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BR9100566A - Processo de fabricacao,por corrosao,de circuitos impressos em placas - Google Patents

Processo de fabricacao,por corrosao,de circuitos impressos em placas

Info

Publication number
BR9100566A
BR9100566A BR919100566A BR9100566A BR9100566A BR 9100566 A BR9100566 A BR 9100566A BR 919100566 A BR919100566 A BR 919100566A BR 9100566 A BR9100566 A BR 9100566A BR 9100566 A BR9100566 A BR 9100566A
Authority
BR
Brazil
Prior art keywords
corrosion
plates
manufacturing
circuits printed
printed
Prior art date
Application number
BR919100566A
Other languages
English (en)
Inventor
Vaclav Soukup
Original Assignee
Maria Helena Soukup
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maria Helena Soukup filed Critical Maria Helena Soukup
Priority to BR919100566A priority Critical patent/BR9100566A/pt
Priority to US07/832,310 priority patent/US5248382A/en
Publication of BR9100566A publication Critical patent/BR9100566A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
BR919100566A 1991-02-08 1991-02-08 Processo de fabricacao,por corrosao,de circuitos impressos em placas BR9100566A (pt)

Priority Applications (2)

Application Number Priority Date Filing Date Title
BR919100566A BR9100566A (pt) 1991-02-08 1991-02-08 Processo de fabricacao,por corrosao,de circuitos impressos em placas
US07/832,310 US5248382A (en) 1991-02-08 1992-02-07 Process for manufacture of printed circuit boards by etching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BR919100566A BR9100566A (pt) 1991-02-08 1991-02-08 Processo de fabricacao,por corrosao,de circuitos impressos em placas

Publications (1)

Publication Number Publication Date
BR9100566A true BR9100566A (pt) 1992-09-29

Family

ID=4051334

Family Applications (1)

Application Number Title Priority Date Filing Date
BR919100566A BR9100566A (pt) 1991-02-08 1991-02-08 Processo de fabricacao,por corrosao,de circuitos impressos em placas

Country Status (2)

Country Link
US (1) US5248382A (pt)
BR (1) BR9100566A (pt)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5531889A (en) * 1994-03-08 1996-07-02 Atotech Usa, Inc. Method and apparatus for removing resist particles from stripping solutions for printed wireboards
US20030138366A1 (en) * 2002-01-24 2003-07-24 Wang Chih Cheng Method of recovering copper
CN114760765B (zh) * 2022-06-16 2022-09-02 深圳市惠利电子科技有限公司 一种干式电路板化学蚀刻设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3772105A (en) * 1970-07-24 1973-11-13 Shipley Co Continuous etching process
US4428773A (en) * 1982-12-30 1984-01-31 Western Electric Company, Inc. Process for treating spent fluids to recover copper and copper oxide
AU608969B2 (en) * 1989-04-21 1991-04-18 Ming-Hsing Lee Process for etching copper with ammoniacal etchant solution and reconditioning the used etchant solution

Also Published As

Publication number Publication date
US5248382A (en) 1993-09-28

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Legal Events

Date Code Title Description
FD5 Application fees: dismissal - article 86 of industrial property law