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BR8804731A - Composicoes e processos para precipitacao de solda - Google Patents

Composicoes e processos para precipitacao de solda

Info

Publication number
BR8804731A
BR8804731A BR8804731A BR8804731A BR8804731A BR 8804731 A BR8804731 A BR 8804731A BR 8804731 A BR8804731 A BR 8804731A BR 8804731 A BR8804731 A BR 8804731A BR 8804731 A BR8804731 A BR 8804731A
Authority
BR
Brazil
Prior art keywords
compositions
processes
precipitation
welding
welding precipitation
Prior art date
Application number
BR8804731A
Other languages
English (en)
Inventor
Takao Fukunaga
Hisao Nakajima
Kenzo Kobayashi
Masanao Kono
Hisao Irie
Ryo Inoue
Original Assignee
Furukawa Electric Co Ltd
Harima Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd, Harima Chemicals Inc filed Critical Furukawa Electric Co Ltd
Publication of BR8804731A publication Critical patent/BR8804731A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Arc Welding In General (AREA)
BR8804731A 1987-09-14 1988-09-14 Composicoes e processos para precipitacao de solda BR8804731A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22829887 1987-09-14
JP63156688A JPH0747233B2 (ja) 1987-09-14 1988-06-27 半田析出用組成物および半田析出方法

Publications (1)

Publication Number Publication Date
BR8804731A true BR8804731A (pt) 1989-04-18

Family

ID=26484372

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8804731A BR8804731A (pt) 1987-09-14 1988-09-14 Composicoes e processos para precipitacao de solda

Country Status (10)

