BR9709438A - Aparelho e processo para resfriar por pulverização um módulo eletrônico - Google Patents
Aparelho e processo para resfriar por pulverização um módulo eletrônicoInfo
- Publication number
- BR9709438A BR9709438A BR9709438A BR9709438A BR9709438A BR 9709438 A BR9709438 A BR 9709438A BR 9709438 A BR9709438 A BR 9709438A BR 9709438 A BR9709438 A BR 9709438A BR 9709438 A BR9709438 A BR 9709438A
- Authority
- BR
- Brazil
- Prior art keywords
- electronic module
- spray cooling
- spray
- cooling
- module
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000007921 spray Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20345—Sprayers; Atomizers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S165/00—Heat exchange
- Y10S165/908—Fluid jets
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/630,135 US5718117A (en) | 1996-04-10 | 1996-04-10 | Apparatus and method for spray-cooling an electronic module |
| PCT/US1997/001191 WO1997038565A1 (en) | 1996-04-10 | 1997-01-24 | Apparatus and method for spray-cooling an electronic module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR9709438A true BR9709438A (pt) | 1999-08-10 |
Family
ID=24525930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR9709438A BR9709438A (pt) | 1996-04-10 | 1997-01-24 | Aparelho e processo para resfriar por pulverização um módulo eletrônico |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US5718117A (pt) |
| EP (1) | EP0893041A4 (pt) |
| JP (1) | JP2000508473A (pt) |
| KR (1) | KR100304522B1 (pt) |
| CN (1) | CN1130960C (pt) |
| AU (1) | AU701552B2 (pt) |
| BR (1) | BR9709438A (pt) |
| IL (1) | IL125650A0 (pt) |
| WO (1) | WO1997038565A1 (pt) |
Families Citing this family (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8182473B2 (en) * | 1999-01-08 | 2012-05-22 | Palomar Medical Technologies | Cooling system for a photocosmetic device |
| US7204832B2 (en) * | 1996-12-02 | 2007-04-17 | Pálomar Medical Technologies, Inc. | Cooling system for a photo cosmetic device |
| US5923533A (en) * | 1998-02-17 | 1999-07-13 | Lockheed Martin Corporation | Multiple tile scaleable cooling system for semiconductor components |
| US5880931A (en) * | 1998-03-20 | 1999-03-09 | Tilton; Donald E. | Spray cooled circuit card cage |
| US6205799B1 (en) | 1999-09-13 | 2001-03-27 | Hewlett-Packard Company | Spray cooling system |
| US6292364B1 (en) * | 2000-04-28 | 2001-09-18 | Raytheon Company | Liquid spray cooled module |
| US6538885B1 (en) * | 2000-09-15 | 2003-03-25 | Lucent Technologies Inc. | Electronic circuit cooling with impingement plate |
| US6595014B2 (en) * | 2001-02-22 | 2003-07-22 | Hewlett-Packard Development Company, L.P. | Spray cooling system with cooling regime detection |
| US6484521B2 (en) | 2001-02-22 | 2002-11-26 | Hewlett-Packard Company | Spray cooling with local control of nozzles |
| US6550263B2 (en) | 2001-02-22 | 2003-04-22 | Hp Development Company L.L.P. | Spray cooling system for a device |
| US6708515B2 (en) | 2001-02-22 | 2004-03-23 | Hewlett-Packard Development Company, L.P. | Passive spray coolant pump |
| US6644058B2 (en) | 2001-02-22 | 2003-11-11 | Hewlett-Packard Development Company, L.P. | Modular sprayjet cooling system |
| US7082778B2 (en) * | 2001-02-22 | 2006-08-01 | Hewlett-Packard Development Company, L.P. | Self-contained spray cooling module |
| US6993926B2 (en) | 2001-04-26 | 2006-02-07 | Rini Technologies, Inc. | Method and apparatus for high heat flux heat transfer |
