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BR9901361A - Aparelho eletrônico de resfriamento - Google Patents

Aparelho eletrônico de resfriamento

Info

Publication number
BR9901361A
BR9901361A BR9901361-4A BR9901361A BR9901361A BR 9901361 A BR9901361 A BR 9901361A BR 9901361 A BR9901361 A BR 9901361A BR 9901361 A BR9901361 A BR 9901361A
Authority
BR
Brazil
Prior art keywords
cooling device
electronic cooling
light metal
box
electronic
Prior art date
Application number
BR9901361-4A
Other languages
English (en)
Inventor
Hamid Reza Falaki
William George Gates
Patrick Francis Hanlon
Martin Michael Keegan
Daniel Peter Kelly
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of BR9901361A publication Critical patent/BR9901361A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/03—Constructional details, e.g. casings, housings
    • H04B1/036—Cooling arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22C—FOUNDRY MOULDING
    • B22C9/00—Moulds or cores; Moulding processes
    • B22C9/06—Permanent moulds for shaped castings
    • B22C9/065—Cooling or heating equipment for moulds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Transmitters (AREA)

Abstract

<B>APARELHO ELETRôNICO DE RESFRIAMENTO<D> é revelado um aparelho eletrônico tendo uma caixa externa dissipativa de calor. A caixa externa tem superfícies estendidas ou aletas definindo entre os mesmos canais estendendo-se verticalmente, em uso, e é fundida em metal leve de especificação LM20. Simplesmente mediante uso de metal leve de especificação LM20 ao invés de LM6 o qual é convencionalmente usado, é obtido um aperfeiçoamento de 3 K na temperatura dos componentes críticos na caixa.
BR9901361-4A 1998-04-28 1999-04-19 Aparelho eletrônico de resfriamento BR9901361A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP98303321A EP0954210A1 (en) 1998-04-28 1998-04-28 Cooling electronic apparatus

Publications (1)

Publication Number Publication Date
BR9901361A true BR9901361A (pt) 2000-09-12

Family

ID=8234797

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9901361-4A BR9901361A (pt) 1998-04-28 1999-04-19 Aparelho eletrônico de resfriamento

Country Status (9)

Country Link
US (1) US6038129A (pt)
EP (1) EP0954210A1 (pt)
JP (1) JP2000031676A (pt)
KR (1) KR19990083468A (pt)
CN (1) CN1237083A (pt)
AU (1) AU720974B2 (pt)
BR (1) BR9901361A (pt)
CA (1) CA2266274A1 (pt)
ID (1) ID23233A (pt)

Families Citing this family (44)

