 2025-10-31 | Sika技术股份公司 | 具有改进的热稳定性和低含量残余二异氰酸酯单体的可湿固化热熔粘合剂 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5021507A (en) * | 1986-05-05 | 1991-06-04 | National Starch And Chemical Investment Holding Corporation | Arcylic modified reactive urethane hot melt adhesive compositions |
| US5827926A (en) * | 1996-11-08 | 1998-10-27 | Minnesota Mining And Manufacturing Company | Moisture-curable, hot-melt composition |
| US6482878B1 (en) * | 2000-04-21 | 2002-11-19 | National Starch And Chemical Investment Holding Corporation | Polyurethane hotmelt adhesives with acrylic copolymers and thermoplastic resins |
| US7829615B2 (en) * | 2003-06-09 | 2010-11-09 | Henkel Ag & Co. Kgaa | Reactive hot melt adhesives |
-
2004
- 2004-03-30 JP JP2004099294A patent/JP3970860B2/ja not_active Expired - Fee Related
- 2004-10-21 BR BR0404454-1A patent/BRPI0404454A/pt not_active IP Right Cessation
- 2004-10-21 TW TW093132021A patent/TW200530357A/zh unknown
- 2004-10-25 DE DE602004008390T patent/DE602004008390T2/de not_active Expired - Lifetime
- 2004-10-25 ES ES04256558T patent/ES2291826T3/es not_active Expired - Lifetime
- 2004-10-25 EP EP04256558A patent/EP1528093B1/en not_active Expired - Lifetime
- 2004-10-28 CN CN200410088007A patent/CN100588686C/zh not_active Expired - Fee Related
- 2004-10-29 MX MXPA04010756A patent/MXPA04010756A/es unknown
Also Published As
| Publication number | Publication date |
|---|---|
| MXPA04010756A (es) | 2005-05-17 |
| JP2005139419A (ja) | 2005-06-02 |
| DE602004008390T2 (de) | 2008-05-15 |
| EP1528093A1 (en) | 2005-05-04 |
| ES2291826T3 (es) | 2008-03-01 |
| CN1624046A (zh) | 2005-06-08 |
| CN100588686C (zh) | 2010-02-10 |
| EP1528093B1 (en) | 2007-08-22 |
| JP3970860B2 (ja) | 2007-09-05 |
| DE602004008390D1 (de) | 2007-10-04 |
| TW200530357A (en) | 2005-09-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application fees: dismissal - article 86 of industrial property law |
Free format text: REFERENTE AS 3A, 4A, 5A, 6A E 7A ANUIDADES. |
|
| B08K | Lapse as no evidence of payment of the annual fee has been furnished to inpi (acc. art. 87) |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2160 DE 29/05/2012. |