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BR9812528A - Método de fabricação de um módulo ou etiqueta eletrônica, módulo ou etiqueta obtidos e suporte que comporta tal módulo ou etiqueta - Google Patents

Método de fabricação de um módulo ou etiqueta eletrônica, módulo ou etiqueta obtidos e suporte que comporta tal módulo ou etiqueta

Info

Publication number
BR9812528A
BR9812528A BR9812528-1A BR9812528A BR9812528A BR 9812528 A BR9812528 A BR 9812528A BR 9812528 A BR9812528 A BR 9812528A BR 9812528 A BR9812528 A BR 9812528A
Authority
BR
Brazil
Prior art keywords
label
module
perforation
support
tape
Prior art date
Application number
BR9812528-1A
Other languages
English (en)
Inventor
Didier Elbaz
Jean-Christophe Fidalgo
Original Assignee
Gemplus Card Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card Int filed Critical Gemplus Card Int
Publication of BR9812528A publication Critical patent/BR9812528A/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • H10W70/699—
    • H10W74/114—
    • H10W72/073—
    • H10W72/075—
    • H10W72/5524—
    • H10W72/884—
    • H10W74/00—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Making Paper Articles (AREA)

Abstract

Resumo da patente de Invenção para "MéTODO DE FABRICAçãO DE UM MóDULO OU ETIQUETA ELETRôNICA, MóDULO OU ETIQUETA OBTIDOS E SUPORTE QUE COMPORTA TAL MóDULO OU ETIQUETA" A invenção diz respeito a um método para a fabricação de pelo menos um módulo ou etiqueta eletrônica de adesividade ativável. O método compreende as etapas seguintes que consistem em fornecer uma película isolante que comporta pelo menos uma interface de contatos e/ou antena, fornecer uma fita adesiva (40; 56; 70; 80) que comporta um material adesivo de adesividade ativável (44) e uma folha de proteção que pode ser retirada, sendo que a referida fita comporta pelo menos uma perfuração correspondendo à zona da resina sobre o módulo da etiqueta, colocar a fita adesiva sobre a película suporte de modo que a perfuração coincida com a zona da resina e ativa-se o material adesivo para que ele fixe a fita sobre a película e colocar a resina de revestimento sobre a zona prevista pelo menos no interior da perfuração e em contato com a perfuração. A invenção também tem como objeto um processo no qual o material adesivo ativável é depositado sem folha de proteção.
BR9812528-1A 1997-09-26 1998-09-23 Método de fabricação de um módulo ou etiqueta eletrônica, módulo ou etiqueta obtidos e suporte que comporta tal módulo ou etiqueta BR9812528A (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9712445A FR2769110B1 (fr) 1997-09-26 1997-09-26 Procede de fabrication d'un module ou etiquette electronique, module ou etiquette obtenue et support comportant un tel module ou etiquette
PCT/FR1998/002052 WO1999017253A1 (fr) 1997-09-26 1998-09-23 Procede de fabrication d'un module ou etiquette electronique, module ou etiquette obtenu et support comportant un tel module ou etiquette
US09/534,053 US6446874B1 (en) 1997-09-26 2000-03-24 Method of fabricating an electronic module or label, module or label obtained and medium including a module or label of this kind

Publications (1)

Publication Number Publication Date
BR9812528A true BR9812528A (pt) 2000-07-25

Family

ID=26233850

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9812528-1A BR9812528A (pt) 1997-09-26 1998-09-23 Método de fabricação de um módulo ou etiqueta eletrônica, módulo ou etiqueta obtidos e suporte que comporta tal módulo ou etiqueta

Country Status (9)

Country Link
US (2) US6446874B1 (pt)
EP (1) EP1018092B1 (pt)
JP (1) JP2001518673A (pt)
CN (1) CN1214344C (pt)
AU (1) AU9353498A (pt)
BR (1) BR9812528A (pt)
CA (1) CA2304581A1 (pt)
FR (1) FR2769110B1 (pt)
WO (1) WO1999017253A1 (pt)