| US20030155434A1 (en) * | 2002-02-01 | 2003-08-21 | Rini Daniel P. | Spray nozzle apparatus and method of use |
| US6571569B1 (en) | 2001-04-26 | 2003-06-03 | Rini Technologies, Inc. | Method and apparatus for high heat flux heat transfer |
| US7654100B2 (en) * | 2001-04-26 | 2010-02-02 | Rini Technologies, Inc. | Method and apparatus for high heat flux heat transfer |
| US6904968B2 (en) * | 2001-09-14 | 2005-06-14 | Hewlett-Packard Development Company, L.P. | Method and apparatus for individually cooling components of electronic systems |
| FR2833803B1 (fr) * | 2001-12-17 | 2004-03-12 | Renault | Circuit electronique de puissance et systeme de motorisation hybride pour vehicule automobile pourvu d'un tel circuit electronique de puissance |
| US6882156B2 (en) * | 2002-02-14 | 2005-04-19 | Teradyne, Inc. | Printed circuit board assembly for automatic test equipment |
| US6625023B1 (en) | 2002-04-11 | 2003-09-23 | General Dynamics Land Systems, Inc. | Modular spray cooling system for electronic components |
| US6604571B1 (en) | 2002-04-11 | 2003-08-12 | General Dynamics Land Systems, Inc. | Evaporative cooling of electrical components |
| US6857283B2 (en) * | 2002-09-13 | 2005-02-22 | Isothermal Systems Research, Inc. | Semiconductor burn-in thermal management system |
| US7159414B2 (en) * | 2002-09-27 | 2007-01-09 | Isothermal Systems Research Inc. | Hotspot coldplate spray cooling system |
| US7836706B2 (en) * | 2002-09-27 | 2010-11-23 | Parker Intangibles Llc | Thermal management system for evaporative spray cooling |
| US6976528B1 (en) | 2003-02-18 | 2005-12-20 | Isothermal Systems Research, Inc. | Spray cooling system for extreme environments |
| US20070199340A1 (en) * | 2003-08-25 | 2007-08-30 | Isothermal Systems Research, Inc. | Multi-chamber spray cooling system |
| US7150109B2 (en) * | 2003-08-25 | 2006-12-19 | Isothermal Systems Research, Inc. | Dry-wet thermal management system |
| US7043933B1 (en) | 2003-08-26 | 2006-05-16 | Isothermal Systems Research, Inc. | Spray coolant reservoir system |
| US7180741B1 (en) | 2003-08-26 | 2007-02-20 | Isothermal Systems Research, Inc. | Spray cool system with a dry access chamber |
| US7240500B2 (en) | 2003-09-17 | 2007-07-10 | Hewlett-Packard Development Company, L.P. | Dynamic fluid sprayjet delivery system |
| US7009842B2 (en) | 2004-01-30 | 2006-03-07 | Isothermal Systems Research, Inc. | Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules |
| US20050183844A1 (en) * | 2004-02-24 | 2005-08-25 | Isothermal Systems Research | Hotspot spray cooling |
| US6952346B2 (en) * | 2004-02-24 | 2005-10-04 | Isothermal Systems Research, Inc | Etched open microchannel spray cooling |
| US7392660B2 (en) * | 2004-08-05 | 2008-07-01 | Isothermal Systems Research, Inc. | Spray cooling system for narrow gap transverse evaporative spray cooling |
| US7901191B1 (en) | 2005-04-07 | 2011-03-08 | Parker Hannifan Corporation | Enclosure with fluid inducement chamber |
| US7362574B2 (en) * | 2006-08-07 | 2008-04-22 | International Business Machines Corporation | Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus |
| US7477513B1 (en) * | 2006-12-29 | 2009-01-13 | Isothermal Systems Research, Inc. | Dual sided board thermal management system |
| CA2628504C (en) | 2007-04-06 | 2015-05-26 | Ashley Stone | Device for casting |
| CN101324533B (zh) * | 2007-06-13 | 2011-07-20 | 中国科学院工程热物理研究所 | 多相体系微射流相变能质传递过程观测系统 |
