BR9510620A - Folha de cobre para a produção de circuitos impressos e método para a sua produção - Google Patents

Folha de cobre para a produção de circuitos impressos e método para a sua produção

Info

Publication number: BR9510620A
Authority: BR; Brazil
Prior art keywords: production; copper foil; protective layer; electrodeposited; printed circuits
Prior art date: 1995-07-20

Application number

BR9510620A

Other languages

English (en)

Inventor

Paul Dufresne

Michel Mathieu

Kurt Acx

Michel Street

Adam M Wolski

Original Assignee

Circuit Foil Sa

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-07-20

Filing date

1995-07-20

Publication date

1999-01-12

1995-07-20 Application filed by Circuit Foil Sa filed Critical Circuit Foil Sa

1995-07-20 Priority to BR9510620A priority Critical patent/BR9510620A/pt

1999-01-12 Publication of BR9510620A publication Critical patent/BR9510620A/pt

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Laminated Bodies (AREA)
Manufacturing Of Printed Wiring (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Electroplating Methods And Accessories (AREA)
Physical Vapour Deposition (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Non-Metallic Protective Coatings For Printed Circuits (AREA)
Electroplating And Plating Baths Therefor (AREA)

BR9510620A 1995-07-20 1995-07-20 Folha de cobre para a produção de circuitos impressos e método para a sua produção BR9510620A (pt)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
BR9510620A BR9510620A (pt)	1995-07-20	1995-07-20	Folha de cobre para a produção de circuitos impressos e método para a sua produção

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
PCT/IB1995/000571 WO1997004627A1 (en)	1995-07-20	1995-07-20	Copper foil for the manufacture of printed circuits and method of producing same
CA002227179A CA2227179A1 (en)	1995-07-20	1995-07-20	Copper foil for the manufacture of printed circuits and method of producing same
BR9510620A BR9510620A (pt)	1995-07-20	1995-07-20	Folha de cobre para a produção de circuitos impressos e método para a sua produção
CN95197959A CN1088323C (zh)	1995-07-20	1995-07-20	用于制造印刷电路板的铜箔表面上形成防护层的方法

Publications (1)

Publication Number	Publication Date
BR9510620A true BR9510620A (pt)	1999-01-12

Family

ID=27170600

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BR9510620A BR9510620A (pt)	1995-07-20	1995-07-20	Folha de cobre para a produção de circuitos impressos e método para a sua produção

Country Status (14)

Country	Link
EP (1)	EP0839440B1 (pt)
JP (1)	JP3363155B2 (pt)
CN (1)	CN1088323C (pt)
AT (1)	ATE186443T1 (pt)
AU (1)	AU2896995A (pt)
BR (1)	BR9510620A (pt)
CA (1)	CA2227179A1 (pt)
DE (1)	DE69513202T2 (pt)
DK (1)	DK0839440T3 (pt)
ES (1)	ES2140690T3 (pt)
FI (1)	FI980099L (pt)
PL (1)	PL177139B1 (pt)
RU (1)	RU2138932C1 (pt)
WO (1)	WO1997004627A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4626390B2 (ja) *	2005-05-16	2011-02-09	日立電線株式会社	環境保護を配慮したプリント配線板用銅箔
JP4492434B2 (ja) *	2005-05-16	2010-06-30	日立電線株式会社	プリント配線板用銅箔とその製造方法およびその製造に用いる３価クロム化成処理液
WO2012002418A1 (ja) *	2010-06-30	2012-01-05	三井金属鉱業株式会社	負極集電体用銅箔の製造方法
JP5325175B2 (ja)	2010-07-15	2013-10-23	Ｊｘ日鉱日石金属株式会社	銅箔複合体、及び成形体の製造方法
CN103501997B (zh)	2011-05-13	2015-11-25	Jx日矿日石金属株式会社	铜箔复合体和用于其的铜箔、以及成型体及其制造方法
JP5822838B2 (ja) *	2012-01-13	2015-11-24	Jx日鉱日石金属株式会社	銅箔複合体、並びに成形体及びその製造方法
HUE030342T2 (en)	2012-01-13	2017-05-29	Jx Nippon Mining & Metals Corp	Copper-foil composite, extruded body, and method for producing it

