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BR9914860A - Montagem de placa de circuitos empilhada adaptada para dissipação de calor - Google Patents

Montagem de placa de circuitos empilhada adaptada para dissipação de calor

Info

Publication number
BR9914860A
BR9914860A BR9914860-9A BR9914860A BR9914860A BR 9914860 A BR9914860 A BR 9914860A BR 9914860 A BR9914860 A BR 9914860A BR 9914860 A BR9914860 A BR 9914860A
Authority
BR
Brazil
Prior art keywords
heat dissipation
board assembly
circuit board
assembly adapted
stacked circuit
Prior art date
Application number
BR9914860-9A
Other languages
English (en)
Inventor
Grant M Smith
Vladimir K Tamarkin
Original Assignee
Unisys Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unisys Corp filed Critical Unisys Corp
Publication of BR9914860A publication Critical patent/BR9914860A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

''MONTAGEM DE PLACA DE CIRCUITOS EMPILHADA ADAPTADA PARA DISSIPAçãO DE CALOR'' Um aparelho é fornecido para dissipação de calor de uma montagem de placa de circuitos empilhada. O aparelho inclui placas de circuito que são orientadas em planos espaçados que se estendem substancialmente paralelos um ao outro. Um dispositivo de transferência de calor conectado nas placas de circuito transfere calor entre as placas de circuito. Um dispositivo de dissipação de calor conectado em pelo menos uma das placas de circuito dissipa pelo menos uma porção do calor transferido.
BR9914860-9A 1998-10-28 1999-10-27 Montagem de placa de circuitos empilhada adaptada para dissipação de calor BR9914860A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/181,448 US5986887A (en) 1998-10-28 1998-10-28 Stacked circuit board assembly adapted for heat dissipation
PCT/US1999/025185 WO2000025562A1 (en) 1998-10-28 1999-10-27 Stacked circuit board assembly adapted for heat dissipation

Publications (1)

Publication Number Publication Date
BR9914860A true BR9914860A (pt) 2001-07-17

Family

ID=22664326

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9914860-9A BR9914860A (pt) 1998-10-28 1999-10-27 Montagem de placa de circuitos empilhada adaptada para dissipação de calor

Country Status (7)

Country Link
US (1) US5986887A (pt)
EP (1) EP1125482B1 (pt)
JP (1) JP2002528922A (pt)
BR (1) BR9914860A (pt)
CA (1) CA2348507A1 (pt)
DE (1) DE69925626T2 (pt)
WO (1) WO2000025562A1 (pt)

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Also Published As

Publication number Publication date
DE69925626D1 (de) 2005-07-07
WO2000025562A1 (en) 2000-05-04
EP1125482A1 (en) 2001-08-22
CA2348507A1 (en) 2000-05-04
DE69925626T2 (de) 2006-04-27
EP1125482B1 (en) 2005-06-01
US5986887A (en) 1999-11-16
JP2002528922A (ja) 2002-09-03

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 10A E 11A ANUIDADE(S),

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2082 DE 30/11/2010.