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FI112288B (fi) * 2000-01-17 2003-11-14 Rafsec Oy Menetelmä älytarrasyöttörainan valmistamiseksi
FR2805067B1 (fr) 2000-02-15 2003-09-12 Bourgogne Grasset Jeton a puce electronique et procedes de fabrication d'un tel jeton
FI111881B (fi) * 2000-06-06 2003-09-30 Rafsec Oy Älykorttiraina ja menetelmä sen valmistamiseksi
FR2812126B1 (fr) * 2000-07-19 2003-08-22 Bourgogne Grasset Enrobage pour circuit electronique, pastille et coque de protection utilisant un tel enrobage et procede de fabrication d'une telle pastille
FI112121B (fi) * 2000-12-11 2003-10-31 Rafsec Oy Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa
FI117331B (fi) 2001-07-04 2006-09-15 Rafsec Oy Menetelmä ruiskuvaletun tuotteen valmistamiseksi
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JP2004095638A (ja) 2002-08-29 2004-03-25 Fujitsu Ltd 薄膜デカップリングキャパシタとその製造方法
CN1886752B (zh) * 2003-11-04 2011-09-07 艾利丹尼森公司 具有加强读出能力的射频识别标签
CN100337261C (zh) * 2004-03-11 2007-09-12 上海交通大学 带接头的金属防盗标签及其制作方法
US7158037B2 (en) * 2004-03-22 2007-01-02 Avery Dennison Corporation Low cost method of producing radio frequency identification tags with straps without antenna patterning
JP4391892B2 (ja) * 2004-06-16 2009-12-24 オリンパス株式会社 アンテナカバー
DE602005023020D1 (de) 2004-06-16 2010-09-30 Olympus Corp Antennenabdeckung und antennenvorrichtung
EP1615166A1 (en) * 2004-07-07 2006-01-11 Axalto S.A. Carrier tape for chip modules and method of manufacturing a chip card
US7237724B2 (en) * 2005-04-06 2007-07-03 Robert Singleton Smart card and method for manufacturing a smart card
US7607249B2 (en) * 2005-07-15 2009-10-27 Innovatier Inc. RFID bracelet and method for manufacturing a RFID bracelet
MX2008013083A (es) * 2006-04-10 2008-12-16 Innovatier Inc Un modulo de insercion electronica para tarjetas y etiquetas electronicas, tarjeta electronica y metodos para fabricar tales modulos de insercion electronica y tarjetas.
US20070290048A1 (en) * 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
US20080055824A1 (en) * 2006-08-25 2008-03-06 Innovatier, Inc. Battery powered device having a protective frame
US20080160397A1 (en) * 2006-08-25 2008-07-03 Innovatier, Inc Battery powered device having a protective frame
FR2908541B1 (fr) * 2006-11-06 2009-01-16 Id3S Identification Solutions Dispositif d'identification par radiofrequence et procede de realisation d'un tel dispositif
EP2138019A4 (en) * 2007-03-23 2011-05-04 Innovatier Inc SQUARE CARD AND METHOD FOR MANUFACTURING A SQUARE CARD
US20080282540A1 (en) * 2007-05-14 2008-11-20 Innovatier, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
CN101315899B (zh) * 2007-05-30 2010-11-24 热速得控股股份有限公司 标签式集成线路软板制作方法及其结构
US7986023B2 (en) * 2007-09-17 2011-07-26 Infineon Technologies Ag Semiconductor device with inductor
DE102008046761B4 (de) 2007-09-14 2021-08-05 Infineon Technologies Ag Halbleiterbauelement mit leitfähiger Verbindungsanordnung und Verfahren zur Bildung eines Halbleiterbauelements
DE102007048237A1 (de) * 2007-10-08 2009-04-09 Giesecke & Devrient Gmbh Chipmodul für Chipkarte
US20090096614A1 (en) * 2007-10-15 2009-04-16 Innovatier, Inc. Rfid power bracelet and method for manufacturing a rfid power bracelet
US20090181215A1 (en) * 2008-01-15 2009-07-16 Innovatier, Inc. Plastic card and method for making a plastic card
CA2712602C (en) * 2008-02-22 2014-08-05 Toppan Printing Co., Ltd. Transponder and booklet
FR2948796A1 (fr) * 2009-07-28 2011-02-04 Ask Sa Support de dispositif d'identification radiofrequence pour carte hybride et son procede de fabrication
US20120086114A1 (en) * 2010-10-07 2012-04-12 Broadcom Corporation Millimeter devices on an integrated circuit
EP2447886A1 (fr) * 2010-10-07 2012-05-02 Gemalto SA Module électronique sécurisé, dispositif à module électronique sécurisé et procédé de fabrication
US8901945B2 (en) 2011-02-23 2014-12-02 Broadcom Corporation Test board for use with devices having wirelessly enabled functional blocks and method of using same
US9159777B2 (en) 2011-04-15 2015-10-13 Infineon Technologies Ag Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coil
US8928139B2 (en) 2011-09-30 2015-01-06 Broadcom Corporation Device having wirelessly enabled functional blocks
DE102011088216A1 (de) * 2011-12-12 2013-06-13 Continental Automotive Gmbh Motorsteuergerät mit Opferstruktur
US9594999B2 (en) 2012-04-03 2017-03-14 X-Card Holdings, Llc Information carrying card comprising crosslinked polymer composition, and method of making the same
US9122968B2 (en) * 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
EP2741241A1 (en) * 2012-12-10 2014-06-11 Oberthur Technologies A Chip Module having a Protective Layer
CN105190651B (zh) 2013-03-15 2019-06-04 X卡控股有限公司 用于制作信息携带卡的芯层的方法以及结果产品
CN111819577B (zh) 2018-03-07 2024-08-13 X卡控股有限公司 金属卡
FR3082696B1 (fr) 2018-06-15 2020-09-11 Linxens Holding Procede de fabrication d'un support en rouleau pour composant electroniques, d'un module de carte a puce et d'une carte a puce, ainsi que support pour composants electroniques
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Also Published As

Publication number Publication date
JP2001518673A (ja) 2001-10-16
CN1279797A (zh) 2001-01-10
FR2769110B1 (fr) 1999-12-03
WO1999017253A1 (fr) 1999-04-08
AU9353498A (en) 1999-04-23
EP1018092A1 (fr) 2000-07-12
FR2769110A1 (fr) 1999-04-02
US6446874B1 (en) 2002-09-10
CN1214344C (zh) 2005-08-10
EP1018092B1 (fr) 2010-12-22
US20020179721A1 (en) 2002-12-05
CA2304581A1 (fr) 1999-04-08

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 6O,7O,8O E 9O ANUIDADES

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1909 DE 07/08/2007.