BR9812961A - Pasta de soldagem dura livre de agente fundente - Google Patents
Pasta de soldagem dura livre de agente fundenteInfo
- Publication number
- BR9812961A BR9812961A BR9812961-9A BR9812961A BR9812961A BR 9812961 A BR9812961 A BR 9812961A BR 9812961 A BR9812961 A BR 9812961A BR 9812961 A BR9812961 A BR 9812961A
- Authority
- BR
- Brazil
- Prior art keywords
- soldering paste
- fusing agent
- hard soldering
- free hard
- paste
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title 1
- 238000005219 brazing Methods 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- 229920002367 Polyisobutene Polymers 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 239000012188 paraffin wax Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Nonmetallic Welding Materials (AREA)
- Powder Metallurgy (AREA)
Abstract
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19747041A DE19747041A1 (de) | 1997-10-24 | 1997-10-24 | Flußmittelfreie Hartlotpaste |
| PCT/EP1998/005564 WO1999021679A1 (de) | 1997-10-24 | 1998-09-02 | Flussmittelfreie hartlotpaste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR9812961A true BR9812961A (pt) | 2000-08-08 |
Family
ID=7846521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR9812961-9A BR9812961A (pt) | 1997-10-24 | 1998-09-02 | Pasta de soldagem dura livre de agente fundente |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US6342106B1 (pt) |
| EP (1) | EP1032483B1 (pt) |
| JP (1) | JP4215390B2 (pt) |
| KR (1) | KR100666836B1 (pt) |
| CN (1) | CN1111463C (pt) |
| AT (1) | ATE217233T1 (pt) |
| AU (1) | AU9535598A (pt) |
| BR (1) | BR9812961A (pt) |
| DE (2) | DE19747041A1 (pt) |
| ES (1) | ES2177061T3 (pt) |
| WO (1) | WO1999021679A1 (pt) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6530514B2 (en) * | 2001-06-28 | 2003-03-11 | Outokumpu Oyj | Method of manufacturing heat transfer tubes |
| JP2005118826A (ja) * | 2003-10-16 | 2005-05-12 | Denso Corp | ろう付け方法 |
| FI120050B (fi) * | 2004-06-03 | 2009-06-15 | Luvata Oy | Menetelmä metallioksidipulverin pelkistämiseksi ja liittämiseksi lämmönsiirtopintaan ja lämmönsiirtopinta |
| FI120051B (fi) * | 2004-06-03 | 2009-06-15 | Luvata Oy | Menetelmä metallipulverin liittämiseksi lämmönsiirtopintaan ja lämmönsiirtopinta |
| KR100620368B1 (ko) * | 2006-04-26 | 2006-09-06 | 최진수 | 주석 및 니켈을 함유한 인동합금 경납땜봉 |
| US20090140030A1 (en) * | 2007-10-30 | 2009-06-04 | Sundar Amancherla | Braze formulations and processes for making and using |
| CN102744534B (zh) * | 2012-07-27 | 2015-01-14 | 张国华 | 一种无银焊料的制备方法及制品 |
| CN104028918B (zh) * | 2014-06-12 | 2016-10-05 | 深圳大学 | 一种树脂粘接磷铜粉钎焊料及其制备方法 |
| US10456871B2 (en) | 2014-08-27 | 2019-10-29 | Heraeus Deutschland GmbH & Co. KG | Solder paste |
| WO2020039497A1 (ja) | 2018-08-21 | 2020-02-27 | ハリマ化成株式会社 | ろう付け材、ろう付け部材、熱交換器、および、ろう付け部材の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4101691A (en) * | 1976-09-09 | 1978-07-18 | Union Carbide Corporation | Enhanced heat transfer device manufacture |
| NZ188341A (en) * | 1977-09-16 | 1980-05-08 | Johnson Matthey Co Ltd | Brazing composition:brazing alloy and thermoplastic materi |
| ES490073A0 (es) * | 1979-04-06 | 1981-05-16 | Johnson Matthey Co Ltd | Procedimiento para la obtencion de una composicion para sol-dar. |
| US5178827A (en) * | 1989-11-17 | 1993-01-12 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
| US5378294A (en) * | 1989-11-17 | 1995-01-03 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
| FI87470C (fi) * | 1989-11-17 | 1993-01-11 | Outokumpu Oy | Som slaglod anvaendbara kopparlegeringar |
-
1997
- 1997-10-24 DE DE19747041A patent/DE19747041A1/de not_active Withdrawn
-
1998
- 1998-09-02 BR BR9812961-9A patent/BR9812961A/pt not_active IP Right Cessation
- 1998-09-02 AT AT98948897T patent/ATE217233T1/de not_active IP Right Cessation
- 1998-09-02 WO PCT/EP1998/005564 patent/WO1999021679A1/de not_active Ceased
- 1998-09-02 EP EP98948897A patent/EP1032483B1/de not_active Expired - Lifetime
- 1998-09-02 CN CN98810504A patent/CN1111463C/zh not_active Expired - Fee Related
- 1998-09-02 KR KR1020007004302A patent/KR100666836B1/ko not_active Expired - Fee Related
- 1998-09-02 ES ES98948897T patent/ES2177061T3/es not_active Expired - Lifetime
- 1998-09-02 AU AU95355/98A patent/AU9535598A/en not_active Abandoned
- 1998-09-02 JP JP2000517819A patent/JP4215390B2/ja not_active Expired - Fee Related
- 1998-09-02 US US09/529,972 patent/US6342106B1/en not_active Expired - Fee Related
- 1998-09-02 DE DE59804087T patent/DE59804087D1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1032483A1 (de) | 2000-09-06 |
| KR20010024543A (ko) | 2001-03-26 |
| ES2177061T3 (es) | 2002-12-01 |
| KR100666836B1 (ko) | 2007-01-11 |
| AU9535598A (en) | 1999-05-17 |
| ATE217233T1 (de) | 2002-05-15 |
| WO1999021679A1 (de) | 1999-05-06 |
| JP2001520940A (ja) | 2001-11-06 |
| CN1277571A (zh) | 2000-12-20 |
| DE19747041A1 (de) | 1999-04-29 |
| US6342106B1 (en) | 2002-01-29 |
| CN1111463C (zh) | 2003-06-18 |
| JP4215390B2 (ja) | 2009-01-28 |
| DE59804087D1 (de) | 2002-06-13 |
| EP1032483B1 (de) | 2002-05-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Decision: intention to grant | ||
| FG9A | Patent or certificate of addition granted | ||
| B25A | Requested transfer of rights approved |
Owner name: DEGUSSA AG (DE) |
|
| B25A | Requested transfer of rights approved |
Owner name: UMICORE AG AND CO. KG (DE) Free format text: TRANSFERIDO DE: DEGUSSA AG |
|
| B24C | Patent annual fee: request for for restoration |
Free format text: REFERENTE A 12A E 13A ANUIDADES. |
|
| B24H | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi) | ||
| B24F | Patent annual fee: publication cancelled |
Free format text: ANULADA A PUBLICACAO CODIGO 24.8 NA RPI NO 2257 DE 08/04/2014 POR TER SIDO INDEVIDA. |
|
| B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE AS 12A E 13A ANUIDADES. |
|
| B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2606 DE 15-12-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |