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BR9805298A - Stabilization of polyamide, polyester and polyacetal. - Google Patents

Stabilization of polyamide, polyester and polyacetal.

Info

Publication number
BR9805298A
BR9805298A BR9805298-5A BR9805298A BR9805298A BR 9805298 A BR9805298 A BR 9805298A BR 9805298 A BR9805298 A BR 9805298A BR 9805298 A BR9805298 A BR 9805298A
Authority
BR
Brazil
Prior art keywords
polyamide
polyester
polyacetal
stabilization
stabilize
Prior art date
Application number
BR9805298-5A
Other languages
Portuguese (pt)
Inventor
Andre Schmitter
Original Assignee
Ciba Sc Holding Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Sc Holding Ag filed Critical Ciba Sc Holding Ag
Publication of BR9805298A publication Critical patent/BR9805298A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • C08K5/5333—Esters of phosphonic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
  • Anti-Oxidant Or Stabilizer Compositions (AREA)

Abstract

Patente de Invenção:<B>"ESTABILIZAçãO DA POLIAMIDA, POLIéSTER E POLIACETAL"<D>. Esta invenção refere-se a composições compreendendo (a) uma poliamida, poliéster ou poliacetal, e (b) como estabilizador o composto da fórmula I com a condição de que, se o componente (a) é uma poliamida então a composição não contém metal hipofosfito nem sal de cobre de um ácido orgânico; ao uso da fórmula I para estabilizar poliamida, poliéster ou poliacetal contra a degradação oxidativa, térmica e/ou induzida pela luz, bem como a um processo para estabilizar esses materiais plásticos.Invention Patent: <B> "STABILIZATION OF POLYAMIDE, POLYESTER AND POLYACETAL" <D>. This invention relates to compositions comprising (a) a polyamide, polyester or polyacetal, and (b) as a stabilizer the compound of formula I with the proviso that if component (a) is a polyamide then the composition does not contain metal hypophosphite or copper salt of an organic acid; the use of formula I to stabilize polyamide, polyester or polyacetal against oxidative, thermal and / or light-induced degradation, as well as a process to stabilize these plastic materials.

BR9805298-5A 1997-12-05 1998-12-04 Stabilization of polyamide, polyester and polyacetal. BR9805298A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH282097 1997-12-05

Publications (1)

Publication Number Publication Date
BR9805298A true BR9805298A (en) 1999-11-23

Family

ID=4242328

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9805298-5A BR9805298A (en) 1997-12-05 1998-12-04 Stabilization of polyamide, polyester and polyacetal.

Country Status (14)

Country Link
JP (1) JPH11269374A (en)
KR (1) KR19990062799A (en)
AR (1) AR017194A1 (en)
BE (1) BE1013420A5 (en)
BR (1) BR9805298A (en)
CA (1) CA2255172A1 (en)
DE (1) DE19855598A1 (en)
ES (1) ES2155760B1 (en)
FR (1) FR2772036A1 (en)
GB (1) GB2331991B (en)
IT (1) IT1303818B1 (en)
NL (1) NL1010729C2 (en)
RU (1) RU2210578C2 (en)
SG (1) SG68701A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE297799T1 (en) * 2000-06-03 2005-07-15 Membrana Gmbh POLYAMIDE MEMBRANE WITH INCREASED HYDROLYSTABILITY AND METHOD FOR PRODUCING SAME
CN101977949A (en) * 2008-03-28 2011-02-16 巴斯夫公司 Polymeric compositions for plastic strapping
EP2406320A1 (en) * 2009-03-13 2012-01-18 Basf Se Stabilized blends of polyester and polyamide
ES2621970T3 (en) * 2009-05-28 2017-07-05 Mitsubishi Gas Chemical Company, Inc. Polyamide resin composition and molded article
JP5708487B2 (en) * 2009-06-08 2015-04-30 三菱瓦斯化学株式会社 Polyamide resin composition and molded product
WO2011052563A1 (en) 2009-10-28 2011-05-05 帝人デュポンフィルム株式会社 Biaxially oriented film for electrical insulation purposes, and film capacitor produced using biaxially oriented film for electrical insulation purposes
KR102189978B1 (en) * 2013-06-13 2020-12-11 주식회사 쿠라레 Polyamide resin composition and molded article produced therefrom
TWI488911B (en) * 2014-04-18 2015-06-21 Fdc Lees Chemical Industry Co Melamine-free composite additive for polyoxymethylene
EP3431520B1 (en) * 2016-03-14 2025-09-24 Mitsubishi Gas Chemical Company, Inc. Process for producing oxymethylene copolymer
JP2023166639A (en) * 2020-10-12 2023-11-22 住友化学株式会社 Novel phenolic compound and resin composition containing the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3584047A (en) * 1967-12-29 1971-06-08 Geigy Chem Corp Alkylhydroxyphenyl polyamides
US3860558A (en) * 1970-12-07 1975-01-14 Ciba Geigy Corp Stabilized polyamide compositions
US3691131A (en) * 1971-02-01 1972-09-12 Ciba Geigy Corp Stabilized polyamide compositions
JPS5578050A (en) * 1978-12-06 1980-06-12 Mitsubishi Chem Ind Ltd Flame-retardant polyester resin composition
JPS57133148A (en) * 1981-02-10 1982-08-17 Toray Ind Inc Polyester-polyether copolymeric composition
JP2525452B2 (en) * 1988-04-27 1996-08-21 東レ株式会社 Polyacetal resin composition with excellent thermal stability
JPH02209944A (en) * 1989-02-10 1990-08-21 Asahi Chem Ind Co Ltd Polyacetal resin composition
BR9808874B1 (en) * 1997-04-15 2010-07-13 process for the preparation of a reduced dust stabilizer.

Also Published As

Publication number Publication date
NL1010729A1 (en) 1999-06-08
GB9825669D0 (en) 1999-01-13
ES2155760A1 (en) 2001-05-16
KR19990062799A (en) 1999-07-26
DE19855598A1 (en) 1999-06-10
GB2331991B (en) 2000-07-05
AR017194A1 (en) 2001-08-22
CA2255172A1 (en) 1999-06-05
BE1013420A5 (en) 2002-01-15
SG68701A1 (en) 1999-11-16
IT1303818B1 (en) 2001-02-23
RU2210578C2 (en) 2003-08-20
NL1010729C2 (en) 1999-07-21
GB2331991A (en) 1999-06-09
FR2772036A1 (en) 1999-06-04
JPH11269374A (en) 1999-10-05
ES2155760B1 (en) 2001-12-01
ITMI982622A1 (en) 2000-06-03

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Legal Events

Date Code Title Description
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B11D Dismissal acc. art. 38, par 2 of ipl - failure to pay fee after grant in time