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4387006A (en) *	1981-07-08	1983-06-07	Fukuda Metal Foil & Powder Co., Ltd.	Method of treating the surface of the copper foil used in printed wire boards
US5071520A (en) *	1989-10-30	1991-12-10	Olin Corporation	Method of treating metal foil to improve peel strength
US5338619A (en) *	1991-05-16	1994-08-16	Fukuda Metal Foil And Powder Co., Ltd.	Copper foil for printed circuits and method of producing same
RU2084087C1 (ru) *	1993-06-15	1997-07-10	Ломовский Олег Иванович	Способ электрохимической металлизации отверстий печатных плат

1995
- 1995-07-20 DK DK95924475T patent/DK0839440T3/da active
- 1995-07-20 FI FI980099A patent/FI980099L/fi unknown
- 1995-07-20 AT AT95924475T patent/ATE186443T1/de not_active IP Right Cessation
- 1995-07-20 CA CA002227179A patent/CA2227179A1/en not_active Abandoned
- 1995-07-20 AU AU28969/95A patent/AU2896995A/en not_active Abandoned
- 1995-07-20 RU RU98102920/09A patent/RU2138932C1/ru not_active IP Right Cessation
- 1995-07-20 CN CN95197959A patent/CN1088323C/zh not_active Expired - Fee Related
- 1995-07-20 DE DE69513202T patent/DE69513202T2/de not_active Expired - Fee Related
- 1995-07-20 EP EP95924475A patent/EP0839440B1/en not_active Expired - Lifetime
- 1995-07-20 WO PCT/IB1995/000571 patent/WO1997004627A1/en not_active Ceased
- 1995-07-20 PL PL95324464A patent/PL177139B1/pl not_active IP Right Cessation
- 1995-07-20 ES ES95924475T patent/ES2140690T3/es not_active Expired - Lifetime
- 1995-07-20 BR BR9510620A patent/BR9510620A/pt not_active IP Right Cessation
- 1995-07-20 JP JP50646697A patent/JP3363155B2/ja not_active Expired - Fee Related

Also Published As

Publication number	Publication date
CN1198293A (zh)	1998-11-04
ES2140690T3 (es)	2000-03-01
DE69513202T2 (de)	2000-05-11
EP0839440A1 (en)	1998-05-06
CA2227179A1 (en)	1997-02-06
JP3363155B2 (ja)	2003-01-08
WO1997004627A1 (en)	1997-02-06
FI980099A7 (fi)	1998-02-27
DK0839440T3 (da)	2000-03-20
PL177139B1 (pl)	1999-09-30
AU2896995A (en)	1997-02-18
ATE186443T1 (de)	1999-11-15
CN1088323C (zh)	2002-07-24
EP0839440B1 (en)	1999-11-03
DE69513202D1 (de)	1999-12-09
PL324464A1 (en)	1998-05-25
RU2138932C1 (ru)	1999-09-27
FI980099L (fi)	1998-02-27
HK1016407A1 (en)	1999-10-29
FI980099A0 (fi)	1998-01-19

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Legal Events

Date	Code	Title	Description
2000-08-01	FB36	Technical and formal requirements: requirement - article 36 of industrial property law
2000-11-14	TC	Change of name
2001-02-20	FF	Decision: intention to grant
2001-06-26	FG9A	Patent or certificate of addition granted
2010-05-18	B24C	Patent annual fee: request for for restoration	Free format text: REFERENTE A 10A, 11A, 12A, 13A E 14A ANUIDADE(S)
2013-08-13	B21F	Lapse acc. art. 78, item iv - on non-payment of the annual fees in time	Free format text: REFERENTE AO NAO CUMPRIMENTO DO DESPACHO 24.3 NA RPI 2054 DE 18/05/2010 E COMPROVAR RECOLHIMENTO DA 15A, 16A, 17A E 18A ANUIDADES.