| US7796384B2 (en) * | 2008-08-27 | 2010-09-14 | Honeywell International Inc. | Hybrid chassis cooling system |
| US7944694B2 (en) * | 2008-10-23 | 2011-05-17 | International Business Machines Corporation | Liquid cooling apparatus and method for cooling blades of an electronic system chassis |
| US7983040B2 (en) * | 2008-10-23 | 2011-07-19 | International Business Machines Corporation | Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem |
| US7885070B2 (en) * | 2008-10-23 | 2011-02-08 | International Business Machines Corporation | Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow |
| US7961475B2 (en) * | 2008-10-23 | 2011-06-14 | International Business Machines Corporation | Apparatus and method for facilitating immersion-cooling of an electronic subsystem |
| US7916483B2 (en) * | 2008-10-23 | 2011-03-29 | International Business Machines Corporation | Open flow cold plate for liquid cooled electronic packages |
| US8018720B2 (en) * | 2009-06-25 | 2011-09-13 | International Business Machines Corporation | Condenser structures with fin cavities facilitating vapor condensation cooling of coolant |
| US8490679B2 (en) * | 2009-06-25 | 2013-07-23 | International Business Machines Corporation | Condenser fin structures facilitating vapor condensation cooling of coolant |
| US7885074B2 (en) * | 2009-06-25 | 2011-02-08 | International Business Machines Corporation | Direct jet impingement-assisted thermosyphon cooling apparatus and method |
| US8014150B2 (en) * | 2009-06-25 | 2011-09-06 | International Business Machines Corporation | Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling |
| US8059405B2 (en) * | 2009-06-25 | 2011-11-15 | International Business Machines Corporation | Condenser block structures with cavities facilitating vapor condensation cooling of coolant |
| US8184436B2 (en) | 2010-06-29 | 2012-05-22 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems |
| US8369091B2 (en) | 2010-06-29 | 2013-02-05 | International Business Machines Corporation | Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
| US8345423B2 (en) | 2010-06-29 | 2013-01-01 | International Business Machines Corporation | Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems |
| US8351206B2 (en) | 2010-06-29 | 2013-01-08 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit |
| US8179677B2 (en) | 2010-06-29 | 2012-05-15 | International Business Machines Corporation | Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
| TWI422318B (zh) | 2010-10-29 | 2014-01-01 | Ind Tech Res Inst | 數據機房 |
| CN105202844B (zh) * | 2015-10-20 | 2017-06-16 | 中国电子科技集团公司第四十四研究所 | 高效率水冷箱 |
| CN105934139B (zh) * | 2016-06-16 | 2018-05-22 | 广东合一新材料研究院有限公司 | 大功率器件的工质接触式冷却系统及其工作方法 |
| US10109901B2 (en) * | 2016-07-22 | 2018-10-23 | Ford Global Technologies, Llc | Battery thermal interface material installation assembly and method |
| US10390455B2 (en) * | 2017-03-27 | 2019-08-20 | Raytheon Company | Thermal isolation of cryo-cooled components from circuit boards or other structures |
| CN107763939A (zh) * | 2017-11-30 | 2018-03-06 | 上海海洋大学 | 一种速冻机用斜切条缝喷嘴 |
| US20230179060A1 (en) * | 2020-05-18 | 2023-06-08 | Abishek SRIDHAR | Cooling system for electric systems |
| CN111540716B (zh) * | 2020-07-13 | 2020-10-02 | 常州江苏大学工程技术研究院 | 用于大功率芯片散热的静电闪蒸微喷雾循环冷却系统 |
| US11950394B2 (en) * | 2021-10-12 | 2024-04-02 | Ge Aviation Systems Llc | Liquid-cooled assembly and method |
Family Cites Families (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3035419A (en) * | 1961-01-23 | 1962-05-22 | Westinghouse Electric Corp | Cooling device |
