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BR9714283A - Processo para a fabricação de um arranjo de sensor para a medição de temperatura. - Google Patents

Processo para a fabricação de um arranjo de sensor para a medição de temperatura.

Info

Publication number
BR9714283A
BR9714283A BR9714283-2A BR9714283A BR9714283A BR 9714283 A BR9714283 A BR 9714283A BR 9714283 A BR9714283 A BR 9714283A BR 9714283 A BR9714283 A BR 9714283A
Authority
BR
Brazil
Prior art keywords
support element
temperature
manufacture
temperature measurement
sensor
Prior art date
Application number
BR9714283-2A
Other languages
English (en)
Inventor
Karlheinz Wienand
Stefan Dietmann
Margit Sander
Original Assignee
Heraeus Electro Nite Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Electro Nite Int filed Critical Heraeus Electro Nite Int
Publication of BR9714283A publication Critical patent/BR9714283A/pt

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

Abstract

Patente de Invenção: <B>"PROCESSO PARA A FABRICAçãO DE UM ARRANJO DE SENSOR PARA A MEDIçãO DE TEMPERATURA"<D>. A invenção refere-se a um processo para a fabricação de um arranjo se sensor para a medição de temperatura, com uma resistência de medição sensível à temperatura que, sobre um substrato de cerâmica, apresenta uma camada de resistência, fina, metálica, isolada eletricamente para fora, superfícies de contato, colocadas livremente, que conduzem eletricidade, e estão ligadas com vias de condução resistentes à alta temperatura, isoladas eletricamente uma da outra e, diretamente fixas mecanicamente sobre um elemento de suporte cerâmico, sendo que a resistência de medição é contatada e fixada por meio de colocação e queima, logo em seguida, sobre um elemento de suporte preparado antes da equipagem. Como meio para a fixação e contato serve uma pasta condutora de filme espesso contendo platina. Na extremidade do elemento de suporte afastada da resistência de medição estão dispostas superfícieis de contato para a ligação de uma tomada ou de um cabo. O sensor de temperatura, um componente padrão, na forma de uma resistência de medição plana, é colocado sem fio como componente de SMD sobre o elemento de suporte cerâmico. O arranjo de sensor fabricado com o processo é apropriado para medições de temperatura também acima de 400°C. Com poucos componentes estandardizados e etapas de trabalho que podem ser facilmente automatizadas, o processo é de baixo custo.
BR9714283-2A 1997-11-13 1997-11-24 Processo para a fabricação de um arranjo de sensor para a medição de temperatura. BR9714283A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19750123A DE19750123C2 (de) 1997-11-13 1997-11-13 Verfahren zur Herstellung einer Sensoranordnung für die Temperaturmessung
PCT/EP1997/006552 WO1999026256A1 (de) 1997-11-13 1997-11-24 Verfahren zur herstellung einer sensoranordnung für die temperaturmessung

Publications (1)

Publication Number Publication Date
BR9714283A true BR9714283A (pt) 2000-04-18

Family

ID=7848502

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9714283-2A BR9714283A (pt) 1997-11-13 1997-11-24 Processo para a fabricação de um arranjo de sensor para a medição de temperatura.

Country Status (7)

Country Link
US (1) US6241146B1 (pt)
EP (1) EP0972288B1 (pt)
JP (1) JP3671060B2 (pt)
CN (1) CN1240048A (pt)
BR (1) BR9714283A (pt)
DE (2) DE19750123C2 (pt)
WO (1) WO1999026256A1 (pt)

