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BR9006918A - Processo para formar,eletroliticamente,uma lamina de cobre para aplicacoes em quadro de circuito impresso,banho eletrolitico para depositar,eletroliticamente,lamina de cobre para aplicacao em quadro de circuito impresso e lamina de cobre - Google Patents

Processo para formar,eletroliticamente,uma lamina de cobre para aplicacoes em quadro de circuito impresso,banho eletrolitico para depositar,eletroliticamente,lamina de cobre para aplicacao em quadro de circuito impresso e lamina de cobre

Info

Publication number
BR9006918A
BR9006918A BR909006918A BR9006918A BR9006918A BR 9006918 A BR9006918 A BR 9006918A BR 909006918 A BR909006918 A BR 909006918A BR 9006918 A BR9006918 A BR 9006918A BR 9006918 A BR9006918 A BR 9006918A
Authority
BR
Brazil
Prior art keywords
copper blade
circuit board
printed circuit
blade
copper
Prior art date
Application number
BR909006918A
Other languages
English (en)
Inventor
Dino F Difranco
Sidney J Clouser
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of BR9006918A publication Critical patent/BR9006918A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
BR909006918A 1989-09-13 1990-09-12 Processo para formar,eletroliticamente,uma lamina de cobre para aplicacoes em quadro de circuito impresso,banho eletrolitico para depositar,eletroliticamente,lamina de cobre para aplicacao em quadro de circuito impresso e lamina de cobre BR9006918A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/406,894 US5215645A (en) 1989-09-13 1989-09-13 Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same
PCT/US1990/005162 WO1991004358A1 (en) 1989-09-13 1990-09-12 Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same

Publications (1)

Publication Number Publication Date
BR9006918A true BR9006918A (pt) 1991-11-26

Family

ID=23609806

Family Applications (1)

Application Number Title Priority Date Filing Date
BR909006918A BR9006918A (pt) 1989-09-13 1990-09-12 Processo para formar,eletroliticamente,uma lamina de cobre para aplicacoes em quadro de circuito impresso,banho eletrolitico para depositar,eletroliticamente,lamina de cobre para aplicacao em quadro de circuito impresso e lamina de cobre

Country Status (14)

Country Link
US (1) US5215645A (pt)
EP (1) EP0443009B1 (pt)
JP (1) JP3058445B2 (pt)
KR (1) KR920701526A (pt)
CN (1) CN1093179C (pt)
AU (1) AU640169B2 (pt)
BR (1) BR9006918A (pt)
CA (1) CA2041665A1 (pt)
DE (1) DE69031905T2 (pt)
HU (1) HU210114B (pt)
IE (1) IE903322A1 (pt)
IL (1) IL95672A (pt)
MY (1) MY107259A (pt)
WO (1) WO1991004358A1 (pt)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3392414B2 (ja) * 1990-05-30 2003-03-31 ジーエイテック インコーポレイテッド 電着された銅箔およびこれを低塩素イオン濃度の電解質溶液を用いて製造する方法
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5516408A (en) * 1993-04-19 1996-05-14 Magma Copper Company Process for making copper wire
CN1084803C (zh) * 1993-04-19 2002-05-15 Ga-Tek公司 制造金属铜粉、铜氧化物和铜箔的方法
US5670033A (en) * 1993-04-19 1997-09-23 Electrocopper Products Limited Process for making copper metal powder, copper oxides and copper foil
US6123788A (en) * 1993-04-19 2000-09-26 Electrocopper Products Limited Copper wire and process for making copper wire
US5679232A (en) * 1993-04-19 1997-10-21 Electrocopper Products Limited Process for making wire
US5366612A (en) * 1993-04-19 1994-11-22 Magma Copper Company Process for making copper foil
US5509557A (en) * 1994-01-24 1996-04-23 International Business Machines Corporation Depositing a conductive metal onto a substrate
JP3313277B2 (ja) * 1995-09-22 2002-08-12 古河サーキットフォイル株式会社 ファインパターン用電解銅箔とその製造方法
TW336325B (en) * 1996-05-24 1998-07-11 Electrocopper Products Ltd Copper wire and process for making copper wire
US5863666A (en) * 1997-08-07 1999-01-26 Gould Electronics Inc. High performance flexible laminate
DE69738388T2 (de) * 1996-08-23 2008-12-04 Nikko Materials Usa Inc., Chandler Flexibles hochleistungslaminat
JPH10330983A (ja) 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
EP1225253A1 (en) * 2001-01-22 2002-07-24 DSL Dresden Material-Innovation GmbH A continuous electroforming process to form a strip for battery electrodes and a mandrel to be used in said electroforming process
US7148566B2 (en) * 2001-03-26 2006-12-12 International Business Machines Corporation Method and structure for an organic package with improved BGA life
US6895299B2 (en) * 2001-10-16 2005-05-17 Brigham Young University Systems and methods for representing complex n-curves for direct control of tool motion
ATE331303T1 (de) * 2001-10-26 2006-07-15 Univ Arizona Programmierbare oberflächenkontrollbauelemente sowie deren anwendung
US6676823B1 (en) 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
JP5116943B2 (ja) * 2003-02-04 2013-01-09 古河電気工業株式会社 高周波回路用銅箔及びその製造方法
US8263225B2 (en) * 2004-06-01 2012-09-11 Isola Usa Corp. Laminate composition for producing reduced curl flat thin core laminate
CN100564606C (zh) * 2005-12-06 2009-12-02 安泰科技股份有限公司 金属薄膜连续电沉积装置及其方法
US8481862B2 (en) * 2006-02-09 2013-07-09 General Dynamics Advanced Information Systems, Inc. Low profile compliant leads
US8100694B2 (en) * 2007-06-11 2012-01-24 The United States Of America As Represented By The Secretary Of The Navy Infrared aimpoint detection system
ATE506468T1 (de) 2008-04-28 2011-05-15 Atotech Deutschland Gmbh Wässriges saures bad und verfahren zum elektrolytischen abschneiden von kupfer
KR101593282B1 (ko) * 2010-11-22 2016-02-11 미쓰이금속광업주식회사 표면 처리 동박
CN102797020A (zh) * 2011-05-23 2012-11-28 建滔（连州）铜箔有限公司 一种厚规格低峰值的电解铜箔的制备方法
BR112014012447A2 (pt) * 2011-12-23 2017-06-06 Hexcel Composites Ltd método para controle online de um processo de fabricação para um material laminado de múltiplos componentes
JP5858849B2 (ja) * 2012-03-30 2016-02-10 Jx日鉱日石金属株式会社 金属箔
JP6067256B2 (ja) * 2012-06-27 2017-01-25 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用負極電極及びリチウムイオン二次電池
CN105603501A (zh) * 2016-01-17 2016-05-25 莫镇威 电解铜箔表面处理添加剂、制备方法、处理方法及装置
CN110629257A (zh) * 2019-07-05 2019-12-31 九江德福科技股份有限公司 一种高抗拉锂电铜箔的制造方法
CN112501658B (zh) * 2020-12-08 2024-10-18 九江德福科技股份有限公司 一种高模量铜箔生产工艺

