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BR9502961A - Circuit sheet metal foil for characteristic and similar resonant frequency label and process for making it - Google Patents

Circuit sheet metal foil for characteristic and similar resonant frequency label and process for making it

Info

Publication number
BR9502961A
BR9502961A BR9502961A BR9502961A BR9502961A BR 9502961 A BR9502961 A BR 9502961A BR 9502961 A BR9502961 A BR 9502961A BR 9502961 A BR9502961 A BR 9502961A BR 9502961 A BR9502961 A BR 9502961A
Authority
BR
Brazil
Prior art keywords
characteristic
making
sheet metal
metal foil
resonant frequency
Prior art date
Application number
BR9502961A
Other languages
Portuguese (pt)
Inventor
Shinya Uchibori
Original Assignee
Miyake Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP07167978A external-priority patent/JP3116209B2/en
Application filed by Miyake Kk filed Critical Miyake Kk
Publication of BR9502961A publication Critical patent/BR9502961A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/0672—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with resonating marks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Burglar Alarm Systems (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BR9502961A 1994-12-01 1995-06-28 Circuit sheet metal foil for characteristic and similar resonant frequency label and process for making it BR9502961A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32350694 1994-12-01
JP07167978A JP3116209B2 (en) 1994-12-01 1995-06-10 Method of manufacturing circuit-like metal foil sheet such as resonance tag

Publications (1)

Publication Number Publication Date
BR9502961A true BR9502961A (en) 1997-05-27

Family

ID=26491853

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9502961A BR9502961A (en) 1994-12-01 1995-06-28 Circuit sheet metal foil for characteristic and similar resonant frequency label and process for making it

Country Status (8)

Country Link
KR (1) KR100197509B1 (en)
CN (1) CN1100999C (en)
AU (1) AU700075B2 (en)
BR (1) BR9502961A (en)
CA (1) CA2153022C (en)
MY (1) MY117567A (en)
SG (1) SG71080A1 (en)
TW (1) TW404092B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5754110A (en) * 1996-03-07 1998-05-19 Checkpoint Systems, Inc. Security tag and manufacturing method
KR100605480B1 (en) 2004-04-19 2006-07-31 고상근 How to manufacture tag of RFID system
JP5377096B2 (en) 2008-09-08 2013-12-25 株式会社東芝 High frequency package device and manufacturing method thereof
KR20120028418A (en) 2010-09-14 2012-03-23 삼성모바일디스플레이주식회사 Method for manufacturing encapsulated substrate using organic luminescence display device and encapsulated substrate using organic luminescence display device
TWI593322B (en) 2010-11-19 2017-07-21 帝斯曼知識產權資產管理有限公司 Metal foil pattern laminated body, metal foil die cutting method, circuit substrate, manufacturing method thereof, and solar battery module
JP6161121B2 (en) 2011-06-06 2017-07-12 ディーエスエム アイピー アセッツ ビー．ブイ． Metal foil pattern laminate, metal foil laminate, metal foil laminate substrate, solar cell module, and method for producing metal foil pattern laminate
CN112621891B (en) * 2019-09-24 2022-10-14 泰州隆基乐叶光伏科技有限公司 Conductive metal foil stamping method and stamping device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3116078A1 (en) * 1981-04-22 1983-01-20 IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen "EMBOSSING FILM"
CH677988A5 (en) * 1986-07-30 1991-07-15 Actron Entwicklungs Ag
CH680483A5 (en) * 1989-10-20 1992-08-31 Kobe Properties Ltd

Also Published As

Publication number Publication date
KR100197509B1 (en) 1999-06-15
CN1126841A (en) 1996-07-17
MY117567A (en) 2004-07-31
AU700075B2 (en) 1998-12-17
SG71080A1 (en) 2000-03-21
CA2153022A1 (en) 1996-06-02
TW404092B (en) 2000-09-01
AU2329495A (en) 1996-06-06
CN1100999C (en) 2003-02-05
CA2153022C (en) 1999-11-30
KR960021510A (en) 1996-07-18

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Legal Events

Date Code Title Description
FB34 Technical and formal requirements: requirement - article 34 of industrial property law
FF Decision: intention to grant
B16A Patent or certificate of addition of invention granted
B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 20A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2312 DE 28-04-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.