BR9710026A - Aparelho de placa de circuito de resfiramento por pulverização - Google Patents

Aparelho de placa de circuito de resfiramento por pulverização

Info

Publication number: BR9710026A
Authority: BR; Brazil
Prior art keywords: spray; circuit board; board apparatus; respiration circuit; respiration
Prior art date: 1996-06-28

Application number

BR9710026A

Other languages

English (en)

Inventor

Thomas R Beise

Original Assignee

Motorola Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1996-06-28

Filing date

1997-03-27

Publication date

1999-08-10

1997-03-27 Application filed by Motorola Inc filed Critical Motorola Inc

1999-08-10 Publication of BR9710026A publication Critical patent/BR9710026A/pt

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H10W40/475—
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20345—Sprayers; Atomizers

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)
Veneer Processing And Manufacture Of Plywood (AREA)

BR9710026A 1996-06-28 1997-03-27 Aparelho de placa de circuito de resfiramento por pulverização BR9710026A (pt)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US08/674,773 US5761035A (en)	1996-06-28	1996-06-28	Circuit board apparatus and method for spray-cooling a circuit board
PCT/US1997/005341 WO1998001015A1 (en)	1996-06-28	1997-03-27	Spray-cooling circuit board apparatus

Publications (1)

Publication Number	Publication Date
BR9710026A true BR9710026A (pt)	1999-08-10

Family

ID=24707829

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BR9710026A BR9710026A (pt)	1996-06-28	1997-03-27	Aparelho de placa de circuito de resfiramento por pulverização

Country Status (10)

Country	Link
US (1)	US5761035A (pt)
EP (1)	EP0908080B1 (pt)
JP (1)	JP2000513506A (pt)
KR (1)	KR100274769B1 (pt)
CN (1)	CN1112840C (pt)
AU (1)	AU700152B2 (pt)
BR (1)	BR9710026A (pt)
DE (1)	DE69708636T2 (pt)
IL (1)	IL125806A0 (pt)
WO (1)	WO1998001015A1 (pt)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6292364B1 (en) *	2000-04-28	2001-09-18	Raytheon Company	Liquid spray cooled module
DE10102869A1 (de) *	2001-01-23	2002-08-14	Siemens Ag	Vorrichtung und Verfahren zur Kühlung von temperaturkritischen Bauteilen
US6604571B1 (en)	2002-04-11	2003-08-12	General Dynamics Land Systems, Inc.	Evaporative cooling of electrical components
US6625023B1 (en)	2002-04-11	2003-09-23	General Dynamics Land Systems, Inc.	Modular spray cooling system for electronic components
US7836706B2 (en)	2002-09-27	2010-11-23	Parker Intangibles Llc	Thermal management system for evaporative spray cooling
US6976528B1 (en)	2003-02-18	2005-12-20	Isothermal Systems Research, Inc.	Spray cooling system for extreme environments
US7079393B2 (en) *	2004-11-16	2006-07-18	International Business Machines Corporation	Fluidic cooling systems and methods for electronic components
US7283365B2 (en) *	2005-01-18	2007-10-16	Lucent Technologies Inc.	Jet impingement cooling apparatus and method
US7901191B1 (en)	2005-04-07	2011-03-08	Parker Hannifan Corporation	Enclosure with fluid inducement chamber
WO2007037306A1 (ja) *	2005-09-28	2007-04-05	Ngk Insulators, Ltd.	ヒートシンクモジュール及びその製造方法
US20080123297A1 (en) *	2006-05-15	2008-05-29	Isothermal Systems Research, Inc.	Hybrid clamshell blade system
US20080047688A1 (en) *	2006-08-28	2008-02-28	Airbus Deutschland Gmbh	Cooling System And Cooling Method For Cooling Components Of A Power Electronics
DE102006041788B4 (de) *	2006-09-06	2012-06-14	Airbus Operations Gmbh	Luftfahrzeug-Elektronikkühleinrichtung für ein Luftfahrzeug mit einem Flüssigkeitskühlsystem
US8037926B2 (en) *	2007-06-21	2011-10-18	International Business Machines Corporation	Method and apparatus for chip cooling
NL1034420C2 (nl) *	2007-09-24	2009-03-26	Thales Nederland Bv	Rechtstreeks geïnjecteerde gedwongen convectiekoeling voor elektronica.
US7952874B2 (en) *	2008-07-01	2011-05-31	Dell Products L.P.	Planer board with integrated cold plate
US8081478B1 (en) *	2008-12-09	2011-12-20	Lockheed Martin Corporation	Fluid cooled electronics module cover
US9686887B2 (en) *	2014-09-15	2017-06-20	Nicholas Michael D'Onofrio	Liquid cooled metal core printed circuit board
EP3455878B1 (en)	2016-05-11	2023-07-05	Hypertechnologie Ciara Inc	Cpu cooling system with direct spray cooling
CN107764111B (zh) *	2016-08-16	2019-06-14	宏碁股份有限公司	散热装置
US12477685B2 (en) *	2023-05-10	2025-11-18	Microsoft Technology Licensing, Llc	Server cooling using sprayed fluid and high conductivity gas or air