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WO1999003375A1 (en) * 1997-07-18 1999-01-28 Mackie Designs Inc. Passive radiator cooled electronics/heat sink housing for a powered speaker
US6374912B1 (en) * 1998-12-30 2002-04-23 Lucent Technologies Deep drawn enclosure with integrated heatsink and fastening details
US6522542B1 (en) * 2000-03-20 2003-02-18 Adc Telecommunications, Inc. Power distribution panel with heat sink
ATE229892T1 (de) * 2000-05-23 2003-01-15 Catem Gmbh & Co Kg Elektrische heizvorrichtung, insbesondere für den einsatz in kraftfahrzeugen
US6628521B2 (en) * 2000-11-06 2003-09-30 Adc Telecommunications, Inc. Mechanical housing
DE20020270U1 (de) * 2000-11-29 2001-03-29 Harting Automotive Gmbh & Co Hermetisch dichtes Gehäuse
US6459581B1 (en) * 2000-12-19 2002-10-01 Harris Corporation Electronic device using evaporative micro-cooling and associated methods
US6900984B2 (en) 2001-04-24 2005-05-31 Apple Computer, Inc. Computer component protection
US6897377B2 (en) * 2001-07-31 2005-05-24 Adc Telecommunications, Inc. Clamping receptacle
US6894907B2 (en) * 2001-07-31 2005-05-17 Adc Telecommunications, Inc. Clamping case
US6795316B2 (en) * 2001-12-21 2004-09-21 Redfern Broadband Networks, Inc. WDM add/drop multiplexer module
WO2003056735A1 (en) * 2001-12-21 2003-07-10 Redfern Broadband Networks, Inc. Improved wdm add/drop multiplexer module
US6862180B2 (en) * 2002-05-24 2005-03-01 Adc Dsl Systems, Inc. Housings for circuit cards
US6781830B2 (en) * 2002-11-05 2004-08-24 Adc Dsl Systems, Inc. Methods and systems of heat transfer for electronic enclosures
WO2004112266A1 (ja) * 2003-06-12 2004-12-23 Matsushita Electric Industrial Co., Ltd. 基地局装置
US6865085B1 (en) 2003-09-26 2005-03-08 Adc Dsl Systems, Inc. Heat dissipation for electronic enclosures
US7418995B2 (en) * 2004-01-14 2008-09-02 Vanner, Inc. System for cooling environmentally sealed enclosures
DE102004012026B3 (de) * 2004-03-11 2005-11-17 Hüttinger Elektronik GmbH & Co. KG Anordnung zum Kühlen
US8289858B2 (en) * 2005-12-13 2012-10-16 Fujitsu Limited ONU delay and jitter measurement
TWM308441U (en) * 2006-05-08 2007-03-21 Yu-Nung Shen Heat sink
US7535716B2 (en) * 2007-05-23 2009-05-19 Adc Telecommunications, Inc. Apparatus for enclosing electronic components used in telecommunication systems
FR2916602B1 (fr) * 2007-05-25 2014-06-20 Splitted Desktop Systems Procede, dispositif et systeme d'auto refroidissement des circuits electroniques.
JP2009253230A (ja) * 2008-04-10 2009-10-29 Fujitsu Ten Ltd 電子機器
JP2009253231A (ja) * 2008-04-10 2009-10-29 Fujitsu Ten Ltd 電子機器
WO2009142644A1 (en) * 2008-05-23 2009-11-26 Hewlett-Packard Development Company, L.P. Computer chassis
US8254850B2 (en) * 2008-06-11 2012-08-28 Adc Telecommunications, Inc. Communication module component assemblies
US8549741B2 (en) * 2008-06-11 2013-10-08 Adc Telecommunications, Inc. Suspension method for compliant thermal contact of electronics modules
US8031470B2 (en) * 2008-06-11 2011-10-04 Adc Telecommunications, Inc. Systems and methods for thermal management
WO2010028350A1 (en) * 2008-09-08 2010-03-11 Intergraph Technologies Company Ruggedized computer capable of operating in high-temperature environments
JP4850934B2 (ja) * 2009-07-10 2012-01-11 三菱電機株式会社 屋外設置機器
DE102009033258B4 (de) * 2009-07-14 2019-01-10 Sew-Eurodrive Gmbh & Co Kg Gehäuse
EP2299582B1 (de) * 2009-09-18 2015-03-11 SMA Solar Technology AG Wechselrichter mit einem Gehäuse und darin angeordneten elektrischen und elektronischen Bauteilen
US20110317346A1 (en) * 2010-06-28 2011-12-29 Zte Corporation Totally-enclosed integrative access system and power consumption reduction method thereof
US8537540B2 (en) * 2010-11-02 2013-09-17 Technology Advancement Group, Inc. Field serviceable CPU module
CN103596297B (zh) 2012-08-13 2017-04-12 华为技术有限公司 射频拉远单元设备及其组合件
US11026347B2 (en) 2012-12-21 2021-06-01 Smart Embedded Computing, Inc. Configurable cooling for rugged environments
WO2015142723A1 (en) 2014-03-17 2015-09-24 Ubiquiti Networks, Inc. Array antennas having a plurality of directional beams
US10164332B2 (en) 2014-10-14 2018-12-25 Ubiquiti Networks, Inc. Multi-sector antennas
US10284268B2 (en) * 2015-02-23 2019-05-07 Ubiquiti Networks, Inc. Radio apparatuses for long-range communication of radio-frequency information
CN104883862A (zh) * 2015-06-25 2015-09-02 苏州市龙源电力科技股份有限公司 一种静音电气控制柜
CN107040294B (zh) 2015-10-09 2020-10-16 优倍快公司 同步多无线电天线系统和方法
WO2020207621A2 (de) * 2019-04-10 2020-10-15 Sew-Eurodrive Gmbh & Co. Kg Elektrogerät mit gehäuseteil
FR3103316B1 (fr) * 2019-11-19 2021-11-12 Safran Cadre métallique conducteur pour module électronique de puissance et procédé de fabrication associé
US12267980B2 (en) * 2019-12-18 2025-04-01 Eaton Intelligent Power Limited Power converter system

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4535386A (en) * 1983-05-23 1985-08-13 Allen-Bradley Company Natural convection cooling system for electronic components
US5065278A (en) * 1990-01-29 1991-11-12 Power Guard Cast housing encased CATV power supply unit
US5473511A (en) * 1994-05-05 1995-12-05 Ford Motor Company Printed circuit board with high heat dissipation
SE504950C2 (sv) * 1995-09-29 1997-06-02 Ericsson Telefon Ab L M Anordning för kylning av elektronikenheter
US5812373A (en) * 1997-03-21 1998-09-22 Lucent Technologies Inc. Heat dissipating weathertight outdoor electronics enclosure
US5915466A (en) * 1998-01-19 1999-06-29 Lucent Technologies Inc. Heat dissipating structure for an electrical assembly

Also Published As

Publication number Publication date
ID23233A (id) 2000-03-30
US6038129A (en) 2000-03-14
CA2266274A1 (en) 1999-10-28
AU720974B2 (en) 2000-06-22
KR19990083468A (ko) 1999-11-25
JP2000031676A (ja) 2000-01-28
CN1237083A (zh) 1999-12-01
AU2396199A (en) 1999-11-18
EP0954210A1 (en) 1999-11-03

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 3A, 5A, 6A, 7A E 8A ANUIDADES

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1910 DE 14/08/2007.