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DE19934109C1 (de) * 1999-07-21 2001-04-05 Bosch Gmbh Robert Temperaturfühler und Verfahren zu seiner Herstellung
DE19936924C1 (de) 1999-08-05 2001-06-13 Georg Bernitz Vorrichtung zur Hochtemperaturerfassung und Verfahren zur Herstellung derselben
DE10051558C2 (de) * 2000-10-18 2003-04-17 Sitronic Elektrotech Ausruest Sensoreinheit mit einem Luftfeuchte-Sensor und mit einem Lufttemperatur-Sensor
DE10104493A1 (de) * 2001-01-31 2002-08-22 Epiq Sensor Nite N V Temperatursensor und Verfahren zur Herstellung eines Temperatursensors
DE10127871C1 (de) * 2001-03-29 2003-03-13 Epiq Sensor Nite N V Gehäuse für einen Temperatur- oder Gassensor
DE10359569A1 (de) * 2003-12-18 2005-07-28 Robert Bosch Gmbh Keramischer Schichtverbund
TWI245125B (en) * 2004-07-26 2005-12-11 Au Optronics Corp An electrical measurement apparatus and method thereof in the bonding process
US7316507B2 (en) * 2005-11-03 2008-01-08 Covidien Ag Electronic thermometer with flex circuit location
DE102006022290B4 (de) * 2006-05-11 2009-07-23 Heraeus Sensor Technology Gmbh Heizer mit integriertem Temperatursensor auf Träger
DE102006056171A1 (de) * 2006-11-27 2008-05-29 Endress + Hauser Wetzer Gmbh + Co. Kg Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße und Verfahren zur Kontaktierung
EP2118629A2 (de) * 2007-01-15 2009-11-18 Maier, Viktor Verfahren zur herstellung eines sensorsystems und sensorsystem
AT505033B1 (de) * 2007-02-06 2008-10-15 Viktor Maier Verfahren und vorrichtung für herstellung, aufbau und betrieb von dickschichtsensoren, dickschichtleitern und dickschicht - sensorketten
US7749170B2 (en) 2007-05-22 2010-07-06 Tyco Healthcare Group Lp Multiple configurable electronic thermometer
DE102007046900C5 (de) 2007-09-28 2018-07-26 Heraeus Sensor Technology Gmbh Hochtemperatursensor und ein Verfahren zu dessen Herstellung
US8496377B2 (en) * 2007-12-31 2013-07-30 Covidien Lp Thermometer having molded probe component
DE102008043219A1 (de) * 2008-10-28 2010-04-29 Robert Bosch Gmbh Gassensor
US8228160B2 (en) * 2008-11-14 2012-07-24 Epcos Ag Sensor element and process for assembling a sensor element
DE102009026402B4 (de) * 2008-11-19 2023-11-02 Endress + Hauser Wetzer Gmbh + Co. Kg Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße
US8162536B2 (en) * 2008-12-15 2012-04-24 Delphi Technologies, Inc. Combined sensor
DE102011103828B4 (de) * 2011-06-01 2017-04-06 Heraeus Sensor Technology Gmbh Massenproduktion kleiner Temepratursensoren mit Flip-Chips
DE102011103827B4 (de) * 2011-06-01 2014-12-24 Heraeus Sensor Technology Gmbh Verfahren zur Herstellung eines Temperatursensors
DE102011089608A1 (de) * 2011-12-22 2013-06-27 Horst Siedle Gmbh & Co. Kg Gehäuseteil für einen elektrischen Sensorsowie Verfahren zur Herstellung des Gehäuseteils
WO2019168655A1 (en) 2018-02-28 2019-09-06 Applied Materials, Inc. Method for measuring a temperature
CN110388992B (zh) * 2019-07-19 2021-03-16 重庆斯太宝科技有限公司 一种高稳定性温度传感器敏感元件
DE102020133985A1 (de) * 2020-12-17 2022-06-23 Tdk Electronics Ag Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung
DE102023136205A1 (de) * 2023-12-21 2025-06-26 Innovative Sensor Technology Ist Ag Sensorelement
CN118794553B (zh) * 2024-09-14 2024-12-03 中国空气动力研究与发展中心超高速空气动力研究所 一种铂薄片热电阻热流传感器及其制备方法

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Also Published As

Publication number Publication date
JP2002514310A (ja) 2002-05-14
DE19750123A1 (de) 1999-06-10
US6241146B1 (en) 2001-06-05
WO1999026256A1 (de) 1999-05-27
JP3671060B2 (ja) 2005-07-13
EP0972288A1 (de) 2000-01-19
EP0972288B1 (de) 2005-08-03
DE59712383D1 (de) 2005-09-08
CN1240048A (zh) 1999-12-29
DE19750123C2 (de) 2000-09-07

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 5A,6A,7A E 8A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1836 DE 14/03/2006.