| US3725566A (en) * | 1972-05-01 | 1973-04-03 | Us Navy | Evaporative cooling and heat extraction system |
| JPS605321B2 (ja) * | 1977-09-03 | 1985-02-09 | 株式会社日阪製作所 | プレート式蒸発器 |
| US4399484A (en) * | 1981-03-10 | 1983-08-16 | The United States Of America As Represented By The Secretary Of The Air Force | Integral electric module and assembly jet cooling system |
| US4434112A (en) * | 1981-10-06 | 1984-02-28 | Frick Company | Heat transfer surface with increased liquid to air evaporative heat exchange |
| GB2124036B (en) * | 1982-03-09 | 1985-01-09 | Vero Electronics Ltd | An improved cooling system for a circuit board installation |
| DE3248147A1 (de) * | 1982-12-27 | 1984-06-28 | Siemens AG, 1000 Berlin und 8000 München | Metallisierte formteile aus kunststoff fuer technische gehaeuse zur abschirmung gegenueber elektromagnetischen stoerfeldern |
| CA1227886A (en) * | 1984-01-26 | 1987-10-06 | Haruhiko Yamamoto | Liquid-cooling module system for electronic circuit components |
| FR2578553B1 (fr) * | 1985-03-06 | 1989-01-06 | Bertin & Cie | Installation de refroidissement par pulverisation |
| FR2579060B1 (fr) * | 1985-03-18 | 1987-04-17 | Socapex | Carte de circuit imprime a echangeur thermique et procede de fabrication d'une telle carte |
| US4854377A (en) * | 1985-11-19 | 1989-08-08 | Nec Corporation | Liquid cooling system for integrated circuit chips |
| CA1283225C (en) * | 1987-11-09 | 1991-04-16 | Shinji Mine | Cooling system for three-dimensional ic package |
| US4847731A (en) * | 1988-07-05 | 1989-07-11 | The United States Of America As Represented By The Secretary Of The Navy | Liquid cooled high density packaging for high speed circuits |
| US4912600A (en) * | 1988-09-07 | 1990-03-27 | Auburn Univ. Of The State Of Alabama | Integrated circuit packaging and cooling |
| JPH06100408B2 (ja) * | 1988-09-09 | 1994-12-12 | 日本電気株式会社 | 冷却装置 |
| CA1304830C (en) * | 1988-09-20 | 1992-07-07 | Toshifumi Sano | Cooling structure |
| US5174364A (en) * | 1988-09-21 | 1992-12-29 | Nec Corporation | Cooling abnormality detection system for electronic equipment |
| US4935864A (en) * | 1989-06-20 | 1990-06-19 | Digital Equipment Corporation | Localized cooling apparatus for cooling integrated circuit devices |
| US5057968A (en) * | 1989-10-16 | 1991-10-15 | Lockheed Corporation | Cooling system for electronic modules |
| US4964019A (en) * | 1989-12-27 | 1990-10-16 | Ag Communication Systems Corporation | Multilayer bonding and cooling of integrated circuit devices |
| US5232164A (en) * | 1990-05-09 | 1993-08-03 | Resch D R | Precisely adjustable atomizer |
| US5067047A (en) * | 1990-05-11 | 1991-11-19 | At&T Bell Laboratories | Circuit pack with inboard jet cooling |
| DE4102019C1 (pt) * | 1991-01-24 | 1992-07-09 | Schroff Gmbh, 7541 Straubenhardt, De | |
| US5131233A (en) * | 1991-03-08 | 1992-07-21 | Cray Computer Corporation | Gas-liquid forced turbulence cooling |
| US5190099A (en) * | 1991-05-01 | 1993-03-02 | The United States Of The America As Represented By The Secretary Of The Army | Pulsatile impinging cooling system for electronic IC modules and systems using fluidic oscillators |
| EP0516478A2 (en) * | 1991-05-30 | 1992-12-02 | Nec Corporation | Cooling structure for integrated circuits |
| US5210440A (en) * | 1991-06-03 | 1993-05-11 | Vlsi Technology, Inc. | Semiconductor chip cooling apparatus |