Country Link
US (1) US5145532A (pt)
EP (1) EP0307888B1 (pt)
JP (1) JPH0747233B2 (pt)
KR (1) KR920009987B1 (pt)
CN (1) CN1030695C (pt)
BR (1) BR8804731A (pt)
DE (1) DE3871297D1 (pt)
ES (1) ES2032915T3 (pt)
MY (1) MY104328A (pt)
SG (1) SG35293G (pt)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
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US5118029A (en) * 1989-11-30 1992-06-02 The Furukawa Electric Co., Ltd. Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board
US5296649A (en) * 1991-03-26 1994-03-22 The Furukawa Electric Co., Ltd. Solder-coated printed circuit board and method of manufacturing the same
KR940023325A (ko) * 1993-03-11 1994-10-22 토모마쯔 켕고 땜납층을 프리코팅해서 사용되는 회로기판 및 땜납층이 프리코팅된 회로기판
JP3390245B2 (ja) * 1993-06-01 2003-03-24 富士通株式会社 洗浄液及び洗浄方法
EP0683008A4 (en) * 1993-12-06 1997-10-08 Furukawa Electric Co Ltd SOLDER LAYER COMPOSITION AND PACKING METHOD USING THE SAME.
US5565261A (en) * 1994-10-31 1996-10-15 Motorola, Inc. Selective call radio having a ceramic substrate for circuit device interconnection
AU4269697A (en) * 1997-02-20 1998-09-09 Partnerships Limited, Inc. Low temperature method and compositions for producing electrical conductors
US6752309B1 (en) * 1999-07-22 2004-06-22 Oatey Co. Water soluble fluxes and methods of using the same
US6863209B2 (en) 2000-12-15 2005-03-08 Unitivie International Limited Low temperature methods of bonding components
US7115218B2 (en) 2001-06-28 2006-10-03 Parelec, Inc. Low temperature method and composition for producing electrical conductors
JP4142312B2 (ja) * 2002-02-28 2008-09-03 ハリマ化成株式会社 析出型はんだ組成物及びはんだ析出方法
JP4094982B2 (ja) 2003-04-15 2008-06-04 ハリマ化成株式会社 はんだ析出方法およびはんだバンプ形成方法
US8042727B2 (en) 2004-03-30 2011-10-25 Tamura Corporation Heater, reflow apparatus, and solder bump forming method and apparatus
JP3964911B2 (ja) 2004-09-03 2007-08-22 松下電器産業株式会社 バンプ付き基板の製造方法
JP3955302B2 (ja) 2004-09-15 2007-08-08 松下電器産業株式会社 フリップチップ実装体の製造方法
JP4287475B2 (ja) 2004-12-17 2009-07-01 パナソニック株式会社 樹脂組成物
US7754529B2 (en) 2005-02-03 2010-07-13 Panasonic Corporation Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method
US7910403B2 (en) 2005-03-09 2011-03-22 Panasonic Corporation Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same
JP4495158B2 (ja) 2005-03-15 2010-06-30 パナソニック株式会社 フリップチップ実装方法、バンプ形成方法、フリップチップ実装装置、およびバンプ形成装置
US7726545B2 (en) * 2005-03-16 2010-06-01 Panasonic Corporation Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei
US7649267B2 (en) 2005-03-17 2010-01-19 Panasonic Corporation Package equipped with semiconductor chip and method for producing same
US7921551B2 (en) 2005-03-24 2011-04-12 Panasonic Corporation Electronic component mounting method
CN100536102C (zh) 2005-03-28 2009-09-02 松下电器产业株式会社 倒装片安装体和倒装片安装方法及倒装片安装装置
EP1865549A4 (en) 2005-03-29 2012-07-11 Panasonic Corp FLIP-CHIP ATTACHING METHOD AND ASSEMBLY PROCESSING
EP1865550A4 (en) 2005-03-29 2012-07-11 Panasonic Corp FLIPCHIP APPLICATION METHOD AND METHOD FOR CONNECTING SUBSTRATES
JP4227659B2 (ja) 2005-04-06 2009-02-18 パナソニック株式会社 フリップチップ実装方法及びバンプ形成方法
WO2006123554A1 (ja) * 2005-05-17 2006-11-23 Matsushita Electric Industrial Co., Ltd. フリップチップ実装体およびフリップチップ実装方法
JP4477062B2 (ja) 2005-05-17 2010-06-09 パナソニック株式会社 フリップチップ実装方法
KR101257977B1 (ko) 2006-03-16 2013-04-24 파나소닉 주식회사 범프형성방법 및 범프형성장치
US7537961B2 (en) 2006-03-17 2009-05-26 Panasonic Corporation Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same
WO2007122868A1 (ja) 2006-03-28 2007-11-01 Matsushita Electric Industrial Co., Ltd. バンプ形成方法およびバンプ形成装置
CN100390050C (zh) * 2006-03-30 2008-05-28 云南省化工研究院 一种连续式制备磷酸二氢钾的方法
CN101432861B (zh) 2006-04-27 2011-02-09 松下电器产业株式会社 连接构造体及其制造方法
CN101578694B (zh) 2006-12-27 2011-07-13 松下电器产业株式会社 导电性凸块及其形成方法和半导体装置及其制造方法
US7569164B2 (en) * 2007-01-29 2009-08-04 Harima Chemicals, Inc. Solder precoating method
CN101542706B (zh) 2007-04-27 2011-07-13 松下电器产业株式会社 电子部件安装体及带焊料凸台的电子部件的制造方法
US9877399B2 (en) * 2015-09-11 2018-01-23 Nec Space Technologies, Ltd. Lead solder joint structure and manufacturing method thereof
GB201812664D0 (en) * 2018-08-03 2018-09-19 Imperial Innovations Ltd Recycling of lead-and tin-based materials
MX2021012401A (es) * 2019-04-09 2021-11-12 Ishikawa Tech Laboratory Co Ltd Método para fabricar un producto de estañado, un estañado, un componente estañado, un producto de estañado, una tarjeta de cableado impreso, una tarjeta de circuitos impresos, un cable, un producto estañado, una tarjeta impresa flexible, un componente electrónico, método para fabricar un artículo de estaño, método para fabricar un producto intermedio de estaño, un artículo de estaño, un producto intermedio de estaño y un miembro conductor.
CN110634593B (zh) * 2019-10-30 2021-05-25 合肥微晶材料科技有限公司 一种具有低方阻及优异耐弯折性能的纳米银线柔性透明导电膜及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1508343A1 (de) * 1966-05-21 1969-10-30 Siemens Ag Loetpaste zur Herstellung von Loetverbindungen metallischer Teile
US3978378A (en) * 1973-02-12 1976-08-31 The Dow Chemical Company Articles having electroconductive components of highly electroconductive resinous compositions
DE3010610A1 (de) * 1980-03-20 1981-10-01 Schoeller & Co Elektronik Gmbh, 3552 Wetter Verfahren zur selektiven verzinnung der loetaugen von gedruckten schaltungen
HU181746B (en) * 1980-10-22 1983-11-28 Richter Gedeon Vegyeszet Process for preparing vinblastine and leurosidine derivatives
US4373974A (en) * 1981-04-02 1983-02-15 Mcdonnell Douglas Corporation Solder composition
SE8403074D0 (sv) * 1984-06-07 1984-06-07 Granstroem Ab E Ljusspridande lins
DE3510000A1 (de) * 1985-03-20 1986-10-02 Ka We electronic GmbH & Co KG, 4796 Salzkotten Thermoplastisches loetmittel und verfahren und vorrichtung zu dessen verwendung
JPS62227593A (ja) * 1986-03-28 1987-10-06 Harima Chem Inc 有機半田
JP2604593B2 (ja) * 1986-05-19 1997-04-30 ハリマ化成 株式会社 金属表面に半田被膜を形成する方法
JPS63113073A (ja) * 1986-05-19 1988-05-18 Harima Chem Inc 電子回路部材を接着し且つその端子間に選択的に電気的導通を得る方法
US4661173A (en) * 1986-07-25 1987-04-28 Mcdonnell Douglas Corporation Alloy-enriched solder cream

Also Published As

Publication number Publication date
DE3871297D1 (de) 1992-06-25
JPH01157796A (ja) 1989-06-21
EP0307888B1 (en) 1992-05-20
EP0307888A3 (en) 1989-09-06
EP0307888A2 (en) 1989-03-22
MY104328A (en) 1994-03-31
ES2032915T3 (es) 1993-03-01
US5145532A (en) 1992-09-08
KR920009987B1 (ko) 1992-11-10
KR890004816A (ko) 1989-05-10
CN1030695C (zh) 1996-01-17
SG35293G (en) 1993-06-11
CN1044428A (zh) 1990-08-08
JPH0747233B2 (ja) 1995-05-24

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Legal Events

Date Code Title Description
FB19 Grant procedure suspended (art. 19)
FF Decision: intention to grant
FA11 Dismissal: dismissal - article 38, par. 2 of industrial property law