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3648113A (en) *	1970-10-22	1972-03-07	Singer Co	Electronic assembly having cooling means for stacked modules
GB2124036B (en) *	1982-03-09	1985-01-09	Vero Electronics Ltd	An improved cooling system for a circuit board installation
JPH065700B2 (ja) *	1987-07-22	1994-01-19	株式会社日立製作所	電子回路デバイスの冷却装置
US4912600A (en) *	1988-09-07	1990-03-27	Auburn Univ. Of The State Of Alabama	Integrated circuit packaging and cooling
US4964019A (en) *	1989-12-27	1990-10-16	Ag Communication Systems Corporation	Multilayer bonding and cooling of integrated circuit devices
US5067047A (en) *	1990-05-11	1991-11-19	At&T Bell Laboratories	Circuit pack with inboard jet cooling
US5404272A (en) *	1991-10-24	1995-04-04	Transcal	Carrier for a card carrying electronic components and of low heat resistance
US5220804A (en) *	1991-12-09	1993-06-22	Isothermal Systems Research, Inc	High heat flux evaporative spray cooling

1996
- 1996-06-28 US US08/674,773 patent/US5761035A/en not_active Expired - Lifetime
1997
- 1997-03-27 AU AU26018/97A patent/AU700152B2/en not_active Ceased
- 1997-03-27 IL IL12580697A patent/IL125806A0/xx unknown
- 1997-03-27 JP JP10504090A patent/JP2000513506A/ja active Pending
- 1997-03-27 KR KR1019980706884A patent/KR100274769B1/ko not_active Expired - Fee Related
- 1997-03-27 CN CN97193771A patent/CN1112840C/zh not_active Expired - Fee Related
- 1997-03-27 DE DE69708636T patent/DE69708636T2/de not_active Expired - Fee Related
- 1997-03-27 WO PCT/US1997/005341 patent/WO1998001015A1/en not_active Ceased
- 1997-03-27 EP EP97917778A patent/EP0908080B1/en not_active Expired - Lifetime
- 1997-03-27 BR BR9710026A patent/BR9710026A/pt not_active Application Discontinuation

Also Published As

Publication number	Publication date
CN1216213A (zh)	1999-05-05
JP2000513506A (ja)	2000-10-10
EP0908080B1 (en)	2001-11-28
DE69708636T2 (de)	2002-08-01
KR100274769B1 (ko)	2000-12-15
IL125806A0 (en)	1999-04-11
EP0908080A4 (en)	2000-03-22
AU2601897A (en)	1998-01-21
WO1998001015A1 (en)	1998-01-08
US5761035A (en)	1998-06-02
CN1112840C (zh)	2003-06-25
KR19990087459A (ko)	1999-12-27
AU700152B2 (en)	1998-12-24
DE69708636D1 (de)	2002-01-10
EP0908080A1 (en)	1999-04-14

Publication	Publication Date	Title
BR9710026A (pt)	1999-08-10	Aparelho de placa de circuito de resfiramento por pulverização
BR9705683A (pt)	1999-06-08	Placa básica
DE69631236D1 (de)	2004-02-05	Gedruckte Schaltungsplatten
DE69636329D1 (de)	2006-08-17	Merschichtige gedruckte leiterplatte
GB2344474B (en)	2002-05-22	Flexible board attaching-connecting device
BR9704745A (pt)	1998-11-10	Placa de circuito impresso
GB9622510D0 (en)	1997-01-08	Rotary transformer with flexible printed circuit boards
BR9700324A (pt)	1998-10-27	Placa de circuito impresso aperfeiçoada
DE69708527D1 (de)	2002-01-10	Atemschutzgerät mit geschlossenem Kreislauf
ES1027840Y (es)	1995-03-01	Placa de circuito impreso.
KR960003540U (ko)	1996-01-22	인쇄회로기판 고정장치
GB9424435D0 (en)	1995-01-18	Board game apparatus
GB9405240D0 (en)	1994-04-27	Board game apparatus
KR960012958U (ko)	1996-04-17	인쇄회로기판 고정구조
KR980006109U (ko)	1998-03-30	모니터의 인쇄회로기판 균열 방지장치
KR960026283U (ko)	1996-07-22	인쇄 회로 기판
KR950028995U (ko)	1995-10-20	인쇄회로기판
KR980004740U (ko)	1998-03-30	모니터의 인쇄회로기판 고정장치
KR970026428U (ko)	1997-06-20	인쇄회로기판간접속장치
KR960018615U (ko)	1996-06-19	모니터의 인쇄회로기판 고압 방지구조
KR960024590U (ko)	1996-07-22	모니터의 인쇄회로기판 고정장치
BR9601091A (pt)	1998-01-06	Placa eletrônica
BR7400092U (pt)	1995-10-10	Placa multivídeo
KR960009591U (ko)	1996-03-16	인쇄회로기판 처짐방지장치
GB2309593B (en)	2000-01-19	Flexible printed circuit board

Legal Events

Date	Code	Title	Description
2008-09-30	B06A	Patent application procedure suspended [chapter 6.1 patent gazette]
2009-09-22	B11B	Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements