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BR8903710A - Composicao de peroxido de hidrogenio estabilizada,composicao de gravacao quimica aquosa e processo de formacao de painel de circuito impresso - Google Patents

Composicao de peroxido de hidrogenio estabilizada,composicao de gravacao quimica aquosa e processo de formacao de painel de circuito impresso

Info

Publication number
BR8903710A
BR8903710A BR898903710A BR8903710A BR8903710A BR 8903710 A BR8903710 A BR 8903710A BR 898903710 A BR898903710 A BR 898903710A BR 8903710 A BR8903710 A BR 8903710A BR 8903710 A BR8903710 A BR 8903710A
Authority
BR
Brazil
Prior art keywords
composition
printed circuit
hydrogen peroxide
forming process
circuit panel
Prior art date
Application number
BR898903710A
Other languages
English (en)
Inventor
Kurt E Heikkila
Rodney K Williams
Bruce A Bohnen
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of BR8903710A publication Critical patent/BR8903710A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
    • C01B15/01—Hydrogen peroxide
    • C01B15/037—Stabilisation by additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Anti-Oxidant Or Stabilizer Compositions (AREA)
BR898903710A 1988-07-27 1989-07-26 Composicao de peroxido de hidrogenio estabilizada,composicao de gravacao quimica aquosa e processo de formacao de painel de circuito impresso BR8903710A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/224,801 US4875973A (en) 1988-07-27 1988-07-27 Hydrogen peroxide compositions containing a substituted aminobenzaldehyde

Publications (1)

Publication Number Publication Date
BR8903710A true BR8903710A (pt) 1990-03-20

Family

ID=22842275

Family Applications (1)

Application Number Title Priority Date Filing Date
BR898903710A BR8903710A (pt) 1988-07-27 1989-07-26 Composicao de peroxido de hidrogenio estabilizada,composicao de gravacao quimica aquosa e processo de formacao de painel de circuito impresso

Country Status (14)

Country Link
US (1) US4875973A (pt)
EP (1) EP0353082A3 (pt)
JP (1) JPH02120211A (pt)
KR (1) KR900001881A (pt)
CN (1) CN1039775A (pt)
AU (1) AU612305B2 (pt)
BR (1) BR8903710A (pt)
DK (1) DK368589A (pt)
FI (1) FI893577A7 (pt)
IL (1) IL91113A0 (pt)
NO (1) NO893047L (pt)
NZ (1) NZ230078A (pt)
PT (1) PT91280A (pt)
ZA (1) ZA895725B (pt)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI93031B (fi) * 1993-06-17 1994-10-31 Cellkem Service Oy Glutaarialdehydin käyttö peroksidin hajoamisen estämiseksi uusiomassan ja muun kuitumassan valmistuksessa
GB8922504D0 (en) * 1989-10-05 1989-11-22 Interox Chemicals Ltd Hydrogen peroxide solutions
CA2049976C (en) * 1990-02-01 1997-01-14 William G. Woods Stabilization of aqueous peroxygen solutions
IT1251431B (it) * 1991-10-25 1995-05-09 Costante Fontana Composto ad elevate caratteristiche stabilizzanti particolarmente per perossidi inorganici utilizzati in applicazioni industriali
US5364510A (en) * 1993-02-12 1994-11-15 Sematech, Inc. Scheme for bath chemistry measurement and control for improved semiconductor wet processing
US5439569A (en) * 1993-02-12 1995-08-08 Sematech, Inc. Concentration measurement and control of hydrogen peroxide and acid/base component in a semiconductor bath
US6074960A (en) * 1997-08-20 2000-06-13 Micron Technology, Inc. Method and composition for selectively etching against cobalt silicide
US6068879A (en) * 1997-08-26 2000-05-30 Lsi Logic Corporation Use of corrosion inhibiting compounds to inhibit corrosion of metal plugs in chemical-mechanical polishing
US6855266B1 (en) 1999-08-13 2005-02-15 Cabot Microelectronics Corporation Polishing system with stopping compound and method of its use
CA2378790A1 (en) * 1999-08-13 2001-02-22 Cabot Microelectronics Corporation Polishing system and method of its use
RU2737297C2 (ru) 2015-10-20 2020-11-26 Хильти Акциенгезельшафт Двухкомпонентная система строительного раствора на основе глинозёмистого цемента и её применение

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5120972B1 (pt) * 1971-05-13 1976-06-29
BE791457A (fr) * 1971-11-18 1973-05-16 Du Pont Solutions acides stabilisees d'eau oxygenee
US3974086A (en) * 1972-05-04 1976-08-10 American Cyanamid Company Stabilization of hydrogen peroxide solutions
GB1435893A (en) * 1972-07-05 1976-05-19 Ici Ltd Treatment of textile materials
SE400581B (sv) * 1974-12-13 1978-04-03 Nordnero Ab Bad for kemisk polering av koppar och dess legeringar
US4027008A (en) * 1975-05-14 1977-05-31 The Gillette Company Hair bleaching composition containing water-soluble amino and quaternary ammonium polymers
GB1565349A (en) * 1975-10-20 1980-04-16 Albright & Wilson Aluminium polishing compositions
US4141850A (en) * 1977-11-08 1979-02-27 Dart Industries Inc. Dissolution of metals
US4236957A (en) * 1979-06-25 1980-12-02 Dart Industries Inc. Dissolution of metals utilizing an aqueous H2 SOY --H2 O.sub. -mercapto containing heterocyclic nitrogen etchant
US4233113A (en) * 1979-06-25 1980-11-11 Dart Industries Inc. Dissolution of metals utilizing an aqueous H2 O2 -H2 SO4 -thioamide etchant
JPS58197277A (ja) * 1982-05-08 1983-11-16 Mitsubishi Gas Chem Co Inc 金属の化学的溶解処理液
US4437930A (en) * 1983-08-22 1984-03-20 Dart Industries Inc. Dissolution of metals utilizing ε-caprolactam
US4437931A (en) * 1983-08-22 1984-03-20 Dart Industries Inc. Dissolution of metals
US4462861A (en) * 1983-11-14 1984-07-31 Shipley Company Inc. Etchant with increased etch rate
EP0168043B1 (de) * 1984-07-11 1990-11-07 MERCK PATENT GmbH Flüssigkristall-Phase
US4636282A (en) * 1985-06-20 1987-01-13 Great Lakes Chemical Corporation Method for etching copper and composition useful therein
GB8522046D0 (en) * 1985-09-05 1985-10-09 Interox Chemicals Ltd Stabilisation

Also Published As

Publication number Publication date
JPH02120211A (ja) 1990-05-08
NZ230078A (en) 1990-08-28
AU612305B2 (en) 1991-07-04
FI893577A0 (fi) 1989-07-26
US4875973A (en) 1989-10-24
AU3900089A (en) 1990-02-01
CN1039775A (zh) 1990-02-21
KR900001881A (ko) 1990-02-27
NO893047D0 (no) 1989-07-26
DK368589D0 (da) 1989-07-26
FI893577L (fi) 1990-01-28
EP0353082A2 (en) 1990-01-31
PT91280A (pt) 1990-02-08
EP0353082A3 (en) 1990-04-18
IL91113A0 (en) 1990-03-19
ZA895725B (en) 1991-03-27
FI893577A7 (fi) 1990-01-28
DK368589A (da) 1990-01-28
NO893047L (no) 1990-01-29

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Legal Events

Date Code Title Description
FD3 Appl. lapsed due to non-payment of renewal fee