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2563360A (en) * 1941-05-24 1951-08-07 Gen Motors Corp Electrodeposition of copper
US3293109A (en) * 1961-09-18 1966-12-20 Clevite Corp Conducting element having improved bonding characteristics and method
US3389064A (en) * 1964-07-22 1968-06-18 Canadian Copper Refiners Ltd Electrolytic refining of copper and tank house electrolyte useful therein
US3930962A (en) * 1975-02-21 1976-01-06 Kennecott Copper Corporation Process and apparatus for producing thin copper foils on a molybdenum or tzm alloy drum
US3923109A (en) * 1975-02-24 1975-12-02 Jr Edward B Williams Drill tool
JPS5233074A (en) * 1975-09-10 1977-03-12 Nippon Mining Co Surface treatment of printed circuit copper foil
WO1987003915A1 (en) * 1985-12-24 1987-07-02 Gould Inc. A process and apparatus for electroplating copper foil
JPS6310990A (ja) * 1986-07-02 1988-01-18 Matsushita Electric Ind Co Ltd ビデオカメラ
JPH0631461B2 (ja) * 1987-06-15 1994-04-27 日本電解株式会社 電解銅箔の製造方法
JPH0649958B2 (ja) * 1987-06-15 1994-06-29 日本電解株式会社 電解銅箔の製造方法
JPH05233074A (ja) * 1992-02-25 1993-09-10 Dai Ichi Seiyaku Co Ltd ｐＨ制御方法及びその装置

Also Published As

Publication number Publication date
KR920701526A (ko) 1992-08-11
WO1991004358A1 (en) 1991-04-04
HU907373D0 (en) 1991-08-28
EP0443009A1 (en) 1991-08-28
MY107259A (en) 1995-10-31
HUT59185A (en) 1992-04-28
EP0443009B1 (en) 1998-01-07
CA2041665A1 (en) 1991-03-14
CN1053818A (zh) 1991-08-14
US5215645A (en) 1993-06-01
HU210114B (en) 1995-02-28
IL95672A (en) 1996-06-18
AU640169B2 (en) 1993-08-19
IE903322A1 (en) 1991-04-10
JPH04501887A (ja) 1992-04-02
DE69031905D1 (de) 1998-02-12
DE69031905T2 (de) 1998-04-16
AU6341790A (en) 1991-04-18
EP0443009A4 (en) 1993-04-14
JP3058445B2 (ja) 2000-07-04
IL95672A0 (en) 1991-06-30
CN1093179C (zh) 2002-10-23

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Legal Events

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FD3 Appl. lapsed due to non-payment of renewal fee