| JP2995590B2 (ja) * | 1991-06-26 | 1999-12-27 | 株式会社日立製作所 | 半導体冷却装置 |
| US5207613A (en) * | 1991-07-08 | 1993-05-04 | Tandem Computers Incorporated | Method and apparatus for mounting, cooling, interconnecting, and providing power and data to a plurality of electronic modules |
| US5166863A (en) * | 1991-07-15 | 1992-11-24 | Amdahl Corporation | Liquid-cooled assembly of heat-generating devices and method for assembling and disassembling |
| EP0536560B1 (de) * | 1991-10-11 | 1996-06-12 | Asea Brown Boveri Ag | Ein- und/oder Ausgabegerät für Prozessdaten |
| JP2852148B2 (ja) * | 1991-10-21 | 1999-01-27 | 日本電気株式会社 | 集積回路パッケージの冷却構造 |
| JP2728105B2 (ja) * | 1991-10-21 | 1998-03-18 | 日本電気株式会社 | 集積回路用冷却装置 |
| US5177666A (en) * | 1991-10-24 | 1993-01-05 | Bland Timothy J | Cooling rack for electronic devices |
| US5175395A (en) * | 1991-11-27 | 1992-12-29 | Rockwell International Corporation | Electromagnetic shield |
| US5220804A (en) * | 1991-12-09 | 1993-06-22 | Isothermal Systems Research, Inc | High heat flux evaporative spray cooling |
| JP2792304B2 (ja) * | 1992-01-22 | 1998-09-03 | 日本電気株式会社 | 集積回路用冷却装置 |
| CA2088821C (en) * | 1992-02-05 | 1999-09-07 | Hironobu Ikeda | Cooling structure for integrated circuit |
| JP2852152B2 (ja) * | 1992-02-06 | 1999-01-27 | 甲府日本電気株式会社 | 電子装置の冷却装置 |
| EP0560478B1 (en) * | 1992-02-10 | 1998-10-14 | Nec Corporation | Cooling structure for electronic circuit package |
| JP2745948B2 (ja) * | 1992-04-06 | 1998-04-28 | 日本電気株式会社 | 集積回路の冷却構造 |
| JP2853481B2 (ja) * | 1992-09-30 | 1999-02-03 | 日本電気株式会社 | 半導体素子の冷却構造 |
| US5436793A (en) * | 1993-03-31 | 1995-07-25 | Ncr Corporation | Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member |
| DE69400401T2 (de) * | 1993-11-16 | 1997-03-27 | Digital Equipment Corp | Elektromagnetische Interferenzabschirmung für elektrische Baugruppen |
| US5431974A (en) * | 1993-12-16 | 1995-07-11 | Pierce; Patricia | Electromagnetic radiation shielding filter assembly |
| US5675473A (en) * | 1996-02-23 | 1997-10-07 | Motorola, Inc. | Apparatus and method for shielding an electronic module from electromagnetic radiation |
-
1996
- 1996-04-10 US US08/630,135 patent/US5718117A/en not_active Expired - Fee Related
-
1997
- 1997-01-24 KR KR1019980708055A patent/KR100304522B1/ko not_active Expired - Fee Related
- 1997-01-24 WO PCT/US1997/001191 patent/WO1997038565A1/en not_active Ceased
- 1997-01-24 JP JP9536174A patent/JP2000508473A/ja active Pending
- 1997-01-24 CN CN97193676A patent/CN1130960C/zh not_active Expired - Fee Related
- 1997-01-24 EP EP97906432A patent/EP0893041A4/en not_active Withdrawn
- 1997-01-24 IL IL12565097A patent/IL125650A0/xx unknown
- 1997-01-24 AU AU21125/97A patent/AU701552B2/en not_active Ceased
- 1997-01-24 BR BR9709438A patent/BR9709438A/pt not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20000005336A (ko) | 2000-01-25 |
| CN1215543A (zh) | 1999-04-28 |
| JP2000508473A (ja) | 2000-07-04 |
| EP0893041A1 (en) | 1999-01-27 |
| EP0893041A4 (en) | 1999-11-17 |
| AU701552B2 (en) | 1999-01-28 |
| CN1130960C (zh) | 2003-12-10 |
| AU2112597A (en) | 1997-10-29 |
| KR100304522B1 (ko) | 2001-09-29 |
| IL125650A0 (en) | 1999-04-11 |
| WO1997038565A1 (en) | 1997-10-16 |
| US5718117A (en) | 1998-02-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
| B09B | Patent application refused [chapter 9.2 patent gazette] |
Free format text: INDEFERIDO COM BASE NO ARTIGO 8O COMBINADO COM O ART. 13 DA LPI |
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